JPH09199200A - Inter-plate connecting connector and electronic circuit module mounting circuit device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To attain the reduction of a space required for inter-plate connection, realization of high density of an inter-plate connecting terminal and improving of reliability relating to connection. SOLUTION: In this device, a second circuit board (electronic circuit module) 3 is mounted in a first circuit board (mother board) 1. Here, the device has an insulator 13 and a plurality of connection terminals 12 securing an intermediate part to the insulator 13, a receiving contact surface 13, with which a lower surface of the second circuit board 3 comes into contact, and a stand off 13d coming into contact with an upper surface of the first circuit board 1 are provided in the insulator 13, a connector has a first connection part 12b into contact with an upper surface of the second circuit board 3 with a lower surface into contact with the receiving contact surface 13 and a second connection part 12c into contact with an upper surface of the first circuit board 1, in the connection terminal 13, this connector 11 is used, the electronic circuit module is mounted in the mother board.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is for mounting a collective circuit (electronic circuit module) in which desired circuit elements are formed and mounted on a board on a circuit board on which desired circuit elements are formed and mounted, for example, a mother board. And an electronic circuit module-equipped circuit device in which an electronic circuit module is mounted on a desired circuit board using the connector, for example, a motherboard.

Since an electronic circuit module such as a multi-chip module (MCM) itself functions similarly to an LSI package, it is necessary to increase the packaging density of circuit elements formed and mounted on a substrate and miniaturize it. . Further, since the electronic circuit module also needs to be mounted on a circuit board of a larger size (for example, a mother board), an inter-board connector for interposing mounting is required.

[0003]

2. Description of the Related Art In a circuit device in which an electronic circuit module is mounted on a mother board, a conventional technique for mounting the electronic circuit module on a device board is a method using a clip pin and a method using a pair of insertable / removable connectors. Is widely known.

FIG. 6 is an explanatory view of a prior art in which an electronic circuit module is mounted on a circuit board. (A) to (c) are explanatory views of a system using a clip pin, and (d) to (f) are connectors. 2 is an explanatory view of a method of using a circuit board, 1 is a circuit board (motherboard) on which an electronic circuit module is mounted, 2, 2
Reference numeral 1 is an electronic circuit module mounted on the circuit board 1, 3 is a board of the electronic circuit module, and 4 is a circuit element mounted on the board 3.

In FIG. 6 (a), circuit elements such as external connection terminals (not shown) are formed on the board 3, and clip pins 5 are provided at the ends of the board 3 on which a plurality of circuit elements 4 are mounted.
The C-shaped clip portion 5a is attached.

A clip portion 5a is formed at one end, and the other ends of a plurality of clip pins 5 aligned in the thickness direction of the drawing paper are connected to a tie bar 6. Therefore, after cutting the tie bar 6 from the clip pin 5, as shown in FIG.
After electrically connecting the external connection terminal and the clip portion 5a with the solder 7, the clip pin 5 is bent to complete the electronic circuit module 2 as shown in FIG. The circuit device mounted on the circuit board completes the electronic circuit module mounted circuit device.

The electronic circuit module 2 is mounted by soldering the tip portion of the clip pin 5 to a desired circuit board, for example, an in-board connecting terminal of a mother board. Such a connection method using the clip pin 5 is also used for mounting a liquid crystal display panel, for example.

In FIG. 6 (d), circuit elements such as external connection terminals (not shown) are formed, and in the vicinity of the end of the electronic circuit module substrate 3 on which a plurality of circuit elements 4 are mounted,
The circuit module 21 is completed by mounting one of the pair of connectors, for example, the plug connector 8 in which a plurality of plug terminals (not shown) are implanted.

One end of the plurality of plug terminals of the connector 8 is connected to an external connection terminal (not shown) formed on the electronic circuit module substrate 3. In FIG. 6 (e),
On the circuit board 1 on which desired circuit elements (not shown) are formed and mounted, the other one of the pair of connectors, for example, a jack connector 9 having a plurality of jack terminals to which the plug terminals are connected is mounted. The lead-out end of the jack terminal (not shown) is formed on the circuit board 1 and is soldered to an in-board connecting terminal (not shown).

Therefore, as shown in FIG. 6 (f), the connector 9
By inserting the connector 8 into the electronic circuit module 2
1 is mounted, and the electronic circuit module mounted circuit device 30 is completed.

[0011]

As described above,
The inter-board connection using the clip pin 5 is performed by connecting the clip portion 5a to the board 3 and then removing the tie bar 6 and the solder 7
It is necessary to fuse and shape the clip pin 5.

That is, the clip pin 5 has a manufacturing inconvenience that the shape is completed after the clip pin 5 is inserted into the substrate 3, and it is difficult to reduce the size of the clip pin 5 in order to secure the spring property of the clip portion 5a. The solder 7 for ensuring the reliability of the electrical connection in the clip portion 5a is indispensable, and prevents the solder 7 from narrowing the pitch of the clip pins 5. Therefore, there is a problem that it is difficult to call it a rational connection method.

Particularly, the above-mentioned problem with respect to the miniaturization of the pitch of the clip pins 5 is that the size of the circuit board 1 is large, for example, when the board 1 is a liquid crystal display panel, it is difficult to handle the liquid crystal display panel where the clip pins 5 project in four directions. It became extremely troublesome, and a new method was strongly desired in terms of productivity and cost.

On the other hand, for board-to-board connection using the connectors 8 and 9, it is only necessary to insert the connector 8 into the connector 9.
A process corresponding to bending when using the clip pin 5 is not required.

However, the space for mounting the connectors 8 and 9, especially the space width w (see FIG. 6 (d)) required to mount the connector 8 on the substrate 3 of the electronic circuit module 21, is determined by the use of the clip pin 5. Much wider than time,
This hinders the densification of the circuit module 21 and the electronic circuit module mounted circuit device 30, and the thickness of the device 30 is increased because the connectors 8 and 9 are generally higher than the mounted circuit element 4.

[0016]

A board on which an electronic circuit module can be mounted in a space equal to or less than that when a conventional clip pin is used, and which can correspond to miniaturization of connection terminals and high density with high reliability. The present invention for realizing an inter-connector and a circuit device equipped with an electronic circuit module,
When mounting the second circuit board on the first circuit board, a board-to-board connector for connecting a circuit formed on the second circuit board to the first circuit board and the connector are used. A circuit device equipped with an electronic circuit module,
An insulator and a plurality of connection terminals having an intermediate portion fixed to the insulator; a receiving surface for contacting the lower surface of the second circuit board with the insulator; and a first contact surface of the first circuit board. A standoff that abuts on an upper surface of the second circuit board; a first connecting portion that contacts the upper surface of the second circuit board, the lower surface of which is in contact with the receiving surface; and the first circuit board. And a board for an electronic circuit module on which a desired circuit element is formed and mounted, and an intermediate portion of a plurality of connection terminals. Is a circuit device mounted with an electronic circuit module mounted on a desired circuit board via a connector for plate connection fixed to an insulator,
External connection terminals are formed on the upper surface of the module substrate,
Intra-board connecting terminals are formed on the upper surface of the circuit board, and the insulator of the inter-board connector has a receiving surface to which the lower surface of the module board contacts and a standoff that contacts the upper surface of the circuit board. A plurality of connection terminals of the board-to-board connection connector, a first connection portion connected to an external connection terminal on an upper surface of the module substrate whose lower surface is in contact with the receiving surface;
The circuit board has a second connecting portion which is connected to the terminal for connecting the substrate when the standoff is brought into contact with a predetermined portion of the upper surface of the circuit substrate, and the first connecting portion and the lower surface of the receiving surface. The external connection terminal of the module substrate which is in contact with is electrically connected by spring elasticity or solder of the first connection portion itself,
The second connection portion when the standoff of the insulator is brought into contact with a predetermined portion of the upper surface of the circuit board and the in-board connection terminal are electrically connected by solder.
It is characterized by the following.

Further, in the state where the lower surface of the second circuit board is in contact with the receiving surface of the insulator, a protrusion is formed on the insulator for determining the positional relationship between the insulator and the second circuit board. The board-to-board connection in which the intermediate portion of the plurality of connection terminals is fixed to the insulator by the board-to-board connector characterized by the above, and the board of the electronic circuit module on which the desired circuit element is formed and mounted An electronic circuit module mounted circuit device mounted on a desired circuit board via a connector for connection, wherein external connection terminals are formed on the upper surface of the module board, and in-board connection terminals are formed on the upper surface of the circuit board. And an insulator of the inter-board connector, a receiving surface in contact with the lower surface of the module substrate, and the insulator and the second circuit with the lower surface of the module substrate in contact with the receiving surface. The protrusion that determines the positional relationship with the substrate and the circuit A standoff that abuts on the upper surface of the plate is provided, and a plurality of connecting terminals of the inter-board connecting connector have a lower surface that contacts the receiving surface and a predetermined portion that abuts on the protrusion. It has a first connecting portion for connecting to an external connecting terminal on the upper surface and a second connecting portion for connecting to the in-board connecting terminal when the standoff is brought into contact with a predetermined portion on the upper surface of the circuit board. The first connection portion and the external connection terminal of the module substrate whose lower surface is in contact with the receiving surface are electrically connected by spring elasticity or solder of the first connection portion itself, The second connection portion when the standoff of the insulator is brought into contact with a predetermined portion on the upper surface of the circuit board and the in-board connection terminal are electrically connected by solder. It is a feature.

The board-to-board connector and the electronic circuit module-equipped circuit device allow the electronic circuit module to be mounted in a space equal to or less than that when the conventional clip pins are used, and the connecting terminal of the connector has an intermediate portion. Since it is fixed to the insulator and there is no processing after connection to the electronic circuit module, higher density is possible and reliability of connection is higher than that of the conventional clip pin.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is an explanatory view of a board-to-board connector according to an embodiment of the present invention and board-to-board connection using the connector, and FIG. 2 is a circuit equipped with an electronic circuit module using the connector of FIG. The figure which shows the principal part of an apparatus, FIG. 3 is FIG. 1 and FIG.
FIG. 3 is an explanatory diagram of a corner portion and an external connection terminal of the electronic circuit module substrate shown in FIG.

In FIG. 2, an electronic circuit module mounted circuit device 31 has a second circuit board (electronic circuit module) 22 on a first circuit board (motherboard) 1 on which desired circuit elements (not shown) are formed and mounted. It will be equipped with.

A desired circuit element (not shown) is formed on the substrate 3, and the electronic circuit module 22 on which the circuit element 4 is mounted is electrically connected to the mother board 1 through a pair of inter-plate connecting connectors 11. . However, in the figure, 71 is a solder for ensuring the durability of the electrical connection between the connection terminal 12 of the connector 11 and the electronic circuit module 22, and 7
Reference numeral 2 is a solder that electrically connects the connection terminal 12 and the motherboard 1.

In FIG. 1, (a) is a front view of a board-to-board connector, (b) is a side view of the connector, and (c) is a view of mounting an electronic circuit module on a motherboard using the connector. It is an explanatory view of a part, a connector 11
Is formed by fixing (inserting) a predetermined portion of the intermediate portion 12a of the plurality of aligned connecting terminals 12 to the insulator 13.

The insulator 13 formed by inserting the intermediate portion 12a and molding the insert portion 13a protruding rearward in a shelf shape for inserting a predetermined portion of the intermediate portion 12a.
Then, the receiving surface 13b that receives the peripheral edge of the back surface of the electronic circuit module substrate 3 comes into contact with a predetermined portion of the substrate 3, for example, two sides 3a and 3b formed by cutting the corners of the substrate 3 as shown in FIG. It has a protrusion 13c and a standoff 13d that abuts on the upper surface of the motherboard 1 on which the electronic circuit module 22 shown in FIG. 2 is mounted.

The protrusion 13c is not always necessary as the insulator 13 according to the present invention. However, the protrusion 13c
By providing the above, the relative positional relationship between the insulator 13 and the substrate 3 can be easily determined, which is extremely effective from a practical point of view.

The connecting terminal 12 in which a predetermined portion of the intermediate portion 12a is inserted into the insulator insert portion 13a is the intermediate portion 1
The first connecting portion 12b is bent from the upper end of 2a toward the front of the insulator 13 (on the insertion side of the substrate 3) by approximately 90 degrees, and the lower end of the intermediate portion 12a is bent toward the rear of the insulator 13. It has the 2nd connection part 12c.

In this embodiment, the width and spacing are 0.2.
The plurality of connection terminals 12 having a size of 0.1 mm are formed by pressing a phosphor bronze plate having a thickness of 0.1 mm and connecting it to a tie bar, aligning them in a straight line, and molding them with a suitable surface treatment such as gold plating or solder plating. Then, the insulator 23 having the intermediate portion 12a inserted therein is molded, the tie bar is cut off, and the connecting portions 12b and 12c are bent.

The connecting portion 12b has an inverted V shape in which the contact portion 12f slightly inward of the tip is in the lowest position, and the minimum portion distance d to the insulator receiving surface 13b is the thickness of the substrate 3 of the electronic circuit module. It is the same as or slightly smaller than.

As shown in FIG. 3, electronic circuit module substrate 3
A plurality of external connection terminals 33 for connecting the connecting portions 12b are formed on the upper surface of the terminal 3, and the terminals 33 and the connecting portions 12b secure electrical connection by spring elasticity of the connecting portions 12b.

The spring elasticity of the connecting portion 12b depends on its length,
Although it depends on factors such as width, thickness, shape, and material, miniaturization of the connector 11 largely depends on the shape design of the connection terminal 12. Therefore, the connection terminal 12 in the connector 11
Has a shape in which the connecting portion 12b is bent at about 90 degrees with respect to the intermediate portion 12a inserted into the insulator 13.

The electronic circuit module substrate 3 is inserted into such a connector 11, that is, the receiving surface 13b and the connecting portion 1 are inserted.
When a predetermined portion of the substrate 3 is inserted between the connection portion 1 and the connection portion 2b,
When 2b contacts the upper surface of the substrate 3, the connection terminal 12
Rotational movement (deflection) such that the leading end of the connecting portion 12b is lifted by using the lead-out portion 12d from the insulator insert portion 13a as the first fulcrum, and the 90-degree bent portion 12e at the root of the connecting portion 12b as the second fulcrum. And the connection terminal 33 of the substrate 3
The connection terminal contact portion 12f comes into contact with the contact terminal to secure an appropriate contact pressure.

When it is not necessary to separate the electronic circuit module substrate 3 from the connector 11, and the connecting portion 1
In the case where the spring elasticity of 2b alone makes the connection uncomfortable, the connection terminal 33 and the connection portion 12b are fixed by the solder 71, as shown in FIGS.

The connection of the connection portion 12b with the solder 71 is performed by printing the solder paste on the connection terminals 33 in advance and placing the solder paste in a reflow oven to fuse the solder paste, or irradiating the solder paste with laser light to fuse the solder paste. It will be.

The connection portion 1 is provided on a predetermined portion of the upper surface of the device substrate 1.
The in-board connecting terminal 14 to which 2c is to be connected is formed, and the connecting portion 12c and the terminal 14 are electrically connected by the solder 72.

Connection part 12c and terminal 14 by solder 72
The connection is performed by printing the solder paste on the terminals 14 in advance and putting it in a reflow oven to fuse the solder paste, or by irradiating a laser beam locally to fuse the solder paste. However, in order to perform the solder connection by the reflow furnace, it is necessary to use the solder 72 having a melting point lower than that of the solder 71.

FIG. 4 is a front view (a) and a side view (b) of a connector for plate connection in another embodiment of the present invention, and FIG. 5 is a connector for plate connection in still another embodiment of the present invention. It is a perspective view showing an important section.

In FIG. 4, an inter-plate connector 41 is provided.
Is an intermediate portion 42a of the plurality of connecting terminals 42 aligned,
It is fixed to the insert portion 13a of the insulator 13. The connection terminal 42 in which the intermediate portion 42a is inserted into the insert portion 13a of the insulator 13 corresponds to the above-mentioned connection terminal 12, and the same connection portion (first connection portion) as the connection portion 12b from the upper end portion of the intermediate portion 42a is formed. Part) 42b and a connecting part (second connecting part) 4 extending from the lower end of the intermediate part 42a.
The connection terminal 42 and the connection terminal 12 are different from each other in that 2c is bent below the insulator 13.

The connector 41 is used similarly to the connector 11 so that the electronic circuit module 22 can be mounted on a predetermined portion of the substrate 1. Then, when mounting the connection portion 42c
Is located on the lower side of the insulator 13, the electronic circuit module mounted circuit device using the connector 41 is
The circuit element formation or mounting area of the device substrate 1 becomes wider than that of the device using 1.

In FIG. 5, a plurality of connection terminals (not shown), such as the intermediate portion 12a of the above-mentioned connection terminal 12 or the intermediate portion 42a of the connection terminal 42, is fixed to the insert portion 52a to insulate the interplate connector 51. The body 52 has protrusions 52c protruding from both ends in the length direction (only one end is shown in the drawing) instead of the protrusions 13c of the insulator 13.

The projection 52c is L-shaped when the rectangular cross-section members 52c 'and 52c "are orthogonal to each other when viewed from above.
2c ′ or 52c ″ is, for example, the substrate 3 (see FIG. 3) in which the lower surface is in contact with the receiving surface 52b by abutting the inner corner 3c or the outer corner 3d in the corner portion of the substrate 3 shown in FIG. Is positioned, and in that state, the connection portion 12b or 42b of the connection terminal 12 or 42 comes into contact with the terminal 33 of the substrate 3.

[0040]

As described above, in the connector for plate-to-plate connection according to the present invention and the electronic circuit module mounted circuit device using the connector, the space required for the electronic circuit module substrate is about the same as when the conventional clip pin is used. Therefore, it is narrower than when using the conventional connector, and the reliability of the inter-plate connection is the same as when using the conventional connector.

Further, when compared with the conventional clip pin, there is no processing after mounting on the electronic circuit module substrate (processing corresponding to bending in the conventional clip pin), and the intermediate portion is fixed to the insulator. This has made it possible to increase the density of connection terminals and improve the reliability of plate-to-plate connections.

[Brief description of drawings]

FIG. 1 is an explanatory diagram of an inter-plate connection connector according to an embodiment of the present invention and an inter-plate connection using the connector.

FIG. 2 is a diagram showing a main part of a circuit device equipped with an electronic circuit module using the connector of FIG.

FIG. 3 is an explanatory view of a corner portion and an external connection terminal of the electronic circuit module substrate shown in FIGS. 1 and 2.

FIG. 4 is an explanatory view of a board-to-board connector in another embodiment of the present invention.

FIG. 5 is a perspective view showing an essential part of a connector for board connection according to still another embodiment of the present invention.

FIG. 6 is an explanatory view of a conventional technique for mounting an electronic circuit module on a desired substrate.

[Explanation of symbols]

1 Electronic circuit module mounting board (motherboard, 1st
Circuit board) 3 board of electronic circuit module (second circuit board) 4 mounted circuit element 11, 41 inter-board connector 12, 42 connection terminal 12a, 42a connection terminal intermediate part 12b, 42b connection terminal connection part (second 1 connection part) 12c, 42c Connection terminal connection part (second connection part) 13,52 Insulator 13a, 52a Insulator connection terminal insert part 13b, 52b Insulator contact surface 13c, 52c Insulator protrusion Parts 13d, 52d Insulator standoffs 14 In-board connection terminals 71, 72 Connection solder

Claims (5)

[Claims] 1. A board-to-board connector for connecting a circuit formed on a second circuit board to the first circuit board when mounting the second circuit board on the first circuit board. And a plurality of connection terminals having an intermediate portion fixed to the insulator, the receiving surface contacting the lower surface of the second circuit board, and the first A standoff for contacting an upper surface of the circuit board; a first connecting portion for contacting an upper surface of the second circuit board, the lower surface of which is in contact with the receiving surface; And a second connecting portion that is in contact with the upper surface of the circuit board. 2. A protrusion is formed on the insulator to determine a positional relationship between the insulator and the second circuit board in a state where the receiving surface of the insulator is in contact with the lower surface of the second circuit board. The board-to-board connector according to claim 1, wherein 3. The inter-plate connector according to claim 1, wherein the first connecting portion and the second connecting portion extend in opposite directions. 4. A board of an electronic circuit module on which a desired circuit element is formed and mounted is mounted on a desired circuit board through a plate-to-plate connector in which an intermediate portion of a plurality of connection terminals is fixed to an insulator. An electronic circuit module mounted circuit device, wherein an external connection terminal is formed on an upper surface of the module board, an in-board connection terminal is formed on an upper surface of the circuit board, and an insulator of the inter-board connection connector is formed. Is provided with a receiving surface that contacts the lower surface of the module board and a standoff that contacts the upper surface of the circuit board. The lower surface of the connecting terminals of the inter-board connector is the receiving surface. A first connecting portion that is connected to an external connection terminal on the upper surface of the module substrate that is in contact with 2 connecting parts, The first connecting portion and the external connection terminal of the module substrate whose lower surface is in contact with the receiving surface are electrically connected by spring elasticity or solder of the first connecting portion itself, and the stand of the insulator. An electronic device characterized in that the second connection part and the in-board connection terminal are electrically connected by solder when the off is brought into contact with a predetermined part on the upper surface of the circuit board. Circuit module mounted circuit device. 5. A board of an electronic circuit module, on which desired circuit elements are formed and mounted, is mounted on a desired circuit board through a plate-to-plate connector in which intermediate portions of a plurality of connection terminals are fixed to an insulator. An electronic circuit module mounted circuit device, wherein an external connection terminal is formed on an upper surface of the module board, an in-board connection terminal is formed on an upper surface of the circuit board, and an insulator of the inter-board connection connector is formed. A receiving surface which is in contact with the lower surface of the module board, and a protrusion which determines the positional relationship between the insulator and the second circuit board when the lower surface of the module board is in contact with the receiving surface. A standoff for contacting the upper surface of the circuit board is provided, and the plurality of connecting terminals of the inter-board connector has a lower surface in contact with the receiving surface and a predetermined portion in contact with the protrusion. External connection terminal on the top The first to connect 1
And a second connecting portion for connecting to the in-board connecting terminal when the standoff is brought into contact with a predetermined portion of the upper surface of the circuit board.
The first connection portion and the external connection terminal of the module substrate whose lower surface is in contact with the receiving surface are electrically connected by spring elasticity or solder of the first connection portion itself. And the second connection portion when the standoff of the insulator is brought into contact with a predetermined portion of the upper surface of the circuit board and the in-board connection terminal are electrically connected by solder. An electronic circuit module mounted circuit device characterized by the following.