JPH04155675A - Head air for magnetic disk device - Google Patents
Head air for magnetic disk deviceInfo
- Publication number
- JPH04155675A JPH04155675A JP27902190A JP27902190A JPH04155675A JP H04155675 A JPH04155675 A JP H04155675A JP 27902190 A JP27902190 A JP 27902190A JP 27902190 A JP27902190 A JP 27902190A JP H04155675 A JPH04155675 A JP H04155675A
- Authority
- JP
- Japan
- Prior art keywords
- arm
- head
- thermal expansion
- fpc
- head arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 20
- 230000001070 adhesive effect Effects 0.000 claims abstract description 20
- 239000011347 resin Substances 0.000 claims abstract description 12
- 229920005989 resin Polymers 0.000 claims abstract description 12
- 239000011888 foil Substances 0.000 claims abstract description 11
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims 1
- 101000606504 Drosophila melanogaster Tyrosine-protein kinase-like otk Proteins 0.000 abstract description 14
- 229910052782 aluminium Inorganic materials 0.000 abstract description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 10
- 229910000838 Al alloy Inorganic materials 0.000 abstract description 8
- 239000010408 film Substances 0.000 abstract description 3
- 239000013039 cover film Substances 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 229920001721 polyimide Polymers 0.000 description 10
- 239000009719 polyimide resin Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000011889 copper foil Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 244000046146 Pueraria lobata Species 0.000 description 1
- 235000010575 Pueraria lobata Nutrition 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は磁気ディスク装置のへラドアームの温度変化に
よる熱変形を防止するヘッドアームに係り、特に、ヘッ
ドアームのたわみによる記録媒体（磁気ディスク）上の
情報と磁気ヘッドとの位置ずれ（オフトラック）を防止
するに好適なヘッドアームに関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a head arm of a magnetic disk device that prevents thermal deformation due to temperature changes in the head arm, and in particular, relates to a head arm that prevents thermal deformation due to temperature changes in the head arm of a magnetic disk device, and particularly relates to a head arm that prevents thermal deformation due to temperature changes in the head arm of a magnetic disk device. The present invention relates to a head arm suitable for preventing misalignment (off-track) between the above information and a magnetic head.
近年、磁気ディスク装置は、情報の高密度化が要求され
ているが、これを達成するために、ヘッドアームに搭載
した磁気ヘッドを記録媒体上の所定トラックに位置決め
することが必要である。しかし、ヘッドアームの熱変形
により、磁気ヘッドが所定のトラックより位置ずれ（オ
フトラック）することがある。このオフトラックを補正
する方策は、特開昭６１−１２３０６８号公報に記載の
ように、ガイドアームと樹脂との二種部品を複数枚の層
状に一体化し、ヘッドアーム全体のシータ方向の熱膨張
率を任意に調整し、ヘッドアームの伸び差によるオフト
ラックを低減させる方法や、特開昭６１−１６０７６号
公報に記載のように、ヘッドアームに、その熱膨張と異
なる部材を取り付けて、バイメタル機能によりオフトラ
ックを補正する方法がある。In recent years, magnetic disk drives are required to have higher information density, but in order to achieve this, it is necessary to position a magnetic head mounted on a head arm on a predetermined track on a recording medium. However, thermal deformation of the head arm may cause the magnetic head to deviate from a predetermined track (off-track). As described in JP-A-61-123068, a measure to correct this off-track is to integrate two types of parts, the guide arm and the resin, into a plurality of layers, and thermally expand the entire head arm in the theta direction. There is a method of adjusting the ratio arbitrarily to reduce off-track due to the difference in expansion of the head arm, and a method of attaching a member to the head arm that differs in its thermal expansion as described in Japanese Patent Application Laid-Open No. 16076/1983, and a method of reducing the off-track due to the difference in expansion of the head arm. There are ways to correct off-track depending on the function.
特開昭６１−１２３０６８号公報に示す従来技術は、ヘ
ッドアームのシータ方向の熱膨張の調整による伸び差補
正のサーマルオフトラックの低減にのみ着目しており、
ヘッドアームに異種の材料である樹脂等を接着したこと
による温度変化時のヘッドアームの面外方向のたわみ（
バイメタルのようなもの）については考慮されておらず
、たわみにより各々のヘッドがずれる（オフトラックす
る）という問題がある。特に最近の磁気ディスク装置で
は、このたわみによるオフトラックの占める割合は大き
くなっている。また、複数枚積層することにより、アー
ムの重量が増し、アームの駆動についても問題が生じる
こともある。The conventional technology disclosed in Japanese Patent Application Laid-Open No. 61-123068 focuses only on reducing thermal off-track in correction of the difference in expansion by adjusting the thermal expansion of the head arm in the theta direction.
Deflection of the head arm in the out-of-plane direction when temperature changes due to bonding a different material such as resin to the head arm (
(such as bimetal) is not taken into consideration, and there is a problem in that each head shifts (off-track) due to deflection. Particularly in recent magnetic disk drives, the proportion of off-track caused by this deflection is increasing. Furthermore, stacking a plurality of sheets increases the weight of the arm, which may also cause problems in driving the arm.
また、特開昭６１−１６０７６号公報はへラドアームを
支持するスピンドル軸方向のアームの変化を補正するも
のであり、この補正は装置各部の熱膨張量差によって生
じるオフトラックをヘッドアームを変形させることによ
り補正させるものである。Furthermore, Japanese Patent Application Laid-open No. 16076/1984 corrects changes in the arm in the spindle axis direction that supports the head arm, and this correction deforms the head arm to compensate for off-track caused by differences in the amount of thermal expansion of various parts of the device. This is what makes the correction.
具体的には、ヘッドアームに熱膨張率の異なる部材を取
り付けることによるバイメタル機能により、ヘッドアー
ムを無理に変形させている。このため、この方策ではへ
ラドアームそのものの変形（たわみ）を防ぐのが目的で
なく、ヘッドアームはその面外方向にたわむという問題
がある。また、装置各部の熱膨張差による変形（たとえ
ば、スピンドルの倒れなど）をすべてヘッドアームのみ
で補正しようとすると、各アームの補正量が異なるため
各アームに取り付ける部材の熱膨張率を、それぞれ、変
化させる必要も生じてしまい、汎用性にもやや欠ける問
題がある。Specifically, the head arm is forcibly deformed by a bimetal function created by attaching members with different coefficients of thermal expansion to the head arm. Therefore, the purpose of this measure is not to prevent deformation (deflection) of the head arm itself, but there is a problem in that the head arm is deformed in a direction out of its plane. In addition, if you try to correct all deformations due to differences in thermal expansion between various parts of the device (for example, spindle collapse) using only the head arm, the amount of correction for each arm will be different, so the coefficient of thermal expansion of the member attached to each arm will be There is also a need to make changes, and there is a problem that the versatility is somewhat lacking.
本発明の目的は、ヘッドアームそのものに生じる面外方
向のたわみ量をヘッドアーム上で防止し、磁気ディスク
装置の熱的なオフトラックを低減または防止することが
できるヘッドアームを提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a head arm that can prevent the amount of deflection in the out-of-plane direction that occurs on the head arm itself, and can reduce or prevent thermal off-track of a magnetic disk device. .
上記目的を達成するために、本発明は磁気ヘッドを搭載
したガイドアームに、磁気ヘッドの情報を伝達するＦＰ
Ｃを取り付けたヘッドアームにおいて、前記ＦＰＣを接
着剤を用いずに絶縁性樹脂と箔状リード線を層状に形成
することにより構成し、かつ前記ＦＰＣの熱膨張率をヘ
ッドアームの熱膨張率と同等にし、前記へラドアームの
面外方向のたわみを抑制するようにしたものである。In order to achieve the above object, the present invention provides an FP that transmits information about the magnetic head to a guide arm on which the magnetic head is mounted.
In the head arm to which C is attached, the FPC is constructed by forming layers of insulating resin and foil lead wires without using adhesive, and the coefficient of thermal expansion of the FPC is equal to the coefficient of thermal expansion of the head arm. They are made the same, and the deflection of the helad arm in the out-of-plane direction is suppressed.
従来は、ＦＰＣを構成する絶縁性樹脂の熱膨張率は２０
／１０＠（１／’Ｃ）程度、箔状リード線の熱膨張率は
１８／１０”（１／’Ｃ）程度、またガイドアームの熱
膨張率は２４ ／ ｌ Ｏ’（１／’Ｃ）程度のものが
多く用いられている。これら三つの部材は熱膨張率の大
きなくおおよそ５０〜２００／１０’（１／’Ｃ））接
着袋に″より接着構成されヘッドアームを構成している
ため、温度変化時にヘッドアームは各材質の違いによる
熱膨張量差により面外方向のたわみ（熱変形）を生じる
。しかし、本発明のへラドアームはＦＰＣを接着剤を用
いずに絶縁性樹脂と箔状リード線を層状に形成すること
により構成し、かつ、前記ＦＰＣの熱膨張率をガイドア
ームの熱膨張率と同等にしているため、接着剤がない分
だけ薄肉・軽量化され、かつ、柔軟性に優れ、熱膨張率
の統一により温度変化時のへラドアームの面外方向のた
わみは大幅に抑制される。その結果、オフトラックを低
減および防止することができる。Conventionally, the coefficient of thermal expansion of the insulating resin constituting the FPC was 20.
/10@(1/'C), the coefficient of thermal expansion of the foil lead wire is approximately 18/10"(1/'C), and the coefficient of thermal expansion of the guide arm is 24/l O'(1/'C). ) are often used.These three members have a large coefficient of thermal expansion and are bonded to an adhesive bag of approximately 50 to 200/10'(1/'C) to form the head arm. Therefore, when the temperature changes, the head arm is deflected in an out-of-plane direction (thermal deformation) due to the difference in the amount of thermal expansion caused by the different materials. However, the helad arm of the present invention is constructed by forming an FPC in layers of insulating resin and foil lead wires without using adhesive, and the coefficient of thermal expansion of the FPC is set to be the coefficient of thermal expansion of the guide arm. Because they are the same, they are thinner and lighter due to the lack of adhesive, and are also highly flexible, and the uniform coefficient of thermal expansion greatly suppresses the out-of-plane deflection of the Herad arm when the temperature changes. As a result, off-track can be reduced and prevented.
以下、本発明の実施例を図面を参照して説明する。第１
図、第２図および第３図は本発明の磁気ディスク装置の
へラドアームの一実施例を示すもので、これらの図にお
いて本発明のヘッドアームを説明するに先立って、本発
明のへラドアームを用いる磁気ディスク装置の一実施例
を第４図を用いて説明する。この図は磁気ディスク装置
の断面図で、１はハウジング、２はハウジング１内にス
ペーサ３、スピンドル４を介して積層される磁気ディス
ク、５はその駆動モータ、６は磁気ディスク２上の情報
の入出力を行う磁気ヘッド、７は磁気ヘッド６を支持す
るロードアーム、８はロードアーム７を取り付けたガイ
ドアームである。ガイドアーム８およびロードアーム７
はへラドアーム９を構成する。１０はヘッドアーム９の
アームホルダ、１１はそのアクチュエータである。そし
て、アクチュエータ１１によりヘッドアーム９を移動さ
せて、ヘッドアーム９の先端の磁気ヘッド６を磁気ディ
スク２上の所定の情報のトラックに位置決めし、情報を
読み書きする。Embodiments of the present invention will be described below with reference to the drawings. 1st
2 and 3 show an embodiment of the head arm of the magnetic disk drive of the present invention. Before explaining the head arm of the present invention in these figures, the head arm of the present invention will be explained. An embodiment of the magnetic disk device used will be described with reference to FIG. This figure is a cross-sectional view of a magnetic disk device, where 1 is a housing, 2 is a magnetic disk stacked inside the housing 1 via a spacer 3 and a spindle 4, 5 is a drive motor, and 6 is information on the magnetic disk 2. A magnetic head performs input/output, a load arm 7 supports the magnetic head 6, and a guide arm 8 to which the load arm 7 is attached. Guide arm 8 and load arm 7
constitutes the helad arm 9. 10 is an arm holder of the head arm 9, and 11 is its actuator. Then, the head arm 9 is moved by the actuator 11, and the magnetic head 6 at the tip of the head arm 9 is positioned on a predetermined information track on the magnetic disk 2, and information is read and written.
次に、第１図、第２図および第３図に戻り、本発明の一
実施例を説明する。ガイドアーム８としてアルミニウム
合金（純アルミニウム含む）を使用した例を示す。第１
図はヘッドアーム９の平面図、第２図は第１図の■−■
矢視断面図、第３図は第１図の■−■矢視断面図である
。アルミニウム合金のガイドアーム８の片面にはフレキ
シブルプリント回路基板（ＦＰＣ）１２が接着剤なしで
、直接、ガイドアーム８上に形成されている。ここでは
−例として、ガイドアーム８の厚さは数閣、ＦＰＣ１２
の厚さは数十〜数百ミクロンメートルと薄いものとする
。そして、ＦＰＣ１２は接着剤を全く用いずに、ポリイ
ミド樹脂のベースフィルム１３ａと磁気ヘッド６の情報
を伝達する細い帯状の複数のアルミ箔リード線１４とポ
リイミド樹脂のカバーフィルム１３ｂをサンドイッチ状
に層状化することにより構成されている（完全無接着）
。Next, referring back to FIGS. 1, 2, and 3, one embodiment of the present invention will be described. An example in which an aluminum alloy (including pure aluminum) is used as the guide arm 8 will be shown. 1st
The figure is a plan view of the head arm 9, and the second figure is the ■-■ of the first figure.
FIG. 3 is a sectional view taken along the line ■-■ in FIG. 1. On one side of the guide arm 8 made of aluminum alloy, a flexible printed circuit board (FPC) 12 is formed directly on the guide arm 8 without using an adhesive. Here - as an example, the thickness of the guide arm 8 is FPC12.
The thickness is as thin as several tens to hundreds of micrometers. The FPC 12 is made by layering a polyimide resin base film 13a, a plurality of thin strip-shaped aluminum foil lead wires 14 for transmitting information from the magnetic head 6, and a polyimide resin cover film 13b in a sandwich-like manner, without using any adhesive. (completely non-adhesive)
.
二こで、ポリイミド樹脂１３ａ、１３ｂの熱膨張率はア
ルミニウム合金のガイドアーム８の熱膨張率と同等にし
である。このため、三つの部材８゜１３．１４の熱膨張
率が同等になり、接着剤を全く用いることなくヘッドア
ーム９を構成できる。The coefficient of thermal expansion of the polyimide resins 13a and 13b is about the same as that of the guide arm 8 made of aluminum alloy. Therefore, the coefficients of thermal expansion of the three members 8° 13.14 become the same, and the head arm 9 can be constructed without using any adhesive.
接着剤を全く用いることなくポリイミド樹脂１３ａ。Polyimide resin 13a without using any adhesive.
１３ｂおよびアルミ箔リード線１４を、直接、ガイドア
ーム８上に順次構成する方法（製法）は、スクリーン印
刷法、転写法、蒸着法およびスパッタリング、エツチン
グ等がある。もちろん製法は上記方法に限る必要はない
。13b and the aluminum foil lead wires 14 are sequentially formed directly on the guide arm 8 by a screen printing method, a transfer method, a vapor deposition method, sputtering, etching, etc. Of course, the manufacturing method does not have to be limited to the above method.
以上のように構成されたヘッドアーム９は、温度変化が
あってもそれぞれの部材の熱膨張率が同等のため、面外
方向のたわみを起こすことはない。The head arm 9 configured as described above does not bend in the out-of-plane direction even if there is a temperature change because each member has the same coefficient of thermal expansion.
さらに、接着剤が全くないため、ヘッドアーム９が薄肉
・軽量化され、かつ、柔軟性に優れるという特徴がある
。また、湿度変化によりＦＰＣ１２の樹脂１３が伸縮変
形し、その結果、ヘッドアーム９が面外方向にたわむよ
うなときは、第５図のように、ＦＰＣ１２の露出面側１
２ａを湿度変化により伸縮変形しない材質１５により被
覆すればよい（湿度対策）。湿度変化により伸縮変形し
ない被覆材１５は、金属材が最も良い。たとえば、第１
図ないし第３図では、各部材の熱膨張率をアルミニウム
と同等にしているため、被覆材１５はアルミニウム（合
金含む）がよい、被覆法は、直接コーティングやメツキ
等する方法や、接着剤により貼り付ける方法等がある。Furthermore, since there is no adhesive at all, the head arm 9 is thin and lightweight, and has excellent flexibility. In addition, when the resin 13 of the FPC 12 expands and contracts due to changes in humidity, and as a result, the head arm 9 bends in an out-of-plane direction, as shown in FIG.
2a may be covered with a material 15 that does not expand or contract due to changes in humidity (humidity countermeasure). The best covering material 15 that does not expand or deform due to changes in humidity is a metal material. For example, the first
In Figures 3 and 3, the coefficient of thermal expansion of each member is the same as that of aluminum, so the covering material 15 is preferably aluminum (including alloys).The covering method is direct coating, plating, etc. There are ways to paste it.
以上は、ガイドアーム８がアルミニウム合金、ＦＰＣ１
２の樹脂１３がガイドアーム８の熱膨張率と同等のポリ
イミド樹脂、箔状リード線１４がアルミニウムの場合に
ついて説明したが、ガイドアーム８の材質はアルミニウ
ム以外にもつと軽量なマグネシウムおよびマグネシウム
合金等であっても良＜、ＦＰＣ１２の樹脂１３はポリイ
ミド樹脂以外にポリエステルおよびガラスエポキシ等で
あっても良く、さらには、箔状リード線１４はアルミニ
ウム以外に銅や貴金属等であっても良い。In the above, the guide arm 8 is made of aluminum alloy and FPC1
In the above description, the resin 13 of No. 2 is made of polyimide resin having a coefficient of thermal expansion equivalent to that of the guide arm 8, and the foil lead wire 14 is made of aluminum. The resin 13 of the FPC 12 may be made of polyester, glass epoxy, etc. other than polyimide resin, and the foil lead wire 14 may be made of copper, noble metal, etc. other than aluminum.
次に、その一実施例について説明する。Next, one embodiment thereof will be described.
箔状リード線１４が銅箔、ガイドアーム８がアルミニウ
ム合金の場合、第６図のように構成する。When the foil lead wire 14 is made of copper foil and the guide arm 8 is made of aluminum alloy, the structure is as shown in FIG. 6.
ＦＰＣ１２を構成する樹脂１３ａ、１３ｂは銅と同等の
熱膨張率をもつポリイミド樹脂とし、ポリイミド樹脂１
３と銅箔リード線１４は、やはり、接着剤なしで層状に
構成する。ポリイミド樹脂は組成の調節により熱膨張率
を自由に変えることができる。そして、接着剤なしで構
成された銅相光の熱膨張率をもつＦＰＣ１２をアルミニ
ウム合金のガイドアーム８に接着剤１６により接着して
ヘッドアーム９を構成する。接着剤１６を用いるのはＦ
ＰＣ１２とガイドアーム８の熱膨張率が異なるためであ
る。ここで接着剤の特性は、ＦＰＣ１２とガイドアーム
８の熱膨張差を緩和できるような低ヤング率（低縦弾性
係数）のものがよい、もちろん、箔状リード線１４が銅
箔で、ガイドアーム８の熱膨張率が銅と同等の材質の場
合、接着剤１６は用いなくても良く、第１図ないし第３
図のように構成できる。ガイドアーム８の熱膨張率を銅
と同等にする方法として、アルミニウムにシリコンを含
有させたＡＱ−８ｉ系合金を用いる方法がある。たとえ
ば、アルミニウムに２２〜２５％のシリコンを含有させ
ると、おおよそ銅の熱膨張率と同等になる。さらに、第
６図で前述の湿度対策が必要な時には、ＦＰＣ１２の露
出面側１２ａに銅、又は、銅と同等の熱膨張率をもつ被
覆材１５を設ければよい。場合によっては、若干熱膨張
率が異なるが、ステンレス鋼であってもよい。The resins 13a and 13b constituting the FPC 12 are polyimide resins having the same coefficient of thermal expansion as copper, and the polyimide resin 1
3 and the copper foil lead wire 14 are also constructed in layers without adhesive. The coefficient of thermal expansion of polyimide resin can be freely changed by adjusting the composition. Then, the head arm 9 is constructed by bonding the FPC 12, which is constructed without an adhesive and has a coefficient of thermal expansion of copper-phase light, to the guide arm 8 made of aluminum alloy with an adhesive 16. F uses adhesive 16
This is because the PC 12 and the guide arm 8 have different coefficients of thermal expansion. Here, it is preferable that the adhesive has a low Young's modulus (low modulus of longitudinal elasticity) that can alleviate the difference in thermal expansion between the FPC 12 and the guide arm 8.Of course, the foil lead wire 14 is made of copper foil, and the guide arm If the material 8 has a coefficient of thermal expansion equivalent to that of copper, the adhesive 16 does not need to be used;
It can be configured as shown in the figure. As a method of making the coefficient of thermal expansion of the guide arm 8 equivalent to that of copper, there is a method of using an AQ-8i alloy made of aluminum containing silicon. For example, when aluminum contains 22 to 25% silicon, the coefficient of thermal expansion becomes approximately the same as that of copper. Furthermore, when the above-mentioned humidity countermeasures in FIG. 6 are required, copper or a covering material 15 having a coefficient of thermal expansion equivalent to that of copper may be provided on the exposed surface side 12a of the FPC 12. In some cases, stainless steel may be used, although the coefficient of thermal expansion is slightly different.
また、ガイドアーム８がアルミニウム合金以外にマグネ
シウム合金等であって、ＦＰＣ１２がガイドアーム８の
熱膨張率と異なるときも、第６図のように構成すればよ
い。Further, even when the guide arm 8 is made of a magnesium alloy or the like other than an aluminum alloy, and the FPC 12 has a coefficient of thermal expansion different from that of the guide arm 8, the structure shown in FIG. 6 may be used.
第７図は第６図の■部拡大断面図であり、ＦＰＣ１２を
構成する絶縁性樹脂１３ａ、１３ｂおよび箔状リード線
１４は接着剤なしで層状に形成されている。第２図の実
施例では、第７図でさらに接着剤１６がない構成となる
。FIG. 7 is an enlarged cross-sectional view of the section ``■'' in FIG. 6, in which the insulating resins 13a, 13b and the foil-like lead wires 14 constituting the FPC 12 are formed in layers without adhesive. In the embodiment shown in FIG. 2, the adhesive 16 in FIG. 7 is further omitted.
本発明によれば、温度変化時のへラドアームの面外方向
のたわみを防止および低減するため、ヘッドアームのた
わみによるオフトラックがなくなり、従来よりも位置決
め精度の良い磁気ディスク装置を提供することができる
。According to the present invention, in order to prevent and reduce the deflection of the head arm in the out-of-plane direction when the temperature changes, off-track due to the deflection of the head arm is eliminated, and it is possible to provide a magnetic disk device with higher positioning accuracy than before. can.
第１図は本発明のへラドアームの一実施例の平面図、第
２図は第１図のｎ−ｎ矢視断面図、第３図は第１図の■
−■矢視断面図、第４図は本発明のヘッドアームを用い
る磁気ディスク装置の断面図、第５図、第６図は他の実
施例を示す第１図の■−■矢視断面に相当する断面図、
第７図は第６図の■部拡大断面図である。
１・・・ハウジング、２・・・磁気ディスク、６・・磁
気ヘッド、８・・・ガイドアーム、９・・・ヘッドアー
ム、１２・・・ＦＰＣ１１３・・・ポリイミド樹脂、１
４・・・箔峯１図
葛 ４ 図
１・・・ハウ８ノ°＞２°。
２、−９玉６気デイスク
７−・ロードアーム
１ｌ−＝７７ケ】１−ｙ
８ｙ 図
？
不 ｌ
茎７図FIG. 1 is a plan view of an embodiment of the helad arm of the present invention, FIG. 2 is a sectional view taken along the line nn in FIG. 1, and FIG. 3 is a
4 is a sectional view of a magnetic disk drive using the head arm of the present invention, and FIGS. 5 and 6 are sectional views of FIG. Corresponding cross-sectional view,
FIG. 7 is an enlarged sectional view of the section ``■'' in FIG. 6. DESCRIPTION OF SYMBOLS 1...Housing, 2...Magnetic disk, 6...Magnetic head, 8...Guide arm, 9...Head arm, 12...FPC113...Polyimide resin, 1
4... Hakumine 1 Figure Kuzu 4 Figure 1... Hau 8° > 2°. 2, -9 balls 6ki disk 7-・Load arm 1l-=77 pieces] 1-y 8y Figure? 7 diagrams of stems
Claims (1)
前記磁気ヘッドの情報を伝達するフレキシブルプリント
回路基板を取り付けて構成されるヘッドアームにおいて
、 接着剤を全く用いずに、前記フレキシブルプリント回路
基板を構成する絶縁性樹脂と前記磁気ヘッドの情報を伝
達する箔状リード線を、直接、前記ガイドアーム上に層
状に形成したことを特徴とする磁気ディスク装置のヘッ
ドアーム。[Claims] 1. A guide arm serving as a substrate on which a magnetic head is mounted,
In a head arm configured by attaching a flexible printed circuit board that transmits information of the magnetic head, information of the magnetic head is transmitted between an insulating resin constituting the flexible printed circuit board and the magnetic head without using any adhesive. A head arm for a magnetic disk device, characterized in that a foil lead wire is formed directly in a layer on the guide arm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27902190A JPH04155675A (en) | 1990-10-19 | 1990-10-19 | Head air for magnetic disk device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27902190A JPH04155675A (en) | 1990-10-19 | 1990-10-19 | Head air for magnetic disk device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04155675A true JPH04155675A (en) | 1992-05-28 |
Family
ID=17605290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27902190A Pending JPH04155675A (en) | 1990-10-19 | 1990-10-19 | Head air for magnetic disk device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04155675A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07302419A (en) * | 1994-05-02 | 1995-11-14 | Nec Corp | Magnetic head positioning mechanism and magnetic disk device having the same |
| US5786964A (en) * | 1994-03-08 | 1998-07-28 | Fujitsu Limited | Magnetic disk drive unit with improved signal feeding and extracting arrangement |
| US5844750A (en) * | 1994-03-17 | 1998-12-01 | Fujitsu Limited | Actuator arm assembly having an actuator arm wiring pattern and a head suspension wiring pattern |
-
1990
- 1990-10-19 JP JP27902190A patent/JPH04155675A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5786964A (en) * | 1994-03-08 | 1998-07-28 | Fujitsu Limited | Magnetic disk drive unit with improved signal feeding and extracting arrangement |
| US5844750A (en) * | 1994-03-17 | 1998-12-01 | Fujitsu Limited | Actuator arm assembly having an actuator arm wiring pattern and a head suspension wiring pattern |
| JPH07302419A (en) * | 1994-05-02 | 1995-11-14 | Nec Corp | Magnetic head positioning mechanism and magnetic disk device having the same |
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