JPS6329527A - Resin potting method for tape carrier package - Google Patents

Abstract

PURPOSE:To prevent the drooping of resin and its creeping to the bottom surface of semiconductor element and to contribute to the implementation of a thin film for a film carrier package by performing application of resin on one surface excellently, by attaching a tape on the rear surface of the semiconductor element before resin potting, and potting a resin solution on the upper surface of the semiconductor element. CONSTITUTION:The flow of a resin solution, which is injected in a device hole, is stopped with tape 9, which is attached on the rear surface of a pellet 6. A film carrier package, on one surface of which resin is applied, is obtained by thermal hardening of the resin solution. The semiconductor element 6 and bumps 10, which are bonding parts of the element 6 and a finger leads 5, are sealed with potting resin 11. The resin 11 is compressed with a plate shaped material 13 from the upper surface of the potting resin 11. Thus the thickness of the entire package is reduced. Or the constant thickness can be maintained.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to improvements in resin potting techniques for assembling tape carrier packages.

[Conventional technology]

One of the mounting methods for semiconductor elements is the tape carrier method. This method is also known as the film carrier method or TAB (
Tape Automated Bonding (Tape Automated Bonding) method is generally a method in which semiconductor elements are successively assembled into a long film tape with sprocket holes, and the holes are used to bond the film (tape).
, and perform positioning.

An example of this method is to drill the sprocket hole and a device hole for incorporating a semiconductor element in a tape of an appropriate width, laminate copper foil, and form a desired lead pattern using photoresist technology or etching technology. . One feature of this method is that finger-shaped leads protrude into the device hole.

Then, the semiconductor element is aligned and bonded to this lead at 7-eighths-up.

Next, after the bonding, a resin solution is potted, thermally cured, and the resin is applied in order to seal the semiconductor element and the bonding portion.

Conventionally, the method for this coating was the so-called double-sided resin coating method, in which resin was applied to the front and back surfaces of the semiconductor element.
This has the disadvantage that it is too thick and difficult to incorporate into thin objects such as IC cards.

Therefore, a single-sided resin coating method has been proposed in which a resin solution is potted on only one side of a semiconductor element and the resin is applied.

Examples of documents that describe film carriers include rIC Mounting Technology J P107-113, P175, and P175 published by Kogyo Kenkyukai Co., Ltd., January 15, 1980.
143 to 146 are listed.

[Problem that the invention seeks to solve]

However, in the case of the single-sided resin coating method, during potting, the resin solution does not stay on the bottom edge of the side surface of the semiconductor element, but drips down to the lower part of the bottom surface in an icicle-like manner, or flows around the bottom surface. As a result, the overall thickness of the package becomes large, making it difficult to incorporate it into IC cards, etc., which exceed the standard thickness or require a thinner film.Remove the icicle-shaped resin and reduce the thickness. Although it is possible, the removal work is time-consuming.

The present invention eliminates the drawbacks of the prior art, prevents the resin from dripping down and wrapping around the bottom surface, enables single-sided coating, improves the workability of potting, and improves the yield. The purpose of the present invention is to provide a technology that can contribute to the thinning of film carrier packages.

The above and other objects and novel features of the present invention include:
It will become clear from the description of this specification and the accompanying drawings.

[Problem that the invention seeks to solve]

A brief overview of typical inventions disclosed in this application is as follows.

That is, in the present invention, tape is attached to the trap before resin potting and to the back (bottom) side of the semiconductor element, and then the resin solution is potted from the front side of the semiconductor element. Further, a protrusion may be provided on the tape. Further, the entire potting object may be pressed from the upper surface of the resin with a plate-like object that prevents resin from adhering.

[Effect]

By applying the tape and performing potting, the tape prevents the resin solution from flowing downward and prevents the resin solution from dripping down. Since the tape is attached to the back side of the semiconductor element, it is possible to prevent the resin solution from entering the bottom side of the semiconductor element. The tape is
You may peel it off as appropriate after potting. If the tape is provided with protrusions, it is possible to prevent the tape from hanging down or wrapping around, and also to prevent it from spreading in the lateral direction. Further, by pressing with the front plate-like object, the thickness of the film carrier package can be reduced and the thickness can be kept constant.

〔Example〕

Next, the present invention will be explained based on embodiments shown in the drawings.

FIG. 4 schematically shows a plan view of an example of a tape carrier, in which sprocket holes 2 are bored at both ends of the resin film tape 1, and a device hole λ is bored in the center thereof. Finger leads 5 of a lead pattern 4 protrude into the device hole 3, and a semiconductor element (pellet) 6 is attached to the back surface of the finger lead 5.

FIG. 5 shows one unit in detail. In FIG. 5, 7 is a test pad, and 8 is a cutting line after resin potting. As shown in FIG. 1, a tape 9 is previously attached to the back side of the pellet 6 of the film carrier shown in FIGS. 4 and 5. Then, a resin solution is dropped from the surface side of the pellet 60 to perform resin potting.

FIG. 1 is a cross-sectional view of the film carrier package after bonding. The flow of the resin solution injected into the device hole 3 is blocked by the tape 9 attached to the back side of the pellet 6, and the resin solution is injected into the device hole 3. By heat curing, a film carrier package coated on one side with resin is obtained. The semiconductor element 6 and the bumps 10 which are the joints between the element 6 and the finger leads 5 are made of potting resin 1.
1 is sealed.

After the potting, the tape 9 may be peeled off from the back side of the pellet 6, or if the tape 9 is made of a thin material and does not seem to affect the thickness much, it can be left on as is. You can stay there.

In FIG. 2, potting was carried out in the same way by protruding protrusions 12 on the tape 9 and positioning the pellet 6 between the protrusions 12 and 12. It can block the flow in the lateral direction and prevent it from spreading laterally.

This is effective when the viscosity of the resin solution is low, and by adhering the tape 9 on which the protrusion 12 is protruded to the back surface of the pellet 6, the above-mentioned effect as a tape can be achieved, and the protrusion 12 It is also possible to prevent the spread to the vicinity of the pellet 6 due to the presence of the .

Next, FIG. 3 shows that the film carrier package potted as shown in FIG.
An explanatory cross-sectional view is shown in which the resin 11 is pressed to reduce the overall thickness of the package or to maintain a constant thickness.

The tape carrier in the present invention can be manufactured by a conventionally known method, and the resin film tape 1 used therein is, for example, a polyimide synthetic resin film (tape).
Consisted of.

The lead pattern 4 is made of, for example, Cu foil.

The semiconductor element (chip) 6 is made of, for example, a silicon single-crystal substrate, and a large number of circuit elements are formed within this chip using well-known techniques to provide one circuit function. A concrete example of a circuit element is, for example, a transistor (MOS), and these circuit elements form, for example, a logic circuit and a memory circuit function.

The tape 9 used in the present invention may be the same as the resin film tape 1 described above.

The potting resin 11 may be made of, for example, an epoxy resin dissolved in a solvent.

The plate-like material 13 is preferably one that does not easily adhere to the potting resins 1, 1 and can therefore be easily peeled off from the register/11. For example, it may be made of Teflon-based synthetic resin.

Note that the tape 9 may or may not be peeled off after being suppressed by the plate-like material 13.

Although the invention made by the present inventor has been specifically explained above based on examples, it goes without saying that the present invention is not limited to the above-mentioned examples, and can be modified in various ways without departing from the gist thereof. Nor.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

According to the present invention, a thin film carrier package can be obtained, and since there is no need to scrape dripping resin, the potting yield is improved, the spread of the resin in the lateral direction is suppressed, and the thickness is reduced. A uniform taste was obtained.

[Brief explanation of drawings]

FIG. 1 is an explanatory cross-sectional view of an example process of the present invention, FIG. 2 is an explanatory cross-sectional view of another example process of the present invention, and FIG. 3 is an explanatory cross-sectional view of yet another example process of the present invention, FIG. 4 is a plan view of an example of a film carrier used in the present invention, and FIG. 5 is a plan view of an example of a unit of the film carrier. DESCRIPTION OF SYMBOLS 1... Resin film tape, 2... Sprocket hole, 3... Tech high speed hole, 4... Lead pattern, 5... Finger lead, 6... Semiconductor element, 7...
...Test pad, 8... Cutting line, 9. Tape, 1
0...Bump, 11...Potting resin, 12...
Projection, 13... Plate-shaped object Fig. 1 Fig. 5

Claims (1)

[Claims] 1. In the resin potting method for a tape carrier package in which a semiconductor element is sealed by potting resin, the potting is performed by attaching a tape to the opposite side of the element to be potted. A tape carrier package resin potting method characterized by: 2. The method according to claim 1, wherein the tape is a tape having protruding portions. 3. The method as set forth in claim 1, wherein after potting, the entire potted object is pressed by a plate-like material that can be peeled off from the potting resin. .