JPS63274197A - Metal core printed circuit board - Google Patents

Metal core printed circuit board

Info

Publication number
JPS63274197A
JPS63274197A JP11001787A JP11001787A JPS63274197A JP S63274197 A JPS63274197 A JP S63274197A JP 11001787 A JP11001787 A JP 11001787A JP 11001787 A JP11001787 A JP 11001787A JP S63274197 A JPS63274197 A JP S63274197A
Authority
JP
Japan
Prior art keywords
aluminum plate
ceramic
metal core
printed wiring
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11001787A
Other languages
Japanese (ja)
Inventor
Kiyoshi Hani
羽仁 潔
Mutsuko Hayama
端山 むつ子
Yoshio Nishimoto
西本 芳夫
Hiroshi Hishiki
菱木 宏
Minoru Kimura
稔 木村
Tatsuji Nakai
中井 達司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP11001787A priority Critical patent/JPS63274197A/en
Publication of JPS63274197A publication Critical patent/JPS63274197A/en
Pending legal-status Critical Current

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  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

PURPOSE:To improve the heat cycle resistance and the soldering thermal resistance of a base material by providing a laminated structure which is formed by the steps of applying anodic oxidation over the surface of an aluminum plate provided with through holes, treating the anodic oxide with a primer or coupling agent, and supperposing prepreg sheets of a specific ceramic and them a metal foil. CONSTITUTION:A through hole 1a is opened in an aluminum plate 1, then treated with anode oxidation by sulfuric acid, chromic acid, etc., and an oxide film layer 2 is formed. Then, a primer treatment is carried out with a direct resin dilute solution or an electrodeposition coating material and a surface treated layer 3 which also seals a hole with a synthetic resin is provided. Then, a laminated board can be obtained by superposing an aluminum plate 1 and a metal foil 5 by using a plurality of prepreg sheets 4 manufactured with ceramic paper and a synthetic resin and by pressurizing, heating and forming. The ceramic paper uses a main raw material of a ceramic short fiber which has a diameter of 5 mum or less and the distribution of a fiber length within the range of 5-500 mum.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、金属芯印刷配線板、特に、絶縁層の、熱伝
導性お、よび絶縁層と金属芯との接着強度の優れた金属
芯印刷配線板に関するものである。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a metal core printed wiring board, particularly a metal core of an insulating layer, which has excellent thermal conductivity and adhesive strength between the insulating layer and the metal core. It relates to printed wiring boards.

(従来の技術) 従来、各種電子機器に使用される印刷配線板は、電子部
品の小形化や高機能化が促進されると共に、これらの部
品の高密度実装技術の進展に伴なって、放熱特性の優れ
た印刷配線板の要求が強くなっている。
(Prior art) Printed wiring boards conventionally used in various electronic devices have been used to improve heat dissipation as electronic components become smaller and more functional, and as technology for high-density packaging of these components progresses. There is a growing demand for printed wiring boards with excellent characteristics.

金属芯印刷配線板は、金属を芯として、その表面を種々
の方。法で絶縁被覆を行なった後、配線パターンを形成
するもので、金属を芯材とするためのガラスエポキシな
どの基板に比べ放熱性に優れること、機械強度の高いこ
と、電磁遮へい効果を持たせられること、低コスト化が
可能なことなどの諸特長を有しているため、従来、種々
の構造や製造法が検討されている。
Metal core printed wiring boards have a metal core with various surfaces. After applying an insulating coating using a method, a wiring pattern is formed.It has superior heat dissipation, high mechanical strength, and electromagnetic shielding effect compared to substrates made of glass epoxy or other materials that use metal as the core material. Various structures and manufacturing methods have been studied in the past because they have various features such as being able to be easily used and to be able to reduce costs.

例えば特開昭58−74091号公報に開示された方法
においては、スルーホールの貫通孔を設けたアルミニウ
ム板の絶縁処理としてアルマイト処理を行なった後、銅
めフきにより配線パターンの形成を行なっている。この
方法は、金属芯としてアルミニウム板しか通用できない
ことや、絶縁された部分の耐電圧特性が低いため、高電
圧のかかる部品が搭載できないなどの欠点があった。ま
た、アルマイト処理や銅メツキパターンの形成に長時間
を要するなどの大きな欠点がある。また、他の例として
は特開昭58−132989号公報に開示された方法に
おいては、貫通孔を設けた金属板の絶縁処理として、ガ
ラス布エポキシプリプレグシートと銅箔とを重ね、プレ
ス形成することにより、プリプレグシートの過剰の樹脂
が貫通孔の穴埋めを行ない、同時に銅箔も接合された基
板となり、これを公知のサブトラクト法で回路形成を行
なう方法であるが、この場合、穴埋めしたエポキシ樹脂
の線膨張係数と金属との線膨張係数の差が大きいため、
基板のはんだ耐熱試験やビートサイクル試験で、スルー
ホール絶縁部の剥離が生ずるなどの欠点を有する。また
、金属芯の絶縁層が熱伝導率の低いガラスとエポキシ樹
脂で構成されるため、基板の放熱性すなわち、熱伝4率
が悪い基板材料となる。
For example, in the method disclosed in Japanese Unexamined Patent Publication No. 58-74091, an aluminum plate with through holes is anodized as an insulation treatment, and then a wiring pattern is formed using copper plating. There is. This method had drawbacks, such as the fact that only an aluminum plate could be used as the metal core, and the insulated parts had low withstand voltage characteristics, making it impossible to mount components to which high voltage was applied. In addition, there are major drawbacks such as the long time it takes to perform alumite treatment and form a copper plating pattern. As another example, in the method disclosed in Japanese Patent Application Laid-open No. 58-132989, in order to insulate a metal plate provided with through holes, a glass cloth epoxy prepreg sheet and a copper foil are stacked and press-formed. As a result, the excess resin in the prepreg sheet fills the through-holes, and at the same time, the copper foil is bonded to the board, which is then used to form a circuit using the well-known subtract method. Because there is a large difference between the linear expansion coefficient of and that of metal,
It has drawbacks such as peeling of the through-hole insulation part during the solder heat resistance test and beat cycle test of the board. Furthermore, since the insulating layer of the metal core is made of glass and epoxy resin, which have low thermal conductivity, the substrate material has poor heat dissipation properties, that is, poor heat transfer coefficient.

(fl明が解決しようとする問題点〕 これらのほか、さらに別の方法としては、絶縁層形成に
電着塗装法や粉体塗料の流動浸tR塗装法を採用する方
法等が提案されているが、いずれも、回路形成が困難で
あるとか、金属との熱膨張係数の差が大きいとか、絶縁
層の熱伝導率が低いなど、#述した諸問題点を包含して
おり、いずわも実用的な方法ではなかった。
(Problems that FL Ming is trying to solve) In addition to these, other methods have been proposed, such as adopting electrodeposition coating method or fluidized immersion tR coating method of powder coating for forming an insulating layer. However, all of them have the problems mentioned above, such as difficulty in circuit formation, large difference in coefficient of thermal expansion with metal, and low thermal conductivity of the insulating layer. was also not a practical method.

この発明は、金属芯印刷配線板における1−記従来例の
問題点を解消するためになされたもので、従来法に比べ
熱伝導率の高い絶縁層を影成し、かつ、該絶縁層は金属
の両面およびスルーホール貫通孔の部分においても金属
との熱膨張係数の差が極めて小さく、さらに接着力の高
い配線板を得る方法を提供することを目的としている。
This invention was made in order to solve the problem of the conventional method described in 1-1 in metal core printed wiring boards, and it forms an insulating layer with higher thermal conductivity than the conventional method, and the insulating layer is It is an object of the present invention to provide a method for obtaining a wiring board that has an extremely small difference in coefficient of thermal expansion with the metal even on both sides of the metal and in the through-hole portion, and has high adhesive strength.

〔問題点を解決するための手段〕[Means for solving problems]

このため、本発明による金属芯印刷配線板は、金属芯と
してアルミニウム板を使用し、該アルミニウム板の絶縁
層として、繊維径が5μm以下で繊維長が5〜500μ
mの範囲の繊維長分布を有するセラミック短繊維をシー
ト化したセラミックペーパと合成樹脂とによる絶縁層を
形成し、さらに、アルミニウム板と絶縁層との接着強度
を向上させる手段として、まず、スルーホール貫通孔を
穿設したアルミニウム板の全表面を、厚さ10〜30μ
mの範囲で陽極酸化を施こし、さらに該表面層に、プラ
イマ処理またはカップリング剤処理を行なった後、前記
セラミックペーパを用いたプリプレグシートを用いて、
金属箔と積層形成を行なうよう構成するごとにより、前
記目的を達成しようとするのである。
Therefore, the metal core printed wiring board according to the present invention uses an aluminum plate as the metal core, and the insulating layer of the aluminum plate has a fiber diameter of 5 μm or less and a fiber length of 5 to 500 μm.
As a means of forming an insulating layer using a synthetic resin and a ceramic paper made of a sheet of ceramic short fibers having a fiber length distribution in the range of The entire surface of the aluminum plate with through holes is 10 to 30μ thick.
After performing anodic oxidation in a range of m, and further performing a primer treatment or a coupling agent treatment on the surface layer, using a prepreg sheet using the ceramic paper,
The above objective is achieved by configuring the metal foil to be laminated with the metal foil.

〔作用〕[Effect]

以[のような構成により、絶縁層のセラミックペーパに
より放熱特性が向トし、また、スルーホール孔の絶縁層
が、セラミック短繊維と合成樹脂の複合体により、スル
ーホール部の放熱性および耐ヒートサイクル性が向上し
、さらに、アルミニウム板と絶縁層とが強固に接着され
るため、基板の耐ヒートサイクル性とはんだ耐熱性が向
トする。
With the following configuration, the heat dissipation properties of the insulating layer are improved by the ceramic paper, and the insulating layer of the through-hole hole is made of a composite of ceramic short fibers and synthetic resin, which improves the heat dissipation property and resistance of the through-hole part. Heat cycle resistance is improved, and since the aluminum plate and the insulating layer are firmly bonded, the heat cycle resistance and soldering heat resistance of the substrate are improved.

【実施例〕【Example〕

以下に、この発明に係る金属芯印刷配線板の具体的な製
造方法の実施例について説明する。第1図(a)〜<e
>に、上記製造方法の各り稈における配線板要部断面図
を、第2図に配線板実成品に配線回路パターンを形成し
た後の要部断面図を示すウ 1は芯(コマ)となるアル
ミニウム板である。
Examples of a specific method for manufacturing a metal core printed wiring board according to the present invention will be described below. Figure 1(a) ~<e
> shows a sectional view of the main part of the wiring board in each culm of the above manufacturing method, and Fig. 2 shows a sectional view of the main part after forming the wiring circuit pattern on the actual wiring board product. It is an aluminum plate.

(g!A造、T程) まず、第1図(a)に示すように、アルミニウム板1に
スルーホール貫通孔1aを穿設し、次いで硫酸、クロム
酸等による陽極酸化処理を行ない、第1図(b)に示す
ように、厚さ10〜30μmの範囲で酸化皮1摸層2を
形成する。酸化皮膜2の厚さは、!0μm以下の場合、
アルミニウム板1と絶縁層の接着力が低下するので好ま
しくない。また、30μm以上の場合は、アルミニウム
板lと絶縁層の界面にミクロボイドが残存するため好ま
しくない。
(g! A construction, T construction) First, as shown in FIG. As shown in FIG. 1(b), an oxide layer 1 and a layer 2 having a thickness of 10 to 30 μm are formed. The thickness of oxide film 2 is! If it is less than 0μm,
This is not preferable because the adhesive strength between the aluminum plate 1 and the insulating layer decreases. Further, if the thickness is 30 μm or more, microvoids remain at the interface between the aluminum plate 1 and the insulating layer, which is not preferable.

に記方法により陽極酸化処理を行なった後、酸化層の封
孔処理を行なわないで、直接樹衛希薄溶液または電着塗
料でプライマ処理を行ない、第1図(c)に示すような
合成樹脂または有機化合物による封孔を兼ねた表面処理
層3を設ける。表面処理像3の厚さは酸化皮膜2と同等
の厚さが好適である。
After performing anodization treatment according to the method described in , without sealing the oxidized layer, a primer treatment is directly performed with a dilute resin solution or electrodeposition paint to form a synthetic resin as shown in Figure 1 (c). Alternatively, a surface treatment layer 3 made of an organic compound that also serves as pore sealing is provided. The thickness of the surface treatment image 3 is preferably equivalent to the thickness of the oxide film 2.

次いで前記セラミックペーパと合成樹脂によって作製し
たプリプレグシート4を複数枚用いて第1図(d)に示
すような構成で、アルミニウム板!とプリプレグシート
4、さらに金属箔5の順に市ね合せ、プレス機で加圧加
熱成形することにより第1図(e)に示す積層板が得ら
れる。
Next, a plurality of prepreg sheets 4 made of the ceramic paper and synthetic resin were used to create an aluminum plate as shown in FIG. 1(d). The prepreg sheet 4 and the metal foil 5 are placed together in this order, and the laminate shown in FIG. 1(e) is obtained by pressurizing and heating forming them using a press.

該積層板は、絶縁層とアルミニウム板lが強固に接着さ
れ、スルーホール6通孔を含めたアルミニウム板1表面
にセラミック短繊維が均質に分散した絶縁層が形成され
る。該積層板の配線回路パターン形成は、アルミニウム
板1に61もって穿設した貫通孔より小さい径で穴あけ
加工を行うことにより、スルーホール孔が形成され、次
いで、通常のサブトラクト法によって配線回路パターン
5の形成を行なうことにより、第2図に示すようなこの
発明の金属芯印刷配線板が得られる。
In this laminate, an insulating layer and an aluminum plate 1 are firmly adhered, and an insulating layer in which short ceramic fibers are homogeneously dispersed is formed on the surface of the aluminum plate 1 including six through holes. To form a wiring circuit pattern on the laminated board, a through hole is formed by drilling a hole with a smaller diameter than the through hole 61 drilled in the aluminum plate 1, and then a wiring circuit pattern 5 is formed by a normal subtracting method. By performing this process, a metal core printed wiring board of the present invention as shown in FIG. 2 is obtained.

以上のように形成されたこの発明による金属芯印刷配線
板は、絶縁層とアルミニウム板1とが強固に接着し、絶
縁層には光熱伝導性と低線膨張率化に大きく作用するセ
ラミック短繊維が均質に分散しているため、放熱特性や
スルーホール(3頼性の優れた金属芯印刷配線板となる
In the metal-core printed wiring board according to the present invention formed as described above, the insulating layer and the aluminum plate 1 are firmly adhered, and the insulating layer contains short ceramic fibers that greatly affect photothermal conductivity and lowering the coefficient of linear expansion. is homogeneously dispersed, resulting in a metal-core printed wiring board with excellent heat dissipation properties and through-hole reliability.

この発明に用いるセラミック短繊維の具体例としては、
アルミナ繊維、アルミナシリケート繊維、ムライト繊維
、スピネル繊維、ベリリア繊維、ボロン繊維、窒化ボロ
ン繊維、窒化ケイ素繊維、窒化アルミニウム繊維などが
ある。これらの繊維は、連続繊維を所定長にカットした
ものまたは溶融法、液相法、気相反応法、前駆体法など
により製造された短繊維、さらにはウィスカーも使用し
1ilる。
Specific examples of ceramic short fibers used in this invention include:
Examples include alumina fiber, alumina silicate fiber, mullite fiber, spinel fiber, beryllia fiber, boron fiber, boron nitride fiber, silicon nitride fiber, and aluminum nitride fiber. These fibers may be continuous fibers cut into predetermined lengths, short fibers produced by a melting method, a liquid phase method, a gas phase reaction method, a precursor method, or the like, and whiskers may also be used.

また、陽極酸化皮膜の上に処理する表面処理剤としては
、前述の電着塗料やシラン化合物、アルミニウム化合物
、ボロン化合物、チタン化合物等のカップリング剤が使
用できる。
Further, as a surface treatment agent to be treated on the anodic oxide film, the above-mentioned electrodeposition paint and coupling agents such as silane compounds, aluminum compounds, boron compounds, and titanium compounds can be used.

(具体例) 次に、この発明を、より具体的な実施例に基づいて説明
するが、この発明原理の適用は、これらの実施例のみに
限定されるものではないことはもちろんである。
(Specific Examples) Next, the present invention will be described based on more specific examples, but it goes without saying that the application of the principles of the invention is not limited only to these examples.

1)mla径3μm、繊維長が20〜500μmの範囲
の繊維長分を有するアルミナ短繊維(例えば三菱化成工
業社製)と有機バインダとしてミクロフィブリル化セル
ローズ(商品名MFC、ダイセル化学社製)を用いて紙
N350μm、坪190g/rr+”のアルミナベーパ
を得た。該アルミナベーパの有機バインダN仔贋は約4
wt%(!If 1パーセント)である。
1) Alumina short fibers (for example, manufactured by Mitsubishi Chemical Industries, Ltd.) having an mla diameter of 3 μm and a fiber length in the range of 20 to 500 μm, and microfibrillated cellulose (trade name: MFC, manufactured by Daicel Chemical Co., Ltd.) as an organic binder. Using this, an alumina vapor with a paper N of 350 μm and a tsubo of 190 g/rr+ was obtained.The organic binder N of the alumina vapor was approximately 4
wt% (!If 1%).

2)Sさ1mmのアルミニウム板1(JIS、Al10
0P)に直径1〜3 m mの貫通孔1aを所定位置に
穴あけ加工した後、クロム酸を電解液として、陽極酸化
処理を行ないアルミニウム板1の表面層に酸化皮膜を、
厚さ約15μm形成させる。
2) Aluminum plate 1 (JIS, Al10
After drilling a through hole 1a with a diameter of 1 to 3 mm in a predetermined position in the aluminum plate 1, an anodizing process is performed using chromic acid as an electrolyte to form an oxide film on the surface layer of the aluminum plate 1.
A thickness of approximately 15 μm is formed.

3)次いでエポキシプライマ(商品名5−tO1束亜合
成化学工業社製)をスプレーで塗装して、J7さ約10
μmの表面処理層を設ける。
3) Next, spray paint an epoxy primer (trade name: 5-tO1 manufactured by Bunya Gosei Kagaku Kogyo Co., Ltd.) to give a J7 diameter of about 10 mm.
A surface treatment layer of μm is provided.

4)次いで上記アルミナベーパに下記第1表に示したエ
ポキシ樹脂を含浸させて130℃×10分間乾燥を行な
いプリプレグシートを得る。
4) Next, the alumina vapor is impregnated with the epoxy resin shown in Table 1 below and dried at 130° C. for 10 minutes to obtain a prepreg sheet.

第  1  表 エピコート1045−11−80     100 g
Dicy     3.2g BDMA     0.16g メチルセロソルブ       70g5)3)で得ら
れたアルミニウム板1のL下に、4)で得られたブリプ
レグンート4を2枚づつ刊ね、さらにその上に11面粗
面化銅箔(例えば日本鉱業社製)を重ね合せプレス圧力
50にg/c12、温度170℃で60分間加圧加熱を
行なって積層板を得る。
Table 1 Epicote 1045-11-80 100 g
Dicy 3.2g BDMA 0.16g Methyl Cellosolve 70g 5) Under the L of the aluminum plate 1 obtained in 3), publish two sheets of Buri Pregunto 4 obtained in 4), and on top of that, 11 surfaces are roughened. Copper foils (for example, manufactured by Nippon Mining Co., Ltd.) are stacked together and heated under pressure at a pressure of 50 g/c and a temperature of 170° C. for 60 minutes to obtain a laminate.

6)該積層板を、NC(数値制御)ドリルマシンでアル
ムニウム板1に酵もってあけた【T通孔1aと同芯円で
絶縁層に0.8〜2.8mm径の穴あけを行なう。
6) The laminated board was drilled into the aluminum plate 1 using an NC (numerically controlled) drill machine. [Drill a hole with a diameter of 0.8 to 2.8 mm in the insulating layer concentrically with the T through hole 1a.

7)次いで、通常のサブトラクト法によって配線回路パ
ターン7の形成を行なうことによりこの発明の金属芯印
刷配線板を得る゛。該金属芯印刷配線板の諸特性例を第
2表に示す。
7) Next, the wiring circuit pattern 7 is formed by the usual subtracting method to obtain the metal core printed wiring board of the present invention. Table 2 shows various characteristics of the metal core printed wiring board.

第  2  表 1)(−40℃×30分0120  ℃X30分)  
 59(クル(発明の効果) 以ト、説明したように、この発明による金属芯印刷配線
板は上記のような効果が1うIられた。
Table 2 1) (-40℃ x 30 minutes 0120℃ x 30 minutes)
59 (Effects of the Invention) As explained above, the metal core printed wiring board according to the present invention has the above-mentioned effects.

1)絶縁層にセラミックペーパを用いたことにより、放
熱特性の優れた基板が得られた。
1) By using ceramic paper for the insulating layer, a substrate with excellent heat dissipation properties was obtained.

2)スルーホール孔の絶縁層がセラミック短繊維と合成
樹脂との複合体で形成されるため、スルーホール部の放
熱性および耐ビートサイクル性が著しく向上した。
2) Since the insulating layer of the through-hole is formed of a composite of short ceramic fibers and synthetic resin, the heat dissipation and beat cycle resistance of the through-hole are significantly improved.

3)アウムニウム板と絶縁層とが強固に接着されたため
、基板の耐ビートサイクル性とはんだ耐熱性とが向上し
た。
3) Since the aluminum plate and the insulating layer were firmly bonded, the beat cycle resistance and solder heat resistance of the board were improved.

4)従来からの製造設備で放熱特性の優れた基板の製造
が可能となフた。
4) It is possible to manufacture substrates with excellent heat dissipation characteristics using conventional manufacturing equipment.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図(a)〜(e)は、この発明による金属芯印刷配
線板の製造方法の一実施例の各1程における配線板要部
断面図、第2図は、上記配線板完成品に、配線回路パタ
ーン形成後の要部断面図である。 1・−一アルミニウム板 la・−スルーホール貫通孔 2−一酸化皮膜層 3−−−−−表面処理層 4・−一セラミックペーパプリプレグシート5−−−−
−金属箔 7・・・−配線回路パターン なお、各図中同一符号は、同一(相当)構成要素を示す
。 第1図
FIGS. 1(a) to (e) are cross-sectional views of the main parts of the printed wiring board in each step of an embodiment of the method for manufacturing a metal core printed wiring board according to the present invention, and FIG. 2 is a cross-sectional view of the wiring board as a finished product. FIG. 2 is a sectional view of a main part after forming a wiring circuit pattern. 1.--Aluminum plate la--Through hole through hole 2--Monoxide film layer 3--Surface treatment layer 4.--1 Ceramic paper prepreg sheet 5--
-Metal foil 7...-Wiring circuit pattern Note that the same reference numerals in each figure indicate the same (equivalent) components. Figure 1

Claims (3)

【特許請求の範囲】[Claims] (1)アルミニウム板を金属芯とする印刷配線板の製造
方法において、アルミニウム板にスルーホール貫通孔を
穿設した後、該アルミニウム板の表面に陽極酸化を施し
、さらに該表面にプライマまたはカップリング剤で表面
処理を施こすとともに、前記貫通孔の穴埋めと絶縁層の
形成においては、セラミック短繊維を主原料とするセラ
ミックペーパと合成樹脂とより成るプリプレグシートを
用いて積層形成を行なうことを特徴とする金属芯印刷配
線板。
(1) In a method of manufacturing a printed wiring board using an aluminum plate as a metal core, after drilling through-holes in the aluminum plate, the surface of the aluminum plate is anodized, and the surface is further coated with a primer or a coupling. In addition to performing surface treatment with a chemical agent, in filling the through holes and forming the insulating layer, lamination is performed using prepreg sheets made of ceramic paper whose main raw material is ceramic short fibers and synthetic resin. Metal core printed wiring board.
(2)前記アルミニウム板に施す陽極酸化として、酸化
皮膜の厚さが10〜30μmの範囲であることを特徴と
する特許請求の範囲第1項記載の金属芯印刷配線板。
(2) The metal core printed wiring board according to claim 1, wherein the thickness of the oxide film formed by anodizing the aluminum plate is in the range of 10 to 30 μm.
(3)前記セラミックペーパとして、繊維径が5μm以
下で、かつ繊維長が5〜500μmの範囲の繊維長分布
を有するセラミック短繊維を主原料としたセラミックペ
ーパを用いたことを特徴とする特許請求の範囲第1項記
載の金属芯印刷配線板。
(3) A patent claim characterized in that, as the ceramic paper, a ceramic paper whose main raw material is ceramic short fibers having a fiber diameter of 5 μm or less and a fiber length distribution in the range of 5 to 500 μm is used. The metal core printed wiring board according to item 1.
JP11001787A 1987-05-06 1987-05-06 Metal core printed circuit board Pending JPS63274197A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11001787A JPS63274197A (en) 1987-05-06 1987-05-06 Metal core printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11001787A JPS63274197A (en) 1987-05-06 1987-05-06 Metal core printed circuit board

Publications (1)

Publication Number Publication Date
JPS63274197A true JPS63274197A (en) 1988-11-11

Family

ID=14525012

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11001787A Pending JPS63274197A (en) 1987-05-06 1987-05-06 Metal core printed circuit board

Country Status (1)

Country Link
JP (1) JPS63274197A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0297085A (en) * 1988-10-03 1990-04-09 Matsushita Electric Works Ltd Metal base laminated board
KR100674321B1 (en) 2005-09-02 2007-01-24 삼성전기주식회사 Pcb with enhanced radiating ability and the manufacturing method thereof
JP2012124389A (en) * 2010-12-09 2012-06-28 Mitsubishi Alum Co Ltd Printed circuit board
JP2018523593A (en) * 2015-07-17 2018-08-23 ロジャーズ ジャーマニー ゲーエムベーハーRogers Germany GmbH Electric circuit board and board manufacturing method
CN108848619A (en) * 2018-07-06 2018-11-20 义乌市宝讯电子科技有限公司 Composite aluminum substrate and its production technology, LED circuit board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0297085A (en) * 1988-10-03 1990-04-09 Matsushita Electric Works Ltd Metal base laminated board
KR100674321B1 (en) 2005-09-02 2007-01-24 삼성전기주식회사 Pcb with enhanced radiating ability and the manufacturing method thereof
JP2012124389A (en) * 2010-12-09 2012-06-28 Mitsubishi Alum Co Ltd Printed circuit board
JP2018523593A (en) * 2015-07-17 2018-08-23 ロジャーズ ジャーマニー ゲーエムベーハーRogers Germany GmbH Electric circuit board and board manufacturing method
JP2018533197A (en) * 2015-07-17 2018-11-08 ロジャーズ ジャーマニー ゲーエムベーハーRogers Germany GmbH Electric circuit board and method of manufacturing same type board
CN108848619A (en) * 2018-07-06 2018-11-20 义乌市宝讯电子科技有限公司 Composite aluminum substrate and its production technology, LED circuit board

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