JPS63283895A - Ultrasonic punching processing method - Google Patents
Ultrasonic punching processing methodInfo
- Publication number
- JPS63283895A JPS63283895A JP11741887A JP11741887A JPS63283895A JP S63283895 A JPS63283895 A JP S63283895A JP 11741887 A JP11741887 A JP 11741887A JP 11741887 A JP11741887 A JP 11741887A JP S63283895 A JPS63283895 A JP S63283895A
- Authority
- JP
- Japan
- Prior art keywords
- ultrasonic
- punch
- processing method
- punching processing
- ultrasonic punching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004080 punching Methods 0.000 title claims description 14
- 238000003672 processing method Methods 0.000 title description 3
- 238000000034 method Methods 0.000 claims description 10
- 239000003960 organic solvent Substances 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000314 lubricant Substances 0.000 claims description 3
- 239000002904 solvent Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000277269 Oncorhynchus masou Species 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 239000013040 bath agent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は超音波撮動を利用した打抜き加工方法、特に
ポンチの?Rm法に関するものである□〔従来の技術〕
第8図は例えば特公昭87−2441号公報に示さn=
従来の超音波打抜き加工方法を実施Tる装置σ」断面図
であり、図において、lはポンチ群であり、こnはポン
チ取付具2の下面に取付けらn1上紀ポンチ取付具2を
撮動拡大用ホーン3,4を弁して磁わい伽勤子5に接祝
して振動糸を構成している。[Detailed Description of the Invention] [Industrial Field of Application] This invention relates to a punching method using ultrasonic imaging, particularly for punching. □ [Prior art] Fig. 8, which relates to the Rm method, is shown in Japanese Patent Publication No. 87-2441, for example, when n=
This is a cross-sectional view of an apparatus for carrying out a conventional ultrasonic punching method. The horns 3 and 4 for dynamic amplification are turned on and a magnetic cable 5 is connected to form a vibrating string.
この振動系に超音波Rh振、励磁電流をリード線6によ
って供給下nば、上記ポンチI#lに、ダイス7上に定
置さnた被加工物Aに対向T6@幅数ミクロンの超音波
振動か与えられるもので、同時にこnに打抜き連動を付
与丁nば、被加工物Aにはポンチ群1の数と配置に相当
Tる多数の孔が打抜かれるのである。An ultrasonic Rh vibration and an excitation current are supplied to this vibration system through the lead wire 6, and an ultrasonic wave of several microns in width is applied to the punch I#l and the workpiece A placed on the die 7. If the vibration is applied and the punching operation is simultaneously applied, a large number of holes corresponding to the number and arrangement of the punch group 1 are punched in the workpiece A.
上記のような装置によって実施さnる従来の超音波打抜
加工方法では、潤滑剤が使用さnていなかった0その理
由は、加工面に醐滑油が残留Tると、例えばプリント基
板において孔明は加工後に行なわれるスルホールめつき
工程で銅めっきが剥離しPずく、そのi!気気持特性低
下Tにとご恐n7cためである□ところがプリント基板
の超音波打抜き加工では、加工時に微細な切り粉が発生
し、これがかT上りやポンチ寿命(IJ低下を招くとい
う問題点があった◎
この発明はかかる問題点を]弄決するためになされたも
ので、プリント基板の超音波打抜き加工特有C/J微a
+な切り粉の発生を抑制し、ポンチの発熱を防ぎ、その
寿命の延長をはかるとともに高精度のスルーホールを加
工できる加工方法を得ることを目的とする。In the conventional ultrasonic punching method carried out using the above-mentioned equipment, no lubricant was used. Komei's copper plating peeled off during the through-hole plating process after processing, and that i! This is because the ultrasonic punching of printed circuit boards generates fine chips during processing, which causes problems such as T rise and punch life (decreased IJ). ◎ This invention was made to solve this problem, and it is possible to improve the C/J microa characteristic of ultrasonic punching of printed circuit boards.
The purpose of the present invention is to obtain a processing method that suppresses the generation of hard chips, prevents heat generation of the punch, extends its life, and enables high-precision through-hole processing.
この発明に係る超音波打抜き加工方法は、打抜き加工時
においてエタノールなどUJ揮発性有機浴剤を+11t
fII剤として使用するものである。The ultrasonic punching method according to the present invention uses +11 tons of UJ volatile organic bath agent such as ethanol during punching.
It is used as an fII agent.
この発明においては、揮発性有機溶剤によって微細な切
り粉を除去し、切りくずのか丁上りを抑制する。またポ
ンチ肩部への切り粉の付着が防止されるのでポンチ切れ
刃の鋭さが保たれ、高い加工精度か維持さhる・更に溶
剤の気化熱によってポンチが冷却されその寿命が延長さ
れる。In this invention, fine chips are removed using a volatile organic solvent to suppress the amount of chips rising. In addition, since chips are prevented from adhering to the punch shoulder, the sharpness of the punch cutting edge is maintained, and high machining accuracy is maintained.Furthermore, the punch is cooled by the heat of vaporization of the solvent, extending its life.
第1図はこの発明の一実施例をボT縦断斜視図であり、
複数のポンチ1な取付けたホーン8は埋込みボルト9に
より超音波振動子lOに締結さn、ここに超音波振動系
が構成さnる0なお、この超音波振動系の上記超音波振
動子10は、そのフランジ11を加圧用移動板しに固定
さn、一方被加工物A C1ダイ13上にamされ、押
え板14で押圧固定される。15ハ先端開口をポンチ1
群に対向せしめた溶剤噴射ノズル、16に上記加圧用移
動板νのガイドポストである。FIG. 1 is a longitudinal sectional perspective view of an embodiment of the present invention.
The horn 8 attached to the plurality of punches 1 is fastened to the ultrasonic vibrator 10 by embedded bolts 9, and an ultrasonic vibration system is constructed here. The flange 11 of the workpiece A is fixed to a moving plate for pressurization, and the workpiece A C1 is placed on the die 13 and fixed by pressing with a holding plate 14. 15 Punch the opening at the tip 1
A solvent injection nozzle is placed opposite the group, and 16 is a guide post for the pressurizing moving plate ν.
ところで超音波電源(図示せずンからの電気的振動Gズ
、超音波振動子lOにて機械的撮動に変換され、この超
音波振動はホーン8を伝播してポンチに付加さnる。こ
こで圧力発生源(図示せず)によって加圧用移動板νを
下降動作することにより・被加工物Aに所要σ〕打抜き
加工が施さn6のである。加工が完了すると加圧用移動
板νを上昇動作させポンチlを引き抜き、溶剤噴射ノズ
ル】5から揮発性有機溶剤を噴射してポンチlに付着し
た微細切り粉を除去するとともにポンチ1を冷却する^
なお第1図に示す実施例では揮発性有機剤を噴射する構
造を採っているが、加工装置全体或はダイ田とポンチl
および押え板14を揮発性有機溶剤の中に浸漬Tるよう
にしても同様の効果が期待できるn
第2図は他の実施例を示し、これはダイ化および押え板
14の中心部主要範囲に多孔質部材νを嵌着一体化し、
それぞれに適宜揮発性有機溶剤を供給含浸させるように
したもので、この場合ダイ化と押え板14に溶剤供給孔
迅が設けらn、かつ配管(図示せず)が施される。By the way, electrical vibrations from an ultrasonic power source (not shown) are converted into mechanical vibration by an ultrasonic vibrator 10, and this ultrasonic vibration propagates through the horn 8 and is applied to the punch. Here, by lowering the pressure moving plate ν using a pressure generation source (not shown), the workpiece A is punched to the desired size σ]. When the process is completed, the pressure moving plate ν is raised. Operate and pull out the punch 1, and spray volatile organic solvent from the solvent injection nozzle 5 to remove fine chips attached to the punch 1 and cool the punch 1.
The embodiment shown in Fig. 1 has a structure in which volatile organic agent is injected, but the entire processing equipment or the die and punch are injected.
The same effect can be expected even if the holding plate 14 is immersed in a volatile organic solvent. The porous member ν is fitted and integrated into the
A volatile organic solvent is supplied and impregnated into each of them as appropriate, and in this case, solvent supply holes are provided in die forming and holding plate 14, and piping (not shown) is provided.
この発明は以上説明したとおり・超音波打抜き加工方法
において、エタールなどの揮発性有機溶剤rr−潤滑剤
として使用するものであり、ポンチに付着する微細切り
粉σ〕除去と冷却により寿命が延長され、かつ高い加工
精度が維持されるのでプリゼト基板等に対するスルーホ
ール加工方法として有効適切である0As explained above, this invention uses a volatile organic solvent such as etal as a lubricant in an ultrasonic punching method, and its life is extended by removing fine chips σ that adhere to the punch and cooling it. , and high processing accuracy is maintained, making it effective and suitable as a through-hole processing method for preset boards, etc.
第1図はこの発明の一実施例を示す縦障「斜視図、第2
図は他の実施例を不丁縦町斜視図、第8図は従来の超音
波打抜き装置の縦断正面図である0(2)において、l
&ズボンチ、8はホーン、1Gは超音波′!hR動子、
認は加圧用移動板、口はダイ、14は押え板・15は溶
剤噴射ノズル、17は多孔質部材である□
尚、図中同一符号は同一または相当部分ご示T。
代理人 大 岩 増 准
第1図
第2図Fig. 1 is a perspective view of a longitudinal disorder showing one embodiment of the present invention;
The figure is a vertical perspective view of another embodiment, and FIG. 8 is a vertical sectional front view of a conventional ultrasonic punching device.
&Bonchi, 8 is a horn, 1G is an ultrasonic wave'! hR movement,
14 is a presser plate, 15 is a solvent injection nozzle, and 17 is a porous member □ The same reference numerals in the drawings indicate the same or corresponding parts T. Agent Masu Oiwa Figure 1 Figure 2
Claims (1)
いて、エタノールなどの揮発性有機溶剤を潤滑剤として
使用することを特徴とする超音波打抜き加工方法。An ultrasonic punching method characterized in that a volatile organic solvent such as ethanol is used as a lubricant in a punching method that applies ultrasonic vertical vibration to a punch.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11741887A JPS63283895A (en) | 1987-05-13 | 1987-05-13 | Ultrasonic punching processing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11741887A JPS63283895A (en) | 1987-05-13 | 1987-05-13 | Ultrasonic punching processing method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63283895A true JPS63283895A (en) | 1988-11-21 |
Family
ID=14711154
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11741887A Pending JPS63283895A (en) | 1987-05-13 | 1987-05-13 | Ultrasonic punching processing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63283895A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005125485A (en) * | 2003-10-01 | 2005-05-19 | Tdk Corp | Cutter, punching machine, information recording medium manufacturing device and central hole forming method |
JP2013534187A (en) * | 2010-08-09 | 2013-09-02 | パンテック アーゲー | Equipment for processing or generating break lines with flat products |
-
1987
- 1987-05-13 JP JP11741887A patent/JPS63283895A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005125485A (en) * | 2003-10-01 | 2005-05-19 | Tdk Corp | Cutter, punching machine, information recording medium manufacturing device and central hole forming method |
JP2013534187A (en) * | 2010-08-09 | 2013-09-02 | パンテック アーゲー | Equipment for processing or generating break lines with flat products |
KR101486678B1 (en) * | 2010-08-09 | 2015-01-26 | 팬택 아게 | Method for processing or creating break lines in flat products |
US9592619B2 (en) | 2010-08-09 | 2017-03-14 | Pantec Ag | Device for processing or generating break lines in flat products |
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