JPS63256465A - Light emitting diode array - Google Patents
Light emitting diode arrayInfo
- Publication number
- JPS63256465A JPS63256465A JP62089933A JP8993387A JPS63256465A JP S63256465 A JPS63256465 A JP S63256465A JP 62089933 A JP62089933 A JP 62089933A JP 8993387 A JP8993387 A JP 8993387A JP S63256465 A JPS63256465 A JP S63256465A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- led array
- wiring pattern
- array chip
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 229910000679 solder Inorganic materials 0.000 claims abstract description 11
- 108091008695 photoreceptors Proteins 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 7
- 239000011521 glass Substances 0.000 abstract description 5
- 206010057040 Temperature intolerance Diseases 0.000 abstract 1
- 230000008543 heat sensitivity Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 239000012466 permeate Substances 0.000 abstract 1
- 230000002950 deficient Effects 0.000 description 3
- 230000008439 repair process Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000001454 recorded image Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
- B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
- B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Exposure Or Original Feeding In Electrophotography (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は発光ダイオード素子アレイチップと駆動用ＩＣ
チップとを搭載したＬＥＤアレイヘッドに係り、とくに
作業効率、接続信頼性の向上およ一／
び特性不良のチップのりベアに好適なＬＥＤアレイヘッ
ドに関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a light emitting diode element array chip and a driving IC.
The present invention relates to an LED array head equipped with a chip, and in particular to an LED array head that improves work efficiency, connection reliability, and is suitable for chip paste bearings with poor characteristics.
従来、たとえば各種超高速普通紙ノンインパクトプリン
タにおいては、発光ダイオード素子アレイチップ（以下
ＬＥＤアレイチップという）を搭載したＬＥＤアレイヘ
ッドが使用されている。2. Description of the Related Art Conventionally, for example, various ultra-high speed plain paper non-impact printers have used LED array heads equipped with light emitting diode element array chips (hereinafter referred to as LED array chips).
また従来の上記ＬＥＤアレイヘッドはたとえば特開昭６
０−１１６４７９号に記載されているように基板上に発
光ダイオード素子アレイチップ（以下ＬＥＤアレイチッ
プという）と、このＬＥＤアレイチップを駆動させるた
めの駆動用ＩＣチップ（以下駆動用チップという）をフ
ェイスアップ状に搭載し、上記基板上の配線パターンと
上記ＬＥＤアレイチップおよび駆動用チップとをワイヤ
ボンディング形式にて接続するとともに、上記ＬＥＤア
レイチップの発光方向を上記基板上のＬＥＤチップ搭載
同一面の上方向または水平方向になるように構成された
ものが提案されている。Further, the conventional LED array head mentioned above is, for example,
As described in No. 0-116479, a light emitting diode element array chip (hereinafter referred to as an LED array chip) and a driving IC chip for driving this LED array chip (hereinafter referred to as a driving chip) are mounted on a substrate. The wiring pattern on the substrate is connected to the LED array chip and the driving chip by wire bonding, and the light emitting direction of the LED array chip is set on the same surface on which the LED chip is mounted on the substrate. It has been proposed to be configured to be oriented upwardly or horizontally.
上記従来技術は、多数個のＬＥＤアレイチップとその駆
動用ＩＣチップを配線パターンを形成する基板上に搭載
実装するために、まず銀ペースト介してダイボンディン
グを行い、ワイヤボンディングを行なっていた。その結
果たとえばＢ４サイズで記録密度が４００ドツト／イン
チのＬＥＤアレイヘッドとすると、そのすべての接続を
ワイヤボンディング形式で行う構成にした場合は、１ヘ
ッド当り９７００本のワイヤ接続となり、搭載実装の作
業効率が悪くかつその接続信頼性の点で問題があった。In the above conventional technology, in order to mount and mount a large number of LED array chips and their driving IC chips on a substrate on which a wiring pattern is formed, die bonding is first performed using silver paste, and then wire bonding is performed. As a result, for example, assuming a B4 size LED array head with a recording density of 400 dots/inch, if all connections are made using wire bonding, there will be 9,700 wire connections per head, which will require mounting and mounting work. There were problems with poor efficiency and connection reliability.
さらに多数個のＬＥＤアレイチップ及び駆動用チップを
搭載実装後において、その特性不良個所が判明し、新チ
ップと交換リペアが可能なら修復後良品となる場合でも
従来技術によるＬＥＤアレイヘッドはりペア作業が極め
て困難であり。Furthermore, after mounting and mounting a large number of LED array chips and drive chips, if the location with defective characteristics is found and it is possible to repair and replace them with new chips, even if the product becomes good after repair, it is not possible to reassemble the LED array head using conventional technology. It is extremely difficult.
ＬＥＤアレイチップにおけるリペアは事実上不可能であ
る。Repairs on LED array chips are virtually impossible.
本発明の目的は、上記従来技術の問題点を解決し５作業
効率接続信頼性の向上および特性不良チップのりペアを
可能とするＬＥＤアレイヘッドを提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide an LED array head which solves the above-mentioned problems of the prior art, improves work efficiency, improves connection reliability, and enables pairing of chips with defective characteristics.
前記の目的は透明な基板の一方の面に配線パターンを形
成し、この配線パターンのパット部に対向してはんだバ
ンプを介して接続されたＬＥＤアレイチップおよび駆動
用ＩＣチップを形成し、かつ前記基板の他方の面に感光
体ドラム面に対向するレンズ系を形成し、前記ＬＥＤア
レイチップからの光を前記基板および前記レンズ系を通
過して感光ドラム面に到達するように構成することによ
り達成される。The purpose of the above is to form a wiring pattern on one side of a transparent substrate, form an LED array chip and a driving IC chip facing the pads of this wiring pattern and connected through solder bumps, and Achieved by forming a lens system facing the photosensitive drum surface on the other surface of the substrate, and configuring the light from the LED array chip to pass through the substrate and the lens system to reach the photosensitive drum surface. be done.
本発明はＬＥＤアレイチップの接続端子をはんだバンプ
にて形成し、基板配線パターンのパット部を前記ＬＥＤ
アレイチップの接続端子の寸法に略一致させ、かつはん
だヌレ性の優れた金属膜で形成しておき、ＬＥＤアレイ
チップをフェイスダウン状に基板配線パターンのパット
部に搭載し、はんだリフロ法によって同時に多数個のＬ
ＥＤアレイチップを接続している。In the present invention, the connection terminals of the LED array chip are formed with solder bumps, and the pad portions of the board wiring pattern are connected to the LED array chips.
The dimensions of the array chip's connecting terminals are approximately the same as those of the connecting terminals, and the LED array chip is formed of a metal film with excellent solderability.The LED array chip is mounted face down on the pad of the board wiring pattern, and is simultaneously soldered using the solder reflow method. many L
The ED array chip is connected.
したがって、前記ＬＥＤアレイチップの搭載実装作業効
率が向上し、かつその接続信頼性も向上するのみでなく
実装後に判定した特性異常ＬＥＤアレイチップのりベア
も可能になる。Therefore, the mounting efficiency of the LED array chip is improved, and the connection reliability thereof is also improved, and it is also possible to carry out the installation of the LED array chip with abnormal characteristics determined after mounting.
以下１本発明の一実施例を示す第１図および第２図につ
いて説明する。第１図は本発明によるＬＥＤアレイヘッ
ドを示す断面図、第２図は第１図に示すＬＥＤアレイヘ
ッドを用いたＬＥＤプリンターの断面概略図である。1 and 2 showing an embodiment of the present invention will be explained below. FIG. 1 is a cross-sectional view showing an LED array head according to the present invention, and FIG. 2 is a schematic cross-sectional view of an LED printer using the LED array head shown in FIG.
第１図に示すように、ガラス基板１上に配線パターン２
を形成し、反対側に感光ドラム８の面に対接するロッド
レンズ７を有するヒートシング９を保持している。前記
配線パターン２はＣｒ０．１μ腸にて形成され、そのパ
ット部２ａに対向するようにＬＥＤアレイチッ人および
駆動用ＩＣチップ５をはんだバンプ４にて接続し、外部
との接続をフレキシブルプリント基板６にて引き出され
ている。前記パット部２ａはＣｒ−８ｉ−０制限抵抗を
介して前記はんだバンプ４に接続されている。また前記
パット部２ａはＣｕ４μ■およびＡｕＯ，３μ■を合せ
て４層構成にし、それぞれバッタリング法にて膜形式を
行ない、さらにフォトエツチング法にてパターン形式を
行なっている。そして前記ＬＥＤアレイチップ３および
駆動用ＩＣチップ５をフェイスダウン状にフリップチッ
プボンディング形式で搭載し、はんだリフロー法にて多
数個同時に接続することが可能な構成をしている。As shown in FIG. 1, a wiring pattern 2 is placed on a glass substrate 1.
, and holds a heat sink 9 having a rod lens 7 facing the surface of the photosensitive drum 8 on the opposite side. The wiring pattern 2 is formed of 0.1μ Cr, and the LED array chip and driving IC chip 5 are connected to each other by solder bumps 4 so as to face the pad portion 2a, and external connections are made using a flexible printed circuit board 6. It is extracted at. The pad portion 2a is connected to the solder bump 4 via a Cr-8i-0 limiting resistor. The pad portion 2a has a four-layer structure including Cu 4 μι and AuO 3 μι, each formed into a film by a battering method, and further patterned by a photoetching method. The LED array chip 3 and driving IC chip 5 are mounted face-down in a flip-chip bonding format, so that a large number of them can be connected simultaneously using a solder reflow method.
本発明によるＬＥＤアレイヘッドは前記のように構成さ
れているから、ＬＥＤアレイチップ３がら発した光が、
ガラス基板１を透過し、ロッドレンズ７を通過して感光
体ドラム８面に到達すると、第２図に示すようにあらが
じめ帯電器１１にて帯電した感光体ドラム８面に電位像
を形成し、現像機１２でトナー粉を付着して顕像化する
。ついで記録紙１３を転写帯電器１４で帯電しつつ前記
感光体ドラム８面に押圧してトナー像を転写し、これを
定着して記録画像を得る。Since the LED array head according to the present invention is configured as described above, the light emitted from the LED array chip 3
When it passes through the glass substrate 1, passes through the rod lens 7, and reaches the surface of the photoreceptor drum 8, a potential image is formed on the surface of the photoreceptor drum 8, which has been previously charged by the charger 11, as shown in FIG. A developing machine 12 applies toner powder to visualize the image. Next, the recording paper 13 is charged by a transfer charger 14 and pressed against the surface of the photoreceptor drum 8 to transfer a toner image and fix it to obtain a recorded image.
したがって本発明によるＬＥＤアレイヘッドは従来のワ
イヤボンデング形式による場合と比較して作業効率およ
び接続信頼性を向上することができる。Therefore, the LED array head according to the present invention can improve work efficiency and connection reliability compared to the conventional wire bonding type.
本発明によれば、ＬＥＤアレイチップはフェイスダウン
状にフリップチップボンディング形式で、はんだリフロ
ー法にて多数個同時に接続することができるため、ワイ
ヤボンディング形式と比較して作業効率が大幅に向上す
る。さらに接続信頼性における比較でも勝っており、か
つ特性不良チップが混入搭載された時のりペア化が可能
である等の効果がある。According to the present invention, a large number of LED array chips can be simultaneously connected face-down by flip-chip bonding using the solder reflow method, so that work efficiency is greatly improved compared to the wire bonding method. Furthermore, it is superior in terms of connection reliability, and has the advantage of being able to be paired even when chips with defective characteristics are installed.
第１図は本発明の一実施例であるＬＥＤアレイヘッドを
示す断面図、第２図は第１図に示すＬＥＤアレイヘッド
を用いたＬＥＤプリンターの断面概略図である。
１・・・ガラス基板、２・・・配線パターン、３・・・
ＬＥＤアレイチップ、４・・・はんだバンブ、５・・・
駆動用ＩＣチップ、６・・・ＦＰＣ１７・・・ロッドレ
ンズ、８・・・感光体ドラム、９・・・ヒートシンク、
１０・・・ヘッドカバー。
第 １ 図
第 ｚ ｚFIG. 1 is a cross-sectional view showing an LED array head according to an embodiment of the present invention, and FIG. 2 is a schematic cross-sectional view of an LED printer using the LED array head shown in FIG. 1...Glass substrate, 2...Wiring pattern, 3...
LED array chip, 4... Solder bump, 5...
Drive IC chip, 6...FPC17...rod lens, 8...photosensitive drum, 9...heat sink,
10...Head cover. Figure 1 z z
Claims (1)
の配線パターンのパット部に対向してはんだバンプを介
して接続され発光ダイオード素子アレイチップおよび駆
動用ＩＣチップを形成し、かつ前記基板の他方の面に感
光体ドラム面に対向するレンズ系を形成し、前記発光ダ
イオード素子アレイチップからの光を前記基板および前
記レンズ系を介して前記感光体ドラム面に到達するよう
に構成したことを特徴とする発光ダイオード素子アレイ
。1. A wiring pattern is formed on one surface of a transparent substrate, and a light emitting diode element array chip and a driving IC chip are formed by connecting via solder bumps facing the pads of this wiring pattern, and the substrate A lens system facing the photoreceptor drum surface is formed on the other surface of the light emitting diode element array chip, and light from the light emitting diode element array chip reaches the photoreceptor drum surface via the substrate and the lens system. A light emitting diode element array featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62089933A JPS63256465A (en) | 1987-04-14 | 1987-04-14 | Light emitting diode array |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62089933A JPS63256465A (en) | 1987-04-14 | 1987-04-14 | Light emitting diode array |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63256465A true JPS63256465A (en) | 1988-10-24 |
Family
ID=13984496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62089933A Pending JPS63256465A (en) | 1987-04-14 | 1987-04-14 | Light emitting diode array |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63256465A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6417745U (en) * | 1987-07-24 | 1989-01-30 | ||
| EP0402341A1 (en) * | 1989-03-06 | 1990-12-12 | Polaroid Corporation | Integral fiber optic printhead |
| WO2005113252A3 (en) * | 2004-05-19 | 2006-05-04 | Intense Ltd | Thermal printing with laser activation |
-
1987
- 1987-04-14 JP JP62089933A patent/JPS63256465A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6417745U (en) * | 1987-07-24 | 1989-01-30 | ||
| EP0402341A1 (en) * | 1989-03-06 | 1990-12-12 | Polaroid Corporation | Integral fiber optic printhead |
| WO2005113252A3 (en) * | 2004-05-19 | 2006-05-04 | Intense Ltd | Thermal printing with laser activation |
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