JPS63299255A - Sealing device - Google Patents

Abstract

PURPOSE:To prevent a pinhole from being made due to a pressure difference between the inside and the outside of a material to be sealed until a material to bond the material to be sealed is solidified by a method wherein a pressure is adjusted in such a way that an atmospheric pressure at the inside of the material to be sealed and the atmospheric pressure at its circumference are kept to be identical. CONSTITUTION:The following are provided: an airtight container 2 which houses a material 4 to be sealed such as a semiconductor device or the like; a heating and cooling part 3 which heats or cools the airtight container 2; an atmospheric pressure control part 1 which controls an atmospheric pressure inside the airtight container 2. The pressure control part 1 is composed of the following: an arithmetic device which controls the pressure inside the airtight container 2 in accordance with a temperature of the material 4 to be sealed; a pump for pressurization and decompression use. The heating and cooling part 3 heats or cools the material 4 to be sealed in such a way that a material 5 for sealing and bonding the material to be sealed is melted. The pressure control part 1 pressurizes or decompresses the pressure inside the airtight container 2 in accordance with a heating or cooling temperature by the heating or cooling part 3 in such a way that, when the material 4 to be sealed is heated or cooled by the heating or cooling part 3, the pressure inside the material 4 to be sealed and the pressure inside the airtight container 2, i.e. in the circumference of the material 4 to be sealed, becomes identical.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a hollow hermetic sealing device for semiconductor devices and the like.

[Prior Art] Conventionally, as shown in FIG. 2, in this type of sealing device, the pressure around the material 4 to be sealed, such as a semiconductor device, is almost the same as atmospheric pressure, Even when heating or cooling is performed by the heating/cooling section 3, the surrounding pressure is not actively changed.

[Problems to be Solved by the Invention] In the conventional sealing device described above, the pressure around the material to be sealed is always fixed near atmospheric pressure, so heating and
During cooling, a large pressure difference occurs between the internal pressure of the material to be sealed and the atmospheric pressure.

As a result, pinholes are generated in a part of the joint of the sealing material, resulting in a loss of airtightness.

An object of the present invention is to provide a sealing device that solves the above problems.

[Differences between the invention and the prior art] Compared to the conventional sealing device described above, the present invention has an added function of maintaining the pressure around the device to be sealed to be the same as the pressure inside the material to be sealed. It has original content in this respect.

[Means for Solving the Problems] The present invention provides an airtight sealing device used for semiconductor devices and the like, which includes an airtight container that houses a material to be sealed such as a semiconductor device, and a method for heating or sealing the material to be sealed. This sealing device is characterized by having a heating/cooling section that performs cooling, and an air pressure control section that controls the pressure within the airtight container according to the temperature of the heating/cooling section.

[Example code] Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

In FIG. 1, the present invention describes a material to be sealed such as a semiconductor device 4
an airtight container 2 for accommodating the sealed material, a heating/cooling section 3 for heating or cooling the material to be sealed 4, and an air pressure control section 1 for controlling the air pressure inside the airtight container 2 according to the temperature of the heating/cooling section 3. We are prepared. The pressure control unit 1 includes a calculation device for controlling the internal pressure of the airtight container 2 in accordance with the temperature of the material to be sealed 4, and a pump for pressurization and depressurization. The heating/cooling unit 3 heats or cools the sealing member 5 of the material to be sealed 4 to such an extent that it melts.

In the embodiment, the pressure control section 1 controls the pressure inside the material to be sealed 4 and the inside of the airtight container 2, that is, the pressure inside the material to be sealed 4 when the material to be sealed 4 is heated and cooled by the heating/cooling section 3. The pressure inside the airtight container 2 is increased or decreased in accordance with the heating or cooling temperature by the heating/cooling unit 3 so that the pressure is the same as the surrounding pressure.

[Effects of the Invention] As explained above, the present invention adjusts the pressure so as to maintain the same air pressure inside the material to be sealed and around it, thereby reducing the time required for the joining members of the material to be sealed to harden. This has the effect of preventing the formation of pinholes caused by the pressure difference between the inside and outside of the material to be sealed.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional diagram showing an embodiment of the present invention, and FIG. 2 is a diagram showing a conventional sealing device. 1... Pressure control section 2... Airtight container 3...
Heating/cooling part 4...Sealed material 5...Joining member for sealing

Claims (1)

[Claims] (1) In an airtight sealing device used for semiconductor devices and the like, an airtight container that houses a material to be sealed such as a semiconductor device, a heating/cooling section that heats or cools the material to be sealed, and a heating/cooling section for heating or cooling the material to be sealed; A sealing device comprising: an air pressure control section that controls the pressure within the airtight container according to the temperature of the cooling section.