JPS6327057U - - Google Patents
Info
- Publication number
- JPS6327057U JPS6327057U JP12067386U JP12067386U JPS6327057U JP S6327057 U JPS6327057 U JP S6327057U JP 12067386 U JP12067386 U JP 12067386U JP 12067386 U JP12067386 U JP 12067386U JP S6327057 U JPS6327057 U JP S6327057U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- island portion
- section
- frame body
- suspension
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000725 suspension Substances 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12067386U JPS6327057U (hu) | 1986-08-05 | 1986-08-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12067386U JPS6327057U (hu) | 1986-08-05 | 1986-08-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6327057U true JPS6327057U (hu) | 1988-02-22 |
Family
ID=31009212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12067386U Pending JPS6327057U (hu) | 1986-08-05 | 1986-08-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6327057U (hu) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04750A (ja) * | 1990-04-18 | 1992-01-06 | Toshiba Corp | 半導体装置用リードフレーム |
-
1986
- 1986-08-05 JP JP12067386U patent/JPS6327057U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04750A (ja) * | 1990-04-18 | 1992-01-06 | Toshiba Corp | 半導体装置用リードフレーム |