JPS63299036A - Vacuum device - Google Patents
Vacuum deviceInfo
- Publication number
- JPS63299036A JPS63299036A JP13567187A JP13567187A JPS63299036A JP S63299036 A JPS63299036 A JP S63299036A JP 13567187 A JP13567187 A JP 13567187A JP 13567187 A JP13567187 A JP 13567187A JP S63299036 A JPS63299036 A JP S63299036A
- Authority
- JP
- Japan
- Prior art keywords
- vacuum
- exhaust port
- foreign matter
- valve
- vessel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007789 sealing Methods 0.000 claims description 19
- 239000000463 material Substances 0.000 abstract description 5
- 238000011282 treatment Methods 0.000 abstract description 2
- 230000001174 ascending effect Effects 0.000 abstract 1
- 238000009489 vacuum treatment Methods 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Abstract
Description
【発明の詳細な説明】 【発明の目的〕 （産業上の利用分野） 本発明は、真空装置に関する。[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a vacuum device.
（従来の技術）
一般に半導体集積回路の形成には、ボロンやリンなどを
シリコンに加え半導体特性を決めるイオン注入や高融点
金属または化合物薄膜を作るスパッタリング等の処理が
高真空中で行なわれている。(Prior art) Generally, in the formation of semiconductor integrated circuits, processes such as ion implantation in which boron, phosphorus, etc. are added to silicon to determine semiconductor properties, and sputtering to create thin films of high melting point metals or compounds are performed in a high vacuum. .
これらの処理を行うイオン注入装置やスパッタリング装
置等では内部の油回転ポンプや油拡散ポンプ、タライオ
ボンプ等真空ポンプで処理室である真空容器内の真空引
きを行う。In ion implantation equipment, sputtering equipment, and the like that perform these processes, a vacuum pump such as an oil rotary pump, an oil diffusion pump, or a Talio pump is used to evacuate the inside of a vacuum container, which is a processing chamber.
しかし、真空容器の中を真空ポンプで排気してやればす
ぐにポンプの到達真空度に達すわけではなく、特に真空
度が上がる程１種々の要因で真空引きが悪化する。その
主な原因として、容器の材料内部に含まれる気体分子や
表面に付着した異物による放出ガスやリークが考えられ
る。However, if the inside of the vacuum container is evacuated by a vacuum pump, the ultimate vacuum level of the pump is not immediately reached.In particular, as the vacuum level increases, the evacuation becomes worse due to various factors. The main causes of this are considered to be gases released or leaks due to gas molecules contained inside the material of the container or foreign matter attached to the surface.
このような、異物によるリーク等の防止例として実開昭
６１−１６２９４１号公報に開示されたものがある。An example of preventing such leaks due to foreign matter is disclosed in Japanese Utility Model Application Publication No. 162941/1983.
これによると、真空容器■と真空ポンプ０間の排気管■
に円板状異物流入防止用ネットに）が回転可能に設けら
れている。そして、異物流入防止用ネットに）により真
空ポンプ■側へ流入する異物を捕捉し、かつ、排気管■
の遮蔽量を切換え可能としている。According to this, the exhaust pipe between the vacuum container ■ and the vacuum pump 0■
A disc-shaped foreign matter inflow prevention net) is rotatably provided in the net. Then, the foreign matter flowing into the vacuum pump ■ side is captured by the foreign matter inflow prevention net (), and the exhaust pipe ■
The amount of shielding can be changed.
（発明が解決しようとする問題点）
しかしながら、上記の真空装置では排気管遮蔽量の変更
に伴い異物捕捉範囲も変化し、異物を捕捉しきれないと
いう問題があった。また、異物流入防止用ネットを回転
させるので、捕捉した異物を放出したり１周辺に付着し
ている異物を巻き上げて、異物によるリークが再発する
という問題があった。(Problems to be Solved by the Invention) However, in the above-mentioned vacuum apparatus, the foreign matter trapping range also changes as the exhaust pipe shielding amount changes, and there is a problem in that the foreign matter cannot be completely captured. Furthermore, since the net for preventing the inflow of foreign matter is rotated, there is a problem in that the captured foreign matter is released or the foreign matter adhering to one area is rolled up, causing a recurrence of leakage due to the foreign matter.
本発明は、上記点に対処してなされたもので、異物が真
空排気口付近に付着せず、異物によるリークの発生を防
止し、気密封止性を向上することのできる真空装置を提
供するものである。The present invention has been made in view of the above-mentioned problems, and provides a vacuum device that prevents foreign matter from adhering to the vicinity of the vacuum exhaust port, prevents leakage caused by foreign matter, and improves hermetic sealing performance. It is something.
（問題点を解決するための手段）
本発明は、排気口と排気口密閉弁の排気口対向面に異物
の付着を防止する異物捕捉手段を真空容器内に設けたこ
とを特徴とする。(Means for Solving the Problems) The present invention is characterized in that a foreign matter trapping means for preventing foreign matter from adhering to the exhaust port and the surface of the exhaust port sealing valve facing the exhaust port is provided in the vacuum container.
（作 用）
本発明の真空装置では、真空容器内に設けた異物捕捉手
段により排気口と排気口密閉弁の排気口対向面に異物の
付着を防止することにより、排気口と排気口密閉弁によ
る気密性を向上させ、メインテナンス時や被処理部材の
搬入搬出時に真空ポンプ内の真空度を保つことができ、
真空容器の真空立ち上げ時間を短縮することを可能とす
るものである。(Function) In the vacuum device of the present invention, the foreign matter trapping means provided in the vacuum container prevents foreign matter from adhering to the exhaust port facing surface of the exhaust port and the exhaust port sealing valve. This improves airtightness and maintains the vacuum inside the vacuum pump during maintenance and when loading and unloading workpieces.
This makes it possible to shorten the time required to start up the vacuum container.
（実施例）
以下、本発明の真空装置を図面を参照して実施例につい
て説明する。(Example) Hereinafter, examples of the vacuum apparatus of the present invention will be described with reference to the drawings.
種々の処理を行なう真空容器（１１）が気密に真空ポン
プ（１２）例えば油拡散ポンプと結合され、真空容器（
１１）内には円筒状排気口（１３）が設けられている。A vacuum container (11) for performing various treatments is hermetically coupled with a vacuum pump (12) such as an oil diffusion pump, and the vacuum container (11)
11) is provided with a cylindrical exhaust port (13).
そして、上気排気口（１３）に気密に係合する如く輪状
の０リング（１４）を備えた円板状排気口密閉弁（１５
）が、真空容器（１１）外の昇降機構（１６）により昇
降自在に設けられている。また、真空容器（ｌｌ）内に
は排気口（１３）および排気口密閉弁（１５）の近傍に
は真空容器（１１）内を処理部（１７）と分割する如く
、異物捕捉手段として多数の水平なフィン（１８）を備
えた方形状トラップ（１９）がネジ等により着脱自在に
設けられている。A disc-shaped exhaust port sealing valve (15) is provided with an annular O-ring (14) so as to airtightly engage with the upper air exhaust port (13).
) is provided so as to be able to be raised and lowered by a lifting mechanism (16) outside the vacuum container (11). In addition, in the vacuum container (ll), near the exhaust port (13) and the exhaust port sealing valve (15), there are many foreign matter trapping means, such as dividing the inside of the vacuum container (11) into a processing section (17). A rectangular trap (19) with horizontal fins (18) is provided so as to be detachable by screws or the like.
次に、上述した真空装置の真空処理方法を説明する。Next, a vacuum processing method using the above-mentioned vacuum apparatus will be explained.
昇降機構（１６）により排気口密閉弁（１５）を下降し
。The exhaust port sealing valve (15) is lowered by the elevating mechanism (16).
排気口（１３）と排気口密閉弁（１５）を０リング（１
４）により気密に係合させ、真空ポンプ（１２）内の真
空度を保つことができる。この時、図示しないバルブに
より真空容器（１１）内の圧力を大気圧に戻し１図。Connect the exhaust port (13) and the exhaust port sealing valve (15) with an O ring (1
4) allows airtight engagement and maintains the degree of vacuum within the vacuum pump (12). At this time, the pressure inside the vacuum container (11) is returned to atmospheric pressure by a valve (not shown) as shown in FIG.
示しない真空容器開閉口を開け、被処理部材を搬出搬入
したり真空容器内のメインテナンス作業等を行なう。The vacuum container opening/closing port (not shown) is opened to carry in and out the workpieces and perform maintenance work inside the vacuum container.
そして１図示しないバルブと真空容器開閉口を閉じ、昇
降機構（１６）により排気口密閉弁（１５）を上昇し、
真空ポンプ（１２）により真空容器（１１）内を所望の
真空度にする。この後、真空容器内の処理部（１７）で
真空処理を行う、その時、処理部（１７）から発生する
異物は１図の矢印で示す如く上方の排気口密閉弁（１５
）と下方の排気口（１３）へ向かうものはトラップ（１
９）のフィン（１８）に捕捉され、水平方向に向かうも
のは壁面に当たり付着する。ここで、異物はイオンや微
細な粒子なので真空中で直進運動を行う。つまり、上記
異物捕捉手段により排気口（１３）近辺と排気口密閉弁
（１５）の排気口（１３）対向面に対して異物の付着を
防止し、クリーン度を保つことにより、排気口（１３）
と排気口密閉弁（１５）を閉じた時の気密性が向上する
。その結果、異物による放出ガスやリークが防止され、
所望の真空度への到達時間が速くなり、装置の稼働効率
が向上する。1. Close the valve (not shown) and the opening/closing port of the vacuum container, and raise the exhaust port sealing valve (15) using the lifting mechanism (16).
The inside of the vacuum container (11) is brought to a desired degree of vacuum using the vacuum pump (12). After that, vacuum processing is performed in the processing section (17) inside the vacuum container. At that time, foreign matter generated from the processing section (17) is removed from the upper exhaust port sealing valve (15) as shown by the arrow in Figure 1.
) and the one heading towards the lower exhaust port (13) is the trap (1
Those caught by the fins (18) of 9) and directed horizontally hit the wall surface and adhere. Here, since the foreign matter is an ion or a fine particle, it moves in a straight line in a vacuum. In other words, the foreign matter trapping means prevents foreign matter from adhering to the vicinity of the exhaust port (13) and the surface facing the exhaust port (13) of the exhaust port sealing valve (15), thereby maintaining cleanliness. )
This improves airtightness when the exhaust port sealing valve (15) is closed. As a result, gas emissions and leaks due to foreign objects are prevented,
It takes less time to reach the desired degree of vacuum, improving the operating efficiency of the device.
また、真空処理が終了すると、再び真空容器内は大気圧
に戻され、被処理部材を搬出搬入したり、トラップ（１
９）を取り外して清掃するなどのメインテナンス作業を
行なう。In addition, when the vacuum processing is completed, the inside of the vacuum container is returned to atmospheric pressure again, and the workpieces to be processed can be carried in and out, and the trap (
9) Perform maintenance work such as removing and cleaning.
上記実施例では、異物捕捉手段として、水平フィンによ
るトラップで説明したが、排気口（１３）と排気口密閉
弁（１５）の排気口（１３）対向面に飛ぶ異物を捕捉で
きればよく、第２図の如く水平でないフィン構成でもよ
く、また、フィン形状はハニカム構造でもよく、網状フ
ィルターでもよく、上記実施例に限定されるものでない
ことは言うまでもない。 以上述べたようにこの実施例
によれば、排気口密閉弁が上昇して、真空容器内で真空
処理を行なう時に、排気口と排気口密閉弁の排気口対向
面に飛ぶ異物を異物捕捉手段であるフィン形状トラップ
で捕捉することにより、排気口密閉弁が下降して排気口
と形成する真空ポンプの気密度が向上し、そして、真空
容器の真空立ち上げ時間を速くすることができる。In the above embodiment, a horizontal fin trap is used as the foreign object trapping means, but it is only necessary to trap foreign objects that fly to the opposite surface of the exhaust port (13) and the exhaust port sealing valve (15). As shown in the figure, the fin configuration may be non-horizontal, and the fin shape may be a honeycomb structure or a mesh filter, and it goes without saying that the fin configuration is not limited to the above embodiments. As described above, according to this embodiment, when the exhaust port sealing valve rises and vacuum processing is performed in the vacuum container, the foreign matter trapping means traps foreign matter that flies to the exhaust port and the exhaust port facing surface of the exhaust port sealing valve. By trapping the gas with a fin-shaped trap, the exhaust port sealing valve lowers to improve the airtightness of the vacuum pump formed with the exhaust port, and it is possible to speed up the vacuum startup time of the vacuum container.
以上説明したように本発明によれば、排気口と排気口密
閉弁の排気口対向面に異物の付着を防止する異物捕捉手
段を真空容器内に設けたことにより、異物による放出ガ
スやリークの発生を防止し、気密封止性を向上し、その
結果、真空到達時間の速い効率的な真空処理を行うこと
ができる。As explained above, according to the present invention, a foreign matter trapping means for preventing foreign matter from adhering to the exhaust port and the surface of the exhaust port sealing valve facing the exhaust port is provided in the vacuum container, thereby preventing gas released or leaking due to foreign matter. This prevents the occurrence of air leakage, improves hermetic sealability, and, as a result, enables efficient vacuum processing with a quick vacuum attainment time.
第１図は本発明である真空装置の一実施例を示す構成図
、第２図は第１図における異物捕捉手段の他の実施例を
示す図、第３図は従来の真空装置を示す構成図である。
図において、
１１・・・真空容器 １３・・・排気口１５・・
・排気口密閉弁 １７・・・処理部１８・・・フィン
１９・・・トラップ特許出願人 東京エレ
クトロン株式会社第１図Fig. 1 is a configuration diagram showing one embodiment of the vacuum device according to the present invention, Fig. 2 is a diagram showing another embodiment of the foreign object capturing means in Fig. 1, and Fig. 3 is a configuration diagram showing a conventional vacuum device. It is a diagram. In the figure, 11... Vacuum container 13... Exhaust port 15...
・Exhaust port sealing valve 17... Processing section 18... Fin 19... Trap patent applicant Tokyo Electron Ltd. Figure 1
Claims (3)
いて、真空容器内に排気口と排気口密閉弁を設け、上記
排気口と排気口密閉弁の排気口対向面に異物の付着を防
止する異物捕捉手段を真空容器内に設けたことを特徴と
する真空装置。(1) In a device in which a vacuum container is evacuated by a vacuum pump, an exhaust port and an exhaust port sealing valve are provided in the vacuum container to prevent foreign matter from adhering to the exhaust port and the surface of the exhaust port sealing valve that faces the exhaust port. A vacuum device characterized in that a trapping means is provided within a vacuum container.
特許請求の範囲第１項記載の真空装置。(2) The vacuum device according to claim 1, characterized in that the foreign matter capturing means is detachable.
を特徴とする特許請求の範囲第１項記載の真空装置。(3) The vacuum device according to claim 1, wherein the foreign matter trapping means is a fin-shaped trap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62135671A JPH0754681B2 (en) | 1987-05-29 | 1987-05-29 | Vacuum device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62135671A JPH0754681B2 (en) | 1987-05-29 | 1987-05-29 | Vacuum device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63299036A true JPS63299036A (en) | 1988-12-06 |
| JPH0754681B2 JPH0754681B2 (en) | 1995-06-07 |
Family
ID=15157204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62135671A Expired - Fee Related JPH0754681B2 (en) | 1987-05-29 | 1987-05-29 | Vacuum device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0754681B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999037919A1 (en) * | 1998-01-22 | 1999-07-29 | Ebara Corporation | Trap device and trap system |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60114570A (en) * | 1983-11-25 | 1985-06-21 | Canon Inc | Evacuating system for plasma cvd device |
| JPS61162941U (en) * | 1985-03-29 | 1986-10-08 | ||
| JPS61265815A (en) * | 1985-05-20 | 1986-11-25 | Sharp Corp | Semiconductor manufacturing apparatus |
-
1987
- 1987-05-29 JP JP62135671A patent/JPH0754681B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60114570A (en) * | 1983-11-25 | 1985-06-21 | Canon Inc | Evacuating system for plasma cvd device |
| JPS61162941U (en) * | 1985-03-29 | 1986-10-08 | ||
| JPS61265815A (en) * | 1985-05-20 | 1986-11-25 | Sharp Corp | Semiconductor manufacturing apparatus |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999037919A1 (en) * | 1998-01-22 | 1999-07-29 | Ebara Corporation | Trap device and trap system |
| US6368371B1 (en) | 1998-01-22 | 2002-04-09 | Ebara Corporation | Trap device and trap system |
| KR100552643B1 (en) * | 1998-01-22 | 2006-02-20 | 가부시키가이샤 에바라 세이사꾸쇼 | Trap device and trap system |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0754681B2 (en) | 1995-06-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |