JPS63312977A - Film forming device - Google Patents

Film forming device

Info

Publication number
JPS63312977A
JPS63312977A JP15065287A JP15065287A JPS63312977A JP S63312977 A JPS63312977 A JP S63312977A JP 15065287 A JP15065287 A JP 15065287A JP 15065287 A JP15065287 A JP 15065287A JP S63312977 A JPS63312977 A JP S63312977A
Authority
JP
Japan
Prior art keywords
target
inner conductor
plasma
conductor
coaxial tube
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15065287A
Other languages
Japanese (ja)
Inventor
Yuji Mukai
裕二 向井
Hiroyoshi Tanaka
博由 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP15065287A priority Critical patent/JPS63312977A/en
Publication of JPS63312977A publication Critical patent/JPS63312977A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To effectively utilize all the high-density plasma produced by a microwave power for forming a film by supplying a microwave power to a coaxial pipe opened to the inside of a vacuum vessel, and arranging a target on the end of an inner conductor of the coaxial pipe. CONSTITUTION:The coaxial pipe 7 is opened to the inside of the vacuum vessel 1, the target 4 is arranged on the end of the inner conductor 3, the outer conductor 2 is connected to a microwave oscillator 5 through a waveguide 6, and a magnet 18 is arranged on the outer periphery of the end. In addition, the length of the outer conductor 2 is made larger than that of the inner conductor 3. A negative voltage is impressed on the target 4 from an electric power source 17 through the inner conductor 3, and the grounded outer conductor 2 is used as a positive counter electrode. Under such conditions, a gas supplied from a supply source 11 is formed into plasma 16 in the vicinity of the target 4, hence the target 4 is efficiently sputtered, and a film is formed on a substrate 15 opposed to the plasma 16.

Description

【発明の詳細な説明】 産業上の利用分野 本発明はマイクロ波プラズマを用いたスパッタリングに
よる成膜装置に関する。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a film forming apparatus by sputtering using microwave plasma.

従来の技術 従来スパッタリング装置には、アルゴン等の不活性ガス
をプラズマ化する手段として直流放電や13.56 M
Hzの高周波放電が用いられている。
Conventional technology Conventional sputtering equipment uses direct current discharge or 13.56 M as a means of turning inert gas such as argon into plasma.
A high frequency discharge of Hz is used.

しかし、単に直流放電や高周波放電でプラズマを発生さ
せただけではプラズマの密度が小さいために成膜速度が
遅い。そこで、ターゲットの近傍に磁石を配置してプラ
ズマを高密度化し成膜速度を向上させたマグネトロンス
パッタ装置が一般に利用されている。
However, simply generating plasma by direct current discharge or high frequency discharge results in a slow film formation rate due to the low density of the plasma. Therefore, a magnetron sputtering apparatus is generally used in which a magnet is placed near the target to increase the plasma density and improve the film formation rate.

電力、近年では、例−えば特開昭61−272372号
公報に見られるようにプラズマ密度を高めるためにマイ
クロ波放電を用いたスパッタリング装置が提案されてい
る。
Regarding electric power, in recent years, a sputtering apparatus using microwave discharge has been proposed to increase plasma density, as seen in, for example, Japanese Patent Application Laid-Open No. 61-272372.

発明が解決しようとする問題点 しかし、前記従来例ではプラズマ発生室とターゲットと
が離れて位置しているため、プラズマ室で発生した高密
度のプラズマがターゲットの表面まで輸送される間に幾
分消滅してしまい、高密度に発生したプラズマを全て利
用することはできないという問題点があった。
Problems to be Solved by the Invention However, in the conventional example described above, the plasma generation chamber and the target are located far apart, so that the high-density plasma generated in the plasma chamber is transported to the surface of the target to some extent. There was a problem in that the plasma that was generated at high density could not be fully utilized.

そこで本発明は、発生した高密度のプラズマをほとんど
全て有効に利用できる成膜装置を提供することを目的と
する。
Therefore, an object of the present invention is to provide a film forming apparatus that can effectively utilize almost all of the generated high-density plasma.

問題点を解決するための手段 本発明は真空容器内に開口した同軸管と、前記同軸管の
内導体の端部に配置したターゲットと、前記同軸管にマ
イクロ波電力を供給する手段を構成要素とする成膜装置
である。
Means for Solving the Problems The present invention comprises a coaxial tube opening into a vacuum container, a target disposed at an end of an inner conductor of the coaxial tube, and means for supplying microwave power to the coaxial tube. This is a film-forming device that does this.

作  用 プラズマをターゲットの極く近傍で発生させることがで
き、プラズマの周囲への発散を防ぐことができ、マイク
ロ波放電によシ生じた高密度のプラズマを十分に利用で
きる。
Working plasma can be generated very close to the target, preventing the plasma from dispersing to the surroundings, and making full use of the high-density plasma generated by microwave discharge.

実施例 本発明の一実施例の概略構成図を第1図に示す。Example A schematic configuration diagram of an embodiment of the present invention is shown in FIG.

第1図において、1は真空容器、2は真空容器1内に開
口した同軸管の外導体、3は同じく同軸管の内導体で端
部にはターゲット4を配置しており、プラズマの周囲へ
の発散を防ぐため、真空容器1内での外導体2の長さを
内導体3の長さより長く構成している。5はマイクロ波
電力発振器で、発振器5から発振したマイクロ波は方形
尋波管6を通って同軸管部7に供給される。ここで、テ
ーパ部8は方形棉波管6から同軸管7へ大電力のマイク
ロ波を損失なく供給するための素子であり、またテーパ
部9f″i同軸管を広げるためのものである。
In Fig. 1, 1 is a vacuum vessel, 2 is an outer conductor of a coaxial tube opened in the vacuum vessel 1, and 3 is an inner conductor of the same coaxial tube, with a target 4 placed at the end, which is connected to the surroundings of the plasma. In order to prevent this from spreading, the length of the outer conductor 2 inside the vacuum vessel 1 is configured to be longer than the length of the inner conductor 3. Reference numeral 5 denotes a microwave power oscillator, and the microwave oscillated from the oscillator 5 is supplied to a coaxial tube section 7 through a square wave tube 6. Here, the taper portion 8 is an element for supplying high-power microwaves from the square wave tube 6 to the coaxial tube 7 without loss, and is also for widening the coaxial tube 9f''i.

10はアルミナ等の誘電体であり真空をシールしている
。アルゴン等の不活性ガスはガス供給管11で供給され
、排気口により排気される。マイクロ波のマツチングは
2つの可動短絡板12.13により整合をと9、ターゲ
ット4及び同軸管の内導体3を冷却するために、内導体
3内には水冷管14を挿入している。基板16はターゲ
ット4と対向して配置しており、マイクロ波放電により
生じるプラズマ16中の不活性ガスイオンを電源17に
よりターゲット4に衝突させる事により、基板15上に
薄膜が成膜される。なお、本実施例では電源17によっ
て負電位にあるターゲット4に対する正電位の対象電極
として接地した同軸管の外部導体2を用いている。
10 is a dielectric material such as alumina, which seals the vacuum. An inert gas such as argon is supplied through a gas supply pipe 11 and exhausted through an exhaust port. The microwaves are matched by two movable short circuit plates 12 and 13, and a water cooling tube 14 is inserted into the inner conductor 3 to cool the target 4 and the inner conductor 3 of the coaxial tube. The substrate 16 is placed facing the target 4, and a thin film is formed on the substrate 15 by causing inert gas ions in the plasma 16 generated by microwave discharge to collide with the target 4 using a power source 17. In this embodiment, the outer conductor 2 of a grounded coaxial tube is used as a target electrode at a positive potential with respect to the target 4 which is at a negative potential due to the power source 17.

また、18はプラズマ16を同軸管の中心部分、すなわ
ちターゲット40表面に高密度に圧縮するための磁石で
ある。
Further, 18 is a magnet for compressing the plasma 16 into the center of the coaxial tube, that is, the surface of the target 40 at high density.

本構成により、真空容器内に開口した同軸管の端部、す
なわちターゲット4の近傍に高密度のプラズマを発生で
きる。
With this configuration, high-density plasma can be generated at the end of the coaxial tube opened into the vacuum container, that is, near the target 4.

なお、通常は同軸管として外導体2と内導体3の断面が
円形のものが使用されるが、これらは円形に限るもので
はなく方形であってもかまわない。
Note that although a coaxial tube in which the outer conductor 2 and inner conductor 3 have circular cross sections is usually used, these are not limited to circular shapes and may be rectangular.

また、磁石も本実施例では18のみであったが、マグネ
トロンスパッタ装置に用いられるように、第2図にター
ゲット4部分の拡大断面図を示すごとく磁石19を配置
してもよい。更に、第1図の磁石18をカプス磁界を発
生するように構成してもよく、その他よシ効果的なよう
に磁石を配置してもよい。
Further, although only 18 magnets were used in this embodiment, magnets 19 may be arranged as shown in FIG. 2, which is an enlarged cross-sectional view of a portion of the target 4, so as to be used in a magnetron sputtering apparatus. Additionally, the magnets 18 of FIG. 1 may be configured to generate a cupped field, or the magnets may be arranged in other effective manners.

発明の効果 本発明により、マイクロ波′1区力を用いてターゲット
の近傍に高密度のプラズマを周囲に発散させることなく
発生できるために、生じたプラズマをほとんど全て有効
にスパッタリングに利用できる。
Effects of the Invention According to the present invention, high-density plasma can be generated in the vicinity of the target using microwave energy without being dispersed to the surroundings, so that almost all of the generated plasma can be effectively used for sputtering.

その結果として成膜速度をより高速化できる。As a result, the film formation rate can be further increased.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例の成膜装置の概略構成図、第
2図は本発明の異なる実施例の構成図である。 2・・・・・・同軸管の外導体、3・・・・・・同軸管
の内導体、4・・・・・・ターゲット、6・・・・・・
マイクロ波発振器。 代理人の氏名 弁理士 中 尾 敏 男 ほか1名t−
X 空容器 a・−同軸管の外導体 3−同軸管の内導体 第2図
FIG. 1 is a schematic diagram of a film forming apparatus according to an embodiment of the present invention, and FIG. 2 is a diagram of a different embodiment of the present invention. 2...Outer conductor of coaxial tube, 3...Inner conductor of coaxial tube, 4...Target, 6...
Microwave oscillator. Name of agent: Patent attorney Toshio Nakao and one other person
X Empty container a - outer conductor of coaxial tube 3 - inner conductor of coaxial tube Fig. 2

Claims (3)

【特許請求の範囲】[Claims] (1)真空容器内に開口した同軸管と、前記同軸管の内
導体の端部に配置したターゲットと、前記同軸管にマイ
クロ波電力を供給する手段から成る成膜装置。
(1) A film forming apparatus comprising a coaxial tube opened into a vacuum container, a target disposed at an end of an inner conductor of the coaxial tube, and means for supplying microwave power to the coaxial tube.
(2)真空容器内の同軸管の外導体の長さを、内導体の
長さより長く構成した特許請求の範囲第1項記載の成膜
装置。
(2) The film forming apparatus according to claim 1, wherein the length of the outer conductor of the coaxial tube in the vacuum container is longer than the length of the inner conductor.
(3)同軸管の内導体とターゲットとを電気的に接触し
、前記内導体に負電圧を印加し、前記同軸管の外導体を
前記内導体に対して電位的に正とした特許請求の範囲第
1項又は第2項記載の成膜装置。
(3) The inner conductor of the coaxial pipe and the target are brought into electrical contact, a negative voltage is applied to the inner conductor, and the outer conductor of the coaxial pipe is made to have a positive potential with respect to the inner conductor. A film forming apparatus according to scope 1 or 2.
JP15065287A 1987-06-17 1987-06-17 Film forming device Pending JPS63312977A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15065287A JPS63312977A (en) 1987-06-17 1987-06-17 Film forming device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15065287A JPS63312977A (en) 1987-06-17 1987-06-17 Film forming device

Publications (1)

Publication Number Publication Date
JPS63312977A true JPS63312977A (en) 1988-12-21

Family

ID=15501523

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15065287A Pending JPS63312977A (en) 1987-06-17 1987-06-17 Film forming device

Country Status (1)

Country Link
JP (1) JPS63312977A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0436465A (en) * 1990-06-01 1992-02-06 Matsushita Electric Ind Co Ltd Microwave plasma generator

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0436465A (en) * 1990-06-01 1992-02-06 Matsushita Electric Ind Co Ltd Microwave plasma generator

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