JPS63290000A - Method of attaching electronic component to thin substrate - Google Patents
Method of attaching electronic component to thin substrateInfo
- Publication number
- JPS63290000A JPS63290000A JP62125420A JP12542087A JPS63290000A JP S63290000 A JPS63290000 A JP S63290000A JP 62125420 A JP62125420 A JP 62125420A JP 12542087 A JP12542087 A JP 12542087A JP S63290000 A JPS63290000 A JP S63290000A
- Authority
- JP
- Japan
- Prior art keywords
- component
- notches
- pins
- substrate
- notch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 9
- 239000000758 substrate Substances 0.000 title abstract description 9
- 238000005452 bending Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 4
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はプリント基板に実装する電子部品の取付方法に
関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for mounting electronic components on a printed circuit board.
従来の薄板基板への電子部品の取付は、リードピンを挿
入穴に通した後、クリンチによりリードピンを曲げるか
、つぶすかして抜けないようにする方式がとられている
。Conventionally, electronic components are mounted on a thin board by inserting a lead pin into an insertion hole and then bending or crushing the lead pin by clinching to prevent it from coming out.
しかし、前述の従来技術において、電子部品のリードピ
ンが太い場合や硬い場合には、曲げやつぶしに大きなパ
ワーが必要であり、駆動力の増強や曲げやつぶしに使う
治具の強度を上げなければならないという問題点を有す
る。またリードピンの曲げの際、リードピンが部品の根
元から曲がる為薄板基板に変形、断線を起こすという問
題点を存する。However, in the conventional technology described above, when the lead pins of electronic components are thick or hard, a large amount of power is required to bend or crush them, and it is necessary to increase the driving force or the strength of the jig used for bending or crushing. The problem is that it does not. Further, when bending the lead pin, there is a problem that the lead pin bends from the base of the component, causing deformation and disconnection of the thin board.
そこで本発明はこのような問題点を解決するもので、そ
の目的とするところは、どのようなリードピンの電子部
品でも簡単にリードピンが曲げられ、かつ薄板基板に変
形・断線を起こさずに電子部品を取付ける方法を提供す
るところにある。The present invention is intended to solve these problems.The purpose of the present invention is to easily bend the lead pins of any type of electronic component without causing deformation or disconnection of the thin board. This is where we provide you with a way to install the .
本発明の、薄板基板への電子部品の取付は方法は、電子
部品のリードピンにノツチを形成し、しかもそのノツチ
箇所が電子部品を基板に挿入したｎ、Ｍ仮下面と同じか
、少し下にくるような位置に形成したことを特徴とする
。The method of attaching electronic components to a thin board according to the present invention is to form a notch in the lead pin of the electronic component, and to make sure that the notch location is at the same level as or slightly below the temporary lower surface of the electronic component inserted into the board. It is characterized by being formed in a position such that the
本発明の上記の構造によれば、リードビンを曲げる際、
ノツチ部分に応力集中が起こるために、この箇所の曲げ
強さが弱くなり、ここで曲がり易くなる。According to the above structure of the present invention, when bending the lead bin,
Since stress concentration occurs at the notch, the bending strength at this location becomes weaker, making it easier to bend.
第１図は本発明の実施例における薄板基板への電子部品
の取付は方法の一例図である。第２図はくさび状のノツ
チを入れた部品の一例図である。FIG. 1 is a diagram illustrating an example of a method for attaching electronic components to a thin board in an embodiment of the present invention. FIG. 2 is an example of a part with a wedge-shaped notch.
部品１のリードピンを薄板基板２の穴へ挿入後、リード
ピンに形成したノツチ部分で曲げて基板に固定する。ノ
ツチは部品を基板に挿入した際、基板下面と同じか、少
し下にくるような位置に形成することにより、リードピ
ンを曲げる際基板にかかる曲げの力が軽減され、しかも
、基板に部品を密行して固定することができる。ノツチ
は基板へ挿入前、挿入後どちらでも形成することができ
るが、本実施例では、基板への挿入前に形成している。After the lead pin of the component 1 is inserted into the hole of the thin board 2, it is fixed to the board by bending the notch portion formed in the lead pin. By forming the notch so that it is at the same level or slightly below the bottom surface of the board when the component is inserted into the board, the bending force applied to the board when bending the lead pin is reduced, and it also allows the component to be tightly attached to the board. It can be fixed in a row. Although the notch can be formed either before or after insertion into the substrate, in this embodiment the notch is formed before insertion into the substrate.
ノツチは少なくとも二本以上のリードピンに形成し、そ
れらのリードピンの曲げ方向は逆にする。本実施例では
リードピンの曲げ方向は、ノツチを入れる方向と同じ方
向に曲げているが逆でもかまわない。ノツチの深さは深
過ぎるとノツチを形成する際にリードピンが曲がったり
、曲げる際にリードピンが折れ易くなるため、部品のリ
ードピン径とリードビン形状により適度な深さに設定す
る。第３図は本実施例における部品にノツチを形成する
方法の概略図であり、部品１は部品受は台３上に位置決
めされた後、両側からくさび状の刃を侍ったノツチ形成
治具４を部品のり−ドビンに押しつけることによりノツ
チが形成される。両側のノツチ形成治具のストロークは
それぞれ調整できるようになっており、これによりノツ
チ深さが可変できる。本実施例ではノツチ形状はくさび
状にしているがＶ形に限定されるものではない。The notches are formed on at least two lead pins, and the bending directions of the lead pins are reversed. In this embodiment, the lead pin is bent in the same direction as the direction in which the notch is inserted, but it may be bent in the opposite direction. The depth of the notch should be set to an appropriate depth depending on the lead pin diameter of the part and the shape of the lead bin, since if the notch is too deep, the lead pin will bend when forming the notch, or the lead pin will easily break when bent. FIG. 3 is a schematic diagram of the method for forming a notch in a component in this embodiment. After the component holder is positioned on the stand 3, a notch forming jig is used with wedge-shaped blades on both sides. A notch is formed by pressing the part 4 against the glue dobbin. The strokes of the notch forming jigs on both sides can be adjusted, allowing the notch depth to be varied. In this embodiment, the notch shape is wedge-shaped, but is not limited to a V-shape.
またｉ４図に示すように１本のリードピンにおいて、さ
まざまな方向からノツチを入れてもかまわない。Furthermore, as shown in Figure i4, notches may be inserted from various directions in one lead pin.
以上述べたように本発明によれば、電子部品のり−ドビ
ンにノツチを形成することにより、リードピンか曲げ易
くなると同時にノツチの箇所から曲がる為、薄板基板に
変形中断線を起こさないという効果を有する。As described above, according to the present invention, by forming a notch in the electronic component glue dowel, the lead pin becomes easy to bend, and at the same time, since the lead pin bends from the notch, it has the effect of not causing deformation break lines in the thin board. .
第１図は本発明の実施例における薄板基板への電子部品
の取付は方法の一例図。第２図はくさび状のノツチを入
れた部品の一例図。第３図は本実施例における部品にノ
ツチを形成する方法の概略図。第４図は円形のノツチを
両側から入れた部品の一例図。
１・・・電子部品 ２・・・薄板基板３・・・部品
受は台 ４・・・ノツチ形成治具以 上
出願人 セイコーエプソン株式会社
子ろ図FIG. 1 is a diagram illustrating an example of a method for attaching electronic components to a thin board in an embodiment of the present invention. Figure 2 is an example of a part with a wedge-shaped notch. FIG. 3 is a schematic diagram of a method of forming a notch in a component in this embodiment. Figure 4 is an example of a part with circular notches inserted from both sides. 1...Electronic component 2...Thin board 3...Component holder is stand 4...Notch forming jig and above Applicant Seiko Epson Co., Ltd.
Claims (1)
リードピンを曲げ易くすると同時に、薄板基板に変形、
断線を起こさずに電子部品を取付けることを特徴とする
薄板基板への電子部品の取付方法By forming notches in the lead pins of electronic components,
While making the lead pins easier to bend, it also transforms into a thin board.
A method for attaching electronic components to a thin board, characterized by attaching electronic components without causing wire breakage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62125420A JPS63290000A (en) | 1987-05-22 | 1987-05-22 | Method of attaching electronic component to thin substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62125420A JPS63290000A (en) | 1987-05-22 | 1987-05-22 | Method of attaching electronic component to thin substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63290000A true JPS63290000A (en) | 1988-11-28 |
Family
ID=14909663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62125420A Pending JPS63290000A (en) | 1987-05-22 | 1987-05-22 | Method of attaching electronic component to thin substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63290000A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6271480B1 (en) * | 1997-05-09 | 2001-08-07 | Nec Corporation | Electronic device |
-
1987
- 1987-05-22 JP JP62125420A patent/JPS63290000A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6271480B1 (en) * | 1997-05-09 | 2001-08-07 | Nec Corporation | Electronic device |
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