JPS63270437A - Conductor for fuse - Google Patents

Conductor for fuse

Info

Publication number
JPS63270437A
JPS63270437A JP10289987A JP10289987A JPS63270437A JP S63270437 A JPS63270437 A JP S63270437A JP 10289987 A JP10289987 A JP 10289987A JP 10289987 A JP10289987 A JP 10289987A JP S63270437 A JPS63270437 A JP S63270437A
Authority
JP
Japan
Prior art keywords
conductor
fuse
wire
alloy
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10289987A
Other languages
Japanese (ja)
Inventor
Masanobu Nishio
西尾 將伸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP10289987A priority Critical patent/JPS63270437A/en
Publication of JPS63270437A publication Critical patent/JPS63270437A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To obtain a conductor for a fuse having excellent fusion characteristics and wire drawability by specifying the compsn. consisting of Al, Cu and Pb, Bi, In, Cd, Sb, Sn, etc. CONSTITUTION:The titled conductor contains, by weight, 0.01-2% Al, 0.01-2% Cu and the balance consisting of one or more kinds among Pb, Bi, In, Cd, Sb and Sn and has the excellent fusion characteristics and wire drawability. Among said components of the conductor, Al has no effect of facilitating the production of a connected fine wire outside of said compsn. area. Cu has further less effect of contributing to the improvement of the tensile strength in the case of below the lower limit, and the desired m.p. temp. can not be obtd. in the case of above the upper limit thereof. In the low m.p. metals except for Pb, the contents are preferably regulated as well to the area of about 0.01-50% Bi, about 0.01-30% In, about 0.01-20% Cd, about 0.01-15% Sb and about 0.01-40% Sn so as to obtain the desired m.p. temp. suitably.

Description

【発明の詳細な説明】 し産業上の利用分野〕 この発明は、定格以上の過電流が流れたときに瞬時に断
線するように機能するヒユーズ用導体に関するものであ
る。
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application This invention relates to a fuse conductor that functions to instantaneously break when an overcurrent exceeding a rated value flows.

[従来の技術] 日本金属学会編集[金属便覧(昭和57年12月20日
改訂第4版p、1007)Jに記載されているように、
ヒユーズとしては、従来pb 、 Znまたはpb−3
n合金が通常用いられている。これらの金属または合金
からなるヒユーズ用導体は、過電流のジュール熱によっ
て溶断して電気回路を開く。外気温に左右されずに溶断
電流を精密に決めようとする場合には、タングステン線
からなるヒユーズ用導体が使用されることもある。また
、加熱雰囲気の過熱によって溶断するタイプのヒユーズ
には低温で溶融するウッドメタルが利用されている。
[Prior art] As described in the Japan Institute of Metals, edited [Metal Handbook (revised December 20, 1981, 4th edition, p. 1007),
Conventional fuses include PB, Zn or PB-3.
n alloys are commonly used. Fuse conductors made of these metals or alloys are blown by the Joule heat of the overcurrent, opening an electrical circuit. When attempting to accurately determine the fusing current without being affected by the outside temperature, a fuse conductor made of tungsten wire may be used. Additionally, wood metal, which melts at low temperatures, is used for fuses that melt when the heating atmosphere overheats.

[発明が解決しようとする問題点] しかしながら、上述したようなヒユーズ用導体を、半導
体装置や電子部品にヒユーズ機能を付加するのに用いる
場合、使用可能な程度の細線や極細線にまで伸線加工を
施すことが困難である。そのため、ヒユーズ機能を有す
る別の装置をそれらの装置や部品を組み込んだ電子機器
の回路に組み込んでいるのが現状である。あるいは、上
述のようなヒユーズ用導体が板状や太線で使用されてお
り、部分的にノツチを入れるなどしてその断面積を減じ
ていた。
[Problems to be Solved by the Invention] However, when the above-mentioned fuse conductor is used to add a fuse function to semiconductor devices or electronic components, it is difficult to draw the fuse conductor to a usable thin or ultra-fine wire. Difficult to process. Therefore, at present, a separate device having a fuse function is incorporated into the circuit of an electronic device incorporating such a device or component. Alternatively, fuse conductors such as those described above have been used in the form of plates or thick wires, and the cross-sectional area has been reduced by partially inserting notches.

へ駐、AH金合金COまたはCu合金からなる細線や極
細線をヒユーズ用導体とし゛C使用することもあるが、
(のようなヒユーズ用導体は過電流に対して溶断しにく
かった。
However, thin wires or ultra-fine wires made of AH gold alloy CO or Cu alloy are sometimes used as conductors for fuses.
Fuse conductors such as () were difficult to blow due to overcurrent.

そこで、この発明は、溶断特性に優れ、かつ伸線加工性
に優れたヒユーズ用導体を提供ザることを目的とする。
SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a conductor for a fuse that has excellent fusing characteristics and wire drawability.

[問題点を解決するための手段] この発明に従ったヒユーズ用導体は、AfJ、を0゜0
1〜2重量%、Cu @0.01〜2mff1%含有し
、その残部がPb5Bl、in、Cd、3b。
[Means for solving the problem] The fuse conductor according to the present invention has an AfJ of 0°0.
1 to 2% by weight, Cu@0.01 to 2mff1%, and the balance is Pb5Bl, in, Cd, 3b.

Snを含む群から選ばれた少なくとも1)1または2種
以上の金属となっているものである。
At least one or more metals selected from the group containing Sn.

[発明の作用効果] Pb、Bi、In、Cd、Sb%Snの金属(以下、低
融点金属と称する)にCuを添加した合金は、低融点金
属自体に比べて引張強さが向上する。これらの合金は融
点も低融点金属自体に比べて、さほど高くはない。とこ
ろが、Cuの含有量が多くなると、融点が上昇してヒユ
ーズ用導体に適さなくなる。そのためCuの含有量はあ
る範囲内に抑える必要がある。また、これらの合金は溶
断特性にも優れていることが認められる。そこで、これ
らの特性を利用して低融点金属とCuとからなる合金細
線をヒユーズ用導体として得ることが望まれる。合金m
線を得る方法の1つとして、合金の溶湯を細流状にして
噴射し、凝固させることにより得ることが考えられる。
[Operations and Effects of the Invention] An alloy in which Cu is added to a metal of Pb, Bi, In, Cd, or Sb%Sn (hereinafter referred to as a low melting point metal) has improved tensile strength compared to the low melting point metal itself. The melting points of these alloys are also not very high compared to the low melting point metals themselves. However, when the Cu content increases, the melting point increases, making it unsuitable for use as a fuse conductor. Therefore, it is necessary to suppress the Cu content within a certain range. It is also recognized that these alloys have excellent fusing characteristics. Therefore, it is desired to utilize these characteristics to obtain a thin alloy wire made of a low melting point metal and Cu as a conductor for a fuse. alloy m
One possible method for obtaining the wire is to inject a molten alloy in the form of a trickle and solidify it.

しかし、この方法によれば、連続細線を得ることが困難
で、数十〇mの細線状のものしか(qられなかった。
However, according to this method, it was difficult to obtain continuous thin wires, and only thin wires of several tens of meters could be obtained.

そこで、本発明者は種々の元素を添加しC上記方法によ
る連続I8線の製造を試みた。その結果、低融点金属と
Cuとの合金にΔ北を添加すると連続細線が製造可能で
あることがわかった。このとき、AfLの含有量が多く
なると、かえって連続細線の製造が困難になることもわ
かった。そのためAflの含有量はある範囲内に抑える
必要がある。
Therefore, the present inventor attempted to manufacture a continuous I8 wire by adding various elements and using the above method. As a result, it was found that continuous thin wires can be manufactured by adding ΔKita to an alloy of a low melting point metal and Cu. At this time, it was also found that as the content of AfL increases, it becomes more difficult to manufacture continuous thin wires. Therefore, it is necessary to suppress the Afl content within a certain range.

また得られた細線の伸線加工性は良好で、ざらに極m線
に加工することが可能である。ざらに、低融点金属とC
uとの合金が持つ良好な溶断特性をも損うことはない。
Further, the obtained thin wire has good wire drawability, and can be roughly processed into an ultra-m wire. Roughly, low melting point metal and C
It does not impair the good fusing properties of the alloy with u.

この発明は、このような本願発明者の知見に基づくもの
である。
This invention is based on such knowledge of the inventor of the present application.

したがって本発明によるヒユーズ用導体はA′1が0.
01〜2重量%、Cuが0.01〜2m!1%、その残
部が少なくとも1種または2種以上の低融点金属となっ
ているものである。AQの含有間を0.01〜2重量%
とじたのは、AQ量が0゜01重量%未満では連続細線
の製造を容易にする効果がなく、逆に2重量%を越える
と、かえって連続細線の製造を困難にするからである。
Therefore, in the fuse conductor according to the present invention, A'1 is 0.
01-2% by weight, Cu is 0.01-2m! 1%, and the remainder is at least one or more low melting point metals. AQ content between 0.01 and 2% by weight
The reason for this is that if the AQ amount is less than 0.01% by weight, it will not have the effect of facilitating the production of continuous thin wires, whereas if it exceeds 2% by weight, it will actually make it difficult to produce continuous thin wires.

Cuの含有量が0.01重量%未満ではヒユーズ用導体
として要する引張強さの向上に寄与する効果が小さく、
2重量%を越えると、その組成において完全に液相にな
る温度が700℃を越え、ヒユーズ用導体として適した
融点温度を越えるものとなる。
If the Cu content is less than 0.01% by weight, the effect of contributing to improving the tensile strength required as a fuse conductor is small;
If it exceeds 2% by weight, the temperature at which the composition becomes completely liquid will exceed 700° C., exceeding the melting point temperature suitable for a fuse conductor.

また、この発明に従った合金の組成において、Pb以外
の低融点金属を1種または2秒以上含有するとき、以下
に示す範囲内の含有量が好ましく、伸線加工性、溶断特
性が優れている。
In addition, in the composition of the alloy according to the present invention, when one or more than two low melting point metals other than Pb are contained, the content is preferably within the range shown below, and has excellent wire drawability and fusing properties. There is.

Bi:0.01〜50償恐% In :0.01〜30重量% Cd :0.01〜20重e% Sb  :0.01〜15重量% Sn :0.01〜40重量% さらに、これらの上記低融点金属の含有量を上記範囲内
で変化させることにより、用途に合わせたヒユーズ用導
体としての融点温度の調整を行なうことができる。
Bi: 0.01-50% by weight In: 0.01-30% by weight Cd: 0.01-20% by weight Sb: 0.01-15% by weight Sn: 0.01-40% by weight By varying the content of the low melting point metal within the above range, the melting point temperature of the fuse conductor can be adjusted to suit the application.

以上のように、この発明のヒユーズ用導体は、溶断特性
に優れ、かつ伸線加工性にも優れている。
As described above, the fuse conductor of the present invention has excellent fusing characteristics and wire drawability.

また、細線や極細線への加工が可能であることから、ヒ
ユーズ用導体としτ高抵抗値が要求され、かつ細線や極
細線であることを必要とするような分野に有効に利用さ
れる。特に、半導体装置(IC1トランジスタ等)や電
子部品(コンデンサ等)に本来持つ機能にヒユーズ機能
を付加したい揚台等に有効に利用される。このとき、こ
れまで半導体装置や電子部品と別に電子機器の回路に組
み込まれてあったヒユーズ機能を有する装置が不要とな
る。そのため、部品点数の低減につながり、高信頼性の
電子機器の製造が可能となる。
In addition, since it can be processed into thin or ultra-fine wires, it can be effectively used as a conductor for fuses in fields where a high resistance value of τ is required and the wires also need to be thin or ultra-fine. Particularly, it is effectively used for lifting boards, etc., where it is desired to add a fuse function to the original function of semiconductor devices (IC1 transistors, etc.) and electronic components (capacitors, etc.). At this time, there is no longer a need for a device having a fuse function, which has heretofore been incorporated into the circuit of an electronic device separately from the semiconductor device or electronic components. This leads to a reduction in the number of parts and makes it possible to manufacture highly reliable electronic devices.

〔実施例1〕 第1表に示す組成からなる合金の溶湯を細流状にして冷
却媒体に噴射し、凝固さけることによって直径200μ
mφの合金線を得た。さらに、これらの合金線を直径1
00μIφまで伸線した。
[Example 1] A molten alloy having the composition shown in Table 1 is made into a fine stream and is injected into a cooling medium to avoid solidification, thereby reducing the diameter to 200 μm.
An alloy wire of mφ was obtained. Furthermore, these alloy wires are made with a diameter of 1
The wire was drawn to 00 μIφ.

得られた合金線に電流を流して溶断特性を調べた。この
とき溶断特性の評価は10△以下の所定の電流を流した
ときの溶断するまでの時間によって行なった。したがっ
て溶断するまでの時間が短いほど、溶断特性が優れてい
ることになる。
A current was passed through the obtained alloy wire to examine its fusing characteristics. At this time, the fusing characteristics were evaluated based on the time until fusing occurred when a predetermined current of 10Δ or less was passed. Therefore, the shorter the time until fusing, the better the fusing characteristics.

本発明例N081〜N088の組成からなる合金線は0
.3〜10Aまでの所定の電流を流したときに瞬時に溶
断した。比較のため、従来例として同径のへ見線を用い
て同様に溶断特性を調査した。
The alloy wires having the compositions of the invention examples N081 to N088 are 0
.. It melted instantly when a predetermined current of 3 to 10 A was applied. For comparison, the fusing characteristics were investigated in the same manner using a diagonal wire of the same diameter as a conventional example.

このときAm線は7〜10Δまでの所定のftf流を流
したときに1秒以内で溶断した。上記結果から、本発明
による低融点金属とAiとCIJどの合金からなるヒユ
ーズ用導体は、はるかに優れた溶断特性を示すことがわ
かる。
At this time, the Am wire was fused within 1 second when a predetermined ftf flow of 7 to 10 Δ was flowed. From the above results, it can be seen that the fuse conductor made of the low melting point metal, Al, and CIJ alloy according to the present invention exhibits far superior fusing characteristics.

また、第1表に示すように比較例N089〜No。In addition, as shown in Table 1, Comparative Examples No. 089 to No.

13の組成からなる合金線、すなわちAiまたはCuの
含有量が本発明例による上下限値を超えた組成からなる
合金線、またはsnの含有量が好ましい範囲の上限値を
越えた組成からなる合金線は、直径200μmφの連続
線を得ることができなかった。
An alloy wire having a composition of No. 13, that is, an alloy wire having a composition in which the content of Ai or Cu exceeds the upper and lower limits according to the examples of the present invention, or an alloy having a composition in which the content of sn exceeds the upper limit of the preferable range. A continuous wire with a diameter of 200 μmφ could not be obtained.

(以下余白) 第1表 (注)A:連続線が得られた。(Margin below) Table 1 (Note) A: A continuous line was obtained.

B:連続線が4qられなかった。B: 4q continuous line was not drawn.

C:粒状のものしか得られなかった。C: Only granular particles were obtained.

【実施例2] 第1表に示すN093の組成からなるPb−AfL−C
(I合金を用いて実施例1と同様の方法で直径200μ
lφの合金線にし、さらに直径150μlφまで伸線し
た。得られた合金線をパワートランジスタの入力側結線
用導体として用いて、超音波ボンディングにより結線し
パワートランジスタを試作した。このパワートランジス
タに定格電流値の10倍の電流を流したところ、瞬時に
入力側結線用導体のみが溶断し、周囲の配線に過電流が
流れることを防止した。
[Example 2] Pb-AfL-C consisting of the composition of N093 shown in Table 1
(A diameter of 200 μm was obtained using I alloy in the same manner as in Example 1.)
The alloy wire was made into a lφ alloy wire, and further drawn to a diameter of 150 μlφ. The obtained alloy wire was used as a conductor for connecting the input side of a power transistor, and the wires were connected by ultrasonic bonding to fabricate a power transistor as a prototype. When a current 10 times the rated current value was applied to this power transistor, only the input-side connection conductor melted instantly, preventing overcurrent from flowing to the surrounding wiring.

[実施例3] 第1表に示すNO62の組成からなるPI)−Au−C
U金合金用いて実施例1と同様の方法で直径200μm
φの合金線にし、さらに直径70μmφまで伸線した。
[Example 3] PI)-Au-C having the composition of NO62 shown in Table 1
A diameter of 200 μm was obtained in the same manner as in Example 1 using U gold alloy.
The alloy wire was made into a φ alloy wire, and further drawn to a diameter of 70 μmφ.

得られた合金線を用いてヒユーズ機能を内蔵したコンデ
ンサを試作した。このとぎヒユーズ用導体の特性として
、引張荷重が209、電気抵抗値が5On+Ω/1ml
、溶断電流(1秒以内に溶断するのに必要な最低電流)
が0.25Aである直径70μmの上記合金線表用いた
Using the obtained alloy wire, we prototyped a capacitor with a built-in fuse function. The characteristics of the conductor for this fuse are that the tensile load is 209, and the electrical resistance is 5On+Ω/1ml.
, fusing current (minimum current required to melt within 1 second)
The above alloy wire having a diameter of 70 μm and having a diameter of 0.25 A was used.

このようなヒユーズ用導体を内蔵したコンデンサに定格
電圧値の5倍の電圧をかけたところ、ヒユーズ用導体の
みが断線し、他の電気回路(コンデンサを含む)は損傷
を受けなかった。
When a voltage five times the rated voltage value was applied to a capacitor with such a built-in fuse conductor, only the fuse conductor broke, and other electrical circuits (including the capacitor) were not damaged.

[実施例4] 第1表に示すN011〜No、8の組成からなる合金の
溶湯を細流状にして、回転しているロール上に噴射し、
凝固さぼることによって厚さ50〜500uI11の薄
帯を得た。これらの薄帯も、実施例1と同様に優れた溶
断特性を示した。
[Example 4] A molten metal of an alloy having a composition of No. 8 shown in Table 1 was made into a trickle and sprayed onto a rotating roll,
A ribbon with a thickness of 50 to 500 uI11 was obtained by solidification. These ribbons also exhibited excellent fusing characteristics similar to Example 1.

Claims (1)

【特許請求の範囲】[Claims]  Alが0.01〜2重量%、Cuが0.01〜2重量
%、その残部がPb、Bi、In、Cd、Sb、Snを
含む群から選ばれた少なくとも1種または2種以上の金
属となっている、ヒューズ用導体。
0.01 to 2% by weight of Al, 0.01 to 2% by weight of Cu, and the balance is at least one or two or more metals selected from the group containing Pb, Bi, In, Cd, Sb, and Sn. A conductor for a fuse.
JP10289987A 1987-04-24 1987-04-24 Conductor for fuse Pending JPS63270437A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10289987A JPS63270437A (en) 1987-04-24 1987-04-24 Conductor for fuse

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10289987A JPS63270437A (en) 1987-04-24 1987-04-24 Conductor for fuse

Publications (1)

Publication Number Publication Date
JPS63270437A true JPS63270437A (en) 1988-11-08

Family

ID=14339705

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10289987A Pending JPS63270437A (en) 1987-04-24 1987-04-24 Conductor for fuse

Country Status (1)

Country Link
JP (1) JPS63270437A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5011658A (en) * 1989-05-31 1991-04-30 International Business Machines Corporation Copper doped low melt solder for component assembly and rework
US5019457A (en) * 1988-10-13 1991-05-28 Sumitomo Electric Industries, Ltd. Conductor used as a fuse
CN105463290A (en) * 2015-11-23 2016-04-06 宁波思明汽车科技股份有限公司 Alloy material for automobile bend and preparing method of alloy material

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5019457A (en) * 1988-10-13 1991-05-28 Sumitomo Electric Industries, Ltd. Conductor used as a fuse
US5011658A (en) * 1989-05-31 1991-04-30 International Business Machines Corporation Copper doped low melt solder for component assembly and rework
CN105463290A (en) * 2015-11-23 2016-04-06 宁波思明汽车科技股份有限公司 Alloy material for automobile bend and preparing method of alloy material

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