JPS63289385A - Valve for vacuum processing device - Google Patents
Valve for vacuum processing deviceInfo
- Publication number
- JPS63289385A JPS63289385A JP12355087A JP12355087A JPS63289385A JP S63289385 A JPS63289385 A JP S63289385A JP 12355087 A JP12355087 A JP 12355087A JP 12355087 A JP12355087 A JP 12355087A JP S63289385 A JPS63289385 A JP S63289385A
- Authority
- JP
- Japan
- Prior art keywords
- valve
- gas
- opening
- valve seat
- vacuum processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007789 gas Substances 0.000 claims abstract description 32
- 239000011261 inert gas Substances 0.000 claims description 3
- 239000003566 sealing material Substances 0.000 claims description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 7
- 239000000428 dust Substances 0.000 abstract description 6
- 229910001873 dinitrogen Inorganic materials 0.000 abstract description 5
- 238000002347 injection Methods 0.000 abstract 4
- 239000007924 injection Substances 0.000 abstract 4
- 238000000034 method Methods 0.000 abstract 1
- 238000005406 washing Methods 0.000 abstract 1
- 239000006227 byproduct Substances 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 2
- 239000004927 clay Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Drying Of Semiconductors (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、真空処理装置１例えばＣＶＤ（Ｃｈｅｍｉｃ
ａｌＶａｐｏｕｖ Ｄｅｐｏｓｉｔｉｏｎ） 装置に
接続されるバルブに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention provides a vacuum processing apparatus 1 such as a CVD (Chemical
alVapouv Deposition) This relates to the valve connected to the device.
この種のバルブは一般に２例えばＣＶＤ装置側に接続さ
れる第１開口、真空排気系側に接続される第２開口を有
し、内部にシール材を取付けて往動自在な弁体を備え、
該弁体に対する弁座を形成させた密閉ケーシングから成
るが、特に上記第１開口と第２開口との延在方向が直角
にある。いわゆるＬ型バルブにおいては、上記弁座にダ
ストや反応副生成物が付着しやすく、場合によっては、
これが弁体が弁座に着座して第１開口と第２開口との連
通を遮断すべきときに、リークを発生させることがある
。例えば、 ＣＶＤ装置において、薄膜成長操作を開始
して数１０時間、経過するとすでにこのようなリークが
発生する場合がある。このような事態を回避するために
は、バルブのケーシング内を洗浄するが、バルブ自体を
交換しなければならない。This type of valve generally has two openings, for example, a first opening connected to the CVD equipment side and a second opening connected to the vacuum exhaust system side, and is equipped with a valve body that is movable with a sealing material installed inside,
It consists of a closed casing in which a valve seat for the valve body is formed, and in particular, the extending directions of the first opening and the second opening are perpendicular to each other. In so-called L-type valves, dust and reaction by-products tend to adhere to the valve seat, and in some cases,
This may cause a leak when the valve body is seated on the valve seat and should cut off communication between the first and second openings. For example, in a CVD apparatus, such a leak may already occur several tens of hours after starting a thin film growth operation. To avoid this situation, the inside of the valve casing is cleaned, but the valve itself must be replaced.
本発明は上記問題に鑑みてなされ、バルブの洗浄や交換
の周期を大巾に延ばすことができる真空処理装置用バル
ブを提供することを目的とする。The present invention has been made in view of the above problems, and an object of the present invention is to provide a valve for a vacuum processing apparatus that can greatly extend the cycle of valve cleaning and replacement.
上記目的は、真空処理装置側に接続される第１開口、真
空排気系側に接続される第２開口を有し。The above object has a first opening connected to the vacuum processing apparatus side and a second opening connected to the vacuum exhaust system side.
内部にシール材を取付けて往動自在な弁体を備え。Equipped with a valve body that has a sealing material installed inside and can move freely.
該弁体に対する弁座を形成させた密閉ケーシングから成
る真空処理装置用バルブにおいて、前記密閉ケーシング
にガス噴出用部材を気密に取シ付は該部材を介して、少
なくとも前記弁体が前記弁座から離れているときに、前
記ガス噴出用部材に接続される圧縮ガス源から供給され
る圧縮ガスを該ガス噴出用部材を介して前記弁座に向っ
て噴出させるようにしたことを特徴とする真空処理装置
用バルブによって達成される。In a valve for a vacuum processing apparatus comprising a sealed casing in which a valve seat is formed for the valve body, a gas ejection member is airtightly attached to the sealed casing so that at least the valve body is connected to the valve seat through the member. When the valve seat is away from the valve seat, compressed gas supplied from a compressed gas source connected to the gas jetting member is jetted toward the valve seat via the gas jetting member. This is achieved by a valve for vacuum processing equipment.
〔作 用〕
真空処理装置側から送られてくるダストや反応副生成物
が弁座やその近傍に付着せんとしてもガス噴出用部材か
らのガス噴出によシ吹きとばされて真空排気系側に接続
される第２開口を通って外部へと除外される。これによ
って従来より、バルブの洗浄や交換の周期を大巾に短縮
することができる。[Function] Even if dust and reaction by-products sent from the vacuum processing equipment side do not adhere to the valve seat or its vicinity, they are blown away by the gas jet from the gas jetting member and sent to the vacuum exhaust system side. is excluded to the outside through a second opening connected to. This makes it possible to significantly shorten the cycle of valve cleaning and replacement compared to conventional valves.
第１図は本実施例のバルブが接続されるＣＶＤ装置の全
体を示す概略図であるが、公知のように準備室（１）と
反応室（２）との間にはゲートバルブ（４）が設けられ
、この開閉により準備室（１）から、その上に薄膜を形
成させるべき基板が反応室（２）内に供給される。準備
室（１）の他方の側壁部にもゲートバルブ（３）が設け
られ、この開閉によシ外部から未処理の基板が準備室（
１）内に供給される。FIG. 1 is a schematic diagram showing the entire CVD apparatus to which the valve of this embodiment is connected. As is well known, there is a gate valve (4) between the preparation chamber (1) and the reaction chamber (2). By opening and closing, a substrate on which a thin film is to be formed is supplied from the preparation chamber (1) into the reaction chamber (2). A gate valve (3) is also provided on the other side wall of the preparation chamber (1), and when this gate valve is opened and closed, unprocessed substrates are transported from the outside to the preparation chamber (1).
1) Supplied within.
準備室（１）の開口（５）はバルブ（６）を介して高真
空排気用ポンプ（７）Ｋ接続される。反応室（２）の土
壁部には反応ガス供給用開口（８）が形成され、下壁部
には排気用開口（９）が形成され、これは本実施例によ
るバルブ顛及びコンダクタンス・バルブσηｔＪｆ”し
てロータリポンプ（６）に接続される。The opening (5) of the preparation chamber (1) is connected to a high vacuum evacuation pump (7)K via a valve (6). A reactant gas supply opening (8) is formed in the clay wall of the reaction chamber (2), and an exhaust opening (9) is formed in the lower wall, which is connected to the valve structure and conductance valve according to this embodiment. σηtJf” and is connected to the rotary pump (6).
次に、第２図及び第３図を参照して本実施例のバルブ顛
の詳細について説明する。Next, details of the valve structure of this embodiment will be explained with reference to FIGS. 2 and 3.
本バルブαＱは、Ｌ型バルブとよれ、ケーシングｃ！Ｄ
の一端壁部には第１開口ＣＩ！２１が形成され、これは
第１図に示される反応室（２）側に接続される。また。This valve αQ is an L-shaped valve and has a casing c! D
One end wall of the first opening CI! 21 is formed, which is connected to the reaction chamber (2) side shown in FIG. Also.
この第１開口Ｉ２２１と直角方向にある側壁部には第２
開口（ハ）が形成され、これは第１図に示されるいわゆ
る薄膜形成用あるいは粗引き用のロータリー・ポンプ（
６）側に接続される。A second opening I221 is provided on the side wall in a direction perpendicular to
An opening (c) is formed, which is connected to a so-called thin film forming or roughing rotary pump (see Fig. 1).
6) Connected to the side.
ケーシング１２Ｉｌ内は弁室０４１．第１．第２圧縮空
気室（２５１■に区画され、圧縮空気室Ｃ５１＆６１は
それぞれ開口（２７１（２８１を介して交互に圧縮空気
が給排される。シールリング關を介して弁ロッド（２９
）は摺動自在に支持され、この一端部にピストン（イ）
）がシールリングＣ３１＋を装着して摺動自在にケーシ
ング［２１１に嵌合している。弁ロクドのの弁室Ｃ２４
１（ｌｌｌ Ｋはばね受け（ロ）が固定され、これと隔
壁Ｃ３５）との間にばねＧ２１が配設されている。弁ロ
ッド（２９）の他端部には弁板（支））が固定され、こ
の表面にはリング状のゴムシールＣ３７＋が固定されて
いる。Inside the casing 12Il is a valve chamber 041. 1st. The second compressed air chamber (251) is divided into compressed air chambers C51 & 61, and compressed air is alternately supplied and discharged through the opening (271 (281).
) is slidably supported, and a piston (a) is attached to one end of this.
) is fitted with a seal ring C31+ and slidably fitted into the casing [211. Valve lock valve chamber C24
1 (ll K) has a spring receiver (B) fixed therein, and a spring G21 is disposed between this and the partition wall C35. A valve plate (support) is fixed to the other end of the valve rod (29), and a ring-shaped rubber seal C37+ is fixed to the surface of this plate.
ゴムシールＧ力に対向する位置にある第１開口のの内側
周辺部間が弁座として働らき、第２図は弁板（至）の開
弁状態を示すが、この状態において弁座□□□とゴムシ
ール３つとの間にあるように本発明に係わる円弧状のガ
ス噴出部材（４［）がケーシング１２１１に固定されて
いる。このために、ケーシング（２１１に円弧状の切欠
き姐）が形成され、これにガス噴出部材＋４（１が嵌着
された上、シール溶接されている。すなわち、気密にケ
ーシングｃ！Ｄに対し固定されている。The area between the inner periphery of the first opening located at the position facing the rubber seal G force acts as a valve seat, and Fig. 2 shows the valve plate in the open state. An arcuate gas ejection member (4[) according to the present invention is fixed to the casing 1211 between the three rubber seals and the three rubber seals. For this purpose, a casing (arc-shaped notch 211) is formed, into which the gas ejection member +4 (1) is fitted and seal welded.In other words, the casing c!D is airtightly Fixed.
ガス噴出部材（４［）は第３図に明示されるような形状
を呈するが９円弧状の本体（４カ内に同心的にガス通路
（４３が形成され、これは給気口−と連通し、またこれ
と連通して内壁面には多数の噴出口（４８１が形成され
ている。給気口（４４１にはパイプ（４５１が接続され
。The gas ejection member (4) has a shape as clearly shown in FIG. In addition, in communication with this, a large number of jet ports (481) are formed on the inner wall surface.A pipe (451) is connected to the air supply port (441).
これはバルブ（４６）を介して圧縮ガス源（句が接続さ
れている。本実施例では圧縮ガス源（４７）のガスとし
ては不活性ガスである窒素（４ηが用いられている。ガ
ス噴出口（４８１は弁座關の方を向いている。This is connected to a compressed gas source (47) via a valve (46). In this embodiment, nitrogen (4η), which is an inert gas, is used as the gas for the compressed gas source (47). The exit (481 is facing the valve seat).
本発明の実施例は以上のように構成されるが。The embodiment of the present invention is configured as described above.
次にこの作用について説明する。Next, this effect will be explained.
ロータリーポンプ（２）を作動して薄膜形成時あるいは
粗引き時には、弁板（３）は図示の位置にあシ。When operating the rotary pump (2) to form a thin film or rough pumping, the valve plate (3) is in the position shown in the figure.
弁座啜から離れていて、第１開口Ｑ２１と第２開口Ｃ２
３）とは連通している。このとき、開口の１を通って圧
縮空気が空気室■側に送られ、ばね３Ｚのはね力に抗し
てピストン１３０）は図示の位置をとっている。The first opening Q21 and the second opening C2 are located away from the valve seat.
3) is in communication. At this time, compressed air is sent to the air chamber (2) through opening 1, and the piston 130) takes the position shown in the figure against the spring force of the spring 3Z.
第２図に矢印で示すように排気ガスは流通するのである
が、このときダストや水分状の反応副生成物が共に運ば
れてきて弁座（９）周辺のケーシングＶＤ内壁に付着せ
んとしている。The exhaust gas flows as shown by the arrow in Figure 2, but at this time, reaction by-products in the form of dust and moisture are carried along with them and try to adhere to the inner wall of the casing VD around the valve seat (9). .
然るに、今、バルブ１４６）が開かれていて圧縮した窒
素ガスがガス噴出部材＋４１の噴出口（４印から弁座■
に向って噴出している。従って、この周辺のケーシング
咀内壁にダストや反応副生成物が付着せんとしても、こ
の噴出ガスによって吹きとばされ。However, now that the valve 146) is open, the compressed nitrogen gas is flowing from the spout (mark 4 to the valve seat) of the gas spouting member +41.
It's gushing out towards. Therefore, even if dust and reaction by-products do not adhere to the inner wall of the casing around this area, they are blown away by the ejected gas.
第２開口（ハ）を通って外部へと排出されてしまう。It is discharged to the outside through the second opening (c).
第２空気室（２６）に圧縮空気が送られ、第１空気室＋
２５１から圧縮空気が排気されるときにはピストン（至
））は第２図において左方へと移動し、弁板（ト）のゴ
ムシールＣ３７）は弁座時に着座する。よって、第１開
口のと第２開口（２３１との連通は遮断される。この閉
弁状態では、ガス噴出部材（４０）は弁板（３６）より
、第２図において右方に位置するが、このときにも窒素
ガスを噴出させるようにしてもよいが２本実施例ではこ
のときにはバルブ４６）が閉じられ、窒素ガスの噴出は
停止される。Compressed air is sent to the second air chamber (26), and the first air chamber +
When compressed air is exhausted from 251, the piston (to) moves to the left in FIG. 2, and the rubber seal C37) of the valve plate (t) seats on the valve seat. Therefore, communication between the first opening and the second opening (231) is cut off. In this valve closed state, the gas ejection member (40) is located to the right of the valve plate (36) in FIG. Although nitrogen gas may also be ejected at this time, in the second embodiment, the valve 46) is closed at this time and the ejection of nitrogen gas is stopped.
以上２本発明の実施例について説明したが、勿論２本発
明はこれに限定されることなく本発明の技術的発想に基
づいて種々の変形が可能でおる。Although the two embodiments of the present invention have been described above, the present invention is of course not limited thereto, and various modifications can be made based on the technical idea of the present invention.
例えば１以上の実施例ではＣＶＤ装置が説明されたが、
これに限ることなく、他の真空処理装置に接続されるバ
ルブにも本発明は適用可能である。For example, while a CVD apparatus has been described in one or more embodiments,
The present invention is not limited to this, but can also be applied to valves connected to other vacuum processing apparatuses.
また１以上の実施例では、いわゆるＬ型バルブを説明し
たが、構成も図示のものに限定されることなく、他型の
バルブにも本発明は適用可能である。Further, in one or more embodiments, a so-called L-type valve has been described, but the structure is not limited to that shown in the drawings, and the present invention is applicable to other types of valves.
また以上の実施例では、ガス噴出部材から窒素ガスを噴
出させるようにしたが、他の不活性ガスでもよく、ある
いは、一般に種々のガスが適用可能である。Further, in the above embodiments, nitrogen gas is ejected from the gas ejection member, but other inert gases may be used, or various gases may be used.
本発明の真空処理装置用バルブによれば、弁座へのダス
トヤ粉状の反応副生成物などが付着するのが極力防止さ
れるので、バルブの洗浄や交換の期間を従来より一段と
長くすることができる。According to the valve for vacuum processing equipment of the present invention, the adhesion of reaction by-products in the form of dust and powder to the valve seat is prevented as much as possible, so the period for valve cleaning and replacement can be made much longer than before. Can be done.
る本発明の実施例のバルブの断面図、第３図は第２図に
おけるｌ−１ｆ線線方向拡大面図である。
なお図において。FIG. 3 is an enlarged sectional view in the direction of the l-1f line in FIG. 2. In addition, in the figure.
Claims (2)
系側に接続される第２開口を有し、内部にシール材を取
付けて往動自在な弁体を備え、該弁体に対する弁座を形
成させた密閉ケーシングから成る真空処理装置用バルブ
において、前記密閉ケーシングにガス噴出用部材を気密
に取り付け、該部材を介して、少なくとも前記弁体が前
記弁座から離れているときに、前記ガス噴出用部材に接
続される圧縮ガス源から供給される圧縮ガスを該ガス噴
出用部材を介して前記弁座に向って噴出させるようにし
たことを特徴とする真空処理装置用バルブ。(1) It has a first opening connected to the vacuum processing equipment side, a second opening connected to the vacuum exhaust system side, and a valve body that is movable with a sealing material attached inside, and In a valve for a vacuum processing apparatus consisting of a sealed casing in which a valve seat is formed, a gas ejection member is airtightly attached to the sealed casing, and the gas ejection member is airtightly disposed through the member, at least when the valve body is separated from the valve seat. A valve for a vacuum processing apparatus, characterized in that compressed gas supplied from a compressed gas source connected to the gas ejection member is ejected toward the valve seat via the gas ejection member.
載の真空処理装置用バルブ。(2) The valve for a vacuum processing apparatus according to the above item 1, wherein the compressed gas is an inert gas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12355087A JPS63289385A (en) | 1987-05-19 | 1987-05-19 | Valve for vacuum processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12355087A JPS63289385A (en) | 1987-05-19 | 1987-05-19 | Valve for vacuum processing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63289385A true JPS63289385A (en) | 1988-11-25 |
Family
ID=14863374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12355087A Pending JPS63289385A (en) | 1987-05-19 | 1987-05-19 | Valve for vacuum processing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63289385A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108757987A (en) * | 2018-06-16 | 2018-11-06 | 张新丰 | A kind of band protective case ball valve |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56105176A (en) * | 1980-01-23 | 1981-08-21 | Hitachi Ltd | Gate valve for vacuum |
-
1987
- 1987-05-19 JP JP12355087A patent/JPS63289385A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56105176A (en) * | 1980-01-23 | 1981-08-21 | Hitachi Ltd | Gate valve for vacuum |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108757987A (en) * | 2018-06-16 | 2018-11-06 | 张新丰 | A kind of band protective case ball valve |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11430640B2 (en) | Substrate processing apparatus | |
| US11443926B2 (en) | Substrate processing apparatus | |
| US7270715B2 (en) | Chemical vapor deposition apparatus | |
| KR20180023298A (en) | Exhaust apparatus and substrate processing apparatus and thin film fabricating method using the same | |
| US7806383B2 (en) | Slit valve | |
| US6173938B1 (en) | Two speed air cylinder for slit valve motion control | |
| KR100936695B1 (en) | Atomic layer deposition apparatus | |
| JP2005320622A (en) | Convertible maintenance valve | |
| US6149729A (en) | Film forming apparatus and method | |
| KR20110097663A (en) | Vacuum-exhaust ball valve and vacuum exhaust apparatus | |
| US7007919B2 (en) | Slit valve method and apparatus | |
| US6719272B1 (en) | Valve and vacuum processing device with the valve | |
| JPS63289385A (en) | Valve for vacuum processing device | |
| KR20230024400A (en) | High Temperature Chemical Vapor Deposition Cover | |
| JP2000346238A5 (en) | Vacuum valves and vacuum processing equipment | |
| JP4901685B2 (en) | An apparatus for depositing an internal protective film on a thermoplastic container by microwave plasma | |
| EP0399671A3 (en) | Processing semi-conductor wafers and other substrates | |
| KR101622909B1 (en) | Gas supply unit and thin film deposition apparatus having the same | |
| JP3012019B2 (en) | Gate valve | |
| KR200157376Y1 (en) | Gate valve for chemical vapor depostion system | |
| JP2006176823A (en) | Film deposition system | |
| KR200177265Y1 (en) | Press control structure of multi-chamber | |
| US20230399740A1 (en) | Substrate processing device | |
| KR20040104040A (en) | Exhaust system of chemical vapor deposition apparatus | |
| JPH01312074A (en) | Load locking device of semiconductor treating device |