JPS6330400B2 - - Google Patents
Info
- Publication number
- JPS6330400B2 JPS6330400B2 JP1126083A JP1126083A JPS6330400B2 JP S6330400 B2 JPS6330400 B2 JP S6330400B2 JP 1126083 A JP1126083 A JP 1126083A JP 1126083 A JP1126083 A JP 1126083A JP S6330400 B2 JPS6330400 B2 JP S6330400B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- matrix
- electroformed shell
- shell
- molding surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011159 matrix material Substances 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 6
- 239000011148 porous material Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000012811 non-conductive material Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005323 electroforming Methods 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 150000003378 silver Chemical class 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Description
【発明の詳細な説明】
本発明は例えば複雑な形状のワークの表面に被
膜を施す場合、被膜をワークの表面と同形の型内
に吸引して保型する真空型の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a vacuum mold, in which, for example, when applying a coating to the surface of a workpiece having a complicated shape, the coating is sucked into a mold having the same shape as the surface of the workpiece and held therein.
この種真空型の製造方法においては、型の成形
面を、ワークと同形の母型に鍍金して成形した電
鋳シエルをもつて形成することは知られている
が、この場合シエルに形成される吸引孔はその直
径が約0.5mm程度の細孔のためその加工に困難を
来たす不都合を有していた。 In the manufacturing method of this type of vacuum mold, it is known that the molding surface of the mold is formed using an electroformed shell formed by plating a mother mold of the same shape as the workpiece. The suction holes have a diameter of about 0.5 mm, making it difficult to process them.
本発明はかゝる不都合を改良することを目的と
したもので、ワークと同形の母型の成形面に非導
電材の細線を植設する第１工程と、該母型を鍍金
して母型の成形面に前記細線を埋設させて電鋳シ
エルを形成する第２工程と、該電鋳シエルの細線
を除去して形成した細孔を吸引孔とすべく該電鋳
シエルを金枠にセツトして多孔質体で補強した第
３工程とからなる。 The present invention aims to improve such disadvantages, and includes a first step of implanting thin wires of non-conductive material on the molding surface of a mother mold of the same shape as the workpiece, and a step of plating the mother mold to form a mother mold. A second step of embedding the thin wire in the molding surface of the mold to form an electroformed shell, and inserting the electroformed shell into a metal frame so that the fine pores formed by removing the thin wire of the electroformed shell become suction holes. The third step consists of setting and reinforcing with a porous material.
以下これを図示実施例について説明すると１は
ワークと同形の母型を示し、該母型はマスターモ
デルを介して成形されるメス型に樹脂等を注入し
て形成され、その成形面には例えば直径0.5mm程
度のドリルを用いて所望の位置に深さ５mm程度の
穴を加工する。この場合被加工材である母型はエ
ポキシ樹脂等の樹脂材のためその切削が容易であ
ると共に形状はオス型のため加工が容易となる。
次いで第２図示のように母型１の加工穴には例え
ばナイロン糸のような非導電性の細線２が後述す
る電鋳シエルの厚みよりも長くして植設される。
そして細線２を植設された母型１は、第３図示の
ように例えばノズル３を介しての吹付けにより銀
鏡処理され、この銀鏡された母型１は第４図示の
ように鍍金槽４内で極板５と電気接続して電鋳す
る。この電鋳により表面に電鋳シエル６を形成し
た母型１は鍍金槽４より取り出して第５図示のよ
うにシエル６の表面から露出する細線２を引き抜
き等により除去する。細線２を除去された電鋳シ
エル６は所定の外形加工をして第６図示のように
金枠７にセツトし、金枠７内には多孔質体８例え
ば樹脂を被覆したアルミナ粒子材を充填して硬化
させ、次いで第７図示のように母型１を離形させ
ることにより前記細線２を除去した細孔を吸引孔
９とする真空型が形成されるものである。 This will be explained below with reference to the illustrated embodiment. Reference numeral 1 indicates a mother mold having the same shape as the workpiece, and the mother mold is formed by injecting resin or the like into a female mold that is molded via a master model, and its molding surface has, for example, Drill a hole with a depth of about 5 mm at the desired location using a drill with a diameter of about 0.5 mm. In this case, the mother die, which is the material to be processed, is made of a resin material such as epoxy resin, so it is easy to cut, and the shape is male, so it is easy to process.
Next, as shown in the second figure, a non-conductive thin wire 2, such as a nylon thread, is implanted into the machined hole of the master die 1 so as to be longer than the thickness of the electroformed shell, which will be described later.
Then, the mother mold 1 on which the fine wires 2 have been implanted is subjected to a silver mirror treatment by spraying, for example, through a nozzle 3 as shown in the third figure, and this silver mirror treated mother mold 1 is placed in a plating tank 4 as shown in the fourth figure. It is electrically connected to the electrode plate 5 inside and electroformed. The mother mold 1 with the electroformed shell 6 formed on its surface by electroforming is taken out from the plating tank 4, and the thin wire 2 exposed from the surface of the shell 6 is removed by drawing or the like, as shown in FIG. The electroformed shell 6 from which the fine wire 2 has been removed is processed into a predetermined external shape and set in a metal frame 7 as shown in Figure 6, and a porous material 8 such as a resin-coated alumina particle material is placed in the metal frame 7. After filling and curing, the mother mold 1 is released as shown in FIG. 7 to form a vacuum mold in which the pores from which the thin wires 2 have been removed serve as suction holes 9.
このように本発明によるときは電鋳シエルに形
成される吸引孔はシエルに埋設される非導電性の
細線の除去によつて形成させたものであるから小
径の吸引孔が簡単且つ迅速に成形できると共に作
業性も改善され、生産性も向上する等の効果を有
する。 In this way, according to the present invention, the suction holes formed in the electroformed shell are formed by removing the non-conductive thin wires buried in the shell, so that small diameter suction holes can be formed easily and quickly. This has the effect of improving workability and productivity.
第１図は母型の正面図、第２図は細線の植設状
態を示す説明図、第３図は銀鏡処理される母型の
説明図、第４図は電鋳処理を示す説明図、第５図
は細線の除去を示す説明図、第６図は金枠のセツ
ト状態を示す説明図、第７図は母型を分離した説
明図、第８図は第７図Ａ部の拡大断面図である。
１……母型、２……細線、６……電鋳シエル、
７……金枠、８……多孔質体、９……吸引孔。
Fig. 1 is a front view of the matrix, Fig. 2 is an explanatory diagram showing the state of implanting fine wires, Fig. 3 is an explanatory diagram of the matrix to be subjected to silver mirror treatment, and Fig. 4 is an explanatory diagram showing electroforming treatment. Fig. 5 is an explanatory diagram showing the removal of thin lines, Fig. 6 is an explanatory diagram showing the setting state of the metal frame, Fig. 7 is an explanatory diagram with the matrix separated, and Fig. 8 is an enlarged cross section of part A in Fig. 7. It is a diagram. 1...Matrix, 2...Fine wire, 6...Electroformed shell,
7... Gold frame, 8... Porous body, 9... Suction hole.
Claims (1)
線を植設する第１工程と、該母型を鍍金して母型
の成形面に前記細線を埋設させて電鋳シエルを形
成する第２工程と、該電鋳シエルの細線を除去し
て形成した細孔を吸引孔とすべく該電鋳シエルを
金枠にセツトして多孔質体で補強した第３工程と
からなる真空型の製造方法。1. A first step of planting a thin wire of a non-conductive material on the molding surface of a matrix having the same shape as the workpiece, and plating the matrix and embedding the thin wire in the molding surface of the matrix to form an electroformed shell. A vacuum mold consisting of a second step and a third step in which the electroformed shell is set in a metal frame and reinforced with a porous material so that the pores formed by removing the thin wires of the electroformed shell are used as suction holes. manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1126083A JPS59140385A (en) | 1983-01-28 | 1983-01-28 | Manufacture of vacuum mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1126083A JPS59140385A (en) | 1983-01-28 | 1983-01-28 | Manufacture of vacuum mold |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59140385A JPS59140385A (en) | 1984-08-11 |
| JPS6330400B2 true JPS6330400B2 (en) | 1988-06-17 |
Family
ID=11772969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1126083A Granted JPS59140385A (en) | 1983-01-28 | 1983-01-28 | Manufacture of vacuum mold |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59140385A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61104820A (en) * | 1984-10-18 | 1986-05-23 | Honda Motor Co Ltd | Mold with embossed pattern for synthetic resin sheet |
| KR101038088B1 (en) * | 2009-09-10 | 2011-06-01 | 주식회사 몰텍스 | Method of manufacturing a porous electroformed shell for patterning using fiber and the porous electroformed shell thereof |
-
1983
- 1983-01-28 JP JP1126083A patent/JPS59140385A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59140385A (en) | 1984-08-11 |
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