JPS63299856A - Solder joining method for magnet wire - Google Patents

Abstract

PURPOSE:To facilitate soldering and to shorten the working time by squeezing the joining part of a magnetic wire in the flatness of limited thickness and soldering the squeezed part to the counter part joining part. CONSTITUTION:The tip of the joining part of the magnetic wire 18 wound on the T part 16a of a core 16 is squeezed flatly by a press punch 20. With this squeezing processing a crack is caused on the insulating film of the magnetic wire 18 to destroy it. At this time, the squeezing is executed so as to make t/d<=0.5 in the case of taking the original diameter dimension of the magnetic wire 18 in dmm and the thickness after crushing in tmm. Thereafter, the squeezed part 18a of the magnetic wire 18 is subjected to soldering to the counter part joining part 16 of the land, terminal, etc., of the printed circuit board 15.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a method for soldering a magnet wire to a mating joint such as a land or a terminal of a printed circuit board by soldering.

(Prior Art) Conventionally, for example, in a brushless motor, a magnet wire 1 is soldered to a land 3 of a printed circuit board 2, as shown in FIG. In this case, before soldering the magnet wire 1 to the land 3,
As shown in the figure, the tip end portion 1a of the magnet wire 1 to be joined is pre-soaked in a molten solder tank 4 for a predetermined time, and then the tip end portion 1a is soldered to the land 3. The need for performing the above presoaking is as follows.

That is, as is well known, the magnet wire 1 has an insulating coating formed by baking synthetic enamel onto the core wire, so the magnet wire 1 was soldered to the land 3 as is.
In this case, the presence of the insulating film makes the bonding difficult, and for this reason, the magnet 1 is immersed in molten solder in advance to dissolve the insulating wave film.

(Problem to be Solved by the Invention) However, in the above method, before soldering the magnet wire 1 to the land 3, the magnet wire 1 is soaked in P (Q) of molten solder over a predetermined period of time. 3, high-temperature solder is attached to the magnet wire 1, which is difficult and dangerous to handle, and it takes a long time to melt the insulating wave film, so that the final solder to the land 3 is There was a problem that it took a considerable amount of time.

The present invention was made in view of the above circumstances, and its purpose is to provide a solder joint for magnet wires that allows soldering work to be performed easily and safely, and also to shorten the work time. We are here to provide you with a method.

[Structure of the Invention] (Means for Solving the Problems) The present invention provides a method for soldering a magnet wire to a mating joint such as a land or a terminal of a printed circuit board.
This method is characterized in that the part of the magnet wire to be joined is crushed into a flattened part and the crushed part is soldered to the mating part to be joined.

(Function) By crushing the part of the magnet wire to be welded flat, a crack breaks down in the insulating coating of the magnet wire, and as a result, this crushed part is attached to the mating part (when soldering, the core wire and the mating part The magnet wires can be soldered well, and the magnet wire can be bonded well.As a result, the conventional Y-9 dipping process for molten solder can be made unnecessary.

(Embodiment) An embodiment of the present invention will now be described with reference to FIGS. 1 to 6.

A part of the brushless motor is shown in FIGS. 3 and 4, and in these FIGS. 3 and 4, 11 is a sleeve that supports and supports the rotating shaft 12, and 13 is a sleeve that is attached to the rotating shaft 12. The rotor yoke includes a rotor magnet 14 attached to the rotor yoke 13, a printed circuit board 15 attached to the sleeve 11, and a core 16 attached to the printed circuit board 15 via a mounting member 17. A magnet wire 18 is made of, for example, a polyurethane wire (UEW), which is a type of synthetic enamelled wire in which an insulating layer is formed by baking a polyurethane resin onto a core wire. This magnet wire 18 is wound around the teeth portion 16a of the core 16, and its tip portion is soldered to the land 19 of the printed circuit board 15.

The method of soldering the magnet wire 18 will now be described. First, as shown in FIG. 2, the tip portion of the magnet wire 18 wound around the teeth portion 16a of the core 16, which is the portion to be joined, is flattened with a press punch 20. This crushing process cracks the insulating wave film of the magnet wire 18 and destroys it. In this case, the original diameter of the magnet wire 18 is d [ms+],
When the thickness after crushing is t [a+m], t/d≦
It is crushed and formed so that it becomes 0.5.

Thereafter, the crushed portion 18a of the magnet wire 18 is soldered to the land 19 of the printed circuit board 15.

In this case, the molten solder penetrates well between the core wire of the magnet wire 18 and the land 19 which is the mating joint, and the residual insulating wave film separates from the core wire, and the magnet wire 18
can be well bonded to the land 19. As a result, the conventional pre-dipping process for molten solder is not required. Furthermore, the magnet wire 18 that has been subjected to the crushing process described above does not have high-temperature solder attached to it unlike the conventional case, so it is easy to handle when cleaning the solder onto the land 19. fi-dipping is the process and final step into the land.
The total work time will be quite long since it will involve tatsuki, but
In this embodiment, the time required for the crushing process is considerably shorter than the time required for pre-soaking, so that the working time can be greatly reduced. In particular, the crushed portion 18a,
According to this embodiment, which is formed so that t/d≦0.5 as described above, as can be seen from FIG. 5, the soldering time required for soldering can be further shortened. .

In this figure, curve A represents the soldering temperature ['C] and the soldering temperature when the core wire warp is 0.14 [maJ] and t/d is a value of 0.5 or less, for example, rO, 3J. Curve B shows the relationship with the required time [seconds] for application, and curve B shows the case where no crushed portion is formed, and therefore the t/d of the wave joining portion in the magnet wire is “1”. In FIG. 5, when looking at a temperature of 350° C., the required time for curve B is approximately 5.9 seconds, whereas the required time for curve A according to this embodiment is shortened to approximately 3.2 seconds. Figure 6 shows the solder temperature at 35
It shows the relationship between the above ratio t/d and the required time when the temperature is 0°C, and as can be seen from the figure, the ratio t/d is r
When the time becomes 5J or more, the time required decreases rapidly. Therefore, if t/d is ro, 5J or less, the soldering work time can be further shortened. Furthermore, the solder melting temperature can also be lowered.

It should be noted that the present invention is not limited to the above embodiments; for example, the mating joint may be a terminal or the like other than the land of a printed circuit board, and the magnet wire is limited to a polyurethane wire. Various changes and modifications may be made without departing from the scope of the invention.

[Effects of the Invention] As is clear from the above description, according to the present invention, when a magnet wire is soldered to a mating joint such as a land or a terminal of a printed circuit board, the corrugated joint portion of the magnet wire can be flattened. Since the crushed portion is soldered to the mating joint, the preparatory process for molten solder, which was required in the past, is no longer necessary, and as a result, the soldering work can be performed easily and safely. It has the excellent effect of not only making it possible to do this, but also greatly shortening the working time.

[Brief explanation of the drawing]

1 to 6 show an embodiment of the present invention, in which FIG. 1 is a perspective view of the crushing portion of the magnet wire, FIG. 2 is a perspective view for explaining the crushing process, and FIGS. Figure 4 is a vertical side view and perspective view showing a part of the brushless morph, Figure 5 is a diagram showing the relationship between solder temperature and required soldering time when the t/d ratio of the collapsed portion is different. FIG. 6 is a diagram showing the relationship between the ratio of t/d and the required soldering time at a predetermined soldering temperature. 7 and 8 show a conventional example, with FIG. 7 being a view corresponding to FIG. 4, and FIG. 8 being a perspective view for explaining the preliminary preparation process for the molten metal. In the figure, 15 is b, 1. 18 is a magnet board.
゛・1 Wire, 18a is a crushed portion, 19 is a land (a mating portion), and 20 is a press punch.

Claims (1)

[Claims] 1. When soldering a magnet wire to a mating joint such as a land or a terminal of a printed circuit board, the part of the magnet wire to be joined is flattened and the crushed part is soldered to the mating joint. A method for soldering magnet wires, characterized in that: 2. The crushed part is made by changing the original diameter of the magnet wire to d [m
m] and the thickness after crushing is t [mm], then t/
The method for soldering magnet wires according to claim 1, wherein the magnet wires are formed so that d≦0.5.