JPS63260463A - Manufacture of thermal head - Google Patents
Manufacture of thermal headInfo
- Publication number
- JPS63260463A JPS63260463A JP9460387A JP9460387A JPS63260463A JP S63260463 A JPS63260463 A JP S63260463A JP 9460387 A JP9460387 A JP 9460387A JP 9460387 A JP9460387 A JP 9460387A JP S63260463 A JPS63260463 A JP S63260463A
- Authority
- JP
- Japan
- Prior art keywords
- paste
- laser
- heating element
- substrate
- solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 239000004020 conductor Substances 0.000 claims abstract description 20
- 238000010438 heat treatment Methods 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 239000002904 solvent Substances 0.000 claims abstract description 11
- 238000004140 cleaning Methods 0.000 claims abstract description 5
- 238000007639 printing Methods 0.000 claims abstract description 5
- 238000001704 evaporation Methods 0.000 claims abstract description 3
- 230000001678 irradiating effect Effects 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 15
- 238000001816 cooling Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 238000010304 firing Methods 0.000 claims description 3
- 239000011521 glass Substances 0.000 abstract description 5
- 239000011347 resin Substances 0.000 abstract description 4
- 229920005989 resin Polymers 0.000 abstract description 4
- 239000000843 powder Substances 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 229910001111 Fine metal Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 210000000988 bone and bone Anatomy 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000006060 molten glass Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は列状に多数形成された発熱素子に選択的に通電
することにより発熱記録を行うサーマルヘッドの製造方
法に関するもので、特に厚膜式サーマルヘッドに関する
。Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a method for manufacturing a thermal head that performs heat-generating recording by selectively energizing a large number of heat-generating elements formed in a row. Regarding the type thermal head.
従来の厚膜式サーマルヘッドの製造技術としては主とし
て、第４図および第５図に示す２つの方式があった。There have been two main methods of manufacturing conventional thick film thermal heads, as shown in FIGS. 4 and 5.
第４図の方式は個々の発熱体素子１１．１２、・・・、
１ｎを直接スクリーン印刷により形成している。この場
合、まず基板３上にリード導体２１ａ、２１ｂ、２２ａ
、°２２ｂ、 ・・・、２ｎａ。The system in Fig. 4 uses individual heating elements 11, 12, . . .
1n is formed by direct screen printing. In this case, first, the lead conductors 21a, 21b, 22a are placed on the substrate 3.
, °22b, ..., 2na.
２ｎｂを形成し、このリード導体２ｉａ、２ｉｂ（ｉ＝
１．２、・・・、ｎ）にまたがって発熱体素子１１．１
２、・・・、１ｎを個々に形成する。2nb, and these lead conductors 2ia, 2ib (i=
1.2,...,n) over the heating element elements 11.1
2, . . . , 1n are individually formed.
一方、第５図の方式のものは、基ｔｆｆｌａ上に交互に
リード導体２１，２２．２３、・・・、２ｎを形成し、
その中央部に帯状抵抗体１を切れ目なく形成したもので
ある。On the other hand, in the method shown in FIG. 5, lead conductors 21, 22, 23, . . . , 2n are alternately formed on the base tffla,
A strip resistor 1 is formed seamlessly in the center thereof.
前者の方式はリード導体と発熱体素子が１素子毎に独立
して形成されるので電気的制御が容易な利点があるが、
スクリーン印刷で形成しているのでその実装密度が低い
欠点があった。すなわち、スクリーン印刷においてはそ
の印刷限界が実際上１００μ程度であるので、６ ｄｏ
ｔ ／ ａｍが限界であった。The former method has the advantage that electrical control is easy because the lead conductor and heating element are formed independently for each element.
Since it was formed by screen printing, it had the disadvantage of low packaging density. In other words, in screen printing, the printing limit is actually about 100μ, so 6 do
t/am was the limit.
また、後者の方式はいわゆる交互リード方式であるので
１６〜２４ｄｏｔ ／ｗの高密度を達成することができ
るが、複数のリード導体それぞれがとなりあう発熱体素
子を共通に駆動する電気的制御を行う必要があるため、
その制御方法が比較的困難である欠点があった。In addition, the latter method is a so-called alternating lead method and can achieve a high density of 16 to 24 dots/w, but electrical control is performed in which each of the plurality of lead conductors commonly drives the adjacent heating elements. Because it is necessary,
The drawback is that the control method is relatively difficult.
このため、本発明においては、
基板上に発熱体素子列を形成するサーマルヘッドの製造
方法において、上記基板上の発熱体素子列形成部分にリ
ード導体を形成する工程と、上記基板上の発熱体素子列
形成部分に連続した帯状抵抗ペーストを印刷形成する工
程と、上記印刷形成された帯状抵抗ペーストの溶剤骨を
蒸発除去するための乾燥工程と、上記乾燥された帯状抵
抗ペーストの個々の発熱素子となる部分にレーザー照射
する工程と、冷却しレーザー照射部分を固化する工程と
、溶剤中で洗浄しレーザー未照射部を除去する工程と、
焼成する工程とを有している。Therefore, in the present invention, a method for manufacturing a thermal head in which a heating element array is formed on a substrate includes a step of forming a lead conductor on a portion of the substrate on which the heating element array is formed, and a step of forming a lead conductor on the heating element array formation portion on the substrate; a step of printing a continuous strip-shaped resistance paste on the element array forming portion; a drying step for evaporating and removing the solvent bones of the printed strip-shaped resistance paste; and an individual heating element of the dried strip-shaped resistance paste. A step of irradiating the laser to the part that becomes , a step of cooling and solidifying the laser irradiated part, a step of cleaning in a solvent and removing the part not irradiated with the laser,
It has a step of firing.
リード導体は第５図に示す従来方法とほぼ同様の密度で
形成される。そして、帯状抵抗ペースト上の発熱体素子
形成部分をレーザー照射して固化しているので、結果的
に第４図に示すような発熱体素子とリード導体配置を得
ることができる。The lead conductors are formed with substantially the same density as in the conventional method shown in FIG. Since the heating element forming portion on the strip resistor paste is solidified by laser irradiation, the heating element and lead conductor arrangement as shown in FIG. 4 can be obtained as a result.
第１図、第２図および第３図は本発明の一実施例を示す
説明図で、それぞれ製造工程を示すものである。FIG. 1, FIG. 2, and FIG. 3 are explanatory diagrams showing one embodiment of the present invention, each showing a manufacturing process.
第１図は基板３上にリード導体２ｉａ、２ｉｂ（ｉ＝１
．２．３、・・・、ｎ）を形成する（リード導体形成工
程）。リード導体２ｉａ、２ｉｂは、例えば、全面に印
刷形成した後、ホトリス技術を用いてエツチング形成す
る。これにより、リード導体２ｉａ、２ｉｂをｌＯ〜２
０μ程度の高密度に形成することができる。なお、リー
ド導体２ｉａ、２ｉｂの材料としては、Ａｕ等の金属微
粉と、ガラス粉末とを樹脂および溶剤によりペースト状
にしたものを用い、上述の処理を施した後、焼成してリ
ード導体２ｉａ、２ｉｂが形成される。FIG. 1 shows lead conductors 2ia, 2ib (i=1
．． 2.3, . . . , n) are formed (lead conductor formation step). The lead conductors 2ia and 2ib are, for example, printed on the entire surface and then etched using photolith technology. As a result, the lead conductors 2ia and 2ib are connected to lO~2
It can be formed at a high density of about 0μ. The material for the lead conductors 2ia and 2ib is a paste made of fine metal powder such as Au and glass powder with a resin and a solvent, which is subjected to the above-mentioned treatment and then fired to form the lead conductors 2ia, 2ib. 2ib is formed.
次に、第２図に示すようにこの基板３上の発熱体素子形
成部分に帯状に切れ目なく抵抗ペーストｌをスクリーン
印刷する（抵抗ペースト印刷工程）。この抵抗ペースト
１はＲｕｂ、等の金属微粉とガラス粉末とを樹脂および
溶剤によりペースト状にしたものをスクリーン印刷して
いる。そして、この印刷された抵抗ペースト１の溶剤骨
を蒸発除去するため乾燥する（乾燥工程）０次に、この
帯状抵抗ペースト１の発熱体素子形成部分１１．１２、
・・・、ｉｎにレーザーを照射し、その部分における抵
抗ペースト１の樹脂分と一部ガラス分とを溶融する（レ
ーザー照射工程）。次に冷却し溶融したガラス分を固化
焼成する（冷却工程）。Next, as shown in FIG. 2, a resistive paste 1 is screen-printed in a seamless strip on the heating element forming portion of the substrate 3 (resistive paste printing step). This resistor paste 1 is made by screen printing a paste made of fine metal powder such as Rub and glass powder using a resin and a solvent. Then, the printed resistance paste 1 is dried in order to evaporate and remove the solvent bones (drying step).Next, the heating element forming portions 11 and 12 of this strip-shaped resistance paste 1,
. . , in is irradiated with a laser to melt the resin portion and a portion of the glass portion of the resistor paste 1 in that portion (laser irradiation step). Next, the cooled and molten glass is solidified and fired (cooling step).
そして、溶剤中にて超音波洗浄しレーザー未照射部の抵
抗ペーストを除去する（洗浄工程）、第３図はこの洗浄
工程を行った後のサーマルヘッドを示すものである。こ
の後、このサーマルヘッドを焼成する（焼成工程）。Then, ultrasonic cleaning is performed in a solvent to remove the resistive paste in the areas not irradiated with the laser (cleaning process). FIG. 3 shows the thermal head after this cleaning process has been performed. After this, this thermal head is fired (firing step).
以上、説明したように本発明によれば微細な発熱体素子
を形成できるので、厚膜方式においても高密度のサーマ
ルヘッドを比較的簡単に製造できる。As described above, according to the present invention, a fine heating element can be formed, and therefore a high-density thermal head can be manufactured relatively easily even in a thick film method.
第１図、第２図、第３図は本発明の一実施例を示す工程
説明図、第４図、第５図は従来の製造方法を説明する図
面である。
１・−・発熱体、 ２−リード導体、
３・−・・・基板FIGS. 1, 2, and 3 are process explanatory diagrams showing one embodiment of the present invention, and FIGS. 4 and 5 are diagrams explaining a conventional manufacturing method. 1--Heating element, 2-Lead conductor, 3--Substrate
Claims (1)
方法において、上記基板上の発熱体素子列形成部分にリ
ード導体を形成する工程と、上記基板上の発熱体素子列
形成部分に連続した帯状抵抗ペーストを印刷形成する工
程と、上記印刷形成された帯状抵抗ペーストの溶剤分を
蒸発除去するための乾燥工程と、上記乾燥された帯状抵
抗ペーストの個々の発熱素子となる部分にレーザー照射
する工程と、冷却しレーザー照射部分を固化する工程と
、溶剤中で洗浄しレーザー未照射部を除去する工程と、
焼成する工程とを有するサーマルヘッドの製造方法。In a method of manufacturing a thermal head in which a heating element array is formed on a substrate, a step of forming a lead conductor on a portion of the substrate where the heating element array is formed, and a step of forming a lead conductor in a continuous band shape on the heating element array forming portion of the substrate. A process of printing and forming a resistance paste, a drying process for evaporating and removing the solvent of the printed resistance paste strip, and a process of irradiating laser onto the portions of the dried resistance paste strip that will become individual heating elements. , a step of cooling and solidifying the laser irradiated area, and a step of cleaning in a solvent to remove the non-laser irradiated area,
A method for manufacturing a thermal head, comprising a step of firing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9460387A JPS63260463A (en) | 1987-04-17 | 1987-04-17 | Manufacture of thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9460387A JPS63260463A (en) | 1987-04-17 | 1987-04-17 | Manufacture of thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63260463A true JPS63260463A (en) | 1988-10-27 |
Family
ID=14114829
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9460387A Pending JPS63260463A (en) | 1987-04-17 | 1987-04-17 | Manufacture of thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63260463A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04279356A (en) * | 1991-03-08 | 1992-10-05 | Canon Inc | Recording head and manufacture thereof |
-
1987
- 1987-04-17 JP JP9460387A patent/JPS63260463A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04279356A (en) * | 1991-03-08 | 1992-10-05 | Canon Inc | Recording head and manufacture thereof |
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