JP2000244160A - Electronic component cooling device on printed board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To readily enable attachment and detachment of a cooling fan and enable a cooling fan to be arranged near electronic components. SOLUTION: The device has a socket 12, which is fixed to a printed substrate 11 since a fixing pin 19 is inserted and soldered to a fixing hole 20, and a connection pin 18 is inserted and soldered to a through-hole 21 and a cooling fan 10 which is mounted on the socket 12. A contact 13 of the mounted cooling an 10 comes into contact with a connector 17 and is electrically connected to the printed board 11 via the connection pin 18. Since a lever 23 turns due to mounting action, a stopping protrusion 24 engages to a recess 14 and stops the cooling fan 10. Thereby, the cooling fan 10 is also fixed to the printed board 11 mechanically.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for cooling electronic components on a printed circuit board, and more particularly to an improvement in a cooling apparatus mounted on a printed circuit board for cooling electronic components such as a microprocessor on the printed circuit board.

[0002]

2. Description of the Related Art In recent years, high performance and miniaturization of electronic devices have been remarkable, and accordingly, microprocessors mounted on electronic devices have also been improved in performance and miniaturization. Therefore, the total amount of heat generated by the microprocessor tends to increase or the amount of heat generated per unit volume tends to increase.

However, microprocessors are weak to heat,
If the junction temperature exceeds a predetermined value, malfunction or failure may occur. For this reason, a heat sink for heat radiation is conventionally attached to the microprocessor, and the microprocessor is cooled by forced air cooling by a cooling fan.

FIG. 7 is a partial sectional view showing a conventional heat sink for cooling a microprocessor and a printed circuit board to which a cooling fan is attached. FIG. 7 shows a package 1 such as a ball grid array of a semiconductor such as a microprocessor, solder balls 2 of a ball grid array mounted on a large number of packages 1, a heat sink 3 mounted on the package 1, and a print for mounting the package 1. A cooling fan 5 for cooling the substrate 4, the package 1, a mounting bracket 6 for mounting the cooling fan 5 to the printed circuit board 4, a screw 7 for fixing the mounting bracket 6 to the printed circuit board 4, and a mounting bracket for mounting the cooling fan 5 6, a screw 8 for fixing the connector 6, a connector socket 9 a attached to the end of a lead wire of the cooling fan 5, and a connector pin 9 b attached to the printed circuit board 4 and engaging with the connector socket 9 a are shown.

[0005] The conventional cooling device is installed on the printed circuit board 4 as follows. That is, the mounting bracket 6 is previously fixed to the printed circuit board 4 with the screw 7, and the cooling fan 5 is fixed to the mounting bracket 6 with the screw 8. Then, the connector socket 9 a extending from the cooling fan 5 is connected to the connector pin 9 b of the printed circuit board 4. In this way,
The cooling fan 5 is mechanically and electrically attached to the printed circuit board 4.

Next, the operation of the conventional cooling device will be described with reference to FIG.

The package 1 houses a semiconductor such as a microprocessor inside, and is mounted on a printed circuit board 4 together with other components via solder balls 2 to perform a predetermined operation. Most of the heat generated by the operation of the semiconductor is transmitted from the upper surface of the package 1 to the heat sink 3 and reaches the fins of the heat sink 3. The cooling fan 5
Since electric power is supplied from the printed circuit board 4 by connecting the connector socket 9a and the connector pin 9b, the electric power is rotated by the electric power to send out cooling air in the directions of arrows A and A '. The cooling air is sent to the fins of the heat sink 3 for cooling.

Since the microprocessor package 1 is small and generates high heat, it is desirable to arrange the cooling fan 5 near the package 1 so as to efficiently apply cooling air. However,
Since many signal lines are concentrated around the package 1 such as a microprocessor, the mounting bracket 6 must be installed away from the package 1 to a portion where the number of signal lines is reduced. In this case, the cooling efficiency is reduced. Therefore, in the case where the cooling fan 5 must be installed at a predetermined distance or more from the package 1 in the conventional design of the printed board, The signal lines are wired to each layer after being multi-layered so that the distance between the mounting bracket 6 and the package 1 is within a predetermined range.

[0009]

However, conventionally, a mounting bracket is fixed to a printed circuit board with screws, and a cooling fan is fixed to the mounting bracket with screws, so that the cooling fan is mechanically fixed and further cooled. Since the electrical connection had to be made by directly connecting the connector socket of the fan to the connector socket of the printed circuit board, a large number of parts were required to mount the cooling fan, which increased the cost and maintenance. Attachment and removal of the cooling fan at times were troublesome.

In addition, if the printed circuit board is multilayered in order to prevent a decrease in cooling efficiency as in the prior art, and mounting fixtures to be fixed by screwing are arranged near the package, the printed circuit board layer is not provided. Increasing the number increases the manufacturing cost.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide an electronic component cooling device on a printed circuit board having a structure for facilitating attachment and detachment of a cooling fan. It is in.

It is another object of the present invention to provide an electronic component cooling device on a printed circuit board which enables a cooling fan to be disposed near a package such as a microprocessor.

[0013]

SUMMARY OF THE INVENTION In order to achieve the above object, an electronic component cooling device on a printed circuit board according to the present invention air-cools electronic components such as a microprocessor disposed on the printed circuit board. In the cooling device, a cooling fan for blowing air to the electronic component, and a socket attached to the printed board, the socket fixed to the printed board removably the cooling fan, the socket is the Legs inserted into the micro holes provided on the printed circuit board, and are provided at positions where they come into contact with the power supply and signal connection contacts of the mounted cooling fan,
A connector mechanism for electrically connecting the cooling fan and the printed circuit board by mounting the cooling fan.

The socket is provided with a cooling fan holding portion for holding the cooling fan inserted from an opening surface, and the socket is provided in the cooling fan holding portion, and is provided with the cooling fan from the cooling fan holding portion. A cooling fan attaching / detaching mechanism for preventing detachment of the cooling fan and for supporting an operation of removing the cooling fan from the cooling fan holding portion.

Further, the cooling fan attachment / detachment mechanism includes a seesaw member which is pivotally supported in a substantially central portion by the holding portion and which rotates in the attachment / detachment direction of the cooling fan, and a member provided at one end of the seesaw member. A stopping projection, and the seesaw member is rotated by the mounting operation of the cooling fan. As a result, the locking projection engages with the recess of the cooling fan to lock the cooling fan. By rotating the seesaw member in the direction opposite to the direction of the mounting operation, the locking projection is disengaged from the concave portion of the cooling fan, and the cooling fan is pushed up.

The socket fixes the cooling fan at a predetermined angle with the printed circuit board.

Further, the socket is for fixing the cooling fan in a state of standing substantially vertically.

Still further, the socket fixes the cooling fan above the electronic component in a state substantially parallel to the printed circuit board.

Further, the socket has a hinge mechanism capable of adjusting a mounting angle of the fixed cooling fan.

[0020]

Preferred embodiments of the present invention will be described below with reference to the drawings.

Embodiment 1 FIG. 1 is a perspective view showing an overall configuration of an electronic component cooling device according to a first embodiment of the present invention, and a part thereof is cut away for convenience. FIG. 2 is a partial cross-sectional view of the cooling device attached to the printed circuit board when viewed from the side. The configuration of the present embodiment will be described with reference to these drawings.

The cooling device according to the present embodiment comprises a cooling fan 10 for sending out cooling air, and a socket 12 for fixing the cooling fan 10 to a printed circuit board 11. The cooling fan 10 includes a power supply and signal connection contact 13 provided on the bottom surface facing the printed circuit board 11, a concave portion 14 provided substantially in the center of the side surface, and a cutout provided at a corner between the side surface and the bottom surface. A notch 15 is provided. Although only one side is visible in the perspective view of FIG. 1, similar concave portions and notches are provided on the opposite side.

The socket 12 in the present embodiment is a member that is attached to the printed circuit board 11 and that detachably fixes the cooling fan 10 to the printed circuit board 11.
The socket 12 has a substantially U-shaped cross section, and the cooling fan 10
The cooling fan holding portion 16 having the guide function described above is used as a main portion, and the cooling fan 10 is mounted by being inserted into the cooling fan holding portion 16 from above the opening. In addition, the connector 1 is provided on the inner surface of the cooling fan holding portion 16 at a position where it contacts the contact 13 of the cooling fan 10 when it is mounted.
7 are provided. Printed circuit board 11 of socket 12
A connection pin 18 that is electrically connected to the connector 17 and forms a connector mechanism with the connector 17, and a fixing pin 19 as a leg for mechanically fixing the socket 12 to the printed circuit board 11 are provided on the bottom surface facing the connector 17. Is provided. In the present embodiment, the fixing pin 19 is formed at a position facing the fixing hole 20 having a small diameter provided on the printed circuit board 11 and has a size that can be mounted in the fixing hole 20. Twelve corners are provided at four corners. The connection pin 18 engages with a through-hole hole 21 provided on the printed circuit board 11 to electrically connect the cooling fan 10.

Further, by being supported by a rotating shaft 22 provided at a substantially central portion of each of the opposing side surfaces of the cooling fan holding portion 16, a lever 23 as a seesaw member that rotates in the mounting / detaching direction of the cooling fan 10 is provided. Is provided. One end of the lever 23 on the side where the cooling fan 10 is inserted has a locking projection 24, and the other end side has a cooling fan removal projection 25.
Are provided, respectively, and the lever 23 and each protrusion 2
The cooling fans 4 and 25 form a cooling fan attaching / detaching mechanism for preventing the mounted cooling fan 10 from being detached and supporting the removal operation of the cooling fan 10.

FIG. 2 shows a ball grid array type package 26 such as a microprocessor, a solder ball 27 for electrically connecting and mechanically fixing the package 26 and the printed circuit board 11, and a package 2.
Although a heat sink 28 is shown attached to 6, the components may be conventional.

A characteristic feature of the present embodiment is that the cooling fan 10 can be electrically and mechanically connected to the printed circuit board 11 only by mounting the cooling fan 10 on a socket 12 previously fixed to the printed circuit board 11. That is. As a result, the cooling fan can be easily printed without mechanical fixing by screwing as in the past, or electrical connection by connecting the contact socket of the cooling fan to the connector pin of the printed circuit board. Can be attached to a substrate.

Next, a procedure for attaching the cooling device according to the present embodiment to the printed circuit board 11 will be described.

First, the socket 12 is fixed to the printed circuit board 11. This is because the connection pin 18 is
Next, the socket 12 is moved in the direction of arrow B shown in FIG. 1 so that the fixing pins 19 are inserted into the fixing holes 20 respectively. Then, the pins 18 and 19 are fixed to the printed circuit board 11 by soldering. As is apparent from this, each of the pins 18, 19 or the through-hole 21 is inserted so that each of the pins 18, 19 can be inserted into the through-hole 21 and the fixing hole 20 provided on the printed circuit board 11, respectively. And the position of the fixing hole 20 need to be designed.

Next, the cooling fan 10 is inserted in the direction of arrow C along the U-shaped guide of the cooling fan holding portion 16 of the socket 12 attached to the printed circuit board 11. When the cooling fan 10 is mounted on the socket 12, the contacts 13 of the cooling fan 10
7 is electrically connected. Thereby, the cooling fan 10
Are electrically connected to the printed circuit board 11, and power is supplied from the printed circuit board 11. Further, the cooling fan 1 is mounted by the mounting action of the cooling fan 10 in the direction of arrow C.
The notch 15 provided on the lower side of the side surface of the abutment 0 comes into contact with the projection 25 for removing the cooling fan, and tries to push the projection 25 for removing the cooling fan to the outside of the cooling fan holder 16. As a result, the lever 23 rotates about the rotation shaft 22, and as a result, the locking projection 24 engages with the concave portion 14 of the inserted cooling fan 10. Thus, the cooling fan 10 can be locked to the socket 12 without manually performing the locking operation. As described above, simply by mounting the cooling fan 10 in the socket 12, the cooling fan 10 can be electrically connected to the printed circuit board 11, fixed mechanically, and automatically locked.

On the other hand, when removing the cooling fan 10 from the socket 12, the lever 23 may be rotated in the opposite direction. That is, the locking projections 24 are
4 or depressed on the lower side of the rotating shaft 22, approximately near the cooling fan removal projection 25. As a result, the locking projection 24 is separated from the recess 14 of the cooling fan 10, so that the cooling fan 10 can be easily removed from the socket 12. Further, if the cooling fan 10 is rotated while holding the locking projection 24, the cooling fan 10 can be pushed up at the cooling fan removal projection 25, so that the cooling fan 10 can be more easily removed.

In the present embodiment, the structure described above allows the cooling fan 10 to be electrically connected to the printed circuit board 11 and to be mechanically fixed only by inserting the cooling fan 10 into the socket 12. And can be locked automatically. Also, since the cooling fan 10 can be easily removed, the cooling fan can be easily attached and detached at the time of maintenance or the like. Further, since the number of parts is small, this effect can be achieved at low cost.

Further, in the present embodiment, the socket 12
The fixing holes 20 and the through-holes 15 necessary for fixing the circuit board 11 to the printed circuit board 11 and for electrically connecting the cooling fan 10 are small in size so that the signal wiring of the printed circuit board 11 is not hindered. Therefore, the cooling fan 10 can be arranged near the package 26. Therefore, the heat generated in the package 26 conducted to the fins of the heat sink 28 is transmitted from the cooling fan 10 erected substantially vertically near the package 26 in the directions of arrows D and D ′ along the printed circuit board 11. The cooling air is efficiently cooled.

In the present embodiment, the fixing pins 19 are provided at the four corners of the bottom surface of the socket 12, but they may be provided in accordance with the arrangement and number of the fixing holes 20 provided in the printed circuit board 11. become. In the present embodiment,
In order to securely fix the printed circuit board 11, the fixing pin 1
9 was soldered in the same manner as the connection pin 18, but as shown in FIG.
It may be simply fitted.

Embodiment 2 FIG. 3 is a perspective view showing an overall configuration of an electronic component cooling device according to a second embodiment of the present invention, and FIG. 4 is a partial view of the cooling device attached to a printed circuit board when viewed from a side. It is sectional drawing. The configuration of the present embodiment will be described with reference to these drawings.
The same or corresponding components as those described in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted unless necessary.

In the first embodiment, the cooling fan 10 is erected and fixed in the vicinity of the microprocessor as in the conventional example. However, in the present embodiment, the cooling fan is mounted on the printed board 11 above the microprocessor. It is characterized in that it is arranged so as to be fixed in a state substantially parallel to.

That is, the socket 12 in the present embodiment is provided so as to cover the package 26 and the heat sink 28. Therefore, 4 provided at the corner of the socket 12
The length of the fixing pin 19 is set so that the installation height of the cooling fan holding portion 16 is higher than the fins of the heat sink 28. Further, unlike the first embodiment, since the cooling fan 10 is placed in a horizontal state, the upper surface of the cooling fan holding portion 16 is formed flat. Further, receiving holes 30 are provided at positions corresponding to the mounting pins 29 provided at the four corners of the cooling fan 10 and used for mechanical holding.

The procedure for mounting the cooling device of the present embodiment having the above configuration to the printed circuit board 11 is basically the same as that of the first embodiment, in which the connection pin 18 is provided in a through-hole and the fixing pin 19 is provided for fixing. After being inserted into the holes, they are fixed by soldering. Also in the present embodiment, the connection pins 18 and the fixing pins 19
Since it is sufficiently small so as not to hinder the signal wiring of the package 26, it is possible to arrange it so as to surround the package 26.

The contact 13 and the mounting pin 29 of the cooling fan 10 are inserted into the connector 17 and the receiving hole 30 provided on the upper surface of the trapezoidal cooling fan holding portion 16, respectively. The diameter of the receiving hole 30 is adjusted so that the cooling fan 10 does not fall out accidentally due to vibration during transportation.
, The entrance of the receiving hole 30 is formed slightly larger to facilitate insertion. Thus, the cooling fan 10 is electrically connected to the printed circuit board 11 and mechanically fixed by being mounted on the socket 12. Further, the cooling fan 10 locked by the receiving hole 30 can be easily removed from the socket 12 by lifting the cooling fan 10 upward.

FIG. 4 shows a state in which the cooling fan 10 is installed. When the cooling fan 10 is energized in this state, the cooling fan 10 rotates and sends the cooling air in the directions of arrows E and E '. Of the heat sink 28 generated in the package 26 by spraying the heat sink 28
The heat conducted to the fins is efficiently cooled.

Embodiment 3 FIG. 5 is a front view showing an entire configuration of an electronic component cooling device according to a third embodiment of the present invention, and is partially cut away for convenience. FIG. 6 is a partial cross-sectional view of the cooling device attached to the printed circuit board when viewed from the side. The configuration of the present embodiment will be described with reference to these drawings. In the first embodiment,
Components that are the same as or correspond to the components described in are denoted by the same reference numerals, and a description thereof will be omitted unless necessary.

In the first embodiment, the cooling fan 10 is erected near the microprocessor, that is, fixed at an angle substantially perpendicular to the printed circuit board 11, as in the conventional example. Further, in the second embodiment, the cooling fan 10 is fixed to a state in which the cooling fan 10 is laid on the upper side of the microprocessor, that is, at an angle substantially parallel to the printed board 11. The present embodiment is characterized in that the cooling fan 10 can be fixed at a desired angle with respect to the printed board 11.

That is, the socket 12 in the present embodiment holds the cooling fan 10 and is movable, the socket movable portion 31, the socket fixed portion 32 fixed to the printed circuit board 11, and the socket movable portion 31 are rotated. And a hinge 33 for allowing the socket movable portion 3
1 can be held by the hinge 33 so as to be rotatable in the directions of G and G 'and at a desired angle. The connector 17 of the socket 12 and the connection pin 18 are connected at the hinge 33 so as to be able to bend so as to cope with this turning action. Further, the cooling fan holding mechanism and the attaching / detaching mechanism of the socket movable section 31 and the fixing mechanism of the socket fixing section 32 to the printed circuit board 11 are the same as those in the first embodiment.
For this reason, the procedure for attaching the cooling device to the printed circuit board 11 in the present embodiment is the same as that in the first embodiment, and a description thereof will be omitted. By simply mounting the cable on the socket 12, the printed circuit board 11 can be electrically and mechanically connected.

Further, in this embodiment, the cooling fan 10 can be inclined at a desired angle by the hinge 33, so that the direction of the cooling air to the heat sink 28 can be changed. Of course, even when the cooling fan 10 is tilted, the connector 17 and the connection pin 18 are electrically connected.

According to the present embodiment, if the package 2
Even if the socket 12 cannot be installed in the vicinity of 6, the cooling air can be blown from the direction of F 'near the heat sink 28 by tilting the cooling fan 10, so that the cooling air is generated in the package 26 and is transmitted to the fins of the heat sink 28. The heat generated can be efficiently cooled.

In this embodiment, if the height of the socket fixing portion 32 is made adjustable, the cooling fan 10 can be mounted on the printed circuit board in the same manner as in the second embodiment as well as in the cooling device of the first embodiment. Package 2 parallel to 11
6 can be cooled from directly above.

[0046]

According to the present invention, electrical connection and mechanical fixation can be reliably and easily achieved only by mounting the cooling fan on the socket. Further, since a fixing screw and an electrical connector are not required, a low-cost cooling device can be obtained.

Further, since the structure for fixing to the printed circuit board can be reduced in size, the cooling fan can be arranged near the electronic component without obstructing the wiring around the electronic component.

Further, since a mechanism capable of securely locking the cooling fan in the state of being mounted on the socket is provided, it does not come off accidentally due to vibration during transportation. In addition, even when the cooling fan needs to be replaced due to a failure or the like, the structure is such that it can be easily attached and detached, so that the maintenance time can be further shortened.

Further, since the cooling fan can be erected substantially vertically with respect to the printed circuit board, the electronic components arranged in the vicinity of the cooling fan can be efficiently cooled.

Further, since the cooling fan can be disposed above the electronic components on the printed circuit board, the electronic components disposed below the cooling fan can be efficiently cooled.

Further, since the mounting angle of the cooling fan can be adjusted, the cooling air from the cooling fan can be blown to the electronic components from the most efficient angle.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an overall configuration of an electronic component cooling device according to a first embodiment of the present invention.

FIG. 2 is a partial cross-sectional view of the cooling device mounted on a printed circuit board according to the first embodiment when viewed from a side.

FIG. 3 is a perspective view illustrating an overall configuration of an electronic component cooling device according to a second embodiment of the present invention.

FIG. 4 is a partial cross-sectional view of a cooling device mounted on a printed circuit board according to a second embodiment when viewed from a side surface.

FIG. 5 is a front view showing an overall configuration of an electronic component cooling device according to a third embodiment of the present invention.

FIG. 6 is a partial cross-sectional view of a cooling device mounted on a printed circuit board according to a third embodiment when viewed from a side.

FIG. 7 is a partial cross-sectional view showing a printed circuit board to which a conventional heat sink for cooling a microprocessor and a cooling fan are attached.

[Explanation of symbols]

Reference Signs List 10 cooling fan, 11 printed circuit board, 12 socket, 13 contact, 14 recess, 15 notch, 16 cooling fan holder, 17 connector, 18
Connection pin, 19 fixing pin, 20 fixing hole, 21 through hole hole, 22 rotating shaft, 23 lever, 24 locking projection, 25 cooling fan removal projection, 26 package, 27 solder ball, 28 heat sink, 29
Mounting pin, 30 receiving hole, 31 socket movable part, 32
Socket fixing part, 33 hinge.

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E322 AA01 AA11 AB07 AB11 BA04 BB03 5E336 AA04 AA09 BB01 BB02 BC04 BC06 CC31 CC43 CC60 DD12 DD22 DD26 DD38 EE01 EE15 GG09 GG23 5F036 AA01 BB35 BC33

Claims (7)

[Claims] 1. A cooling device for air-cooling an electronic component such as a microprocessor disposed on a printed circuit board, comprising: a cooling fan for blowing air to the electronic component; and a cooling fan attached to the printed circuit board. And a socket for detachably fixing the cooling fan to the printed circuit board, wherein the socket is inserted into a minute hole provided on the printed circuit board, and a power supply and a signal of the mounted cooling fan. A connector mechanism that is disposed at a position where the cooling fan is mounted on the printed circuit board, the connector mechanism electrically connecting the cooling fan to the printed circuit board when the cooling fan is mounted. Electronic component cooling device. 2. The cooling fan holding section for holding the cooling fan inserted from an opening surface, the socket being provided in the cooling fan holding section, and receiving the cooling fan from the cooling fan holding section. 2. The cooling device for electronic components on a printed circuit board according to claim 1, further comprising: a cooling fan attaching / detaching mechanism for preventing detachment of the cooling fan and for supporting an operation of removing the cooling fan from the cooling fan holding portion. 3. The see-saw member, wherein the cooling fan attaching / detaching mechanism is pivotally supported in a mounting / removing direction of the cooling fan by being supported at a substantially central portion by the holding portion, and a member provided at one end of the see-saw member. A locking projection, and the see-saw member is rotated by the mounting operation of the cooling fan, so that the locking projection engages with the recess of the cooling fan to lock the cooling fan. The locking projection is disengaged from the concave portion of the cooling fan by rotating the seesaw member in a direction opposite to the direction of the mounting operation, and the cooling fan is pushed up. An electronic component cooling device on a printed circuit board as described in the above. 4. The cooling device according to claim 1, wherein the socket fixes the cooling fan at a predetermined angle with the printed circuit board. 5. The socket according to claim 4, wherein the cooling fan is fixed in a state where the cooling fan stands substantially vertically.
An electronic component cooling device on a printed circuit board as described in the above. 6. The cooling device for electronic components on a printed circuit board according to claim 5, wherein the socket fixes the cooling fan above the electronic component in a state substantially parallel to the printed circuit board. 7. The electronic component cooling device on a printed circuit board according to claim 1, wherein the socket has a hinge mechanism capable of adjusting a mounting angle of the fixed cooling fan.