JPS63318010A - Flexible wiring plate - Google Patents
Flexible wiring plateInfo
- Publication number
- JPS63318010A JPS63318010A JP62154824A JP15482487A JPS63318010A JP S63318010 A JPS63318010 A JP S63318010A JP 62154824 A JP62154824 A JP 62154824A JP 15482487 A JP15482487 A JP 15482487A JP S63318010 A JPS63318010 A JP S63318010A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- flexible wiring
- wiring board
- filamentous
- thread
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011810 insulating material Substances 0.000 claims abstract description 47
- 239000004744 fabric Substances 0.000 claims abstract description 34
- 229920005989 resin Polymers 0.000 claims abstract description 28
- 239000011347 resin Substances 0.000 claims abstract description 28
- 239000000463 material Substances 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 15
- 229920001721 polyimide Polymers 0.000 claims abstract description 8
- 239000002131 composite material Substances 0.000 claims abstract description 7
- 239000004677 Nylon Substances 0.000 claims abstract description 4
- 239000000805 composite resin Substances 0.000 claims abstract description 4
- 229920001778 nylon Polymers 0.000 claims abstract description 4
- 239000004020 conductor Substances 0.000 claims description 52
- 239000003822 epoxy resin Substances 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 5
- -1 fluororesin Polymers 0.000 claims description 5
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 229920001225 polyester resin Polymers 0.000 claims description 4
- 239000004645 polyester resin Substances 0.000 claims description 4
- 239000009719 polyimide resin Substances 0.000 claims description 4
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 3
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 claims description 3
- 239000004925 Acrylic resin Substances 0.000 claims description 3
- 229920000178 Acrylic resin Polymers 0.000 claims description 3
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 3
- 239000004695 Polyether sulfone Substances 0.000 claims description 3
- 239000004697 Polyetherimide Substances 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 3
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 claims description 3
- 239000004917 carbon fiber Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 3
- 229920001643 poly(ether ketone) Polymers 0.000 claims description 3
- 229920006122 polyamide resin Polymers 0.000 claims description 3
- 229920005668 polycarbonate resin Polymers 0.000 claims description 3
- 239000004431 polycarbonate resin Substances 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 229920006393 polyether sulfone Polymers 0.000 claims description 3
- 229920001601 polyetherimide Polymers 0.000 claims description 3
- 229920013716 polyethylene resin Polymers 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 abstract description 5
- 229910045601 alloy Inorganic materials 0.000 abstract description 4
- 239000000956 alloy Substances 0.000 abstract description 4
- 229910052737 gold Inorganic materials 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 229920002647 polyamide Polymers 0.000 abstract description 4
- 229910052709 silver Inorganic materials 0.000 abstract description 3
- 239000004753 textile Substances 0.000 abstract 2
- 239000011295 pitch Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000009958 sewing Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000004952 Polyamide Substances 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000012784 inorganic fiber Substances 0.000 description 2
- 238000010297 mechanical methods and process Methods 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 235000011194 food seasoning agent Nutrition 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000009940 knitting Methods 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、フレキシブル配線板に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a flexible wiring board.
フレキシブル配線板は、回路部品を接続する電気配線を
、回路設計に基いて配線図形に表現し、これをフォト・
エツチング法などの技術によって、フレキシブルな絶縁
基板」二に導電層の配線図形として形成された板であっ
て、配線と部品搭載の両機能を有するものである。Flexible wiring boards represent the electrical wiring that connects circuit components in a wiring diagram based on the circuit design, and then photo-print this.
A flexible insulating substrate is a board formed with a conductive layer wiring pattern using techniques such as etching, and has both wiring and component mounting functions.
このフレキシブル配線板は、使用目的により種々の形状
、特性が要求され、例えば、大型電子計算機や大型画像
機器のなどのユニット間の接続には、ピッチ間隔１００
μｍ１長さ１メ一トル以」二の長尺のフレキシブル配線
板も用いられている。This flexible wiring board is required to have various shapes and characteristics depending on the purpose of use.
Flexible wiring boards with lengths of 1 μm and 1 meter or more are also used.
従来のフレキシブル配線板は、ポリイミドフィルムまた
はポリエステルフィルムのなどのフレキシブル絶縁基板
の上に、導電ペーストで印刷法などにより導電パターン
（回路）が形成されたもの、若しくは、フレキシブル絶
縁基板の上に接着された銅箔またはアルミ箔をフォト・
エツチング法なでにより導電パターン（回路）が形成さ
れたものである。Conventional flexible wiring boards are those in which a conductive pattern (circuit) is formed using a printing method using conductive paste on a flexible insulating substrate such as polyimide film or polyester film, or in which a conductive pattern (circuit) is formed on a flexible insulating substrate such as a polyimide film or polyester film. Copper foil or aluminum foil can be photo-printed.
A conductive pattern (circuit) is formed by etching.
フレキシブル絶縁基板上に導電性パターンが形成された
従来のフレキシブル配線板では、薄板状に成形してフレ
キシブル性を付与できる絶縁材料に制限され、従来から
用いられている絶縁性材料にはポリイミドフィルムやポ
リエステルフィルムなどしかなかった。同様に、導電性
パターンを形成する印刷法やフォト・エツチング法など
の制約から導電性材料の種類も一定の範囲に限定されて
いる。Conventional flexible wiring boards, in which conductive patterns are formed on flexible insulating substrates, are limited to insulating materials that can be formed into thin plates to provide flexibility, and insulating materials conventionally used include polyimide films and All that was available was polyester film. Similarly, the types of conductive materials are limited to a certain range due to restrictions on printing methods, photo-etching methods, etc. for forming conductive patterns.
従来の長尺のフレキシブル配線板では、ピッチ間隔を６
０μｍ程度にするのが限界であり、接続部を有しないも
のでは２メ一トル程度が限界であり、これらを安価に量
産することが困難である。Conventional long flexible wiring boards have a pitch interval of 6
The limit is about 0 μm, and the limit is about 2 meters for those without connecting parts, making it difficult to mass-produce these at low cost.
この発明は上述の背景に基づきなされたものであり、そ
の目的とするところは、絶縁性材料および導電性材料の
選択の幅か広く、長尺のフレキシブル配線板も廉価に量
産できるフレキシブル配線板を提供することである。This invention was made based on the above-mentioned background, and its purpose is to provide a flexible wiring board that has a wide selection of insulating and conductive materials and that can mass-produce long flexible wiring boards at low cost. It is to provide.
上記の課題はこの発明のフレキシブル配線板により解決
される。The above problems are solved by the flexible wiring board of the present invention.
すなわち、この発明のフレキシブル配線板は、糸状導電
性材料および糸状絶縁性キイ料より組合された編織物か
らなり、該糸状導電性材料の一部若しくは全部が導電パ
ターンを形成することを特徴とするものである。That is, the flexible wiring board of the present invention is characterized in that it is made of a knitted fabric made of a thread-like conductive material and a thread-like insulating key material, and a part or all of the thread-like conductive material forms a conductive pattern. It is something.
この発明の−の態様としては、編織物が、糸状導電性材
料をたて糸として用い、糸状絶縁性材料をよこ糸として
用いて織られたものであるとすることができる。In the - aspect of the present invention, the knitted fabric may be woven using a filamentous conductive material as the warp yarn and a filamentous insulating material as the weft yarn.
この発明の前記の態様において、織られた糸状導電性材
料が、隣接する糸状導電性材料と一定間隔を有するもの
であるとすることができる。In the above aspects of the invention, the woven thread-like electrically conductive material may have a constant spacing from adjacent thread-like electrically conductive materials.
この発明の−の態様としては、編織物を、糸状導電性材
料および糸状絶縁性材料を用いて編んだものとすること
ができる。In a negative aspect of the present invention, the knitted fabric may be knitted using a filamentous conductive material and a filamentous insulating material.
この発明の他の−の態様としては、編織物を、糸状絶縁
性材料より形成された布状絶縁材料に糸状導電性材料が
縫い込まれたものとすることができる。As another aspect of the present invention, the knitted fabric may be one in which a thread-like conductive material is sewn into a cloth-like insulating material formed from a thread-like insulating material.
この発明の前記の態様において、編織物の片面もしくは
両面に可撓性絶縁層が積層されたものとすることかでき
る。In the above embodiment of the invention, a flexible insulating layer may be laminated on one or both sides of the knitted fabric.
この発明の前記の態様において、糸状導電性材料を、糸
状に成形された導電性金属、糸状材料に導電性金属か被
覆された複合材料、または炭素繊維とすることができる
。In the above aspect of the invention, the thread-like conductive material can be a conductive metal formed into a thread, a composite material in which a thread-like material is coated with a conductive metal, or carbon fiber.
この発明の前記の態様において、糸状導電性材料を、外
表面の一部もしくは全面に絶縁コーティングが施された
ものとすることができる。In the above-described aspect of the invention, the thread-like conductive material may be coated with an insulating coating on part or all of its outer surface.
この発明の前記の態様において、糸状導電性材料および
糸状絶縁性材料の断面形状を、円形、楕円形、矩形、多
角形、または菱形とすることができる。In the above aspects of the invention, the cross-sectional shapes of the filamentous conductive material and filamentous insulating material may be circular, elliptical, rectangular, polygonal, or diamond-shaped.
この発明の前記の態様において、糸状絶縁性オ」料を、
ポリイミド樹脂、ポリアミド樹脂、塩化ビニル樹脂、ア
クリル樹脂、塩化ビニリデン樹脂、エポキシ樹脂、ガラ
ス、ガラス−エポキシ樹脂、ポリエステル樹脂、ポリエ
ーテルケトン樹脂、ポリエーテルサルフォン樹脂、ポリ
カーボネート樹脂、ポリフェニレンサルファイド樹脂、
フッ素樹脂、ポリエーテルイミド樹脂、ポリエチレン樹
脂、ポリプロピレン樹脂、ビスマレイミド樹脂、ポリエ
ステルナイロン複合樹脂から選ばれたものとすることか
できる。以下、この発明をより具体的に説明する。In the above embodiment of the invention, the filamentous insulating material is
Polyimide resin, polyamide resin, vinyl chloride resin, acrylic resin, vinylidene chloride resin, epoxy resin, glass, glass-epoxy resin, polyester resin, polyether ketone resin, polyether sulfone resin, polycarbonate resin, polyphenylene sulfide resin,
It can be selected from fluororesin, polyetherimide resin, polyethylene resin, polypropylene resin, bismaleimide resin, and polyester nylon composite resin. This invention will be explained in more detail below.
糸状導電性材料
この発明によるフレキシブル配線板の材料は、主として
糸状導電性材料と糸状絶縁性材料とである。この発明に
おいて用いることのできる糸状導電性材料として、糸状
に成形された導電性金属、糸状材料に導電性金属が被覆
された複合相、導電性金属と糸状絶縁相と撚り合わせた
複合相および炭素繊維などがある。ここで導電性金属に
は、金、銀、アルミニウム、銅、鉄、スズ、ニッケルな
どの１１１体金属、およびこれらの合金がある。また、
糸状材料に導電性金属が？ｍ覆された複合材には、金属
線または合金線、もしくは有機／無機繊維などの糸状材
料に、金、銀、アルミニウム、銅、秋、スズ、ニッケル
などの単体金属、およびこれらの合金などの導電性金属
で被覆された複合材がある。Thread-like conductive material The materials of the flexible wiring board according to the present invention are mainly a thread-like conductive material and a thread-like insulating material. Thread-like conductive materials that can be used in this invention include a conductive metal formed into a thread, a composite phase in which a thread-like material is coated with a conductive metal, a composite phase in which a conductive metal and a thread-like insulating phase are twisted together, and carbon. There are fibers, etc. Here, the conductive metals include 111 metals such as gold, silver, aluminum, copper, iron, tin, and nickel, and alloys thereof. Also,
Conductive metal in thread-like material? Composite materials include thread-like materials such as metal wires or alloy wires or organic/inorganic fibers, combined with elemental metals such as gold, silver, aluminum, copper, aluminum, tin, nickel, and their alloys. There are composite materials coated with conductive metals.
さらに、炭素繊維などの導電性無機繊維を導電性材料と
して用いることができる。Furthermore, conductive inorganic fibers such as carbon fibers can be used as the conductive material.
この発明において用いられる糸状導電性材料は、その外
表面の一部若しくは全面に絶縁コーティングを施しても
よい。このように、絶縁コーティングを施すことにより
、所定の位置の導電パターンを絶縁することができる。The filamentous conductive material used in the present invention may be coated with an insulating coating on part or all of its outer surface. In this manner, by applying an insulating coating, the conductive pattern at a predetermined position can be insulated.
糸状導電性材料の寸法および形状は、フレキシブル配線
板の用途および形状などに応じて適宜選択することがで
き、その断面形状は、好ましくは、円形、楕円形、矩形
、多角形、および菱形などである。The dimensions and shape of the filamentous conductive material can be appropriately selected depending on the use and shape of the flexible wiring board, and its cross-sectional shape is preferably circular, oval, rectangular, polygonal, rhomboid, etc. be.
糸状絶縁性材料
この発明における糸状絶縁性材料は、フレキシブル配線
板に用いた場合に十分の絶縁性を有し、糸状に成形しか
つ配線板に用いた場合に十分な機械的強度を有するもの
である。このような絶縁性材料として、ポリイミド樹脂
、ポリアミド樹脂、塩化ビニル樹脂、アクリル樹脂、塩
化ビニリデン樹脂、エポキシ樹脂、ガラス、ガラス−エ
ポキシ樹脂、ポリエステル樹脂、ポリエーテルケトン樹
脂、ポリエーテルサルフォン樹脂、ポリカーボネ一ト樹
脂、ポリフェニレンサルファイド樹脂、フッ素樹脂、ポ
リエーテルイミド樹脂、ポリエチレン樹脂、ポリプロピ
レン樹脂、ビスマレイミド樹脂、ポリエステルナイロン
複合樹脂などがある。Thread-like insulating material The thread-like insulating material of the present invention has sufficient insulation properties when used in a flexible wiring board, and has sufficient mechanical strength when formed into a thread shape and used in a wiring board. be. Examples of such insulating materials include polyimide resin, polyamide resin, vinyl chloride resin, acrylic resin, vinylidene chloride resin, epoxy resin, glass, glass-epoxy resin, polyester resin, polyether ketone resin, polyether sulfone resin, and polycarbonate resin. Examples include polyurethane resin, polyphenylene sulfide resin, fluororesin, polyetherimide resin, polyethylene resin, polypropylene resin, bismaleimide resin, and polyester nylon composite resin.
特に、従来の絶縁性材料として用いられていなかったポ
リフェニレンサルファイド樹脂などを、この発明のフレ
キシブル配線板において使用することによって、ポリフ
ェニレンサルファイド樹脂成形品などとの一体成形など
の利点を得ることができる。この材料として市販の繊維
を用いることもできる。In particular, by using polyphenylene sulfide resin, which has not been used as a conventional insulating material, in the flexible wiring board of the present invention, advantages such as integral molding with polyphenylene sulfide resin molded products can be obtained. Commercially available fibers can also be used as this material.
糸状絶縁性材料の寸法および形状は、フレキシブル配線
板の用途および形状などに応じて適宜選択することがで
き、その断面形状は、好ましくは、円形、楕円形、矩形
、多角形、および菱形などである。The dimensions and shape of the thread-like insulating material can be appropriately selected depending on the use and shape of the flexible wiring board, and the cross-sectional shape is preferably circular, oval, rectangular, polygonal, diamond, etc. be.
蛙蘇惣
この発明のフレキシブル配線板は、編織物からなる。こ
の編織物は前記の糸状導電性材料および糸状絶縁性材料
より組合せて形成され、この糸状導電性材料の一部若し
くは全部か導電パターンを成す。The flexible wiring board of this invention is made of a knitted fabric. This knitted fabric is formed by combining the above-mentioned filamentous conductive material and filamentous insulating material, and a part or all of the filamentous conductive material forms a conductive pattern.
この発明の好ましい態様の編織物は、糸状導電性材料を
たて糸として用い、糸状絶縁性材料をよこ糸として用い
て織ったもの、若しくは糸状導電性材料をよこ糸として
用い、糸状絶縁性材料をたて糸として用いて織ったもの
である。この発明においてその織る様式は、任意であり
、例えは、たて糸とよこ糸が１本ごとに交錯する組織の
平織、たて糸またはよこ糸の浮きが斜めに続いて斜文線
をつくる組織のあや織（斜文織）、などがある。A knitted fabric according to a preferred embodiment of the present invention is woven using a filamentous conductive material as the warp and a filamentous insulating material as the weft, or one in which a filamentous conductive material is used as the weft and a filamentous insulating material is used as the warp. It is woven by hand. In this invention, the weaving style is arbitrary, and examples include plain weave, which has a structure in which the warp and weft threads intersect each other, and twill weave, which has a structure in which floating warp or weft threads continue diagonally to create diagonal lines. Bunori), etc.
第１図は、糸状絶縁性材料２ａをたて糸、糸状導電性材
料３と糸状絶縁性材料２ｂとを交互によこ糸として用い
る平組織の編織物１の一態様の拡大図を示す。この態様
では、導電パターンはパターン幅が糸状導電性材料の太
さを有し、ピッチ間の幅ρを持つ横に平行な複数線を形
成する。FIG. 1 shows an enlarged view of one embodiment of a knitted fabric 1 having a flat structure in which a thread-like insulating material 2a is used as a warp, and a thread-like conductive material 3 and a thread-like insulating material 2b are alternately used as a weft. In this embodiment, the conductive pattern has a pattern width equal to the thickness of the thread-like conductive material and forms a plurality of horizontally parallel lines having a pitch pitch width ρ.
第２図は、糸状絶縁性材料２ａをたて糸、糸状導電性材
料３のみをよこ糸として用いる平組織の編織物１の別の
態様を示す。この態様においても織られた糸状導電性材
料３ａは、隣接する糸状導電性材料３ｂと一定間隔を何
する。FIG. 2 shows another embodiment of a knitted fabric 1 with a flat weave using only the thread-like insulating material 2a as the warp and the thread-like conductive material 3 as the weft. Also in this embodiment, the woven thread-like conductive material 3a is spaced at a constant interval from the adjacent thread-like conductive material 3b.
この発明の好ましい態様として、糸状導電性材料と糸状
絶縁性材料とで編んだ編織物を用いることができる。As a preferred embodiment of the present invention, a knitted fabric made of a thread-like conductive material and a thread-like insulating material can be used.
第４図は、糸状導電性材料３と糸状絶縁性材料２とを用
いて編んだ編織物の態様の拡大図を示す。FIG. 4 shows an enlarged view of an embodiment of a knitted fabric knitted using a thread-like conductive material 3 and a thread-like insulating material 2.
この態様ではパターン幅はｄに対応する。In this embodiment, the pattern width corresponds to d.
次いで、別の態様としての編織物には、糸状絶縁性材料
より形成された布状絶縁材料に糸状導電性材料か縫い込
まれたものかある。Next, in another embodiment of the knitted fabric, a thread-like conductive material is sewn into a cloth-like insulating material formed from a thread-like insulating material.
この態様において、布状絶縁材料の形成法および糸状導
電性材料の縫い込み法は、この発明の目的に反しない限
り任意である。このような縫い込み法として、例えば、
針、ミシンなどを用いた方法かある。In this embodiment, the method of forming the cloth-like insulating material and the method of sewing the thread-like conductive material are arbitrary as long as they do not contradict the purpose of the present invention. As such a sewing method, for example,
There are methods using needles, sewing machines, etc.
この態様の例の拡大図を第３図に示す。この例では、布
状絶縁材料２より得た平織の布状絶縁材料４に、糸状導
電性材料３が縫い込まれた編織物１である。この縫い込
まれた糸状導電性材料３は所望の導電パターンを形成す
ることができる。An enlarged view of an example of this embodiment is shown in FIG. This example is a knitted fabric 1 in which a thread-like conductive material 3 is sewn into a plain-woven cloth-like insulating material 4 obtained from a cloth-like insulating material 2 . The sewn thread-like conductive material 3 can form a desired conductive pattern.
さらに、この態様の別の例の拡大図を第５図に示す。こ
の例では、布状絶縁材料２を編んで得られた布状絶縁材
料４に、糸状導電性材料３が横に平行に縫い込まれた編
織物１である。Furthermore, an enlarged view of another example of this aspect is shown in FIG. This example is a knitted fabric 1 in which a thread-like conductive material 3 is sewn horizontally and parallel to a cloth-like insulating material 4 obtained by knitting a cloth-like insulating material 2.
この発明は上記態様例に限定されずこの発明の範囲に包
含される種々の変形例も可能である。This invention is not limited to the embodiments described above, but various modifications are possible that fall within the scope of this invention.
フレキシブル配線板
この発明のフレキシブル配線板は、糸状導電性材料の一
部若しくは全部から導電パターンが形成された編織物を
使用して得られる。この発明において、この編織物自体
をフレキシブル配線板とすることができる。さらに、こ
の編織物を切断加工・裁断加工などにより所望の形状に
成形することもできる。Flexible Wiring Board The flexible wiring board of the present invention is obtained by using a knitted fabric in which a conductive pattern is formed from part or all of a thread-like conductive material. In this invention, this knitted fabric itself can be used as a flexible wiring board. Furthermore, this knitted fabric can be formed into a desired shape by cutting, cutting, etc.
この編織物を別の部材と組合せて用いてもよい。This knitted fabric may be used in combination with another member.
例えば、編織物の片面もしくは両面に種々の材料を積層
または被覆させることもできる。その様な材料としてポ
リエステル樹脂、エポキシ樹脂、ポリイミド樹脂などの
可撓性絶縁材がある。For example, various materials can be laminated or coated on one or both sides of the knitted fabric. Such materials include flexible insulating materials such as polyester resin, epoxy resin, and polyimide resin.
この発明によるフレキシブル配線板は、通常のフレキン
プル配線板への応用の他、配線コネクタ、成形立体プリ
ント配線基板などの用途がある。The flexible wiring board according to the present invention can be used not only as a normal flexible wiring board but also as a wiring connector, a molded three-dimensional printed wiring board, and the like.
上記のように構成されたこの発明によるフレキンプル配
線板は下記の通り作用する。The flexible wiring board according to the present invention constructed as described above operates as follows.
編織物では、その編織物を構成する糸は互いに絡み合い
一定の形状を保持する。その編織物を構成する糸の一部
を糸状導電性材料で置換えるのみならず、更にこの糸状
導電性材料で所定の導電パターンを形成することにより
フレキシブルな配線板とすることができる。In knitted fabrics, the threads that make up the knitted fabric are intertwined with each other to maintain a certain shape. A flexible wiring board can be obtained not only by replacing some of the threads constituting the knitted fabric with a thread-like conductive material, but also by forming a predetermined conductive pattern with this thread-like conductive material.
この発明のフレキシブル配線板により、次の効果を得る
ことができる。With the flexible wiring board of the present invention, the following effects can be obtained.
（ａ）布状にできるものであれば、絶縁飼料としてこの
発明のフレキシブル配線板に使用することかできるので
、従来から使用されてきた絶縁性材料の種類に限定され
ずより自由な選択をすることができる。(a) Any material that can be made into a cloth shape can be used as insulating feed in the flexible wiring board of this invention, allowing for more freedom in selection without being limited to the types of insulating materials that have been conventionally used. be able to.
（ｂ）同様に、織ったり、編んたり、また縫ったりする
ことのできる導電材料である限り、導電材料としてこの
発明のフレキシブル配線板に使用することができるので
、従来から使用されてきた導電性拐料の種類に限定され
ずより自由な選択をすることかできる。(b) Similarly, as long as it is a conductive material that can be woven, knitted, or sewn, it can be used as a conductive material in the flexible wiring board of the present invention, so it can be used as a conductive material that has been used conventionally. You can make more free choices without being limited to the type of kidnapping fee.
（Ｃ）従来のフレキシブル配線板で製造が困難であった
長尺のものにおいても、この発明による構成を有するフ
レキシブル配線板により容易に製造することができる。(C) Even long flexible wiring boards that are difficult to manufacture with conventional flexible wiring boards can be easily manufactured with the flexible wiring board having the structure according to the present invention.
（ｄ）印刷法やフォト・エツチング法などの複雑かつ繁
雑な方法に拠らず機械的な方法により導電パターンを形
成することができるので、量産により廉価にこの発明の
フレキシブル配線板を製造することができる。(d) Since the conductive pattern can be formed by a mechanical method without relying on complicated and complicated methods such as printing methods or photo-etching methods, the flexible wiring board of the present invention can be manufactured at low cost through mass production. Can be done.
（ｅ）機械的な方法によるので、導電材料、絶縁材料の
制置を部分的に変えることも可能であるなどの利点があ
る。(e) Since it is based on a mechanical method, it has the advantage that it is possible to partially change the placement of the conductive material and the insulating material.
実施例１
ポリアミド糸（音大製、直径２５μｍ）をたて糸とし、
金線（国中電子工業製 直径２５μｍ）とポリアミド糸
（前記と同じ）を交互によこ糸として平織の編織物を製
造した。この編織物から、５０μｍのピッチ幅を有する
フレキシブル配線板５ｍを得た。Example 1 Polyamide yarn (manufactured by Ondai, diameter 25 μm) was used as the warp yarn,
A plain weave knitted fabric was produced using gold wire (manufactured by Kuninaka Electronics Co., Ltd., diameter 25 μm) and polyamide thread (same as above) as weft threads alternately. From this knitted fabric, a 5 m flexible wiring board having a pitch width of 50 μm was obtained.
実施例２
ポリアミド糸（音大製、直径６０μｍ）を用いて手織の
布状絶縁材料を作製し、これに銅線にニッケル、金メッ
キした４電性糸（三井金属鉱業製、直径５０μｍ）を用
いてミシンにより縫いこんで所望の回路パターン（導電
パターン）を形成した。Example 2 A hand-woven cloth-like insulating material was made using polyamide thread (manufactured by Ondai, diameter 60 μm), and a tetraelectric thread (manufactured by Mitsui Mining & Co., Ltd., diameter 50 μm) consisting of copper wire plated with nickel and gold was used for this. A desired circuit pattern (conductive pattern) was formed by sewing with a sewing machine.
第１図はこの発明による平織のフレキシブル配線板の一
例を示す拡大部分図、第２図は平織の配線板の別の態様
を示す拡大部分図、第３図は糸状導電性季」料か縫い込
まれた一実施例を示す拡大部公園、第４図はこの発明に
よる編まれた配線板の他の態様を示す拡大部分図、第５
図は導電糸が縫い込まれた一実施例を示す拡大部分図で
ある。
１・・・編織物、２・・・糸状絶縁性材料、３・・・糸
状導電性材料、４・・・布状絶縁材料。
出願人代理人 佐 藤 −雄
２ａ
第１図
ａ
第２図
一！１１閂舶中牢牛／′
”ド１曲体暉ヤー３
第４図
看薯晶し・
第５図Fig. 1 is an enlarged partial view showing an example of a plain weave flexible wiring board according to the present invention, Fig. 2 is an enlarged partial view showing another embodiment of the plain weave wiring board, and Fig. 3 is a thread-like conductive seasoning. FIG. 4 is an enlarged partial view showing another embodiment of the woven wiring board according to the present invention; FIG.
The figure is an enlarged partial view showing an embodiment in which a conductive thread is sewn. DESCRIPTION OF SYMBOLS 1... Knitted fabric, 2... Thread-like insulating material, 3... Thread-like conductive material, 4... Cloth-like insulating material. Applicant's representative Sato -O 2a Figure 1 a Figure 2 1! 11 Barrel ship middle prison cow/' ``Do 1 curved body 3 Fig. 4 Observation crystallization Fig. 5
Claims (1)
た編織物からなり、該糸状導電性材料の一部若しくは全
部が導電パターンを形成することを特徴とするフレキシ
ブル配線板。 ２、編織物が、糸状導電性材料をたて糸またはよこ糸と
して用い、糸状絶縁性材料をよこ糸またはたて糸として
用いて織られたものである特許請求の範囲第１項記載の
フレキシブル配線板。 ３、織られた糸状導電性材料が、隣接する糸状導電性材
料と一定間隔を有する特許請求の範囲第２項記載のフレ
キシブル配線板。 ４、編織物が、糸状導電性材料および糸状絶縁性材料を
用いて編んだものである特許請求の範囲第１項記載のフ
レキシブル配線板。 ５、編織物が、糸状絶縁性材料より形成された布状絶縁
材料に糸状導電性材料が縫い込まれたものである特許請
求の範囲第１項記載のフレキシブル配線板。 ６、編織物の片面もしくは両面に可撓性絶縁層が積層さ
れたものである特許請求の範囲第１項乃至第５項のいず
れか１項記載のフレキシブル配線板。 ７、糸状導電性材料が、糸状に成形された導電性金属、
糸状材料に導電性金属が被覆された複合材料、または炭
素繊維である特許請求の範囲第１項乃至第６項のいずれ
か１項記載のフレキシブル配線板。 ８、糸状導電性材料が、外表面の一部もしくは全面に絶
縁コーティングが施されたものである特許請求の範囲第
７項に記載のフレキシブル配線板。 ９、糸状導電性材料および糸状絶縁性材料の断面形状が
、円形、楕円形、矩形、多角形、または菱形である特許
請求の範囲第１項乃至第８項のいずれかに記載のフレキ
シブル配線板。 １０、糸状絶縁性材料が、ポリイミド樹脂、ポリアミド
樹脂、塩化ビニル樹脂、アクリル樹脂、塩化ビニリデン
樹脂、エポキシ樹脂、ガラス、ガラス−エポキシ樹脂、
ポリエステル樹脂、ポリエーテルケトン樹脂、ポリエー
テルサルフォン樹脂、ポリカーボネート樹脂、ポリフェ
ニレンサルファイド樹脂、フッ素樹脂、ポリエーテルイ
ミド樹脂、ポリエチレン樹脂、ポリプロピレン樹脂、ビ
スマレイミド樹脂、ポリエステルナイロン複合樹脂から
選ばれた特許請求の範囲第１項乃至第９項のいずれかに
記載のフレキシブル配線板。[Claims] 1. A flexible wiring board comprising a knitted fabric made of a combination of a filamentous conductive material and a filamentous insulating material, wherein a part or all of the filamentous conductive material forms a conductive pattern. . 2. The flexible wiring board according to claim 1, wherein the knitted fabric is woven using a filamentous conductive material as the warp or weft and a filamentous insulating material as the weft or warp. 3. The flexible wiring board according to claim 2, wherein the woven filamentous conductive material has a constant distance from adjacent filamentous conductive materials. 4. The flexible wiring board according to claim 1, wherein the knitted fabric is knitted using a filamentous conductive material and a filamentous insulating material. 5. The flexible wiring board according to claim 1, wherein the knitted fabric is a fabric in which a thread-like conductive material is sewn into a cloth-like insulating material formed from a thread-like insulating material. 6. The flexible wiring board according to any one of claims 1 to 5, wherein a flexible insulating layer is laminated on one or both sides of a knitted fabric. 7. A conductive metal in which a filamentous conductive material is formed into a filament;
The flexible wiring board according to any one of claims 1 to 6, which is a composite material in which a thread-like material is coated with a conductive metal, or carbon fiber. 8. The flexible wiring board according to claim 7, wherein the filamentous conductive material has an insulating coating applied to a part or the entire outer surface thereof. 9. The flexible wiring board according to any one of claims 1 to 8, wherein the cross-sectional shape of the thread-like conductive material and the thread-like insulating material is circular, elliptical, rectangular, polygonal, or diamond-shaped. . 10. The filamentous insulating material is polyimide resin, polyamide resin, vinyl chloride resin, acrylic resin, vinylidene chloride resin, epoxy resin, glass, glass-epoxy resin,
Patent claims selected from polyester resin, polyetherketone resin, polyethersulfone resin, polycarbonate resin, polyphenylene sulfide resin, fluororesin, polyetherimide resin, polyethylene resin, polypropylene resin, bismaleimide resin, polyester nylon composite resin The flexible wiring board according to any one of items 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62154824A JPS63318010A (en) | 1987-06-22 | 1987-06-22 | Flexible wiring plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62154824A JPS63318010A (en) | 1987-06-22 | 1987-06-22 | Flexible wiring plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63318010A true JPS63318010A (en) | 1988-12-26 |
Family
ID=15592678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62154824A Pending JPS63318010A (en) | 1987-06-22 | 1987-06-22 | Flexible wiring plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63318010A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2389861A (en) * | 2002-06-17 | 2003-12-24 | Ta Lai Sporting Goods Entpr Co | Conductive woven fabric |
| JP2004349002A (en) * | 2003-05-20 | 2004-12-09 | Hitachi Chem Co Ltd | Wiring member for transport aircraft and its manufacturing method |
| JP2006310554A (en) * | 2005-04-28 | 2006-11-09 | Katsuya Hiroshige | Aligned conductive wiring board |
| JP2006332647A (en) * | 2005-05-13 | 2006-12-07 | Sefar Ag | Circuit board and method of manufacturing the same |
| WO2008069275A1 (en) * | 2006-12-07 | 2008-06-12 | Nec Corporation | Wiring board and method for manufacturing the same |
| WO2008123114A1 (en) * | 2007-03-20 | 2008-10-16 | Junkosha Inc. | Flat cable |
| JP2009139838A (en) * | 2007-12-10 | 2009-06-25 | Furukawa Electric Co Ltd:The | Installation sheet of wire |
| JP2011525043A (en) * | 2008-06-10 | 2011-09-08 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Electronic fabric |
| JP2013107483A (en) * | 2011-11-21 | 2013-06-06 | Toyota Boshoku Corp | Electroconductive woven cloth member |
| WO2015033622A1 (en) * | 2013-09-04 | 2015-03-12 | オリンパスメディカルシステムズ株式会社 | Ultrasonic transducer and ultrasonic endoscope |
| US9320141B2 (en) | 2009-07-16 | 2016-04-19 | Nec Corporation | Wiring structure, cable, and method of manufacturing wiring structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5921514B2 (en) * | 1981-05-27 | 1984-05-21 | 株式会社測機舎 | Optical system of light wave distance meter |
| JPS6132309A (en) * | 1984-07-20 | 1986-02-15 | 第一電工株式会社 | Flat cable and method of producing same |
| JPS627189A (en) * | 1985-07-03 | 1987-01-14 | 小泉 安政 | Wiring board |
-
1987
- 1987-06-22 JP JP62154824A patent/JPS63318010A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5921514B2 (en) * | 1981-05-27 | 1984-05-21 | 株式会社測機舎 | Optical system of light wave distance meter |
| JPS6132309A (en) * | 1984-07-20 | 1986-02-15 | 第一電工株式会社 | Flat cable and method of producing same |
| JPS627189A (en) * | 1985-07-03 | 1987-01-14 | 小泉 安政 | Wiring board |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2389861A (en) * | 2002-06-17 | 2003-12-24 | Ta Lai Sporting Goods Entpr Co | Conductive woven fabric |
| JP2004349002A (en) * | 2003-05-20 | 2004-12-09 | Hitachi Chem Co Ltd | Wiring member for transport aircraft and its manufacturing method |
| JP2006310554A (en) * | 2005-04-28 | 2006-11-09 | Katsuya Hiroshige | Aligned conductive wiring board |
| JP2006332647A (en) * | 2005-05-13 | 2006-12-07 | Sefar Ag | Circuit board and method of manufacturing the same |
| WO2008069275A1 (en) * | 2006-12-07 | 2008-06-12 | Nec Corporation | Wiring board and method for manufacturing the same |
| US8367932B2 (en) | 2007-03-20 | 2013-02-05 | Junkosha Inc. | Flat cable |
| WO2008123114A1 (en) * | 2007-03-20 | 2008-10-16 | Junkosha Inc. | Flat cable |
| JP2009139838A (en) * | 2007-12-10 | 2009-06-25 | Furukawa Electric Co Ltd:The | Installation sheet of wire |
| JP2011525043A (en) * | 2008-06-10 | 2011-09-08 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Electronic fabric |
| US9320141B2 (en) | 2009-07-16 | 2016-04-19 | Nec Corporation | Wiring structure, cable, and method of manufacturing wiring structure |
| JP2013107483A (en) * | 2011-11-21 | 2013-06-06 | Toyota Boshoku Corp | Electroconductive woven cloth member |
| WO2015033622A1 (en) * | 2013-09-04 | 2015-03-12 | オリンパスメディカルシステムズ株式会社 | Ultrasonic transducer and ultrasonic endoscope |
| JP5869147B2 (en) * | 2013-09-04 | 2016-02-24 | オリンパス株式会社 | Method for manufacturing ultrasonic transducer |
| US9597710B2 (en) | 2013-09-04 | 2017-03-21 | Olympus Corporation | Method for manufacturing ultrasound transducer |
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