JPS63301598A - Device for mounting electronic component - Google Patents

Abstract

PURPOSE:To allow the title device to be applicable to many kinds of electronic parts with simple structure by attaching plural kinds of nozzle on the mounting head. CONSTITUTION:When a suction nozzle rotates and stops at the position of suction in the order of suction nozzles 20, 23, 21, 26 and 22, and a part supply cassette 9 corresponding to respective nozzles moves to the position of suction, a suction nozzle 20 lowers and sucks, for example, when a flat small part is moved. Then, a mounting head 8 rotates, and a suction nozzle 23 for different shape electric parts moves to the position of suction. However, in the case where a part supply cassette 9 synchronously moved to the position of suction is a cassette for cylindrical large electric parts, the suction head 23 does not operate. Then, when the suction head 21 moves to the position by intermittently rotating, the suction nozzle 21 lowers, sucks it, and mount it on the electronic circuit board 11 having moved to the specified position. Thus, suction nozzles corresponding to many kinds of electronic parts are arranged on the mounting head 8 to allow a part to be mounted with a suitable nozzle applied to it.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an electronic component mounting apparatus for mounting various types of electronic components onto an electronic circuit board.

(Prior Art) In recent years, the number of irregularly shaped electronic components has increased and the number of types has increased, and as a result, several types of suction nozzles are being used to mount electronic components.

A conventional electronic component mounting apparatus will be explained with reference to FIGS. 4 to 7.

FIG. 4 is a perspective view of a double A-shaped suction nozzle that can handle both small and large electronic components. figure(
As shown in a), the small nozzle 1 protrudes from the large nozzle 2 and is attracted to the child part 3 of the small part.
As shown in Figure (b), the large electronic component 4 is attracted with the small nozzle 1 housed in the large nozzle 2.

FIG. 5 is a perspective view of an electronic component mounting apparatus using the above-mentioned double structure suction nozzle. Placed. A mounting head 8 fixed to an index shaft 7 that rotates intermittently at 36 degrees and a plurality of component supply cassettes 9 are arranged radially, and rotate in synchronization with the intermittent rotation of the mounting head 8 to sequentially move the component supply cassettes 9 to the component supply position. The device is comprised of a component supply device 10 that moves a component supply cassette 9, and an XY table 12 on which an electronic circuit board 11 is mounted. Note that the XY table 12 can be arbitrarily positioned on the table by two servo motors 13 and 14 that drive in the X direction and the Y direction. Further, as the mounting head 8 rotates, the nozzle head 6 is sucked by extending the double structure suction nozzle 5 at the position of the component supply cassette 9 that sucks the electronic component 3 or 4, and is pulled up to continue rotating.

Meanwhile, the XY table 12 operates and the electronic circuit board 11
The upper mounting section is moved to the mounting position 15 of the mounting head 8. The double structure suction nozzle 5 is lowered again by the mounting device 15,
The electronic components that have been sucked and transported are mounted on the electronic circuit board 11. When the attachment is completed, the double structure suction nozzle 5 is pulled up again and continues to rotate. Therefore, the double structure suction nozzle 5 rotates intermittently while passing through a fixed path.

FIG. 6 shows the arrangement of ten double structure suction nozzles 5, which are arranged concentrically at intervals of 36° and rotate intermittently at 36° clockwise intervals. The upper end is a suction position 16, and the lower end is a mounting position 15.

The operation of the electronic component mounting apparatus configured as described above will be explained.

When the component supply cassette 9 containing small electronic components comes to the suction position 16, the small nozzle 1 of the double structure suction nozzle 5 extends while protruding, and the small electronic component is suctioned with its tip. The mounting head 8 rotated 36 degrees, and in synchronization with this, the component supply cassette 9 containing large electronic components came to the suction position 16, and the small nozzle 1 was accommodated in the large nozzle 2. It stretches out and attracts large electronic components with its tip.

In this way, it rotates while suctioning the electronic components one by one until it reaches the mounting position. On the other hand, the electronic circuit board 11 mounted on the XY table 12 is driven by NC data, moves sequentially to a fixed position where each electronic component is mounted, and waits. At the mounting position, the double structure suction nozzle 5 that has suctioned the electronic components each time is lowered to sequentially mount the electronic components in a fixed position.

However, as the types of electronic components increase, a problem has arisen in that the double structure suction nozzle 5 cannot accommodate all types.

To solve this problem, it is necessary to use multiple types of suction nozzles. A description will be given of an electronic component mounting apparatus that takes this type of measure and is disclosed in Japanese Patent Application Laid-open No. 11.3699/1982.

FIG. 7 is a plan view schematically showing the configuration of the mounting head;
A plurality of sub-heads 19 are arranged around the periphery of the main head 18 fixed to the index shafts 71 to 17, and a plurality of types of suction nozzles 20 are arranged around the periphery of each sub-head 19 in the shapes of circles, squares, triangles, and bullets. 21.2
Attach 2 and 23. Furthermore, in order to change the relative position of the sub navels 1 to 19 with respect to the main head 18, a gear 24 fixed to the rotating shaft (not shown) of the sub head 19 is rotated by a pinion 25 fixed to a servo motor (not shown). .

The operation of the electronic component mounting apparatus having the suction head configured as described above is basically the same as that of the first conventional example shown in FIG. 5, so the explanation thereof will be omitted.

(Problem to be Solved by the Invention) However, in such a countermeasure, since each sub-head is equipped with the same combination of suction heads 20, 21, 22 and 23, a large number of identical suction nozzles are required, and the overall nozzle There was a problem that the number of books was extremely large.

Further, in order to rotate the sub-head 19 and select a desired suction nozzle, an independent drive device having a gear 24 and a pinion 25 is required, which results in a complicated structure.

The present invention solves the above problems and provides an electronic component mounting device that has a simple structure and can mount a wide variety of electronic components.

(Means for Solving the Problems) In order to solve the above problems, the present invention arranges a plurality of types of suction nozzles in a mounting head having the same structure as the conventional example, and programs them in advance according to the electronic components. This specifies the suction nozzle.

(Function) According to the above configuration, the optimum suction nozzle can be selected according to various electronic components with a simple structure.

(Example) Embodiments of the present invention will be explained with reference to FIGS. 1 to 3.

FIG. 1 is a perspective view of an electronic component mounting apparatus according to the present invention. The difference from the conventional example shown in FIG. 5 lies in the suction nozzles attached to the lower end of each nozzle head 6, so the same components as in the conventional example are given the same reference numerals and explanations will be omitted.

FIG. 2 shows the arrangement of multiple types of suction nozzles attached to the nozzle head 6, and the suction nozzles 20, 21.2 shown in FIG.
In addition to the four types 2 and 23, a suction nozzle 26 shown in a rectangular shape is added. These five types are repeated counterclockwise in the order of suction nozzles 20, 23, 21, 26 and 22, and two of each are arranged.

The suction nozzle 20 shown as a circle is for a small flat plate, the suction nozzle 22 shown as a triangle is for a large size flat plate, the suction nozzle 26 shown as a rectangle is for a small cylindrical size, and the suction nozzle 21 shown as a square is for a cylindrical size. Suction nozzle 23 for large size, shown in bullet shape
is for other variants.

The operation of the electronic component mounting apparatus configured as described above will be explained.

Each suction nozzle 20, 23, 21, 26 and 22 rotates to the suction position 16 in order and stops. When the corresponding component supply cassette 9 comes to the suction position, for example, if a small flat electronic component is present, the suction nozzle 20 descends and suctions it. Next, the mounting head 8 rotates and the suction nozzle 23 for odd-shaped electronic components comes to the suction position. However, if the component supply cassette 9 that has been moved to the suction position at the same time is a cylindrical large electronic component, the suction nozzle 23 23 does not operate. Next, when the suction head 21 rotates intermittently, the suction nozzle 2
1 descends and attracts.

The suction nozzles 20 and 21 that have been sucked, respectively, come to the mounting position and are mounted on the electronic circuit board 11 that is moving to a fixed position. In this way, since suction nozzles corresponding to many types of electronic components are arranged in the mounting head 8, it is possible to apply the optimal suction nozzle for mounting.

In this embodiment, the five types of suction nozzles are evenly arranged, but the type and configuration of the suction nozzles may be flexibly changed depending on the ratio of the number of electronic components used.

FIG. 3 mainly shows a suction nozzle 20 shown in a round shape that is used for a frequently used small flat electronic part.
．． 23 and 21 are added and arranged.

(Effects of the Invention) As explained above, according to the present invention, multiple types of suction nozzles are attached to the mounting head of a conventional electronic component mounting apparatus, and the selection of electronic components to be applied to each suction nozzle is programmed. By preparing the software,
An electronic component mounting device that has a simple structure and can be applied to many types of electronic components can be obtained.

[Brief explanation of drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus according to the present invention, and FIG.
Figures 3 and 3 are layout diagrams of multiple types of suction nozzles attached to each mounting head, Figure 4 is a perspective view of the main parts of a conventional dual structure suction nozzle, and Figure 5 is a diagram of a conventional electronic component mounting device. FIG. 6 is a perspective view, and FIG. 6 is a layout diagram of the dual structure suction nozzle attached to the mounting head, and FIG. 7 is a schematic plan view of a conventional mounting head to which a plurality of types of suction nozzles are attached. 1...Small size nozzle, 2...Large size nozzle,
3...Small electronic components, 4...Large electronic components,
5... Double structure suction head, 6... Nozzle head, 7,17... Index shaft, 8
... Mounting head, 9 ... Parts supply cassette, 10
...Electronic component supply device, 11...Electronic circuit board, 12...XY table, 13.14...Servo motor, 15...Mounting position, 16...Adsorption position, 18...
・Main head, 19・ Sub head, 20.21.2
2.23.26 - Suction head, 24... Gear, 25... Pinion. Patent applicant Matsushita Electric Industrial Co., Ltd. Figure 1 Figure 2 Figure 2゜Figure 3 Figure 4 Figure 5 Figure 6 Figure 7

Claims (2)

[Claims] (1) A component supply device that supplies various electronic components one by one to a predetermined position, an XY table that holds an electronic circuit board and moves it to a predetermined position, and sucks the components supplied by the above component supply device. However, in the electronic component mounting device described above, which consists of a nozzle head with a plurality of suction nozzles attached to the electronic circuit board arranged in a circle around the periphery, and a mounting head that rotates intermittently at the center of the circle, various types of An electronic component mounting apparatus characterized in that a plurality of types of suction nozzles corresponding to electronic components having different shapes and dimensions are attached to the above-mentioned mounting head. (2) A claim characterized in that the plurality of types of suction nozzles are provided with removable nozzle heads, and the type of suction nozzles and their distribution can be selected in accordance with the frequency of use of electronic components. The electronic component mounting device according to item (1).