JPS6328604Y2 - - Google Patents
Info
- Publication number
- JPS6328604Y2 JPS6328604Y2 JP19072283U JP19072283U JPS6328604Y2 JP S6328604 Y2 JPS6328604 Y2 JP S6328604Y2 JP 19072283 U JP19072283 U JP 19072283U JP 19072283 U JP19072283 U JP 19072283U JP S6328604 Y2 JPS6328604 Y2 JP S6328604Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- blade
- protective film
- string
- punching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 27
- 230000001681 protective effect Effects 0.000 claims description 17
- 238000004080 punching Methods 0.000 claims description 14
- 235000012431 wafers Nutrition 0.000 description 27
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 10
- 229920002554 vinyl polymer Polymers 0.000 description 10
- 229920006266 Vinyl film Polymers 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19072283U JPS6099529U (ja) | 1983-12-10 | 1983-12-10 | 半導体ウエ−ハの保護膜の打抜き具 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19072283U JPS6099529U (ja) | 1983-12-10 | 1983-12-10 | 半導体ウエ−ハの保護膜の打抜き具 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6099529U JPS6099529U (ja) | 1985-07-06 |
| JPS6328604Y2 true JPS6328604Y2 (enExample) | 1988-08-02 |
Family
ID=30410873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19072283U Granted JPS6099529U (ja) | 1983-12-10 | 1983-12-10 | 半導体ウエ−ハの保護膜の打抜き具 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6099529U (enExample) |
-
1983
- 1983-12-10 JP JP19072283U patent/JPS6099529U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6099529U (ja) | 1985-07-06 |
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