JPS63306691A - Regeneration of rejected product of printed circuit board - Google Patents
Regeneration of rejected product of printed circuit boardInfo
- Publication number
- JPS63306691A JPS63306691A JP14359387A JP14359387A JPS63306691A JP S63306691 A JPS63306691 A JP S63306691A JP 14359387 A JP14359387 A JP 14359387A JP 14359387 A JP14359387 A JP 14359387A JP S63306691 A JPS63306691 A JP S63306691A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- copper
- dipped
- printed circuit
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000008929 regeneration Effects 0.000 title abstract description 3
- 238000011069 regeneration method Methods 0.000 title abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910052802 copper Inorganic materials 0.000 claims abstract description 23
- 239000010949 copper Substances 0.000 claims abstract description 23
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 12
- 229910001870 ammonium persulfate Inorganic materials 0.000 claims abstract description 8
- 239000012790 adhesive layer Substances 0.000 claims abstract description 6
- 238000007654 immersion Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000000654 additive Substances 0.000 claims description 3
- 230000007547 defect Effects 0.000 claims description 2
- 238000007605 air drying Methods 0.000 claims 1
- 230000001172 regenerating effect Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 12
- 230000002950 deficient Effects 0.000 abstract description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 9
- 238000007747 plating Methods 0.000 abstract description 7
- 239000007864 aqueous solution Substances 0.000 abstract description 6
- 238000005530 etching Methods 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- 238000007639 printing Methods 0.000 abstract description 4
- 239000007788 liquid Substances 0.000 abstract 2
- JHWIEAWILPSRMU-UHFFFAOYSA-N 2-methyl-3-pyrimidin-4-ylpropanoic acid Chemical compound OC(=O)C(C)CC1=CC=NC=N1 JHWIEAWILPSRMU-UHFFFAOYSA-N 0.000 abstract 1
- 230000003750 conditioning effect Effects 0.000 abstract 1
- 238000007598 dipping method Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 abstract 1
- 238000005498 polishing Methods 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 8
- 229910000831 Steel Inorganic materials 0.000 description 4
- 238000004064 recycling Methods 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 239000000047 product Substances 0.000 description 3
- 238000007788 roughening Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 2
- 241000208140 Acer Species 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- SOCTUWSJJQCPFX-UHFFFAOYSA-N dichromate(2-) Chemical compound [O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O SOCTUWSJJQCPFX-UHFFFAOYSA-N 0.000 description 1
- CMMUKUYEPRGBFB-UHFFFAOYSA-L dichromic acid Chemical compound O[Cr](=O)(=O)O[Cr](O)(=O)=O CMMUKUYEPRGBFB-UHFFFAOYSA-L 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 235000010265 sodium sulphite Nutrition 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
〔芦業上の第１」用分封〕
本発明にセミアディティブ法によって製造される印刷配
線板の回路形成後のベーキング以前に発見される不具合
品の再生方法に関するものである。[Detailed Description of the Invention] [Separation for first use in the industry] The present invention relates to a method for recycling defective products discovered before baking after circuit formation of a printed wiring board manufactured by a semi-additive method. be.
従来これら不具合品の再生に不具合の発見された印刷配
線板をコンベアーに流しながら塩化第二鉄や塩化第二銅
などのエツチング液をスプレー状に吹付は印刷配線板に
付着している金楓銅を除去し水洗後基叛の表面を粉末研
摩剤を含ませたスポンジなどで研摩し水洗後乾燥し周知
のセミアディティブ法で再度工事し不具合品の再生を行
なうことが多かった。Conventionally, in order to recycle these defective products, the printed wiring boards that were found to be defective were sent to a conveyor, and an etching solution such as ferric chloride or cupric chloride was sprayed to remove the gold maple copper that had adhered to the printed wiring boards. After washing with water, the surface of the base was polished with a sponge containing powdered abrasive, washed with water, dried, and reworked using the well-known semi-additive method to regenerate defective products.
しかし通常の工事でに無電解銅めっき沿に１．５〜２．
０時間歇すれば金属鋼が均一に０．５μｍ程度析出する
が現状の再生処理でニ４．０〜５．０時ｆｉｉ’ｊ浸漬
する必要がある。又スルホールのランド部に円形状に無
電解銅が付着せず更に長時間浸漬しなくてはならない場
合もあった。これはスプレー状のエツチング液を基板に
吹付は金酋銅を除去する際基板表面の接着剤もある程度
＋４＋Ｍ的に除去され％にランド部は吹付けるエツチン
グ液の流れが速くなる為接着剤がより多く除去されるこ
としでよるものである。However, in normal construction work, electroless copper plating is applied to 1.5 to 2.
If it waits for 0 hours, metallic steel will precipitate uniformly to a thickness of about 0.5 μm, but in the current regeneration process, it is necessary to immerse the steel for 4.0 to 5.0 hours. In addition, there were cases in which electroless copper did not adhere in a circular shape to the lands of the through-holes, requiring immersion for an even longer period of time. This is because when a spray-type etching solution is sprayed onto the board, when removing the gold-plated copper, the adhesive on the board surface is also removed to a certain extent, and the flow of the sprayed etching solution becomes faster on the land area, making the adhesive stronger. This is due to the fact that many of them have been removed this year.
更Ｖ（工シチング准ＬＤ残渣の影響によりチシ」が基板
全体に不均一な析出となりマフラ模様を呈することも多
くこの１ま印刷配線板を再生すると銅と基材の密着力が
部分的に著しく悪化し実用に耐えられない場合が多い、
又基板表面に粉状の銅残りが発生し絶縁抵抗が著しく劣
化することもあった。Due to the influence of LD residue, the copper is deposited non-uniformly over the entire board, creating a muffler pattern.When a printed wiring board is recycled, the adhesion between the copper and the base material may be significantly reduced in some areas. In many cases, the condition worsens and becomes unusable.
In addition, powdery copper residue may be left on the surface of the substrate, resulting in significant deterioration of insulation resistance.
上述した従来のセミアティティ７′印刷配線板の再生方
法に対し本発明は不共合印刷配線板に付着している銅を
過硫酸アンモニウム水溶液中で浸漬除去し自然乾燥後通
常の工程に比較しより短時間接着剤層を粗化するという
相違点を有する。In contrast to the above-mentioned conventional method for recycling semi-attitude 7' printed wiring boards, the present invention removes copper adhering to non-coupled printed wiring boards by immersing them in an aqueous ammonium persulfate solution, and then drying them naturally. The difference is that the adhesive layer is roughened over time.
本発明の印刷配線板の不具合品り生方法はセミアティア
イプ印刷配線板の製造工程中回路形成後の基板ベーキン
グ以的に発見される不具合印刷配線板に於て付着してい
る銅を過硫酸アンモニウム水溶液中で浸漬除去し自然乾
燥後接着剤層を粗化することを特徴とする。The method for producing defective printed wiring boards of the present invention is to remove copper adhering to printed wiring boards with ammonium persulfate, which is discovered during board baking after circuit formation during the manufacturing process of semi-circular printed wiring boards. The adhesive layer is characterized by being removed by immersion in an aqueous solution, dried naturally, and then roughened.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１１ｔ（ａｌｒｔ−Ｉ！ｉラディティ７法による印刷
配線板の製造に於てエッテンク後の中間検査工程で発見
されたランド欠損による不良基板の断面図である。FIG. 11 is a cross-sectional view of a defective board due to a land defect discovered in an intermediate inspection process after etching in the production of printed wiring boards by the 11th (alrt-I!i) Radity 7 method.
このような不良基板の外生方法ｒｉまず不良のある基板
を過硫酸アンモニウム水溶液中に浸漬し回路やランド部
などの無電解めっき銅を完全に溶解除去去し水洗する。A method for removing such a defective board is to first immerse the defective board in an ammonium persulfate aqueous solution to completely dissolve and remove the electroless plated copper on circuits, lands, etc., and then wash it with water.
（第１図（ｂ））過硫酸アンモニウム濃濃度ｔ’ｊｌｏ
ｇ／１以上ならはいずれの濃度でも適用可能である。又
水溶液の温度Ｆｉｏ−１００℃の間のいずれでも目的を
達することができる。一般に過硫酸アンモニウムｄｊｋ
度を増加させるｔまど又液温を上げるはど銅溶解速度ｒ
ｉ増加するか、液の寿命１作業性、経済性などを考慮し
通常１５０〜３００ｇ／ｌの濃度で液温ｒｊ特に調整し
ない室温１５〜２０℃が選はれる。(Figure 1(b)) Ammonium persulfate concentration t'jlo
Any concentration of g/1 or higher is applicable. Further, the objective can be achieved at any temperature of the aqueous solution between Fio and 100°C. Generally ammonium persulfate djk
Increasing the copper dissolution rate r
Considering the increase in i, life of the solution, workability, economic efficiency, etc., a concentration of 150 to 300 g/l and a room temperature of 15 to 20 DEG C. without any particular adjustment are usually selected.
次に粉末研摩剤を用いた自動整面装置で基板全面を研摩
し表面の接着剤層を清浄にし水洗後放置し自然乾燥する
。更に重クローム酸ンーダ及びホウフヴ化水素酸を主成
分とする周知の表面粗化液中に通常の浸漬時間より短い
時ｒ＆＆］浸漬し接着剤層を粗化する。粗化時間は通常
の浸漬時間１２分間以内ならば効果があるが４〜６分間
が最も良好な結果を得ることができる。次に水洗後型亜
硫酸ソーダ水溶液中に浸漬し基板表面に付着している重
クローム酸ンータを還元除去し充分水洗後熱電解銅めっ
き液中に浸漬し一次銅を０．１〜０．５μｍ基板全面に
析出させる。（第１図（Ｃ））次に自動整面装置で基板
表面を整面し第１図（ｄ）の如く周知の方法て逆版印刷
を行ない所望の回路を印刷する。更に必要部分をビロリ
ン酸銅めっき液を用いた電気めっきで補強し逆版印刷イ
ンクを除去後回路部以外の一次銅ケエツチング除去し印
刷回路を形成する（第１図（ｅ））ことによりセミアデ
ィティブ法による印刷配線板を再生する。Next, the entire surface of the substrate is polished using an automatic leveling device using powdered abrasive to clean the adhesive layer on the surface, washed with water, and then left to dry naturally. Further, the adhesive layer is roughened by immersing it in a well-known surface roughening solution containing dichromic acid and hydroborosulfuric acid for a shorter time than the usual immersion time. It is effective if the roughening time is within 12 minutes, which is the normal immersion time, but the best results can be obtained with a roughening time of 4 to 6 minutes. Next, after washing with water, the substrate is immersed in an aqueous solution of sodium sulfite to reduce and remove dichromate adhering to the surface of the substrate, and after thorough washing with water, it is immersed in a thermal electrolytic copper plating solution to coat the substrate with a thickness of 0.1 to 0.5 μm of primary copper. Deposit on the entire surface. (FIG. 1(C)) Next, the surface of the substrate is leveled using an automatic leveling device, and as shown in FIG. 1(d), reverse printing is performed by a well-known method to print a desired circuit. Furthermore, the necessary parts are reinforced by electroplating using birophosphate copper plating solution, the reverse printing ink is removed, and the primary copper etching other than the circuit part is removed to form a printed circuit (Fig. 1 (e)). Recycle printed wiring boards according to the law.
以上本発明によるセゼアディティプ印刷配線板の不具合
品の再生方法は無電解銅めっきによる一次銅の析出時間
が短縮され付着が均一化された安定した筒品質の安価な
印刷配線板が得られる。廃莱することの多かった不具合
が実用に供せられるようになり省資曽的観点からも効果
が大きい。As described above, the method for recycling defective printed wiring boards of Cezeaditip according to the present invention shortens the time for primary copper deposition by electroless copper plating, and produces inexpensive printed wiring boards with uniform adhesion and stable tube quality. Problems that were often scrapped can now be put to practical use, and the effect is great from the perspective of saving resources.
第１図（ａｌ−（ｅｌは本発明によるセミラディティフ
印刷配線板の不具合品の再生工程に於ける印刷配線板の
断面図である。
１・・・・・・絶縁基材、２・・・・・・接着剤、３・
・・・・・無電解−次めっき銅、４・・・・・・逆版印
刷インク、５・・・・・・電解鋼めっき。
代理人 弁理士 内 原 晋
１１！揉基村
３ 熱電解−次鋼め
５ 電解ｉ１１か４
第１
２話着簀１１
−）！ ４ ｆ芹り印罪１目ンク
図FIG. 1 (al-(el) is a cross-sectional view of a semiraditif printed wiring board in the recycling process of defective semiraditif printed wiring boards according to the present invention. 1... Insulating base material, 2... ...Adhesive, 3.
. . . Electroless secondary plating copper, 4 . . . Reverse printing ink, 5 . . . Electrolytic steel plating. Agent Patent Attorney Susumu Uchihara 11!揉木村3 Thermal electrolysis-Next steel 5 Electrolysis i11 or 4 Episode 1 2 catch up 11 -)! 4 f Seri Insin 1st Menk Diagram
Claims (1)
基板ベーキング以前に発見される不具合印刷配線板に於
て付着している銅を過硫酸アンモニウム水溶液中で浸漬
除去し自然乾燥後接着剤層を粗化することを特徴とする
印刷配線板の不具合再生方法。During the manufacturing process of semi-additive printed wiring boards, the copper adhering to the printed wiring board is removed by immersion in an aqueous ammonium persulfate solution, and the adhesive layer is roughened after air drying. A method for regenerating defects in a printed wiring board, characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14359387A JPS63306691A (en) | 1987-06-08 | 1987-06-08 | Regeneration of rejected product of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14359387A JPS63306691A (en) | 1987-06-08 | 1987-06-08 | Regeneration of rejected product of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63306691A true JPS63306691A (en) | 1988-12-14 |
Family
ID=15342331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14359387A Pending JPS63306691A (en) | 1987-06-08 | 1987-06-08 | Regeneration of rejected product of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63306691A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103002666A (en) * | 2011-09-08 | 2013-03-27 | 深圳市励高表面材料处理有限公司 | Washing process for acid nickel plated gold of printed circuit board |
-
1987
- 1987-06-08 JP JP14359387A patent/JPS63306691A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103002666A (en) * | 2011-09-08 | 2013-03-27 | 深圳市励高表面材料处理有限公司 | Washing process for acid nickel plated gold of printed circuit board |
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