JPS63317305A - Cutting method for base - Google Patents

Abstract

PURPOSE:To protect an end section of base from chipping at the time of cutting a base, and make a post-work of removing cut pieces constituting the base section only at the time of cutting by coating the base with a filling agent, to a carrier and cutting the base together with the carrier and the filling agent or with the filling agent. CONSTITUTION:For example, a pipe-shaped carrier into 1 which, for example, an indeterminate crystal base 2 is inserted, and a space between the carrier 1 and a crystal 2 is filled by pouring a fluidizing filling agent 3 therein, and the crystal 2 is bonded with the carrier 1 by curing said filling agent 3. After being fixed, the crystal 2 is cut together with the carrier 1 and a filling agent by a blade 4 of a cutter. Chipping at the time of cutting can be prevented by fixing the whole periphery of the base 2 with the tilling agent 3. Said fixing can be carried out by pouring in and curing the filling agent 3, and as the base is fixed with a thin bonding layer, a support to be processed in accordance with the base shape can be eliminated. Also, the base 2 is fixed with the whole outer periphery, the filling agent 3 of weak bonding power to be peeled off easily can be selected for use.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention makes it possible to easily cut silicon St, gallium arsenide GaAs semiconductor substrates, and other crystalline substrates, regardless of whether they are regular or amorphous substrates. This invention relates to a method for cutting a substrate.

[Summary of the Invention] The present invention provides a method for cutting a regular or amorphous base, in which the base is coated with a filler, cured, and fixed to a support.
Cutting the substrate together with the support and filler or the filler eliminates the need for a support base that matches the shape of the substrate, making it easier to take out cut pieces and remove and clean debris, etc. By fixing the entire circumference of the part, it is possible to adapt to any shape of substrate with a short preparation time, and also prevents chipping of the edge of the substrate during cutting, making post-cutting work easier. It is.

[Prior Art] Conventionally, in a wafer manufacturing process, a slicing machine has been used to cut a cylindrical crystal or the like into thin disk shapes.

Normally, slicing machines (cutting machines) often use an internal blade type (doughnut plate), but in this case, in order to completely cut the crystal part while preventing the workpiece (wafer) from falling or scattering, the cutting machine This is done by adhering a support base such as a carbon base to serve as a pillow.

FIGS. 2(a) and 2(b) are explanatory diagrams of a conventional method of cutting a crystal, in which (a) is a side sectional view and (b) is a front view. Crystal +00 is adhered to the support lot by adhesive 102. Set this in a cutting machine and rotate the plate 103, diamond particles electrodeposited on the cutting edge +0
4, the crystals are cut into wafers one by one as shown by dotted line A. The crystals cut in this way are then coated with adhesive 1.
02 is dissolved and removed to complete a wafer.

Problems to be Solved by the Invention However, the above-mentioned conventional crystal cutting method has the following problems.

(1) In order to make the crystal +00 ready for cutting, it is necessary to perform an actual fitting process so that the crystal 100 can fit onto the support stand 101, which requires a lot of effort and time. As a way to simplify this, we use a fixed form.

Regardless of the shape of the crystal, it is possible to shape it by grinding the outer periphery to match the dimensions of a standardly manufactured support, but in this case too, grinding the outer periphery requires time and effort, and
It cannot be applied to crystals that need to be cut without shaping or in an irregular shape.

(2) Since the support base 101 fixes a portion of the crystal 100, it is necessary to firmly adhere it using a strong adhesive 102 and a thin adhesive layer. For this reason, it is very difficult to peel off the adhesive 102 after cutting, and it takes a long time to remove and clean the scum from the wafer.

(3) Since the entire circumference of the crystal 100 is not fixed to the support stand 101, the workpiece is likely to fall and scatter during cutting, and shell-like chipping is likely to occur at the edge of the workpiece that is not fixed.

The present invention was devised to solve the above-mentioned problems, and it is possible to adapt to the shape of any type of substrate such as crystals in a short time, and also to cut the edges of the substrate when cutting the substrate. It is an object of the present invention to provide a method for cutting a substrate that prevents chipping and further facilitates post-work to take out cut pieces of only the substrate after cutting.

[Means for Solving the Problems] To achieve the above object, the method for cutting a substrate of the present invention includes a step of coating a substrate with a filler, curing it, and fixing it to a support; The method is characterized by comprising a step of cutting the substrate with or without the filler.

[Function] The present invention prevents chipping during cutting by fixing the entire circumference of the substrate using a filler. Fixation is achieved by simply pouring a filler into the gap between the support and the base, coating it, and curing it.In order to fix the base with a thin adhesive layer, conventional supports are processed to match the shape of the base. is no longer necessary. Furthermore, since the base is fixed on the entire outer periphery, a filler with weak adhesive strength that is easily peelable can be selected and used.

[Embodiments] Hereinafter, embodiments of the present invention will be described in detail based on the drawings.

FIG. 1 is an explanatory diagram showing an embodiment of the present invention, in which (a) is a side sectional view and (b) is a front view. This embodiment shows a case where the present invention is applied to a wafer manufacturing process. In this example, a support l in the form of a vibrator (cylindrical) is prepared, for example, an amorphous crystal 2 is inserted into it, and a filler 3 in a fluid state is poured to fill the gap between the support l and the crystal 2. Then, the crystal 2 is adhered to the support l by hardening of the filler 3. After this fixation, the crystal 2 together with the support 1 and the filler 3 is cut by a blade 4 of a cutting machine.

The support l is preferably made of carbon, but is not limited to carbon as long as it has a material that causes less wear and clogging of the cutting edge 4a of the blade 4. In addition, the shape of the crystal 2 may be not only cylindrical but also rectangular or similar to the shape of the crystal, if the crystal 2 can be inserted.
It can be shaped like a gutter or a box, or it can be shaped into a cylindrical shape that takes into account ease of setting on a cutting machine and stability.

Filler 3 needs to harden and have an adhesive effect, but in order to adhesively fix the entire outer periphery of the crystal, a strong adhesive (such as epoxy synthetic resin) is required as in the case of conventional partial periphery adhesion. Instead, you can select and use a material that is easy to fix and remove, such as plaster. As another example of the material of the filler 3, a thermofusible resin or the like is suitable because it can be easily peeled off by heating.

The preparatory work for cutting involves fixing the crystal, which can be easily fixed by simply pouring the filler 3 in a fluid state into the gap between the pipe-shaped support l and the crystal 2 inserted into it. It can be carried out in a short fixed time without being affected by the shape of 2.

In the cutting operation, the blade 4 is cut as shown by the dotted line B by rotating the blade 4 while being fixed to the support 1 and fixed to the cutting machine. Prior to this, the crystal orientation of the end face of the arbitrarily cut crystal 2 is examined by X-ray diffraction or structural analysis, and the cutting direction is adjusted based on the crystal orientation. Since the entire outer periphery of the crystal 2 is fixed, chipping, in which the edge of the crystal 2 is chipped in a shell shape, does not occur during cutting. Also, cutting is
Since the cutting is performed while cooling liquid is injected into the blade 4 to prevent dust, there is no risk of heat generation in the cut portion, and there is no risk of the filler 3 melting if it is a heat-melting resin.

The post-cutting work is to take out the cut piece (wafer) containing only crystals from the cut piece, but in the above example, the filler 3
This is done by peeling and cleaning. If the filler 3 is gypsum,
Dissolve it using an appropriate solvent such as an acid solution and remove the released carbon.

Of course, carbon and the like may be physically removed first. If the filler 3 is a hot-melt resin, it is heated and melted away, and if it is made of another material, it is peeled off and removed by means suitable for the material. As mentioned above, since the filler 3 can be selected to be easily peelable, the above-mentioned post-work is extremely easy.

In addition, in the examples, the support and filler were cut together when cutting the crystal, but by selecting a filler that hardens with strength, it is possible to cut the crystal after the filler hardens.

The object of the present invention can also be achieved by removing the support before the cutting operation and cutting the filler together.

Furthermore, at this time, if a transparent or translucent filler is selected, the arrangement state of the crystals, etc. can be identified, and workability can be improved. Of course, if the support is also made transparent or translucent, workability can be similarly improved in the embodiments. Further, the present invention can be applied to general substrates such as semiconductor substrates other than crystals, and can be applied not only to irregularly shaped substrates but also to regular shaped substrates. As described above, the present invention can be applied and implemented in various ways in accordance with its gist.

[Effects of the Invention] As is clear from the above description, the method for cutting a substrate of the present invention provides the following effects.

(1) Since the base is coated with a filler and fixed on the support,
Preparation work for cutting can be done in a short time no matter what shape the substrate is, such as a polygonal column, a cone, or an irregular shape.

(2) Since it is fixed on the entire circumferential surface of the base, chipping can be prevented during cutting.

(3) Since it can be fixed with a weak adhesive force, it becomes easy to peel off the filler or support and wash the cut piece of the substrate.

[Brief explanation of the drawing]

FIGS. 1A and 1B are explanatory views showing one embodiment of the present invention, and FIGS. 2A and 2B are explanatory views of the prior art. 1... Support, 2... Crystal (substrate), 3... Filler.

Claims (1)

[Scope of Claims] A substrate characterized by comprising the steps of: coating the substrate with a filler, curing it and fixing it to a support; and cutting the substrate either together with the support and the filler or with the filler. cutting method.