JPS63260195A - Manufacture of printed board and the like - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a printed circuit board, a mirror having a decorative cut-out pattern, and the like.

Conventionally, in the production of printed circuit boards, etc., a predetermined pattern is printed on a substrate such as plastic, glass, or film using removable ink, and then the required printed wiring is formed, and the removable ink is printed on the board. It has been known to produce printed circuit boards by peeling off inked areas. However, the conventional method has the drawback that the manufacturing process is complicated and troublesome, and it is difficult to obtain a durable printed circuit board.

1. The present invention eliminates the drawbacks of the prior art described above, simplifies the manufacturing process, and allows plating to be applied freely to the inside of the island-shaped cut-out area, allowing the desired pattern to be applied. To provide a highly durable printed circuit board that can be easily obtained, can be plated with high strength, and a mirror having a decorative cut-out pattern.

Negative plate! base! In order to achieve the above-mentioned object, a method for manufacturing a printed circuit board or the like according to the present invention includes printing a predetermined pattern on a substrate using non-conductive and removable ink, and printing a predetermined pattern on a substrate using a predetermined area of the substrate. After printing with the ink, printing is performed again with the non-conductive ink according to the pattern at the position of the area printed with the non-conductive and peelable ink, and then the non-conductive ink is applied. Metal plating is applied to the area printed with the conductive ink, except for the area printed with the non-conductive and peelable ink, and the area printed with the non-conductive and removable ink is plated with metal. It is characterized in that it is peeled off from the substrate together with the printed area portion applied to the substrate.

Since the structure is as described above, according to the present invention, the area printed with the conductive ink can be electrically conductive even inside the area printed with the non-conductive ink and cut out in an island shape. The inside of the area that is printed with non-conductive ink and is punched out in an island shape is created by providing an area that is not coated with non-conductive ink. Since the plating can be freely plated with hard chrome plating, etc., it has excellent durability and can be used as a contact point for a switch for a sufficiently long period of time. This provides the advantage of providing decorative mirrors and the like.

Figure 1 shows the first step of the method according to the invention, in which a substrate 1 such as plastic, glass or film is printed with a non-conductive and removable ink in the desired pattern. , forming a non-conductive and peelable area 2.

Next, as shown in FIG.
A conductive ink is printed over the entire required area of the substrate 1, including the area 3, which is made conductive.

Thereafter, in a third step as shown in FIG. 3, the area 2 printed with the non-conductive and peelable ink is
The non-conductive area portion 4 is formed by printing again with non-conductive ink at the position according to the pattern.

In this way, the substrate 1 is provided with an area portion 2 that can be peeled off from the substrate 1 with a desired pattern, and a conductive layer having a boundary line of the desired pattern over the entire surface of the desired area portion of the substrate 1 is provided. A continuously expanding conductive area portion 3 is thus formed.

Next, as shown in FIG. 4, in a fourth step, plating is applied to the entire surface of the conductive area 3 except for the non-conductive area 4 to form a plated area 5.

As is obvious, the non-conductive area portion 4 is not plated, and even if an island-shaped pattern is printed on the substrate, it is printed with non-conductive ink and the island-shaped pattern is punched out. By providing a non-conductive ink-applied area inside the area, it is possible to conduct electricity through the continuously expanding conductive area 3 which has conductivity even to the internal area. If necessary, plating can be applied freely to the inside of the area cut out in the form of islands according to the desired pattern.

Finally, as a final step, as shown in FIG. 5, the printed area 2 with non-conductive and removable ink is peeled off from the substrate 1 together with the printed area 3.4 applied thereon. . Since this peeling can be easily separated from the substrate 1 by the aforementioned non-conductive and removable ink, and the plated area 5 is not applied on the area 4 printed with the non-conductive ink, The boundaries of the pattern are weak and a non-conductive and peelable material can be applied to the substrate 1, for example by rolling a release roller coated with an adhesive over the above-mentioned treated area of the substrate. The area 2 printed with ink can be easily peeled off from the substrate 1.

After peeling off in this way, the area portion 3 where the predetermined pattern was peeled off and printed with conductive ink and the plated area portion 5 applied thereon are left on the substrate 1, and the desired pattern is printed. A printed circuit board with wiring or a mirror with a desired cut-out pattern can be obtained.

Furthermore, as mentioned above, according to the present invention, a predetermined pattern is printed on a substrate with non-conductive and releasable ink,
After printing with conductive ink over the entire required area of the substrate, printing again with non-conductive ink according to the pattern at the position of the area printed with the non-conductive and removable ink, After that, metal plating is applied to the area printed with the conductive ink except for the area printed with the non-conductive ink, and printing is performed with the non-conductive and removable ink. Since the process consists of peeling off the plated area from the substrate together with the printed area on it, the strength of the area other than the plated area is weak and peeling is easy, and it does not form like an island. Since there is a continuous part printed with the conductive ink inside the area that has been punched out, plating can be freely applied to the desired area inside the area that has been punched out in the form of an island, and the plating Since hard chrome plating or the like can be applied freely, it is possible to obtain a printed circuit board etc. which has good durability and can be used for a long period of time as a contact point of a switch.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram illustrating the first step of the method of the invention for printing a desired pattern on a substrate with a non-conductive and removable ink. FIG. 2 is a schematic explanatory diagram illustrating a second step of the method of the present invention in which a conductive ink is used to print over the required area on the substrate shown in FIG. FIG. 3 shows a book in which printing is performed using non-conductive ink on the substrate shown in FIG. 2 according to the pattern at the position of the printed area portion formed by the non-conductive and removable ink. FIG. 3 is a schematic explanatory diagram showing the third step of the method of the invention. FIG. 4 is a schematic diagram illustrating a fourth step of the method of the present invention in which plating is applied to the printed area formed by the conductive ink on the substrate shown in FIG. 3; FIG. 5 shows the final stage of the method of the invention for stripping the area covered by the non-conductive and releasable ink from the substrate shown in FIG. 4 together with the printed area coated thereon. A schematic explanatory diagram showing a process. 1...Substrate 2...Printed area of the board printed with a desired pattern using non-conductive and removable ink 3...Required area of the board printed with conductive ink Printing area portion 4 applied to the area portion...Printing according to the pattern with the non-conductive ink at the position of the printing area portion applied with the non-conductive and removable ink according to the pattern. Printed area area 5 of the substrate printed with conductive ink Plating area area applied on the printed area area with conductive ink Patent applicant Hiroshi Iinuma Collection 14 Figure 5 Figure

Claims (1)

[Claims] Printing a predetermined pattern on a substrate with non-conductive and removable ink, printing with conductive ink over the entire required area of the substrate, and then printing with the non-conductive and removable ink. Printing was performed again with non-conductive ink according to the pattern at the position of the area that had been printed, and then printing was performed with the conductive ink except for the area that had been printed with the non-conductive ink. A printed circuit board characterized in that the area portion is plated with metal, and the area portion printed with the non-conductive and peelable ink is peeled off from the substrate together with the printed area portion applied thereon. etc. manufacturing method.