JPS63283038A - Semiconductor integrated circuit - Google Patents

Abstract

PURPOSE:To make it possible to automatically make interconnection, by providing power supply wirings and grounding wirings around a block cell constructed by arranging and connecting a plurality of polycells, such that the distance between a pair of the power supply and grounding connection is equal to the distance defined between a power supply connection and a grounding connection of the polycells. CONSTITUTION:Several kinds of standarlized polycells 1 having a uniform thickness and respective predetermined circuit functions are aligned to form a polycell line 2 in combination. A power supply connection 3 is connected to one edge of each polycell 1 while a grounding conection 4 is connected to the other edge thereof. Such polycells 1 are arranged in a plurality of lines and in multiple layers to form a block cell 5, around which power supply wirings 6 and groundig wirings 7 are provided so as to form a rectangular closed circuit. Branches 6a and 7a are extended from these wirings toward the sides of the block cell. The distance between the branches 6a and 7a is equal to the distance defined between the power supply wiring 3 and the grounding wiring 4 of the polycell 1. In this manner, the power supply wiring and the grounding wiring of each polycell can be connected automatically to the corresponding power supply wiring and grounding wiring of the block cell 5, respectively.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor integrated circuit obtained by combining a plurality of standardized circuit cells.

[Conventional technology]

FIG. 4 is an explanatory diagram showing power supply and ground wiring in a conventional example of this type of semiconductor integrated circuit. In the figure, reference numeral 1 denotes standardized polycells having a constant thickness and each having a predetermined circuit function, and a desired integrated circuit is designed by combining a plurality of types of polycells. 2 is a polycell row formed by connecting a plurality of polycells 1 (three in this case) in a row.

Since each polycell 1 has a power supply wiring 3 and a ground wiring 4 extending from one end to the other at a constant interval, it is possible to design the polycell row 2 as shown in the layout of FIG. In an actual integrated circuit, power supply wirings 3 and ground wirings 4 of adjacent polycells 1 are connected to each other. Reference numeral 5 denotes a block cell configured by arranging a plurality of polycells 1 in multiple rows and in multiple layers, and a power supply wiring 6 is provided along the - side from one end to the other end, and a power supply wiring 6 is provided along the other side. Ground wiring 7 is provided extending from one end to the other end. Then, one end of the polycell row 2 is connected to a block cell 5.
A semiconductor integrated circuit is constructed by assembling these against one end of the two.

Since the conventional semiconductor integrated circuit is configured as described above, if the polycell row 2 and the block cell 5 are designed in such a manner that their power supply wirings 3 and 6 are in contact with each other as shown in FIG. The connection between them can be made automatically during the manufacturing process, but since the ground wires 4 and 7 do not come into contact with each other, the connection between them will ultimately have to be done manually. Furthermore, due to the arrangement of the polycell rows 2 and block cells 5, if the direction of the butt of the block cells 5 against the polycell rows 2 changes by 90 degrees from the state shown in FIG. Since the power supply wiring 3 and the ground wiring 4 do not come into contact with the power supply wiring 6 and the ground wiring 7 of the block cell 5, at this time, the wiring between the power supply wiring 3.6 and the ground wiring 4.7 must be done manually. It will be.

(Problems to be Solved by the Invention) As mentioned above, in conventional semiconductor integrated circuits, one of the power supply wirings and the ground wiring between a block cell and a matching polycell do not come into contact with each other, or the polycell Depending on the direction in which the block cells are matched against each other, neither the power supply wires nor the ground wires may come into contact with each other, and the connection between them cannot be made automatically, so it is necessary to rely on manual wiring processing. There was a point.

This invention was made to solve these problems, and allows connections between the power supply wires and the ground wires of the combined circuit cells to be made without relying on human labor, regardless of the orientation or arrangement of the circuit cells. The purpose of this invention is to obtain a semiconductor integrated circuit that can perform automatic processing.

[Means for solving problems]

In the semiconductor integrated circuit according to the present invention, a second circuit cell is formed by connecting a plurality of first circuit cells arranged to have a constant thickness and each having a predetermined circuit function. A semiconductor integrated circuit in which the edges of the circuit cells of the first circuit cell are butted against each other, and the power wiring and ground wiring of the first circuit cell are connected to the power wiring and the ground wiring of the second circuit cell. The power supply wiring and the ground wiring are respectively extended toward each side of the second circuit cell in accordance with the interval between the power supply wiring and the ground wiring of the circuit cell.

[Effect]

In this invention, no matter which side of the second circuit cell the first circuit cell is butted against, the power wiring and ground wiring of the first circuit cell are connected to the power wiring and ground wiring of the second circuit cell. Since they abut the wires together, the connection between them can be made automatically during the manufacturing process.

〔Example〕

FIG. 1 is an explanatory diagram showing power supply and ground wiring in one embodiment of the present invention, including a polycell 1 which is a first circuit cell, a polycell row 2 constituted by a plurality of arrays of the polycell 1, and a polycell 1 The power supply wiring 3 and ground wiring 4 formed on the surface of the semiconductor integrated circuit are the same as those of the conventional semiconductor integrated circuit described above. Further, the block cell 5, which is the second circuit cell, is also configured by arranging polycells 1 in a plurality of columns and in a multilayer structure, similarly to a conventional semiconductor integrated circuit. In the figure, reference numeral 7 denotes a ground wiring, which is formed to form a rectangular closed path along the periphery of the block cell 5, and is connected to each corner of the ground wiring 7 toward each corresponding side. A branch line 7a is extended.

Further, on the outside of the ground wiring 7, a power supply wiring 6 is formed to form a rectangular closed circuit along the periphery of the block cell 5, and at the corners of the power supply wiring 6, branches toward each corresponding side. A line 6a is formed, and each branch line 6a and each branch line 7 of the ground wiring 7 paired with these branch lines 6a.
A is set to match the spacing between the power supply wiring 3 and the ground wiring 4 of the polycell 1.

In the part where the power supply wiring 6 overlaps the branch 1i17a of the ground wiring 7, the power supply wiring 6 is crossed over the branch line 7a by an overpass, as shown in FIG. 2, which is a perspective view of the point A(7) in FIG. This is to avoid a short circuit between the power supply wiring 16 and the ground wiring 7. In this embodiment, in order to perform the above-mentioned three-dimensional crossing wiring, when forming the power supply wiring 6 and the ground wiring 7 at the same time, the power supply wiring 6 overlaps with the branch line 7a of the ground wiring 7.
is formed by omitting a part of the branch line 7a, and then at least the branch line 7a is formed.
A conductive part 6 on which an oxide film is formed and laminated thereon.
By connecting the separately formed power supply wirings 6 at b, insulation separation between the branch line 7a and the power supply wiring 6 is achieved.

Since this semiconductor integrated circuit is configured as described above, no matter which side of the block cell 5 the polycell group 2 or the polycell 1 is designed to butt against, the power wiring 3 and the ground wiring on the polycell 1 side are always connected. 4 block cell 5
It can be connected by coming into contact with the side power supply wiring 6 and ground wiring 7.

In other words, in any case where the block cell 5 is rotated by 90 degrees, the power supply and ground wirings of the block cell 5 and the polycell 1 can be interconnected by simply butting the block cell 5 and the polycell 1 together. Also, in the state shown in FIG. 3, in which the block cell 5 is mirror-inverted from the state shown in FIG.
In either case, the block cell 5 and the polycell 1 can be interconnected by simply butting the power supply and ground wiring between them.

In the above embodiment, the power supply wiring 6 and the ground wiring 7 of the block cell 5 are formed in a closed circuit shape that goes around the periphery of the block cell 5, but the relationship with the other wiring pattern is not limited to this. In consideration of the above, the wiring may be divided in the middle. Furthermore, the power supply wiring 6 and the ground wiring 7 are as follows:
Depending on the positional relationship between the power supply wiring 3 and the ground wiring 4 of the polycell 1, the outer and inner positions may be reversed.

〔Effect of the invention〕

As explained above, according to the present invention, the power supply wiring and the ground wiring are extended to each side of the second circuit cell in accordance with the interval between the power supply wiring and the ground wiring of the first circuit cell. Therefore, no matter which side of the second circuit cell the first circuit cell is designed to butt against, the first. The advantage is that the power supply wiring and the ground wiring can be brought into contact between the second circuit cells, and the connection between them can be automatically made during the manufacturing process.

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram showing the power supply and ground wiring in an embodiment of the present invention, FIG. 2 is a perspective view of the part indicated by the symbol A in FIG. 1, and FIG. 3 shows the block cell from the state shown in FIG. 1. FIG. 4 is an explanatory diagram showing the power supply and ground wiring in a conventional semiconductor integrated circuit. FIG. 5 is an explanatory diagram of the embodiment showing the mirror inverted state. FIG.
It is an explanatory view showing a state changed by 0 degrees. In the figure, 1 is a poly cell (first circuit cell), 3 is a power supply wiring, 4 is a ground wiring, 5 is a block cell (second circuit cell), 6 is a power supply wiring, 6a is its branch line, and 7 is a ground Wiring 7a is its branch line. Note that the same reference numerals in each figure indicate the same or corresponding parts.

Claims (1)

[Claims] (1) An edge of a second circuit cell configured by arranging and connecting a plurality of first circuit cells each having a predetermined circuit function and arranged to have a constant thickness, and an edge of another first circuit cell. In the semiconductor integrated circuit, the power supply wiring and ground wiring of the first circuit cell are connected to the power supply wiring and ground wiring of the second circuit cell, respectively. According to the spacing between the ground wire and the second
A semiconductor integrated circuit characterized in that a power supply wiring and a ground wiring are respectively extended toward each side of a circuit cell.