JPS63256267A - Soldering method - Google Patents

Abstract

PURPOSE:To enable soldering by bringing the electric wire covered by an insulation material into contact with the part to be connected as it is by removing the insulating cover of a connection part, dropping a molten solder to the connection place of the electric wire and thereafter soldering the connecting place of the wire to the connection part by a soldering iron. CONSTITUTION:A soldering iron 5 is heated and an electric wire 3 is placed on the land 2 above a printed circuit board 1. A roll device 20 is then moved and a string like solid solder 18 is fed to a soldering iron tip 6 to form a solder pool. A holding part is moved downwards, the soldering iron tip 6 is brought into contact with the electric wire 3, and simultaneously the solder pool is dropped on the electric wire 3 and an insulation material is scattered with the heat thereof to pull out a core wire 4. The roll device 20 is further moved and a string like solder 18 is drawn out and fed to the soldering iron tip 6 and after forming the solder pool it is dropped on the core wire 4 to fix the core wire 4 and land 2. With this method soldering can be effected as it is by bringing the electric wire covered by insulation material into contact with the part to be brought into contact.

Description

[Detailed Description of the Invention] [Industrial Application Field] This invention relates to a method of soldering 11 wires covered with a sleeve-shaped insulator to a connected part 9, such as a land of a printed wiring board. .

[Conventional technology]

A printed wiring board on which an electronic circuit pattern is printed has a connection part to which a wire is soldered for electrical connection with an external electrical component such as a switch.

In other words, some have a land. The above-mentioned electric wires are usually made of steel with a sleeve-shaped insulating material such as polyurethane wrapped around the core, and it is necessary to remove this insulating covering before soldering to the above-mentioned land. .

Figures 5 and 6 are diagrams for explaining this conventional soldering method. In Figure 1, (1) is a printed wiring board on which an electronic circuit pattern is printed, and (2) is this printed wiring board (1 ) is a connected part, that is, a land, to which the electric wire (3) is soldered. The % wire (3) ri to be soldered to this land (2) and the copper core edge (4) are covered with an insulating material such as polyurethane in the form of a sleeve.
It is arranged in the installation part of the printed wiring board (1) where is installed. (5) is this electric & I (31) above land (2)
A soldering iron is used for soldering, and its tip (6) is heated by a built-in heater (7).

(8) is melted by the heat generated by this soldering iron (5).

This is a solid solder rod used to fall onto the electric wire (3) and fix it to the land (2). (9) is a crucible placed in a separate place in which a molten solder bath a1 is stored, and this solder bath α is heated by a built-in heater (111).
[There is.

Next, to explain the conventional soldering method, first, move the nt11M+31 placed in the installation part, insert the tip part that will be the connection point into the crucible α1, and scatter the insulation vtJ with the heat. , pull out the core wire (4). Next, this electrofusion (3) is moved to the land (2) that will be the connected part, and the core wire (4) that will be the connection point is placed on this land +2), and then heated by the heater (7). Move the tip (6) to the connection point between the core wire (4) and the land 121. Then, attach the solder bar (8) to this iron tip (Q).
After melting the solder for 11 minutes in contact with the iron tip (6) and adhering the molten solder to the core wire (4) and land (2).

By solidifying, %* (31 is fixed to the land (2).

[Problem that the invention seeks to solve]

Conventionally, in order to fix a wire coated with a sleeve-shaped insulator to a connected part, it was necessary to separately prepare an insulation removal device to remove the insulation, and the wire was also removed from the above removal device. The problem was that it had to be moved to

The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a method that allows a tIIM coated with an insulating material to be fixed to a connected part while remaining in contact with the connected part.

[Means for solving problems]

The soldering method according to the present invention involves arranging a connection point of an insulated electrofusion coated with a sleeve-shaped insulator on a part to be connected, and then forming the connection point of the electric wire with a heated soldering iron. The insulating coating on the core portion is removed by dropping the molten solder, and then the connection point of the upper d pin 'fJLIii11 is soldered to the connection part using the soldering iron.

[Effect]

In this invention, a connection point of an electric wire covered with a sleeve-shaped insulating material is placed on a connected part, solder is supplied to a heated soldering iron to form molten solder, and then the molten solder is applied to the electric wire. The insulating material is scattered by falling onto the connection point of the electric wire, and further, solder is supplied to a soldering iron to fix the connection point of the electric wire from which the insulating material has been removed to the connected part.

〔Example〕

An embodiment of the present invention will be described below with reference to FIGS. 1 to 3.

In the figure, (1) to (7) are the same as those explained in the conventional example, and the explanation is omitted. A soldering iron (5) is fixed to the tip of part Q3. I is a cylinder provided above this holding part (I).

It is driven by hydraulic or pneumatic pressure to move the holding part 0 in the vertical direction. acJ is a nozzle which is fixed to the lower end of the horizontal part a3 of the above-mentioned reporting part (I'a) and whose tip is directed towards the soldering iron tip (6) of the above-mentioned soldering iron (5), and is compressed by the compressed air supply device or Air is blown onto the soldering iron tip (6).rld is the thread-like solid solder supplied to this soldering iron tip (6) (at the supply section of II).

There is a reel 0 on which this solid solder 0 is wound, and a roll device (2) that pulls out the solid solder (18) from this reel 0.

It is composed of a direction correction guide Cυ that guides the thread-like uniform solder Ql that has passed through the roll device (to) to the soldering iron tip (6).

Note that this direction correction guide C1υ is integrally fixed to the above-mentioned holding part along with the soldering iron (5). Further, @ is a solder pool in which this filamentous solid solder Qll is supplied to the soldering iron tip (6) and melted in a bath. @ is upper ^d cylinder〇41゜Compressed air supply device Qe, soldering iron (5), roll device■
For example, a sequencer is used as a control section that connects the components to each other and controls the movements of each component in relation to each other.

Next, the soldering method will be explained using the flowchart shown in FIG. First, drive the cylinder 〇 to pull the soldering iron (5) upward (step 25). Next, heat the soldering iron (step 24), place the electric wire (3) on the land (2) on the printed wiring & (l) installed in the installation part, and check whether it is in the specified position (step 26) .27). Next, issue a command from the control unit (2) to move the roll device 4.

Thread-like solid solder is supplied to the iron tip (6) via the direction correction guide QD and melted to form a solder pool (2). At this time, a large amount of the filamentous solder aυ is drawn out to form a loop between the roll device (to) and the direction correction guide (step 28). Next, send the following signal from the control unit @ to move the cylinder I, move the holder α downward, bring the tip (6) into contact with the electric wire 1w+31, and move the solder pool @ to the electric wire (3 ), the insulator is scattered by the heat and the core wire (4) comes out (Step 29.3
0). Furthermore, a new signal issued from the control unit @ moves the roll device tli (a), pulls out the thread-like solid solder, supplies it to the iron tip <6), melts it, and forms a solder pool, and then the core wire (4) By dropping it upward, the core wire (4) and land (2) are fixed (step! s1,
52.35). Next, the cylinder A is driven by the signal from the control unit (C), the holding part is pulled upward (Step 64), and compressed air is blown from the nozzle 4 onto the tip (6) to remove excess solder. Blow it off and prepare for the next soldering operation (step 55). In the same way, print distribution board (1
) to the installation part in order, and then solder the electric wire (3) to the land (2) in the same way as above, allowing you to continue the soldering work efficiently.

[Effects of the Invention] As explained above, the present invention has a sleeve-shaped insulating coating 7' (after placing the connection point of the electric wire on the connected part, a heated soldering iron is applied to the connection point of the tIL&i). Using the molten solder formed in the tMKi to remove the insulation coating, supply solder to the soldering iron held in that position, remove the insulation coating, drop the molten solder, and connect the wire to the connected part. Since the method of soldering is to solder to the wire, if the electric wire covered with an insulating material is brought into contact with the part to be connected, soldering can be performed as is, and the soldering can be performed efficiently.

It has the effect of improving work efficiency.

[Brief explanation of drawings]

FIG. 1 is a side view schematically showing a soldering device used in the present invention, and FIGS. 2 and 3 are partially enlarged views showing its operating state. Fig. 4 is a flowchart showing the soldering method of the present invention, Fig. 5 is a schematic side view showing the conventional soldering method, and Fig. 6 is a flowchart showing the conventional soldering method. FIG. 3 is a cross-sectional view showing a device for removal. In the figure, (2) is land, +3) t'i'lL line, (
5) is a soldering iron, IJ21 is a holding part, α脾 is a cylinder, αη is a supply part of thread-like solid solder, αS is thread-like solid solder, Qυ is a direction correction guide, and the same symbols in the figure indicate the same or equivalent inspection. shows.

Claims (1)

[Claims] After placing the connection point of an insulated wire covered with a sleeve-shaped insulator on the part to be connected, molten solder formed with a heated soldering iron is dropped onto the connection point of the wire to remove the insulation coating of the part. , and then soldering the connection point of the electric wire to the connected part using the soldering iron.