JPS62295324A - Manufacture of substrate type temperature fuse - Google Patents
Manufacture of substrate type temperature fuseInfo
- Publication number
- JPS62295324A JPS62295324A JP13903786A JP13903786A JPS62295324A JP S62295324 A JPS62295324 A JP S62295324A JP 13903786 A JP13903786 A JP 13903786A JP 13903786 A JP13903786 A JP 13903786A JP S62295324 A JPS62295324 A JP S62295324A
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- metal material
- point metal
- temperature fuse
- type temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims description 11
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 238000002844 melting Methods 0.000 claims description 25
- 239000007769 metal material Substances 0.000 claims description 24
- 230000008018 melting Effects 0.000 claims description 15
- 238000003466 welding Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 9
- 230000004907 flux Effects 0.000 claims description 6
- 238000009499 grossing Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Fuses (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
３、発明の詳細な説明
〈産業上の利用分野〉
本発明は基板型温度ヒユーズの製造方法の改良に関する
ものである。Detailed Description of the Invention 3. Detailed Description of the Invention (Field of Industrial Application) The present invention relates to an improvement in the manufacturing method of a substrate type thermal fuse.
く先行技術と問題点〉
温度ヒユーズの１つとして基板型温度ヒユーズが公知で
ある。第３図Ａは基板型温度ヒユーズの上面説明図を、
第３図Ｂは第３図Ａにおけるｂ−ｂ断面図をそれぞれ示
しており、絶縁基板１・上に一対の層状電極２°、２・
を設け、低融点金属材３・の両端をそれぞれ各Ｔ、極に
溶接し、低融点金属材上にフラックス層４°を設け、絶
１！基板上全体に絶縁属５゛ をモールドしである。Prior Art and Problems> A substrate-type temperature fuse is known as one type of temperature fuse. Figure 3A is a top view of the substrate type temperature fuse.
FIG. 3B shows a cross-sectional view taken along line bb in FIG. 3A, in which a pair of layered electrodes 2°, 2,
, weld both ends of the low-melting point metal material 3 to each T and pole, and provide a 4° flux layer on the low-melting point metal material. An insulating metal layer 5 is molded all over the board.
この基板型温度ヒユーズにおいて、フラックス層は、温
度ヒユーズ作動時、溶融した低融点金属材の表面張力に
よる球状化切断を促進する作用々奏する。特に、この球
状化が電極を核として発生するから、当該球状化切断に
対し、電極直上の低融点金属材部分のフラックス層部分
の寄与度は１￥に大である。In this substrate-type temperature fuse, the flux layer functions to promote cutting of the molten low-melting point metal material into spheroidization due to surface tension when the temperature fuse is activated. In particular, since this spheroidization occurs with the electrode as a nucleus, the contribution of the flux layer portion of the low melting point metal material directly above the electrode to the spheroidization is as large as 1 yen.
しかしがら、電極直上の低融点金属材部分は溶接箇所で
あり、この溶接時、芯部加熱に伴う気泡爆裂があり、そ
の溶接表面が荒れており、従来においては、この荒面に
フラックスを塗布しているため、塗布面不良に基因する
フラックス層不良が起り得、かかる温度ヒユーズでは、
低融点金属÷オの上記球状化切断を促迅に行なわしめＮ
ｕ＜問題がある。However, the low melting point metal material directly above the electrode is a welding point, and during welding, bubbles explode due to heating of the core, resulting in a rough welding surface. Conventionally, flux is applied to this rough surface. Therefore, flux layer defects may occur due to defects in the coating surface, and such temperature fuses
Speed up the above-mentioned spheroidization cutting of low melting point metal ÷ E
u<There is a problem.
〈発明の目的〉
本発明の目的は、かかる問題点に巡み、その不利を排除
すべく基板型温度ヒユーズを製造面において改良するこ
とにある。<Object of the Invention> An object of the present invention is to solve the above-mentioned problems and to improve the manufacturing process of a substrate-type temperature fuse in order to eliminate the disadvantages thereof.
〈発明の構成〉
本発明に係る基板型温度ヒユーズの製造方法は、絶縁基
板上に設けた一対の層状電極間に低融点金属材を配置し
、各電極と低融点金属材とを溶接し、次いで、該低融点
金属材の溶接箇所の表面を平滑化処理し、而るのちに、
低融点金属材上にフラフクスを塗布することを特徴とす
る方法である。<Configuration of the Invention> The method for manufacturing a substrate-type temperature fuse according to the present invention includes arranging a low-melting point metal material between a pair of layered electrodes provided on an insulating substrate, welding each electrode and the low-melting point metal material, Next, the surface of the welding point of the low melting point metal material is smoothed, and then,
This method is characterized by applying fluffx on a low melting point metal material.
〈実施例の説明〉 以下、図面により本発明を説明する。<Explanation of Examples> The present invention will be explained below with reference to the drawings.
第１図は低融点金属材（ヒユーズ素子）の溶接を終了し
た段階を示している。FIG. 1 shows the stage at which welding of a low melting point metal material (fuse element) has been completed.
第１図において、１は絶、Ｉａ基板（例えばセラミック
ス板）、２．２は一対の層状電極（例えば、根系洞系ま
たは金糸導電性ペーストの印刷、焼付けによる）、３は
低融点金属材（線状、または箔状）であり、各端部を各
電極にビーム溶接またはハンダごて方式によって溶接し
である。In Fig. 1, 1 is an Ia substrate (for example, a ceramic plate), 2.2 is a pair of layered electrodes (for example, by printing or baking a root system or gold thread conductive paste), and 3 is a low melting point metal material ( Each end is welded to each electrode by beam welding or a soldering iron method.
この段階において、溶接箇所表面は粗荒面ａである。At this stage, the surface of the welding location is a rough surface a.
本発明においては、この溶接箇所を平滑化処理し、次い
で、低融点金属材上にフラフクスを塗布する。In the present invention, this welding location is smoothed and then fluffx is applied onto the low melting point metal material.
平滑化処理には、溶接箇所を表面平滑なプレスにより第
２図Ａに示すように平滑化する方法、あるいは、第２図
Ｂに示すように低融点金属材の全面を平滑にプレス処理
する方法、または、第２図Ｃに示すように、溶接箇所を
平滑表面に切削加工する方法等（ｂは切削面を示す）を
用いることができる。For smoothing treatment, the welded area can be smoothed by pressing to make the surface smooth, as shown in Figure 2A, or the entire surface of the low-melting point metal material can be pressed to make it smooth, as shown in Figure 2B. Alternatively, as shown in FIG. 2C, a method may be used in which the welding area is cut into a smooth surface (b indicates the cut surface).
このようにして、低融点金属材の溶接箇所を平滑化処理
したのちは、従来通り、低融点金属材上にフラフクスを
塗布し、次いで、絶縁基板上に樹脂（例えばエポキシ樹
脂）をモールド成形し、これにて、基板型温度ヒユーズ
の製造を終了する。After smoothing the welded parts of the low-melting point metal material in this way, fluffx is applied to the low-melting point metal material as before, and then a resin (e.g., epoxy resin) is molded onto the insulating substrate. , This concludes the manufacture of the substrate type temperature fuse.
〈発明の効果〉
本発明に係る基板型温度ヒユーズの製造方法においては
、上述した通り、低融点金属材を電極に溶接したのち、
その溶接表面を平滑化処理したうえで、低融点金属材上
にフラフクスを塗布しているから、低融点金属材オの電
極直上部分にもフラフクスを一様に塗布できる。従って
、低融点金属材のＢＥ状化切断を迅速に行なわせ得る良
好な作動特性の基板型温度ヒユーズを製造できる。<Effects of the Invention> In the method for manufacturing a substrate type temperature fuse according to the present invention, as described above, after welding a low melting point metal material to an electrode,
Since the welding surface is smoothed and then the fluffx is applied to the low melting point metal material, the fluffx can be evenly applied to the part of the low melting point metal material directly above the electrode. Therefore, it is possible to manufacture a substrate-type temperature fuse with good operating characteristics that can quickly cut a low-melting point metal material into a BE shape.
第１図は本発明における平滑化処理直前の状態を示す説
明図、第２図Ａ、第２図Ｂ並びに第２図Ｃはそれぞれ本
発明における平滑化処理の各種方法を示す説明図、第３
図Ａは公知の基板型温度ヒユーズを示す上面図、第３図
Ｂは第３図へにおけるｂ−ｂ断面図である。
図において、ｌは基板、２．２は電極、３は低融点金属
材である。
７３１ｆＪＡ
γ３１ｊＪＢFIG. 1 is an explanatory diagram showing the state immediately before the smoothing process in the present invention, FIGS. 2A, 2B, and 2C are explanatory diagrams showing various methods of the smoothing process in the present invention, and FIG.
Figure A is a top view showing a known substrate type temperature fuse, and Figure 3B is a sectional view taken along line bb in Figure 3. In the figure, 1 is a substrate, 2.2 is an electrode, and 3 is a low melting point metal material. 731fJA γ31jJB
Claims (1)
配置し、各電極と低融点金属材とを溶接し、次いで、該
低融点金属材の溶接箇所の表面を平滑化処理し、而るの
ちに、低融点金属材上にフラックスを塗布することを特
徴とする基板型温度ヒューズの製造方法。A low melting point metal material is placed between a pair of layered electrodes provided on an insulating substrate, each electrode and the low melting point metal material are welded, and then the surface of the welding point of the low melting point metal material is smoothed, A method for manufacturing a substrate-type thermal fuse, which is characterized in that a flux is subsequently applied onto a low-melting point metal material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13903786A JPH0740456B2 (en) | 1986-06-13 | 1986-06-13 | Substrate type temperature fuse manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13903786A JPH0740456B2 (en) | 1986-06-13 | 1986-06-13 | Substrate type temperature fuse manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62295324A true JPS62295324A (en) | 1987-12-22 |
| JPH0740456B2 JPH0740456B2 (en) | 1995-05-01 |
Family
ID=15235981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13903786A Expired - Fee Related JPH0740456B2 (en) | 1986-06-13 | 1986-06-13 | Substrate type temperature fuse manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0740456B2 (en) |
-
1986
- 1986-06-13 JP JP13903786A patent/JPH0740456B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0740456B2 (en) | 1995-05-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3610874A (en) | Laser welding technique | |
| JPS62293707A (en) | Capped electronic parts | |
| JPH02275660A (en) | Electric pin and manufacture thereof | |
| US4483062A (en) | Method for manufacturing solid electrolyte condensers | |
| JPH1064747A (en) | Coil component and its manufacturing method | |
| JPS62295324A (en) | Manufacture of substrate type temperature fuse | |
| CA1093167A (en) | Method for making fused solid electrolyte capacitor assemblages and a fused capacitor made thereby | |
| JPH0456028A (en) | Temperature fuse and its forming method | |
| JPH02156606A (en) | Connection structure of lead wire | |
| JPH0227523Y2 (en) | ||
| JPH0465158A (en) | Manufacture of semiconductor device | |
| JP3012227U (en) | Flat motor stator | |
| JPH01169885A (en) | Soldering method | |
| JP3162177B2 (en) | Chip component mounting method and wiring board | |
| JPH02151389A (en) | Solder material | |
| JP2000246459A (en) | Structure for insulating treatment of spot welding electrode tip | |
| JPH05243100A (en) | Manufacture of solid-state electrolytic capacitor | |
| JPH0436528Y2 (en) | ||
| JPS62213212A (en) | Chip inductor | |
| CN111865015A (en) | Coil processing technology | |
| JPS6016090B2 (en) | How to pull out lead wires for plastic film capacitors | |
| JPH0355783A (en) | Soldering lead terminal | |
| JPH0346206A (en) | Manufacture of chip inductor | |
| JPH01176620A (en) | Manufacture of temperature fuse | |
| JPS6314450B2 (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |