JPH0995075A - Ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To attempt to prevent the damage of an IC module at the time of handling. SOLUTION: An IC module 3 is engaged with the recess 2 of a card board 1 and connected. An elastic element 10 is interposed between the module 3 and the inner bottom of the recess 2. Even if the board 1 is bent, its strain is absorbed by the element 10 to reduce the effect of the strain to the module 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card provided with an IC module, and more particularly to an IC card having measures for preventing damage to the IC module.

[0002]

2. Description of the Related Art IC cards, which are card-shaped media media containing a microcomputer and memory, have been used in many fields in place of magnetic cards because of their large storage capacity. As shown in FIGS. 5 and 6, the structure of this IC card is generally such that a thin card substrate 1 made of a synthetic resin, which is a base material, is provided with a recess 2 and the recess 2 has an I
The C module 3 is fitted and bonded and fixed by the adhesive 15. As the representative adhesive 15, a hot melt type polyester or polyolefin adhesive is used because it has excellent workability and can firmly bond the IC module 3 after curing. The IC module 3 itself has a structure in which an IC chip 6 is bonded onto an IC substrate 4 provided with a pattern 5 and connected by a bonding wire 7, and the connection portion and the IC chip 6 are covered with a synthetic resin protective film 9.

[0003]

However, in the above-mentioned conventional IC card, a highly rigid glass epoxy resin or the like is used as the material of the IC substrate 4 of the IC module 3, while the card substrate which is the base material of the IC card. Vinyl chloride is often used as the first material. By the way, an IC card is often bent by an external force when it is handled, and this external force causes a large deformation of the card substrate 1 made of vinyl chloride, which is thin and has low rigidity, as shown in FIG. The distortion of the card substrate 1 caused by this large deformation propagates to the IC module 3 via the joint between the IC module 3 and the card substrate 1 by the adhesive 15.
There has been a problem that a destruction phenomenon such as cutting the bonding wire 7 occurs and the function of the IC module 3 is lost.

An object of the present invention is to provide an IC card capable of preventing damage to the IC module due to deformation of the card substrate.

[0005]

The IC card according to the present invention comprises:
A recess 2 is provided on one surface of a synthetic resin card substrate 1, and an IC module 3 is fitted into and bonded to the recess 2 via an elastic body 10. Instead of the elastic body 10, the adhesive 13 having elasticity after curing may be used to bond the IC module 3 into the recess 2.

[0006]

[Operation] When a large bending is applied to the card substrate 1,
The deformation of the elastic body 10 or the elastic adhesive 13 can prevent the strain generated in the card substrate 1 from propagating to the IC module 3.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION

(First Embodiment) FIGS. 1 and 2 show a first embodiment of the present invention. Reference numeral 1 denotes a card substrate formed of vinyl chloride or the like in the shape of a thin rectangular flat plate, and a recess 2 is formed on a part of one side thereof. 3 is an IC module, the structure of which is the same as that of the conventional one described above. An IC chip 6 is bonded to the lower surface of a pattern 5 of an IC substrate 4 made of glass epoxy resin or the like and connected by a bonding wire 7. Then, the connection portion and the IC chip 6 are protected by the synthetic resin protective film 9
Covered with. The IC module 3 is joined and fixed in the recess 2 with adhesives 11 and 12 via an elastic body 10. Examples of the elastic body 10 include general-purpose rubber such as NR, IR and SBR, or special rubber such as CR, NBR, silicon rubber and urethane rubber.

The IC module 3 is provided in the recess 2 of the card substrate 1.
In order to bond and fix the above, for example, first, the elastic body 10 having a quadrangular cross section is bonded and fixed to the inner bottom surface of the concave portion 2 near the outer circumference via the adhesive 11. Next, the IC chip 6 of the IC substrate 4
By bonding and fixing the lower surface of the peripheral portion projecting outwardly on the elastic body 10 with the adhesive 12, the IC module 3 is provided between the outer peripheral edge of the IC substrate 4 and the inner peripheral wall of the recess 2. , And the IC chip 6 and the inner bottom surface of the recess 2 are fitted and joined in the recess 2 so as to form a gap therebetween. Alternatively, in advance, the elastic body 10 is bonded and fixed to the lower surface of the peripheral portion protruding outward from the IC chip 6 of the IC substrate 4 via the adhesive 12, and the IC module 3 is fitted into the recess 2 at the same time. It is also possible to bond the lower surface of the elastic body 10 to the inner bottom surface of the recess 2 via the adhesive 11.

At this time, the bending moment M may act on the card substrate 1 during handling as shown in FIG. Since the elastic body 10 is absorbed and relaxed by the deformation, the propagation to the IC module 3 can be suppressed, and the deformation and damage of the IC module 3 can be prevented.

(Second Embodiment) FIGS. 3 and 4 show a second embodiment of the present invention. In this embodiment, the concave portion 2 of the card substrate 1 has a rectangular first concave portion 2a which is slightly larger than the plane of the IC substrate 4 of the IC module 3 and the concave portion provided on the bottom wall of the first concave portion 2a. Is also slightly smaller and slightly larger than the plane of the IC chip 6 to form a reverse convex cross-section. On the bottom wall of the first recess 2a, the lower surface of the peripheral edge portion of the IC substrate 4 protruding outward from the IC chip 6 is joined and fixed via an adhesive 13 having elasticity after curing,
The IC chip 6 is arranged in the second recess 2b. Also in this embodiment, even when the bending moment M acts on the card substrate 1 as shown in FIG. 4, the distortion of the card substrate 1 is absorbed and relaxed by the deformation of the adhesive 13 having elasticity, and thus extends to the IC module 3. Can be suppressed.

[0011]

According to the present invention, the concave portion 2 of the card substrate 1
Since the IC module 3 is bonded and fixed in the inside through the elastic body 10 or the adhesive 13 having elasticity after curing, it is possible to prevent the IC module 3 from being deformed or damaged during handling of the IC card, and the highly reliable IC You can get a card.

[Brief description of drawings]

FIG. 1 is a sectional view of an essential part of an IC card according to a first embodiment.

FIG. 2 is a schematic diagram when bending is applied to the IC card of the first embodiment.

FIG. 3 is a sectional view of an essential part of an IC card according to a second embodiment.

FIG. 4 is a schematic diagram when bending is applied to the IC card of the second embodiment.

FIG. 5 is an external perspective view of a conventional IC card.

FIG. 6 is an enlarged sectional view taken along line AA in FIG. 5;

FIG. 7 is a schematic diagram when a conventional IC card is bent.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Card substrate 2 Recesses 3 IC module 10 Elastic body 13 Adhesive having elasticity after curing

Claims (2)

[Claims] 1. A recess 2 is provided on one surface of a synthetic resin card substrate 1, and an IC module 3 is provided with an elastic member 10 in the recess 2.
IC characterized by being fitted and joined via
card. 2. An IC characterized in that a recess 2 is provided on one surface of a synthetic resin card substrate 1, and an IC module 3 is fitted into the recess 2 and bonded with an adhesive 13 having elasticity after curing. card.