JPS63253799A - Speaker system with amplifier - Google Patents
Speaker system with amplifierInfo
- Publication number
- JPS63253799A JPS63253799A JP8682387A JP8682387A JPS63253799A JP S63253799 A JPS63253799 A JP S63253799A JP 8682387 A JP8682387 A JP 8682387A JP 8682387 A JP8682387 A JP 8682387A JP S63253799 A JPS63253799 A JP S63253799A
- Authority
- JP
- Japan
- Prior art keywords
- amplifier
- speaker unit
- power
- radiation plate
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007599 discharging Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 claims 1
- 230000005855 radiation Effects 0.000 abstract 5
- 230000000694 effects Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
Landscapes
- Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、カーオーディオにおけるスピーカユニットに
おいて、特に、コンパクトで迫力あるアンプ付スピーカ
システムに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a speaker unit for car audio, and particularly to a compact and powerful speaker system with an amplifier.
従来の装置は、特開昭６１−２１９２８９号に記載のよ
うに、熱伝導性の良い材質で特別に形成されたバスレフ
ボートの１部にアンプ回路の発熱部品を取付ける事によ
り効果的に放熱を行なっていた。As described in Japanese Patent Application Laid-Open No. 61-219289, conventional devices effectively dissipate heat by attaching the heat-generating components of the amplifier circuit to a part of a bass reflex boat that is specially made of a material with good thermal conductivity. I was doing it.
上記従来技術は、ホームオーディオなど、スペースにこ
だわる必要がない場合においては、問題はないが、カー
オーディオなど、コンパクト化が要求されるシステムに
おいては、形状が大きすぎ収納が難かしいという問題が
あった。The above conventional technology has no problems in cases where space is not a concern, such as home audio systems, but in systems that require compactness, such as car audio systems, there is a problem that the shape is too large and it is difficult to store it. Ta.
本発明の目的は、上記不具合を解決することにある。An object of the present invention is to solve the above-mentioned problems.
上記目的は、アンプ回路の発熱部品であるパワーＩＣを
取り付けた放熱板を、スピーカーユニットのバックプレ
ートに共締めすることにより、達成される。The above object is achieved by fastening together a heat sink to which a power IC, which is a heat generating component of an amplifier circuit, is attached to a back plate of a speaker unit.
アンプ回路の発熱部品であるパワーＩＣを取り付けた放
熱板をスピーカユニットのバックプレートにネジ等で共
締めする事により、パワーＩＣの発熱が、バックプレー
トを伝わり、放熱される事となり、パワーＩＣの温度上
昇がおさえられ、安定したアンプ特性を得る事ができる
。By fastening the heat sink to which the power IC, which is a heat generating component of the amplifier circuit, is attached, to the back plate of the speaker unit with screws, etc., the heat generated by the power IC will be transmitted through the back plate and dissipated. Temperature rise is suppressed and stable amplifier characteristics can be obtained.
以下、本発明の一実施例を図面により説明する。 An embodiment of the present invention will be described below with reference to the drawings.
図面において電気部品１２ 、１３ 、１４は、プリン
ト基板１９にハンダ付されて２す、プリント基板１９は
ネジ１０ 、１１により、放熱板５に実装される。又パ
ワーＩＣ８も、ネジ９により放熱板５に実装されている
。放熱板５は、ネジ６により、スピーカユニット２２の
バックプレート４にネジ止めされている為に、パワーＩ
Ｃ８の発熱は、放熱板５を介し、スピーカユニット２２
のバックプレート４１マクネツト３及びプレート２．ス
ピーカフレーム１などを介し放熱される。よって実施例
によれば、アンプ部を実装する為の特別な付属品が不要
で、かつ非常にコンパクトな形状で、アンプ回路の特性
を良好に発揮する効果がある。電気信号の系統は、ヘッ
ドユニット２１の出力信号は、ケーブル１６′を通じコ
ネクター１８を介し、プリント基板１９に送られる。プ
リント基板１９に入力された信号は、プリント基板１９
上に実装された電気部品１２ 、１３ 、１４などを介
して、パワーＩＣ８で増巾され、増巾されたｉ号は、コ
ネクター１７を介してケーブル１５を通じコネクター７
を介し、スピーカユニット２２に伝達され、スピーカユ
ニット２２で電気信号が、音源信号に変換され、放出さ
れる。In the drawings, electrical components 12, 13, and 14 are soldered to a printed circuit board 19, and the printed circuit board 19 is mounted on a heat sink 5 with screws 10 and 11. The power IC 8 is also mounted on the heat sink 5 with screws 9. Since the heat sink 5 is screwed to the back plate 4 of the speaker unit 22 with screws 6, the power I
The heat generated by C8 is transmitted to the speaker unit 22 via the heat sink 5.
back plate 41 machinette 3 and plate 2. Heat is radiated through the speaker frame 1 and the like. Therefore, according to the embodiment, there is no need for any special accessories for mounting the amplifier section, and the amplifier circuit has an extremely compact shape, which has the effect of exhibiting the characteristics of the amplifier circuit well. As for the electrical signal system, the output signal of the head unit 21 is sent to the printed circuit board 19 via the cable 16' and the connector 18. The signal input to the printed circuit board 19 is
Through the electrical components 12, 13, 14, etc. mounted on the top, the power IC 8 amplifies the width of the i signal, and the amplified signal I passes through the cable 15 via the connector 17 to the connector 7.
The electrical signal is transmitted to the speaker unit 22 via the speaker unit 22, where the electrical signal is converted into a sound source signal and emitted.
本発明によれば、（１）スピーカユニットのバックプレ
ートにアンプ部を実装可能さする事により、コンパクト
なアンプ付スピーカシステムを実現できる。（２）アン
プ部をスピーカユニットのバックプレートに配置する事
により、アンプ出力部からスピーカユニット塩の配線を
短かくでき、損失の少ないアンプ付スピーカシステムを
得られる。（３）アンプ回路の発熱をスピーカユニット
を介して、放熱する事により、アンプ回路の温度上昇を
よく甘いし、安定したアンプ特性を得ることができる。According to the present invention, (1) a compact speaker system with an amplifier can be realized by making it possible to mount the amplifier section on the back plate of the speaker unit. (2) By arranging the amplifier section on the back plate of the speaker unit, the wiring from the amplifier output section to the speaker unit salt can be shortened, and a speaker system with an amplifier with low loss can be obtained. (3) By dissipating the heat generated by the amplifier circuit through the speaker unit, the rise in temperature of the amplifier circuit can be moderated and stable amplifier characteristics can be obtained.
図面は、本発明の一実施例を示すスピーカの構成図であ
る。The drawing is a configuration diagram of a speaker showing an embodiment of the present invention.
Claims (1)
ニットを駆動するアンプ回路部に組み込まれたパワーＩ
Ｃの発熱を効率良く行なう為の放熱板を、スピーカユニ
ットのバックプレートにネジで共締した事を特徴とする
アンプ付スピーカシステム。1. In a speaker system with an amplifier, the power I built into the amplifier circuit that drives the speaker unit
A speaker system with an amplifier characterized in that a heat dissipation plate for efficiently discharging heat from C is co-fastened to the back plate of the speaker unit with screws.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8682387A JPS63253799A (en) | 1987-04-10 | 1987-04-10 | Speaker system with amplifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8682387A JPS63253799A (en) | 1987-04-10 | 1987-04-10 | Speaker system with amplifier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63253799A true JPS63253799A (en) | 1988-10-20 |
Family
ID=13897529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8682387A Pending JPS63253799A (en) | 1987-04-10 | 1987-04-10 | Speaker system with amplifier |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63253799A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03103694U (en) * | 1990-02-08 | 1991-10-28 | ||
| GB2305809A (en) * | 1995-09-28 | 1997-04-16 | Harman Int Ind | Loudspeaker drive unit acts as heatsink for amplifier |
| GB2319923A (en) * | 1996-11-27 | 1998-06-03 | Sony Uk Ltd | Loudspeaker yoke acts as heatsink |
| US6373957B1 (en) | 2001-05-14 | 2002-04-16 | Harman International Industries, Incorporated | Loudspeaker structure |
-
1987
- 1987-04-10 JP JP8682387A patent/JPS63253799A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03103694U (en) * | 1990-02-08 | 1991-10-28 | ||
| GB2305809A (en) * | 1995-09-28 | 1997-04-16 | Harman Int Ind | Loudspeaker drive unit acts as heatsink for amplifier |
| GB2305809B (en) * | 1995-09-28 | 1997-11-05 | Harman Int Ind | Power amplifier and loudspeaker frame integration |
| US6263084B1 (en) | 1995-09-28 | 2001-07-17 | Harman International Industries, Incorporated | Power amplifier and loudspeaker frame integration |
| GB2319923A (en) * | 1996-11-27 | 1998-06-03 | Sony Uk Ltd | Loudspeaker yoke acts as heatsink |
| GB2319923B (en) * | 1996-11-27 | 2000-09-27 | Sony Uk Ltd | Loudspeaker |
| US6373957B1 (en) | 2001-05-14 | 2002-04-16 | Harman International Industries, Incorporated | Loudspeaker structure |
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