JPS63292412A - Magnetic disk device - Google Patents
Magnetic disk deviceInfo
- Publication number
- JPS63292412A JPS63292412A JP12779487A JP12779487A JPS63292412A JP S63292412 A JPS63292412 A JP S63292412A JP 12779487 A JP12779487 A JP 12779487A JP 12779487 A JP12779487 A JP 12779487A JP S63292412 A JPS63292412 A JP S63292412A
- Authority
- JP
- Japan
- Prior art keywords
- guide arm
- thin plate
- plate member
- package
- magnetic disk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 abstract description 8
- 101000606504 Drosophila melanogaster Tyrosine-protein kinase-like otk Proteins 0.000 abstract description 6
- 230000001070 adhesive effect Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/54—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed with provision for moving the head into or out of its operative position or across tracks
- G11B5/55—Track change, selection or acquisition by displacement of the head
- G11B5/5521—Track change, selection or acquisition by displacement of the head across disk tracks
- G11B5/5565—Track change, selection or acquisition by displacement of the head across disk tracks system adaptation for compensation of variations of physical parameters, e.g. temperature
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
Landscapes
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、磁気ディスク装置に係り、特に熱変形による
オフトラックの低減に好適な磁気ディスク装置に関する
。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a magnetic disk device, and particularly to a magnetic disk device suitable for reducing off-track caused by thermal deformation.
従来の磁気ディスク装置は、日経メカニカル１９８５．
１２−１６の５４頁図３および５５頁 ゛図５及び
図６に掲載されているように、サーボおよびデータ用Ｉ
Ｃパッケージは、各ガイドアーム上に塔載されておらず
、まとめて他の一個所に設けられていた。例えば１図３
ではユニットになったアームの側面にまとめて設けられ
ている。A conventional magnetic disk device is Nikkei Mechanical 1985.
12-16, page 54 Figure 3 and page 55 ゛As shown in Figures 5 and 6, the servo and data I
The C packages were not mounted on each guide arm, but were collectively provided at one other location. For example, 1 Figure 3
In this case, they are installed together on the side of the unit arm.
上記従来技術では、各ヘッド用のＩＣパッケージを一個
所にまとめて設ける構造であるため、どうしても磁気ヘ
ッドとＩＣの距離が遠くなり、雑音を拾ったりして読み
取り誤差等を生じることが多かった。特に近年の高精度
、高速化、高密度化された磁気ディスク装置では、この
問題解決は重要である。In the above-mentioned conventional technology, since the IC packages for each head are provided in one place, the distance between the magnetic head and the IC inevitably becomes long, which often picks up noise and causes reading errors. Solving this problem is particularly important in recent years of magnetic disk drives that have become more accurate, faster, and more dense.
この対策として、ＩＣパッケージを磁気ヘッドに出来る
だけ近付けることが考えられ、ＩＣパッケージをガイド
アームに接着剤等により直接固定する構造のものがある
が、この直接固定構造では。As a countermeasure to this problem, it is possible to place the IC package as close as possible to the magnetic head, and there is a structure in which the IC package is directly fixed to the guide arm with an adhesive or the like, but this direct fixing structure does not work.
ガイドアームとＩＣパッケージの熱膨張率の差による熱
膨張差により温度変化時にガイドアームが熱変形すると
いう別の問題が生じ、オフトラックの原因になる。Another problem arises in that the guide arm is thermally deformed when the temperature changes due to the difference in thermal expansion coefficient between the guide arm and the IC package, which causes off-track.
本発明は、ＩＣパッケージをガイドアームに取り付ける
磁気ディスク装置において、温度変化時にガイドアーム
が熱変形しないＩＣパッケージとガイドアームの固定構
造を提供することにある。An object of the present invention is to provide a structure for fixing an IC package and a guide arm in a magnetic disk device in which an IC package is attached to a guide arm, in which the guide arm is not thermally deformed when the temperature changes.
〔問題点を解決するための手段〕
本発明は磁気ヘッドがガイドアームの先端に保持されて
いる磁気ディスク装置において、ガイドアームに穴を設
けると共に、該穴に少なくとも一つの曲げ部を有する薄
板部材を設け、該薄板部材にＩＣパッケージを固定した
ものである。[Means for Solving the Problems] The present invention provides a magnetic disk device in which a magnetic head is held at the tip of a guide arm, in which a hole is provided in the guide arm and a thin plate member having at least one bent portion in the hole. is provided, and an IC package is fixed to the thin plate member.
温度変化によりＩＣパッケージとガイドアームに熱膨張
差が生じても、ＩＣパッケージをガイドアームは曲げ部
を有する薄板部材により間接的に固定されているため、
熱膨張差は薄板部材の曲げ部において吸収され、ガイド
アームの熱変形が緩和される。このため、オフトラック
は生じなくなる。Even if a thermal expansion difference occurs between the IC package and the guide arm due to temperature changes, the IC package and the guide arm are indirectly fixed by a thin plate member with a bent portion.
The difference in thermal expansion is absorbed at the bent portion of the thin plate member, and thermal deformation of the guide arm is alleviated. Therefore, no off-track occurs.
以下１本発明の一実施例を第１図、第２図に基いて説明
する。第１図はＩＣパッケージを塔載したガイドアーム
の断面図で、第２図の１−１線断面図に相当する。第２
図は第１図に示したガイドアーム底面図である。同図に
おいて、２は磁気ヘッド１を保持するガイドアーム、３
はＩＣパッケージである。ガイドアーム２にはＩＣパッ
ケージ３を挿入する貫通した肉抜き穴４が設けられてい
る。５はＩＣパッケージのビンで、該ピン５は半田６に
よりガイドアーム２上のプラスチック基板７に接続され
ている。そして、８は薄板部材で、該薄板部材８は弾性
変形可能に少なく一つの曲げ部を有する１本実施例では
曲率のある曲げ部９ａ。An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. FIG. 1 is a sectional view of a guide arm on which an IC package is mounted, and corresponds to the sectional view taken along line 1-1 in FIG. Second
This figure is a bottom view of the guide arm shown in FIG. 1. In the figure, 2 is a guide arm that holds the magnetic head 1;
is an IC package. The guide arm 2 is provided with a through hole 4 into which an IC package 3 is inserted. Reference numeral 5 denotes a pin of an IC package, and the pin 5 is connected to a plastic substrate 7 on the guide arm 2 by solder 6. Reference numeral 8 designates a thin plate member, and the thin plate member 8 is elastically deformable and has at least one bent portion. In this embodiment, a bent portion 9a has a curvature.
９ｂが２個設けられている＠ １０ａｔ １０ｂは薄板
部材８とガイドアーム２およびＩＣパッケージ３との接
着部で、それぞれの接触している部分を接着剤により固
定している。@ 10at 10b where two 9b are provided is an adhesive portion between the thin plate member 8, guide arm 2, and IC package 3, and the contacting portions of each are fixed with an adhesive.
ここで、薄板部材８の熱膨張率はＩＣパッケージ３やガ
イドアーム２と大きく異なるものではなく、ガイドアー
ム２と同等のものが好ましい、これは薄板部材８とガイ
ドアーム２間に余計な熱膨張差を発生させないためであ
り、ガイドアーム２がたとえば熱膨張率α＝２３Ｘ１０
″″″〜２６×１０”−”（”Ｃ″″″）のアルミ系素
材であれば、薄板部材８も同等の熱膨張率を有するアル
ミ系素材とした方がよい、尚、ＩＣパッケージ３の熱膨
張率αは本実施例では３Ｘ１０−’（”Ｃ−”）である
、４ちるん、ガイドアーム２と薄板部材８が同一素材で
あれば最良である。ここで、アルミ系素材とはアルミニ
ウム素材又はアルミニウム合金素材をいう。Here, the coefficient of thermal expansion of the thin plate member 8 is not significantly different from that of the IC package 3 or the guide arm 2, and is preferably equivalent to that of the guide arm 2. This is to prevent a difference, and the guide arm 2 has a coefficient of thermal expansion α=23X10, for example.
If the thin plate member 8 is made of an aluminum material with the same coefficient of thermal expansion, it is better to use an aluminum material with the same coefficient of thermal expansion as the IC package 3. The coefficient of thermal expansion α is 3X10-'("C-") in this embodiment.It is best if the guide arm 2 and the thin plate member 8 are made of the same material. refers to aluminum material or aluminum alloy material.
また、薄板部材８の曲げ部９ａ、９ｂは、本実施例の如
く２個所でなく１個所でもよく、逆に３個所以上でもよ
い、さらに１曲げ部９ａ、９ｂの曲率も特に限定される
ものでなく、直角でも差し支えない。Further, the bent portions 9a, 9b of the thin plate member 8 may be formed at one point instead of two as in this embodiment, or conversely may be formed at three or more points, and the curvature of each bent portion 9a, 9b is also particularly limited. It can also be at a right angle.
また、接着部１０は薄板部材８とガイドアーム２および
ＩＣパッケージ３の接触部全体ではなく。Furthermore, the adhesive portion 10 is not the entire contact portion between the thin plate member 8, the guide arm 2, and the IC package 3.
その一部分であってもよい。It may be a part of it.
第１図及び第２図では薄板部材８の形状が帯状であるが
、他の形状例として第３図乃至第６図に示した形状であ
ってもよい、ここで第３図乃至第６図は第２図の主要部
のみ図示したものである。Although the shape of the thin plate member 8 is shown in FIGS. 1 and 2 as a strip, it may have the shape shown in FIGS. 3 to 6 as other examples of the shape. 2 shows only the main parts of FIG.
第３図は十字形の薄板部材８、第４図は二分割された帯
状の薄板部材８ａ、８ｂ、第５図は同じく二分割された
コ字形状の薄板部材８ａ、８ｂ、第６図は一体化された
コ字形状の薄板部材８で、枠が周囲に設けられている。3 shows a cross-shaped thin plate member 8, FIG. 4 shows a strip-shaped thin plate member 8a, 8b divided into two parts, FIG. 5 shows a U-shaped thin plate member 8a, 8b, which is also divided into two parts, and FIG. It is an integrated U-shaped thin plate member 8, and a frame is provided around the periphery.
前記の各形状の薄板部材は状況に応じて使い分ければよ
い、第７図は第４図に示した薄板部材８ａ、８ｂの斜視
図である。The thin plate members of each shape described above may be used depending on the situation. FIG. 7 is a perspective view of the thin plate members 8a and 8b shown in FIG. 4.
次に本発明の作用について第８図及び第９図を用いて説
明する。第８図、及び第９図は第１図の要部拡大図であ
る。−例としてガイドアーム２と薄板部材８がアルミニ
ウム素材で、ＩＣパッケージ３がセラミック素材の場合
を考える。磁気ディスク装置１の温度上昇時にガイドア
ーム２とＩＣパッケージ３は、それぞれ温度上昇に応じ
て熱膨張するが、熱膨張率の違いによりそれぞれの熱膨
張量が異なる。このようなとき、従来構造の如く、ＩＣ
パッケージ３がガイドアーム２に接着剤によ′り直接接
着されていると、前記熱膨張量の差により接着部に応力
が働き、ガイドアーム２が変形する。しかし、本発明の
如く薄板部材８を介して間接的に接着固定すると、熱膨
張量の差は薄板部材８の曲げ部９ａ、９ｂにより吸収さ
れ、応力（変形）が緩和される。第８図は温度上昇前で
、ガイドアーム２とＸＣパッケージ３の間隔が円であり
、第９図は温度上昇後で、間隔がα’ （Ｑ’ ＞１
１）に広がったときの様子を示しており、熱膨張量の差
（Ｑ’−１１）が薄板部材８の曲げ部９ａ、９ｂの曲率
変化により緩和されている。同図はガイドアーム２基準
でＩＣパッケージ３の変形を表わしている。逆に、ＩＣ
パッケージ３の方がガイドアーム２より熱膨張率が大き
いときは、ΩよりΩ′の方が小さくなり薄板部材８は前
記と逆方向に変形し、同様に熱膨張量の差は緩和される
０図のような場合、緩和する曲げ部は９ａか９ｂのどち
らか一方でもよく、また両方であってもよい。Next, the operation of the present invention will be explained using FIGS. 8 and 9. 8 and 9 are enlarged views of the main parts of FIG. 1. - As an example, consider the case where the guide arm 2 and the thin plate member 8 are made of aluminum material, and the IC package 3 is made of ceramic material. When the temperature of the magnetic disk device 1 rises, the guide arm 2 and the IC package 3 each thermally expand in accordance with the temperature rise, but the amount of thermal expansion differs depending on the difference in the coefficient of thermal expansion. In such a case, as in the conventional structure, the IC
When the package 3 is directly bonded to the guide arm 2 with an adhesive, stress is applied to the bonded portion due to the difference in the amount of thermal expansion, and the guide arm 2 is deformed. However, when the thin plate member 8 is indirectly bonded and fixed as in the present invention, the difference in thermal expansion amount is absorbed by the bent portions 9a and 9b of the thin plate member 8, and the stress (deformation) is alleviated. Figure 8 shows the distance between the guide arm 2 and the XC package 3 before the temperature rise, and the distance between the guide arm 2 and the XC package 3 is a circle, and Figure 9 shows the distance after the temperature rise, and the distance is α'(Q'> 1
1), the difference in thermal expansion amount (Q'-11) is alleviated by the change in curvature of the bent portions 9a, 9b of the thin plate member 8. This figure shows the deformation of the IC package 3 based on the guide arm 2. On the contrary, I.C.
When the coefficient of thermal expansion of the package 3 is larger than that of the guide arm 2, Ω' becomes smaller than Ω, and the thin plate member 8 deforms in the opposite direction to the above, and the difference in the amount of thermal expansion is similarly alleviated. In the case shown in the figure, the bent portion to be relaxed may be either 9a or 9b, or both.
また１本発明はＩＣパッケージ３とガイドアーム２の熱
膨張率に差があるときのみならず、両者の温度変化が異
なるときに同様の効果がある。Furthermore, the present invention has similar effects not only when there is a difference in the coefficient of thermal expansion between the IC package 3 and the guide arm 2, but also when the temperature changes between the two differ.
第１０図、第１１図は本発明の他の実施例を示す断面図
であり、薄板部材８をガイドアーム２の一部を切除して
残部にて製作するようにした一体形のものである。まず
、第１０図の如く肉抜き穴４の一部分８で示す部分のみ
薄板状に残す６次に第１１図の如く形状になるようにプ
レス等の加工手段により薄板部材を切り起こす、このよ
うにして、曲げ部９を有する薄板部材８をガイドアーム
２の一部分から一体形として形成する。この実施例によ
れば、前述した薄板部材８とガイドアーム２の接着は不
用となる。第１２図は第１１図の底面図の一例で、薄板
部材８が帯状の例を示している。図はＩＣパッケージ３
を塔載した状態を示しており、１０ｂが接着部である。FIGS. 10 and 11 are cross-sectional views showing another embodiment of the present invention, in which the thin plate member 8 is an integral type in which a part of the guide arm 2 is cut out and the remaining part is manufactured. . First, as shown in FIG. 10, only a portion 8 of the lightening hole 4 is left in a thin plate shape.Next, the thin plate member is cut and raised by a processing means such as a press so that it has the shape shown in FIG. 11. Then, a thin plate member 8 having a bent portion 9 is integrally formed from a portion of the guide arm 2. According to this embodiment, the above-described bonding between the thin plate member 8 and the guide arm 2 is unnecessary. FIG. 12 is an example of the bottom view of FIG. 11, showing an example in which the thin plate member 8 is strip-shaped. The diagram shows IC package 3
10b is the adhesive part.
第１３図、第１４図は第１０図において薄板状の部分（
８ａ、８ｂで示す部分）が分離されている場合で、前記
と同様の方法で分離した薄板部材８が構成される。第１
５図は第１４図の底面図の一例である。Figures 13 and 14 show the thin plate-like portion (
8a and 8b) are separated, and the separated thin plate member 8 is constructed in the same manner as described above. 1st
FIG. 5 is an example of the bottom view of FIG. 14.
薄板部材８はガイドアーム２がＩＣパッケージ３の大き
さなどに応じて適切な形状を選ぶ必要がある。第１６図
、第１７図はその一例で、第１６図は曲げ部９が一個所
の場合、第１７図は曲げ部９の曲率が非常に小さい場合
である。このように。The thin plate member 8 needs to have an appropriate shape for the guide arm 2 depending on the size of the IC package 3 and the like. FIGS. 16 and 17 are examples of this. FIG. 16 shows the case where the bent portion 9 is at one place, and FIG. 17 shows the case where the curvature of the bent portion 9 is very small. in this way.
ＩＣパッケージ３の形状やガイドアーム２との熱膨張差
の大きさに応じて薄板部材８の形状及び曲げ部９の曲率
は適宜設定し得るものである。The shape of the thin plate member 8 and the curvature of the bent portion 9 can be set as appropriate depending on the shape of the IC package 3 and the magnitude of the difference in thermal expansion with the guide arm 2.
本発明によれば、ＩＣパッケージをガイドアームに塔載
しても、その熱膨張量の差は薄板部材の曲げ部で吸収緩
和される。従って、ガイドアームの熱変形が生じにくく
なり、オフトラックが増加することはなくなる。According to the present invention, even if the IC package is mounted on the guide arm, the difference in thermal expansion amount is absorbed and alleviated at the bent portion of the thin plate member. Therefore, thermal deformation of the guide arm is less likely to occur, and off-track does not increase.
第１図は本発明の一実施例で第２図の１−１線断面図、
第２図は第１図の底面図、第３図乃至第６図は主要部の
異なる態様を示す底面図、第７図は第４図に示した主要
部材の斜視図、第８図及び第９図は本発明の詳細な説明
する説明図、第１０図は本発明の他実施例の製造工程途
中の断面図。
第１１図は同製造終了時の断面図、第１２図は第１１図
の部材にＩＣパッケージを塔載した状態の底面図、第１
３図は他実施例で第１０図に相当する断面図、第１４図
は開催実施例の第１１図に相当する断面図、第１５図は
開催実施例の第１２図に相当する底面図、第１６図およ
び第１７図は更に本発明の異なる他の実施例を示す断面
図である。
１・・・磁気ヘッド、 ２・・・ガイドアーム、
３・・・ＩＣパッケージ、 ４・・・穴、５・・・Ｉ
Ｃビン、 ８・・・薄板部材、９ａ、９ｂ・・
・曲げ部、
１０ａ、１０ｂ−接着部。FIG. 1 is an embodiment of the present invention, and is a sectional view taken along the line 1-1 in FIG.
Fig. 2 is a bottom view of Fig. 1, Figs. 3 to 6 are bottom views showing different aspects of the main parts, Fig. 7 is a perspective view of the main parts shown in Fig. 4, and Figs. FIG. 9 is an explanatory diagram for explaining the present invention in detail, and FIG. 10 is a sectional view in the middle of the manufacturing process of another embodiment of the present invention. Fig. 11 is a cross-sectional view after the completion of manufacturing, Fig. 12 is a bottom view of the IC package mounted on the member shown in Fig. 11, and
3 is a sectional view corresponding to FIG. 10 in another embodiment, FIG. 14 is a sectional view corresponding to FIG. 11 in the holding example, and FIG. 15 is a bottom view corresponding to FIG. 12 in the holding example. FIGS. 16 and 17 are cross-sectional views showing other different embodiments of the present invention. 1...Magnetic head, 2...Guide arm,
3...IC package, 4...hole, 5...I
C bin, 8... Thin plate member, 9a, 9b...
- Bending part, 10a, 10b - adhesive part.
Claims (1)
磁気ディスク装置において、ガイドアームに穴を設ける
と共に、該穴に少なくとも一つの曲げ部を有する薄板部
材を設け、該薄板部材にＩＣパッケージを固定したこと
を特徴とする磁気ディスク装置。 ２、特許請求の範囲第１項において、薄板部材はガイド
アーム及びＩＣパーケッジと接着固定されている磁気デ
ィスク装置。 ３、特許請求の範囲第１項において、薄板部材はガイド
アームの一部を切除し、残部を折曲して一体形成したも
のである磁気ディスク装置。 ４、特許請求の範囲第１項において、薄板部材はガイド
アームと同等の熱膨張率を有する素材である磁気ディス
ク装置。 ５、特許請求の範囲第１項において、薄板部材及びガイ
ドアームがアルミニウム素材又はアルミニウム合金素材
である磁気ディスク装置。[Claims] 1. In a magnetic disk device in which a magnetic head is held at the tip of a guide arm, a hole is provided in the guide arm, and a thin plate member having at least one bent portion is provided in the hole, and the thin plate member is provided with a hole in the guide arm. A magnetic disk device characterized in that an IC package is fixed to a member. 2. A magnetic disk device according to claim 1, wherein the thin plate member is adhesively fixed to the guide arm and the IC package. 3. A magnetic disk device according to claim 1, wherein the thin plate member is integrally formed by cutting out a part of the guide arm and bending the remaining part. 4. The magnetic disk device according to claim 1, wherein the thin plate member is made of a material having a coefficient of thermal expansion equivalent to that of the guide arm. 5. The magnetic disk device according to claim 1, wherein the thin plate member and the guide arm are made of aluminum or aluminum alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12779487A JPS63292412A (en) | 1987-05-25 | 1987-05-25 | Magnetic disk device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12779487A JPS63292412A (en) | 1987-05-25 | 1987-05-25 | Magnetic disk device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63292412A true JPS63292412A (en) | 1988-11-29 |
Family
ID=14968840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12779487A Pending JPS63292412A (en) | 1987-05-25 | 1987-05-25 | Magnetic disk device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63292412A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04126315U (en) * | 1991-05-08 | 1992-11-18 | テイアツク株式会社 | Magnetic head device for magnetic disks |
| US6014289A (en) * | 1994-03-22 | 2000-01-11 | Hutchinson Technology Incorporated | Integrated circuit on a monocoque suspension |
| US6144530A (en) * | 1997-12-24 | 2000-11-07 | Tdk Corporation | Magnetic head apparatus with head IC chip |
| US6437944B2 (en) * | 1997-10-20 | 2002-08-20 | Fujitsu Limited | Head slider supporting device, disk device and suspension |
| US6483669B1 (en) | 1999-09-17 | 2002-11-19 | Hutchinson Technology Incorporated | Integrated lead suspension with IC chip and method of manufacture |
| US6639757B2 (en) | 2001-01-10 | 2003-10-28 | Hutchinson Technology Inc. | Heat dissipation structures for integrated lead disk drive head suspensions |
| EP1505574A2 (en) * | 1997-09-10 | 2005-02-09 | Fujitsu Limited | Disc apparatus head slider support suspension |
-
1987
- 1987-05-25 JP JP12779487A patent/JPS63292412A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04126315U (en) * | 1991-05-08 | 1992-11-18 | テイアツク株式会社 | Magnetic head device for magnetic disks |
| US6014289A (en) * | 1994-03-22 | 2000-01-11 | Hutchinson Technology Incorporated | Integrated circuit on a monocoque suspension |
| EP1505574A2 (en) * | 1997-09-10 | 2005-02-09 | Fujitsu Limited | Disc apparatus head slider support suspension |
| EP1505574A3 (en) * | 1997-09-10 | 2008-08-27 | Fujitsu Limited | Disc apparatus head slider support suspension |
| US6437944B2 (en) * | 1997-10-20 | 2002-08-20 | Fujitsu Limited | Head slider supporting device, disk device and suspension |
| US6583962B2 (en) | 1997-10-20 | 2003-06-24 | Fujitsu Limited | Head slider supporting device, disk device and suspension having thermal protection for head IC chip |
| US6144530A (en) * | 1997-12-24 | 2000-11-07 | Tdk Corporation | Magnetic head apparatus with head IC chip |
| US6483669B1 (en) | 1999-09-17 | 2002-11-19 | Hutchinson Technology Incorporated | Integrated lead suspension with IC chip and method of manufacture |
| US6944936B2 (en) | 1999-09-17 | 2005-09-20 | Hutchinson Technology Incorporated | Method for manufacturing an integrated lead suspension |
| US6639757B2 (en) | 2001-01-10 | 2003-10-28 | Hutchinson Technology Inc. | Heat dissipation structures for integrated lead disk drive head suspensions |
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