JPS6331504Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a mold, and an object of the present invention is to provide a mold that can directly heat the molding material within the mold and is effective in controlling temperature and saving energy.

Traditionally, in structures that heat synthetic resin materials or rubber materials for molding put into a mold,
The mold is heated by a heater, and heat is supplied from the heated mold to the molding material. Therefore, according to such a conventional structure, it is not possible to directly heat the molding material,
The amount of heat transferred from the mold to other parts and the atmosphere is also large,
In other words, energy loss was large. On top of that,
A structure is required to cut off and absorb this wasted energy, and in terms of temperature control, it has been difficult to increase accuracy because there is a delay in temperature rise and fall.

In view of the above-mentioned problems, the present invention includes making a mold from an insulator, and forming a heater made of a thin metal film on the molding surface of the mold that comes into contact with the molding material by sputtering or ion plating, By electrifying the heater and generating heat, it is possible to perform highly accurate temperature control at low cost and save energy.

An embodiment of the present invention will be described below with reference to FIG. Reference numeral 11 denotes an upper mold fixed to an upper mold holding frame 12 of the molding apparatus, and 13 denotes a lower mold fixed to a lower mold holding frame 14, which are used to heat press mold a synthetic resin material or a rubber material. Above upper mold 11 and lower mold 1
Thin film heaters 15 and 16 are respectively formed on both press surfaces of 3, and each of the thin film heaters 15 and 16 is connected to a power source 18 via a conductive wire 17. Thin film heater 1
A control drive circuit 21 is configured to be driven intermittently or under current control by a temperature control section 20 having temperature detection sections 19 and 19 provided near the temperature detection sections 5 and 16.

Since the mold having the above configuration heats only the molding surface that directly contacts the molded product to a predetermined temperature by the thin film heaters 15 and 16, it is necessary to maintain the entire temperature of the upper mold 11 and the lower mold 13 at a high temperature. There is no direct thin film heater 15, which is extremely economical.
16, the structure is extremely simple.

Next, an example of manufacturing the mold of the present invention will be described.

(Example) A mold was prototyped using high-frequency sputtering.
(See Figures 3 and 4) Metal thin film material: Ti (titanium) Insulator: Alumina porcelain Sputtering conditions Argon gas pressure 0.08Torr Electrode spacing 50mm Power (effective) 300W Voltage 2.5KV Current 200mA Time 30 minutes Above conditions As shown in Figure 3, argon gas
Sputtering chamber 2 filled with Ar and depressurized
2, a high frequency electrode 23 and a base holder 24 are placed opposite each other, and the high frequency electrode 23 is connected to a high frequency power source 26 via a matching box 25, and the high frequency electrode 23 is connected to the high frequency electrode 23 so as to face the titanium plate 27 fixed to the high frequency electrode 23. A base holder 24 is provided with an alumina porcelain mold 28 serving as a covering. At this time, the uncoated part of the mold 28 is masked with aluminum 29 as shown in FIG.
Prevented titanium film from adhering.

As shown in FIG. 5, electrodes 31, 31 were connected to the mold 28 which formed the metal thin film heater 30 by the sputtering process, and an alternating current voltage 32 was applied to the mold 28 to heat it in the atmosphere.

Average film thickness of thin film heater 30: 1.1 μm Resistance between electrodes 31, 31: 50Ω Temperature measurement: Surface thermometer When voltage was applied to 100 V, it was confirmed that the temperature rose to approximately 200°C. At this time, the thin film heater 30
No changes were observed.

As mentioned above, the mold of the present invention has a heater made of a thin metal film on the molding surface to directly heat the molding material, and the mold made of an insulator acts as a heat insulator around the heater. Since the thin film heater is formed by sputtering or ion plating, the thin film heater is formed by sputtering or ion plating.
It is also possible to use molds with complex shapes.

[Brief explanation of the drawing]

Fig. 1 is a front sectional view of the main parts of a molding device and a block diagram of a control circuit showing an embodiment of the present invention, Fig. 2 is an explanatory diagram showing the state of high frequency sputtering of a mold, and Fig. 3 is a diagram of Fig. 2. A front cross-sectional view of the mold in
FIG. 4 is an explanatory diagram showing the product test situation. 11... Upper mold, 12... Upper mold holding frame, 13...
Lower mold, 14... Lower mold holding frame, 15, 16, 30...
... thin film heater, 17 ... conductive wire, 18 ... power supply,
19...Temperature detection section, 20...Temperature control section, 21
...Control drive circuit, 22...Sputtering chamber,
23...High frequency electrode, 24...Base holder, 25
...Matching box, 26...High frequency power supply,
27... Titanium plate, 28... Molding mold, 29
...Aluminum〓, 31... Electrode, 32... AC power supply.

Claims (1)

[Scope of utility model registration request] A mold is made of an insulator, and a heater made of a thin metal film is deposited on the molding surface of the mold that comes into contact with the molding material by sputtering or ion plating, and the heater is electrically conductive. A mold featuring: