JPS63260132A - Surface modification apparatus - Google Patents

Abstract

PURPOSE:To heat the surface of a material to be treated effectively, quickly and uniformly by a clean method, by supplying reacting gas on the material to be treated on a rotary stage, applying heat rays to the surface of the material to be treated, and heating the material. CONSTITUTION:A material to be treated 2 is mounted on a rotary stage 1. Halogen lamps 3 for supplying heat rays and ultraviolet-ray lamps 5 are arranged in a lamp chamber 8, which is partitioned with a quartz plate 7 that can transmit ultraviolet rays and heat rays, so that the surface of the material to be treated 2 is uniformly irradiated. Since the quartz plate 7 is provided between the lamps 3 and 5 and the material to be treated 2, the flow of reacting gas on the surface of the material to be treated 2 is quick and becomes uniform. Since the heat rays are directly applied on the rotating material to be treated 2 so as to heat the material, the temperature increase on the surface of the material to be treated 2 is quick, and the temperature distribution becomes uniform. The removing speed of organic material on the surface of the material to be treated 2 becomes quick. Thus the temperature increase on the surface of the material to be treated can be made quick, and the surface treating speed becomes quick.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a surface modification device suitable for cleaning the surface of an object to be treated, such as removing organic substances under dry conditions.

[Conventional technology]

As shown in Japanese Patent Application Laid-open No. 115336/1983, a conventional organic matter removal device incorporates a heater into a stage on which the object to be treated is placed in one reaction tank. The object to be treated is indirectly heated by heat conduction caused by contact between the object and the stage, and the organic matter in the object is dissociated by ultraviolet rays irradiated in the reaction tank, and then sent into the reaction tank. By active oxygen generated by irradiating reactant gas with ultraviolet rays.

This makes it easier to remove organic substances deposited on the surface of the object to be treated.

[Problem that the invention seeks to solve]

In the above conventional technology, the workpiece is placed on a heated stage and heated by contact conduction, and consideration must be given to directly heating the workpiece with radiant heat. However, there was a problem in that the rate of temperature rise on the surface of the object to be processed was slow.

The present invention effectively cleans the surface of the workpiece in a clean manner.

The object of the present invention is to obtain a surface modification device that can heat rapidly and uniformly.

[Means for solving problems]

The above object is achieved by irradiating the surface of the object with heat rays and heating it with radiant heat. In other words, in addition to the reactive gas and the ultraviolet rays that activate it,
At the same time, a hot wire is supplied to heat the surface of the object to be treated. The source of the heat rays is, for example, a halogen bulb, and the radiation from the halogen bulb is effectively irradiated onto the surface of the workpiece using a reflecting mirror to heat it.

[Effect]

In the surface modification apparatus, the object to be treated is placed on a rotation stage in a reaction chamber, and ultraviolet rays and heat rays are supplied together with a reaction gas. The workpiece is placed on a rotating stage and rotated.
Reactant gas and ultraviolet rays to be supplied.

This has the effect of uniformly supplying the heat rays to the surface of the object to be treated.

The supply of ultraviolet rays causes the energy of the ultraviolet rays to dissociate the chemical bonds of organic matter deposited on the surface of the object to be treated, and the ultraviolet rays to decompose and activate the reactive gas. The activated reaction gas reacts with constituent atoms of the organic substance, and is gasified and evaporated to remove the organic substance. The hot wire acts to speed up these reactions.

By supplying the above-mentioned hot wire from the surface side of the workpiece, combined with the rotation of the workpiece surface, the workpiece surface can be rapidly and uniformly heated, and since heating is not done by contact heat conduction as in the conventional method, the temperature of the workpiece increases. Rising quickly.

There is no possibility of uneven temperature distribution due to poor contact with the rotating stage.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic diagram showing an embodiment of a surface modification apparatus according to the present invention, and FIG. 2 is a diagram showing a temperature rise on the surface of a treated object in the above embodiment. In FIG. 1, a rotary stage 1 having a small heat capacity is provided in one reaction chamber, and a workpiece 2 is placed on the rotary stage 1. A lamp chamber 8 partitioned above the object 2 by a quartz plate 7 that transmits ultraviolet rays and heat rays is equipped with a halogen bulb 3 for supplying heat rays and an ultraviolet lamp 5, each of which has a uniform surface. Each of the lamps 3 and 5 includes a reflecting mirror that effectively reflects the emitted light from the lamps 3 and 5 onto the surface of the object 2 to be processed. The introduction tube for the reaction gas introduced into the reaction chamber is branched into many branch tubes within the reaction chamber, and each branch tube passes through the reflector 4 and passes between the halogen bulb 3 and the ultraviolet lamp 5, and passes through the quartz plate 5. 7 and is open to the surface of the object 2 to be processed. Therefore, the reaction gas consisting of oxygen gas containing ozone is directly introduced into the surface of the object to be treated 2 from the introduction pipe via the branch pipe. The ozone contained in the reaction gas absorbs ultraviolet rays and does not reduce the intensity of the ultraviolet rays on the surface of the object 2 to be treated, and the density of active oxygen generated when the ozone is decomposed by ultraviolet rays is lower than that of the object 2 to be treated.
The surface of the object 2 to be treated is rotated close to the ultraviolet light source so that the surface of the object 2 becomes darker. The flow to the surface of the object to be treated is fast and uniform. The distance between the surface of the object 2 and the quartz plate 7 is 1 m.
It is desirable to keep it around 1m.

In addition, in this embodiment, heat rays are directly supplied to the surface of the rotating workpiece to heat it, so the temperature on the surface of the workpiece rises quickly and has a uniform temperature distribution, allowing the removal of organic matter on the surface of the workpiece. The speed will be faster.

In addition, 1 reflecting mirror 4 includes an ultraviolet lamp 5 and a halogen bulb 3.
The reflecting mirrors corresponding to the individual reflecting mirrors may be connected to each other, or the reflecting mirrors may be formed continuously, but the reflecting mirror surface of the ultraviolet lamp 5 may be formed by aluminum vapor deposition or mirror polishing of aluminum. It is desirable that the reflective mirror surface of the halogen bulb be a reflective surface such as gold plated.

Note that in order to protect the reflecting mirror surface of the reflecting mirror 4 and to prevent the generation of ozone in the lamp chamber 8 due to ultraviolet rays, it is desirable to purge the interior of the lamp chamber 8 with an inert gas such as N2.

FIG. 2 is a diagram showing the rise in surface temperature of the object to be processed 2 in the above embodiment in comparison with the conventional example.

In contrast to curve A, which shows the conventional heating method using the heat conduction of the rotary stage using a heater attached to the rotary stage, direct heating using radiant heat according to the present invention reaches the temperature necessary for the reaction, as shown in curve B. The heating time could be reduced to about 172 seconds.

In this embodiment, an example is shown in which the halogen light bulb 3 is used as the hot ray supply source, but it is of course possible to use other infrared radiation sources that are not likely to diffuse impurities.

【Effect of the invention〕

As described above, the surface modification apparatus according to the present invention supplies a reactive gas to the surface of the object to be treated on a rotary table and irradiates the surface with ultraviolet rays, by simultaneously irradiating the ultraviolet rays with heat rays.

It is possible to obtain a surface modification device that can increase the temperature of the surface of the object to be treated and has a high surface treatment speed.

Furthermore, since the surface of the object to be processed is directly heated, the temperature distribution on the surface of the object to be processed does not become uneven due to poor contact between the object and the stage as in the prior art.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram showing an embodiment of a surface modification apparatus according to the present invention, and FIG. 2 is a diagram showing a temperature rise on the surface of a treated object in the above embodiment. 1...Rotating stage 2...Workpiece 3...
Heat ray source (halogen bulb) 5... Ultraviolet lamp

Claims (1)

[Claims] 1. A surface modification device that supplies a reactant gas to a workpiece on a rotary table and irradiates it with ultraviolet rays, characterized in that it irradiates heat rays at the same time as the ultraviolet rays.