JPS63283187A - Mounting method in portable medium - Google Patents

Abstract

PURPOSE:To increase the strength of a connector, to improve reliability, and to improve mass productivity by applying a surface mounting method by connecting by soldering the tonguelike electrode of an element engaged within an element containing hole planely oppositely to the substrate electrode of a substrate. CONSTITUTION:Cream solder is printed on substrate electrodes 5a, 5b, and a crystal vibrator 6 is engaged within an element containing hole 4 to connect tonguelike electrodes 9a, 9b to corresponding electrodes 5a, 5b. Then, the solder reflows by heating, and a connector is soldered at 10. Thus, after an IC chip 2 is mounted by soldering, an IC card is composed.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a mounting method for mounting a required element such as a crystal camera on a portable medium such as an IC card.

(Prior Art) To explain a portable medium using an IC card as an example, I
A C card has an IC chip that constitutes a CPU and memory embedded in a plastic card base material of the size of a button, and the surface of the card base material is used for transmitting and receiving required data with an external shield such as a reader/writer. A plurality of external terminals for electrical input and the like are also provided. According to the 15O (International Organization for Standardization) standard, the thickness of the card base material is 0.76m.
stipulated in m. Since it is necessary to embed an IC chip or the like in such a thin card base material, thin mounting is adopted for IC cards, and a thin film carrier or the like is used as a mounting substrate.

By the way, IC cards are of a standard format with an IC chip as described above, but in recent years, in order to have multiple functions, IC cards have been equipped with a crystal camera, an LCD, batteries, resistors, capacitors, etc. A device in which the element is embedded in a card base material is being considered.

FIGS. 5 and 6 show a conventional mounting method in which such required elements are mounted on the connecting portions on the substrate by soldering.

In these figures, 11 is a thin substrate, 12 is an IC chip constituting the CPU and memory, and 13 is a plurality of external terminals.A rectangular shape corresponding to the element shape is provided at the required part of the substrate 11. An element housing hole 14 is bored, and substrate electrodes 15a115b are provided on both sides thereof. 16 is a required element such as a resistor, and end electrodes 17a117b are formed at both ends thereof.

After the element 16 is fitted into the element housing hole 14 and positioned appropriately using a jig or the like, a thin nozzle is inserted between the substrate electrode and the opposing end electrodes 15a, 178, 15b, and 17b. Cream solder is injected and then heated to reflow the cream solder.
Required elements 16 are mounted on the substrate 11 by soldering 18 connections.

(Problems to be Solved by the Invention) Conventionally, soldering connections have been made using cream solder paste flow due to the end face of a board electrode formed in a thin board and the end electrode opposing this. Therefore, the strength of the connection part is weak, and there is a risk that the connection part will come off during handling between the subsequent processes such as the embedding process into the card base material. Also, cream solder must be injected with a thin nozzle. There was a problem that the work efficiency was poor because of this.

This invention was made based on the above circumstances, and is a mounting method in a portable medium that increases the strength of the connection part and improves reliability, and also allows surface mounting method to be applied and improves mass production. The purpose is to provide.

[Structure of the Invention] (Means for Solving the Problems) In order to solve the above problems, the present invention provides a mounting method in a portable medium in which required elements are soldered and connected to substrate electrodes on a substrate. In the substrate, an element housing hole is formed adjacent to the substrate electrode, a tongue-shaped electrode is protruded from the element, the element is fitted into the element housing hole, and the tongue-shaped electrode is inserted into the substrate. The gist is to solder it in contact with the electrode.

(Function) Since the tongue-like electrode of the element is soldered and connected face-to-face with the board electrode on the board side, the tongue-like electrode is brought into contact with the board electrode printed with cream solder in advance and connected by heating. Can be done. Therefore, surface mounting automation technology can be applied, thereby improving productivity, and since the tongue-shaped electrode and the board electrode are in face-to-face contact with each other in the soldering part, the connection strength is increased.

(Example) Hereinafter, an example of the present invention will be described based on FIGS. 1 to 4. This embodiment is applied to a mounting method on an IC card.

First, members applied to this embodiment will be explained.

In FIGS. 1 and 2, 1 is a thin substrate, 2 is an IC chip constituting a CPU, memory, etc., and 3 is a plurality of external terminals. Corresponding element housing holes 4 are drilled, and substrate molds f are formed on both sides of the hole 4.
f15a and f15b are formed. 6 is a crystal oscillator as a required element, and this crystal oscillator 6 is shown in FIG.
As shown in FIGS. 5 and 6, a tuning fork-shaped crystal piece 7 is housed in a package 8, and tongue-shaped electrodes 9a are provided on both sides in the longitudinal direction.
9b is overhanging.

Next, the mounting method and operation of the crystal sensor 6, which is a necessary element, on the substrate 1 will be explained.

Cream solder is printed on the substrate electrodes 5a and 5b, and the crystal resonator 6 is fitted into the element storage hole 4 using an automatic mounting machine (not shown), so that the tongue-like electrodes A9a and 9b correspond to the substrate electrodes 5a, 5b, respectively. Next, the cream solder is heated by a reflow soldering device to reflow, and solder 10 is applied to the opposing portions.

In this way, after the required elements are mounted on the board 1 by soldering and the IC chip 2 etc. are mounted, the board 1 is laminated between plastic card base materials (not shown) and an IC card is formed. configured. During handling between these processes, the soldered joints are firmly connected by face-to-face contact between the tongue-shaped N poles 9a and 9b and the board electrodes 5a and 5b, so the soldered joints are Damage is prevented, and even after the product is manufactured, similar damage prevention is achieved and reliability is improved.

[Effects of the Invention] As explained above, according to the present invention, the tongue-like electrode of the element fitted into the element housing hole is connected by soldering to the board electrode on the board side, so that the board Automated surface mount technology, in which cream solder is printed on the electrodes in advance and a tongue-shaped electrode is connected to the solder by heating, can be applied, which improves mass production, and also increases connection strength and reliability. It has the advantage of improving performance.

[Brief explanation of the drawing]

1 to 4 are for explaining an embodiment of the mounting method in a portable medium according to the present invention. FIG. 1 is a plan view showing a state in which an element is mounted on a substrate, and FIG. 1. FIG. 3 is a partially cutaway side view showing an enlarged example of the element. FIG.
5 is a plan view showing the device mounted on the board by the conventional mounting method, and FIG. 6 is the Vl-
It is a sectional view taken along the Vl line. 1: Substrate, 4: Element storage hole, 5a, 5b two-substrate electrode, 6: Crystal resonator (required element), 9a, 9b: Tongue-shaped electrode, 10: Solder.

Claims (1)

[Claims] A method of mounting a required element on a portable medium by soldering and connecting it to a substrate electrode on a substrate, comprising: forming an element storage hole in the substrate adjacent to the substrate electrode;
A mounting method in a portable medium, characterized in that a tongue-shaped electrode is protruded from the element, the element is fitted into the element housing hole, and the tongue-shaped electrode is brought into contact with the substrate electrode and soldered. .