JPS63249627A - Manufacture of releasable material - Google Patents
Manufacture of releasable materialInfo
- Publication number
- JPS63249627A JPS63249627A JP8284187A JP8284187A JPS63249627A JP S63249627 A JPS63249627 A JP S63249627A JP 8284187 A JP8284187 A JP 8284187A JP 8284187 A JP8284187 A JP 8284187A JP S63249627 A JPS63249627 A JP S63249627A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- thermoplastic resin
- polyolefin
- dimethylpolysiloxane
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title claims abstract description 5
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 239000004205 dimethyl polysiloxane Substances 0.000 claims abstract description 25
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims abstract description 25
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims abstract description 25
- 229920000098 polyolefin Polymers 0.000 claims abstract description 20
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 20
- 239000000203 mixture Substances 0.000 claims abstract description 18
- 238000002844 melting Methods 0.000 claims abstract description 7
- 230000008018 melting Effects 0.000 claims abstract description 7
- -1 polyethylene Polymers 0.000 claims description 21
- 238000010894 electron beam technology Methods 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- 229920000573 polyethylene Polymers 0.000 claims description 10
- 239000004698 Polyethylene Substances 0.000 claims description 9
- 229920001577 copolymer Polymers 0.000 claims description 7
- 239000004711 α-olefin Substances 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 3
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 31
- 230000005855 radiation Effects 0.000 abstract description 2
- 239000004743 Polypropylene Substances 0.000 description 15
- 229920001155 polypropylene Polymers 0.000 description 11
- 238000002156 mixing Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 239000000123 paper Substances 0.000 description 6
- 238000003475 lamination Methods 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 5
- 239000012298 atmosphere Substances 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 4
- 229920001684 low density polyethylene Polymers 0.000 description 4
- 239000004702 low-density polyethylene Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002655 kraft paper Substances 0.000 description 2
- 239000003550 marker Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical class C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229920001179 medium density polyethylene Polymers 0.000 description 1
- 239000004701 medium-density polyethylene Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000010902 straw Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920002397 thermoplastic olefin Polymers 0.000 description 1
- 229920001567 vinyl ester resin Chemical class 0.000 description 1
- 125000000391 vinyl group Chemical class [H]C([*])=C([H])[H] 0.000 description 1
- 150000007934 α,β-unsaturated carboxylic acids Chemical class 0.000 description 1
Landscapes
- Treatments Of Macromolecular Shaped Articles (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は主としてワッペン、シール等の基台面とか、巻
回された包装用テープ等の背面に剥離性を付与する剥離
紙等の製造方法に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention mainly relates to a method for manufacturing release paper, etc. that imparts releasability to the base surface of patches, stickers, etc., or the back surface of wound packaging tape, etc. .
従来、ワラ(ン、シール等の粘着性シートの基台に使用
される剥離紙、或いは巻回された包装用粘着テープ等の
背面には、剥離性を発現させるために、ポリオレフィン
をラミネートした基材面上に、高価な反応性シリコーン
を塗布し、さらに熱硬化処理を行なっていた。その工程
は、シリコーンを塗布、乾燥、架橋させる処理工程から
成るが。Conventionally, release paper used as a base for adhesive sheets such as straw, stickers, etc., or the back side of wound packaging adhesive tapes, etc., has a polyolefin-laminated base in order to exhibit releasability. Previously, expensive reactive silicone was applied onto the surface of the material, followed by a heat curing process.The process consisted of applying the silicone, drying it, and crosslinking it.
通常、その際の装置の長さは数十メートルにも達し、大
規模なものとなる。さらに、反応性シリコーンを塗布す
る際に、トルエンなどの溶媒を使用するため、その回収
にも多大な設備費とエネルギーを必要としている。Usually, the length of the equipment at that time reaches several tens of meters, making it large-scale. Furthermore, since a solvent such as toluene is used when applying reactive silicone, a large amount of equipment cost and energy is required to recover the solvent.
上記シリコーン油を熱可塑性樹脂に混合する方法によっ
て、性能の良い剥離紙の製造が可能であれば、上記大規
模な工程を省略することが出来る。If a release paper with good performance can be produced by mixing the silicone oil with a thermoplastic resin, the large-scale process described above can be omitted.
しかし、この場合、剥離紙として要求される剥離性が発
現しないばかシでなく、表面にブリードしたシリコーン
油が、ワッペン、シール等の粘着剤層に移行し、その粘
着力が低下し、ワッペン、シールとして致命的欠陥とな
る。However, in this case, the releasability required for release paper is not achieved, and the silicone oil that bleeds onto the surface transfers to the adhesive layer of patches, stickers, etc., reducing its adhesive strength. This is a fatal flaw as a seal.
この問題を解決する方法として、特開昭57−1872
21では、放射線硬化型オルガノポリシロキサンを樹脂
に添加混合して、ラミネーションおよびインフレーショ
ン法によって成形した後、放射線を照射する方法が提案
されているが、この方法では、メルカプト基などを含む
高価なオルガノシロキサンを使用しないと実用に耐える
程度の性能が発現しない。As a method to solve this problem,
No. 21 proposes a method in which a radiation-curable organopolysiloxane is added and mixed with a resin, molded by lamination and inflation methods, and then irradiated with radiation. If siloxane is not used, practical performance will not be achieved.
本発明者らは、上記の現行法での問題点を勘案し、煩雑
な工程を必要としない、安価な剥離性材料の製造法を開
発すべく鋭意検討した結果、単独で加熱したり電子線照
射をするだけでは硬化することが困難な化学的に安定な
ジメチルポリシロキサンとポリオレフィン系熱可塑性樹
脂とから成る組成物を成形し、成形品の表面にジメチル
ポリシロキサンをブリードせしめた後、電子線照射を施
こすことによってすぐれた剥離性能(低剥離強度及び高
残留粘着率)が発現されること、さらに驚くべきことに
、剥離性能が高いにもかかわらず、マジックインキ筆記
性が良好であることを発見し。The inventors of the present invention took into consideration the problems with the current methods described above, and as a result of intensive studies to develop an inexpensive method for producing removable materials that does not require complicated processes, the inventors found that they A composition consisting of a chemically stable dimethylpolysiloxane and a polyolefin thermoplastic resin, which is difficult to cure by simply heating, is molded, and after the dimethylpolysiloxane bleeds onto the surface of the molded product, it is irradiated with an electron beam. It was found that excellent peeling performance (low peel strength and high residual adhesion rate) was achieved by applying this method, and more surprisingly, despite the high peeling performance, the marker ink writing properties were good. Discover.
新規な剥離紙の製造方法として提案している。This is proposed as a new method for producing release paper.
本研究者等は、更に鋭意研究を重ねたところ、電子線照
射後、空気中でポリオレフィン系熱可塑性樹脂の融点未
満の温度で熱処理を施こすことによって、さらに剥離性
能が向上すること及び照射線量が著しく低い場合でも良
好な剥離性能が発現することを発見した。After further intensive research, the present researchers found that after electron beam irradiation, heat treatment in air at a temperature below the melting point of the polyolefin thermoplastic resin further improved the peeling performance and the irradiation dose. It has been discovered that good peeling performance can be achieved even when the
本発明は極めて反応性に乏しく性能の発現が難しかった
ジメチルポリシロキサンを剥離剤として使用することが
可能なことを発見したことに基づいてなされたものであ
る。The present invention was made based on the discovery that dimethylpolysiloxane, which had extremely low reactivity and was difficult to exhibit its performance, could be used as a stripping agent.
以下、本発明の詳細な説明する。 The present invention will be explained in detail below.
本発明において原料として用いられるポリオレフィン系
熱可塑性樹脂としては、高密度テリエチレン、中密度ポ
リエチレン、低密度ポリエチレン。The polyolefin thermoplastic resin used as a raw material in the present invention includes high-density teriethylene, medium-density polyethylene, and low-density polyethylene.
ポリプロピレンお−よびこれらの共重合体、エチレンと
ビニルエステル又はα、β−不飽和カルボン酸エステル
との共重合体などが使用できる。好まシくは、エチレン
重合体、エチレン−プロピレン共重合体、エチレン−ブ
テン共重合体、ポリプロピレン、ポリブテン、ポリ−4
−メチル−1−ペンテンが使用できる。これらは単独で
も性能発揮するが、特定の2種類以上の混合物を使用す
ることによって性能の発現を容易にすることができる。Polypropylene and copolymers thereof, copolymers of ethylene and vinyl esters or α,β-unsaturated carboxylic acid esters, etc. can be used. Preferably, ethylene polymer, ethylene-propylene copolymer, ethylene-butene copolymer, polypropylene, polybutene, poly-4
-Methyl-1-pentene can be used. These can exhibit performance even when used alone, but performance can be facilitated by using a mixture of two or more specific types.
この場合、ポリエチレンとC3〜C5のα−オレフィン
の単重合体もしくは共重合体を必須成分とする混合物を
使用することが好ましい。中でも、低密度ポリエチレン
とポリプロピレンの混合物ヲ使用することが適している
。その組成比は1.j51J工チレン1〜99重i%に
対してポリプロピレン99〜1重量係で、好ましくは、
ポリエチレン10重量゛チ以上ないし40重量%以下に
対し、ポリプロピレン90重量%以下ないし60重量%
以上、及び、ポリエチレン90重量%以下ないし60重
量%以上に対し、ポリプロピレン10重量%以上ないし
40重量%以下、さらに好ましくはポリエtレン15〜
30重量%に対してポリグロtv785〜70重量%及
び、ポリエチレン85〜70重量優に対してポリプロピ
レン15〜30重量%である。ポリエチレンが40重量
%よシ多(60重量−未満に対してポリプロピレンが6
゜重量係未満40重量%より多い場合には、性能発揮上
は問題はないが、成形性が著しく悪くなる。In this case, it is preferable to use a mixture containing polyethylene and a homopolymer or copolymer of C3 to C5 α-olefin as essential components. Among these, it is suitable to use a mixture of low density polyethylene and polypropylene. Its composition ratio is 1. j51J Polypropylene 99 to 1 weight percent to 1 to 99 weight i% of polyethylene, preferably,
90% by weight or less to 60% by weight of polypropylene to 10% by weight or more to 40% by weight of polyethylene
Above, polypropylene is 10% to 40% by weight, more preferably polyethylene 15% to 40% by weight, based on 90% to 60% by weight of polyethylene.
785-70% by weight of polyglo tv to 30% by weight and 15-30% by weight of polypropylene to 85-70% by weight of polyethylene. Polyethylene is more than 40% by weight (polypropylene is less than 60% by weight)
If the amount is more than 40% by weight, there will be no problem in terms of performance, but the moldability will be significantly worse.
ポリオレフィン系熱可塑性樹脂のメA/)インデックス
又はメルト20−インデックスは、一般的には0.01
〜200.9/l0m1nであ)、0.1〜10010
0l710が望ましく、1〜20.9/lominが好
適である。The mea/) index or melt 20-index of polyolefin thermoplastic resin is generally 0.01.
~200.9/l0m1n), 0.1~10010
0l710 is desirable, and 1 to 20.9/lomin is suitable.
また、最も容易に性能が発現する組成である低密度ポリ
エチレンとポリプロピレンの混合物におけるメルトイン
デックスは、ポリエチレンとしては0. Ol 〜20
0 g/10m1nであり、O,l 〜l OOg/1
0m1nが望ましく、0.5〜15 、!i’/1or
ninが好適であり、ポリプロピレンとシテハ、0.O
1〜150、!i’/lominであり、l−100、
S’/10m1nが望ましく。Furthermore, the melt index of a mixture of low density polyethylene and polypropylene, which is the composition that most easily exhibits performance, is 0. Ol ~20
0 g/10m1n, and O,l ~l OOg/1
0m1n is desirable, 0.5~15,! i'/1or
nin is preferred, polypropylene and siteha, 0. O
1~150,! i'/lomin, l-100,
S'/10m1n is desirable.
2〜30.9/l 0m1nが好適である。2 to 30.9/l 0 m1n is suitable.
また、上記ポリオレフィン系熱可塑性樹脂に混合するジ
メチルポリシロキサンとは、末端が一8iR1R2R3
(但し、 R’ 、 R2,R’は夫々独立に、メチル
基、ヒドロオキシル基、C1〜C3のフルコキシ基から
選ばれる)なるジメチルポリシロキサンイン系熱可塑性
樹脂との混合が困難で成形しにくいはかシではなく、充
分な剥離性能を発現させるためには、多大な照射線量を
必要とし、マトリックスの樹脂の機械的強度を著しく低
下させる。また、8XIO’C8を越えると、充分な剥
離性能の発現が困難になる。In addition, the dimethylpolysiloxane to be mixed with the polyolefin thermoplastic resin has a terminal of 18iR1R2R3.
(However, R', R2, and R' are each independently selected from a methyl group, a hydroxyl group, and a C1 to C3 flukoxy group.) Difficult to mix with dimethylpolysiloxane-based thermoplastic resin and difficult to mold. In order to exhibit sufficient peeling performance without being fragile, a large irradiation dose is required, which significantly reduces the mechanical strength of the matrix resin. Moreover, if it exceeds 8XIO'C8, it becomes difficult to exhibit sufficient peeling performance.
また、ジメチルポリシロキサンのポリオシ2イン系熱可
塑性樹脂との混合割合はポリオレフィン系熱可塑性樹脂
に対して、0.5〜30重量%であり、1−15重量%
が好ましく、2〜6重量%が好適である。その量が0.
5重量%未満では、充分な剥離性能が得られず、30重
量%を越えるとジメチルポリシロキサンを混合しに<<
、成形が非常に困難になるばかシか、コスト的に不利で
ある。In addition, the mixing ratio of dimethylpolysiloxane with the polyoxydiyne thermoplastic resin is 0.5 to 30% by weight, and 1 to 15% by weight with respect to the polyolefin thermoplastic resin.
is preferable, and 2 to 6% by weight is suitable. The amount is 0.
If it is less than 5% by weight, sufficient peeling performance cannot be obtained, and if it exceeds 30% by weight, dimethylpolysiloxane cannot be mixed.
However, it is either very difficult to mold or disadvantageous in terms of cost.
上記のポリオレフィン系熱可塑性樹脂およびジメチルポ
リシロキサンを混合するには、一般に合成樹脂を混線、
混合する際に使用する装置が利用出来る。例えば、バン
バリーミキサ−、ニーダ−1二軸押出機、単軸押出機、
ロールミルなどの混合機を使って溶融混合させる方法が
ある。特に、粘度の低いジメチルポリシロキサンを使用
する場合には、通常の混合は困難となるので、押出機の
シリンダー中間部にジメチルポリシロキサンをIンゾで
注入することによシ混合する。In order to mix the above polyolefin thermoplastic resin and dimethylpolysiloxane, it is generally necessary to cross-wire the synthetic resin,
Equipment used for mixing can be used. For example, Banbury mixer, kneader 1 twin screw extruder, single screw extruder,
There is a method of melting and mixing using a mixer such as a roll mill. In particular, when dimethylpolysiloxane having a low viscosity is used, ordinary mixing becomes difficult, so dimethylpolysiloxane is injected into the middle of the cylinder of the extruder to mix it.
上記混合物を成形するには、通常の押し出しラミネーシ
ョン法および共押し出しラミネーション法、インフレー
ション法、共押し出ジインフレージョン法が1ハ目的、
用途に応じて適宜選択すればよい。この成形品に電子線
照射処理を施こすことによって、剥離性表面を形成する
ことができるO
成形後に、添加、混合したジメチルポリシロキサンを表
面にブリードさせる方法については、マトリックスの樹
脂組成、ジメチルポリシロキサンの粘度、及びジメチル
ポリシロキサンの添加tKよって異なる。成形直後に完
全にブリードしている場合が多いが、必要に応じてエイ
ジングしてもいい。エイヅングに際しては、変形が起こ
らない程度の温度をかけてもいいし、常温でもいい。ジ
メチルポリシロキサンとの関連でいうと、粘度の低いも
のの方が有利でちる。In order to mold the above mixture, the usual extrusion lamination method, coextrusion lamination method, inflation method, coextrusion di-inflation method is used for the following purposes:
It may be selected as appropriate depending on the purpose. By subjecting this molded product to electron beam irradiation treatment, a releasable surface can be formed. It varies depending on the viscosity of siloxane and the addition tK of dimethylpolysiloxane. In many cases, it bleeds completely immediately after molding, but it can be aged if necessary. When aging, the temperature may be applied to a degree that does not cause deformation, or it may be at room temperature. In relation to dimethylpolysiloxane, those with lower viscosity are more advantageous.
上記の電子線処理を実施する方法としては、コツククロ
フト型、コツククロフトワルトン型、バンプグラフ型、
絶縁コア変圧器型、直線型、ダイナミドロン型、高周波
型、エレクトロンカーテン型などの各種電子線加速器か
ら電子線を放出させる方法が挙げられる。照射線量は必
要とされる被照射物の性能によって広い範囲で変えるこ
とができる。一般には、20メガラド以下であり、2〜
10メガラドが望ましく、とシわけ3〜8メガラドが好
適である。照射線量が20メガラドを越えるとマトリッ
クスの一すマーの機械的強度が弱くなシ、実用的でない
。また、加速電圧は特にこだわらないが、100〜30
0 kVが実用的である。Methods for carrying out the above electron beam treatment include Kotsukucroft type, Kotskucroft Walton type, bumpgraph type,
Examples include methods of emitting electron beams from various types of electron beam accelerators, such as insulated core transformer type, linear type, dynamidron type, high frequency type, and electron curtain type. The irradiation dose can vary within a wide range depending on the required performance of the irradiated object. In general, it is less than 20 megarads, and 2 to
A value of 10 megarads is desirable, and a range of 3 to 8 megarads is preferred. If the irradiation dose exceeds 20 megarads, the mechanical strength of the matrix will be weak, making it impractical. Also, the acceleration voltage is not particularly particular, but it is 100 to 30
0 kV is practical.
照射時の雰囲気さしては、基本的には、不活性ガス中で
ある。ただし、ポリエチレンの場合は。The atmosphere during irradiation is basically an inert gas atmosphere. However, in the case of polyethylene.
酸素雰囲気下でもかまわない。α−オレフィンかC3以
上の単もしくは共重合体の場合、酸素雰囲気下で照射す
る・と劣化が著しく機械的強度がおちる。It does not matter if it is in an oxygen atmosphere. In the case of α-olefins or C3 or higher monopolymers or copolymers, irradiation in an oxygen atmosphere causes significant deterioration and decreases in mechanical strength.
熱処理の方法としては、循環式及び定置式オープンに照
射後のロール状のまま定置しておく方法及び通過させる
方法、また熱ロールを通過させる方法がある。循環式及
び定置式オープン中にロール状のまま定置することが望
ましい。Heat treatment methods include a method of leaving the irradiated roll in a circulating type, a method of leaving it in a roll after irradiation, a method of passing it through a heated roll, and a method of passing it through a heated roll. It is desirable to leave the roll in place during the circulation and stationary openings.
また、熱処理の温度は、一般的にはポリオレフィン系熱
可塑性樹脂の融点未満であるが、ポリオレフィン系熱可
塑性樹脂の種類によって異なる。Further, the temperature of the heat treatment is generally lower than the melting point of the polyolefin thermoplastic resin, but it varies depending on the type of polyolefin thermoplastic resin.
一般的には融点未満のできるだけ高い温度がいいが、融
点よシ5〜10℃低い温度が望ましい。Generally, a temperature as high as possible below the melting point is preferred, but a temperature 5 to 10°C lower than the melting point is desirable.
さらに、熱処理の時間は、添加混合したシリコーンの量
、樹脂の組成、照射線量によって異なるが、主として熱
処理温度との相関で決定されるべきである。性能発揮上
からは、特にいくら長くてもかまわないが、樹脂の種類
によっては、長すぎると機誠特性の低下が起こる場合が
ある。一般的には、数秒間から1週間であり、10秒間
から3日間が好ましho
本発明の系に電子線を照射することによってすぐれた剥
離性能を発揮するに至るメカニズムは必らずしも明確で
はな込。しかし、電子線によって架橋もしくは分解する
性質を持つポリオレフィン系熱可塑性樹脂がジメチルポ
リシロキサンと共存することによって、ポリオレフィン
に生じたラジカルとジメチルポリシロキサンラジカルと
が微妙かつ複雑に影響しあい、グラフト反応及び/又は
シロキサン同志の架橋を促進し、特殊な性能発揮につな
がっているものと思われる。その後の熱処理によって、
EB照射で完結しえなかった反応を、さらに促進させた
のかもしれない。Furthermore, the heat treatment time varies depending on the amount of silicone added and mixed, the composition of the resin, and the irradiation dose, but should be determined mainly in correlation with the heat treatment temperature. From the standpoint of performance, it does not matter how long the length is, but depending on the type of resin, if it is too long, the mechanical properties may deteriorate. In general, the period is from a few seconds to one week, preferably from 10 seconds to 3 days. Not clear. However, when a thermoplastic polyolefin resin that has the property of crosslinking or decomposing with electron beams coexists with dimethylpolysiloxane, the radicals generated in the polyolefin and the dimethylpolysiloxane radicals interact delicately and complexly, resulting in graft reactions and/or Alternatively, it is thought that it promotes crosslinking between siloxanes, leading to special performance. Through subsequent heat treatment,
This may have further accelerated the reaction that could not be completed by EB irradiation.
本発明の方法は、従来゛の大規模な塗布、乾燥。The method of the present invention eliminates the conventional large-scale coating and drying process.
架橋工程、あるいは溶媒回収工程を必要とせず、さらに
使用するジメチルポリシロキサンの混合割合、樹脂の組
成、電子線処理条件、加熱処理条件等を変えて組み合わ
せることによって発現される剥離性能を調節することが
出来る。Adjustment of peeling performance by changing and combining the mixing ratio of dimethylpolysiloxane used, resin composition, electron beam treatment conditions, heat treatment conditions, etc. without requiring a crosslinking step or a solvent recovery step. I can do it.
以下、実施例、比較例を示して、本発明を更に詳しく説
明するが、本発明はその要旨を越えない限シ、これらの
例に何ら制約されるものではない。Hereinafter, the present invention will be explained in more detail with reference to Examples and Comparative Examples; however, the present invention is not limited to these examples as long as the gist thereof is not exceeded.
実施例、比較例において、種々の条件で作製した試料の
剥離強度および残留粘着率を測定し、その結果を一括し
て第−表に示す。In Examples and Comparative Examples, the peel strength and residual adhesion of samples prepared under various conditions were measured, and the results are summarized in Table 1.
上記の剥離強度および残留粘着率の測定は次のようにし
て行なった。すなわち、標準テープとしてパイロンクラ
フトチーブ(共和(株)製)を用い、これを剥離紙のラ
ミネートした面に貼シ、JIS −Z −0237に従
い、180’剥離試験を実施し、さらにJIS −Z
−1523に準じて残留粘着率を測定した。The peel strength and residual adhesion rate described above were measured as follows. That is, using Pylon Craft Cheve (manufactured by Kyowa Co., Ltd.) as a standard tape, it was pasted on the laminated surface of release paper, a 180' peel test was conducted in accordance with JIS-Z-0237, and further JIS-Z
-1523, the residual adhesion rate was measured.
シ、ウアpマー)(以下PPと略す〕とメルトインデッ
クス(以下MIと略す)がO67fi/l Omi n
。(hereinafter abbreviated as PP) and melt index (hereinafter abbreviated as MI) are O67fi/l Omin
.
密度=0.925の低密度ポリエチレン(昭和電工(株
)製ニジヨウレックス)(以下LDと略す)をPP/L
D=80/20 (重量%〕の割合で溶融混合した混合
物に25℃における粘度が500をラミネートしたクラ
フト紙に、樹脂温315℃ラミ厚10μmの条件で押し
出しラミネートし、続いて、酸素濃度300 ppm
jラインスピード30m/rnin 、照射線量4メガ
ラドで電子線照射処理を施こした後、80℃のギヤオー
プンでロール状のまま3日間熱処理を施こした。結果を
第−表に示す・
実施例−2
実施例1でポリプロピレンをラミネートしたりとを共押
し出しラミネート〔樹脂温315℃、ラミ厚10μm〕
する以外は、実施例1と同様の試験を行なった。結果を
第−表に示す。Low-density polyethylene (Showa Denko K.K. Nijiyo Rex) (hereinafter abbreviated as LD) with a density of 0.925 is PP/L.
A mixture melt-mixed in a ratio of D=80/20 (wt%) with a viscosity of 500 at 25°C was laminated on kraft paper with a resin temperature of 315°C and a lamination thickness of 10 μm, followed by extrusion lamination with an oxygen concentration of 300°C. ppm
After electron beam irradiation treatment was performed at a j-line speed of 30 m/rnin and an irradiation dose of 4 megarads, heat treatment was performed for 3 days at 80° C. in the roll form with the gear open. The results are shown in Table 1. Example 2 Co-extrusion laminate with polypropylene laminated in Example 1 [Resin temperature 315°C, laminate thickness 10 μm]
The same test as in Example 1 was conducted except for the following. The results are shown in Table 1.
実施例3
実施例1で、ppとLDの混合比をPP/LD=80/
20(重#%)のかわシに、 PP/LD=70/30
(重量%)にしたものを用いる以外は実施例1と同様に
行なった。結果を第−表に示す。Example 3 In Example 1, the mixing ratio of pp and LD was set to PP/LD=80/
20 (weight #%), PP/LD=70/30
The same procedure as in Example 1 was carried out except that the amount of (% by weight) was used. The results are shown in Table 1.
実施例4
実施例1で、PDMS −1のかわシに25℃における
粘度が3000C8(以下、PDMS −Ifと略す〕
のジメチルポリシロキサンを用いる以外は実施例1と同
様に行なった。結果を第−表に示す。Example 4 In Example 1, the viscosity of PDMS-1 at 25°C was 3000C8 (hereinafter abbreviated as PDMS-If).
Example 1 was carried out in the same manner as in Example 1 except that dimethylpolysiloxane was used. The results are shown in Table 1.
実施例5 同様に行なった。結果を第−表に示す。Example 5 I did the same. The results are shown in Table 1.
実施例6
実施例1でPDMS −1の添加量を3重量%のかわり
に5重量%にしたものを用いる以外は実施例1と同様に
行なった。結果を第−表に示す。Example 6 The same procedure as in Example 1 was carried out except that the amount of PDMS-1 added in Example 1 was changed to 5% by weight instead of 3% by weight. The results are shown in Table 1.
実施例7
実施例1で、電子線の照射量を4メガラドのかわりに2
メガラドにする以外は実施例1と同様に行なった。結果
を第−表に示す。Example 7 In Example 1, the electron beam irradiation dose was changed to 2 megarads instead of 4 megarads.
The same procedure as in Example 1 was carried out except that megarad was used. The results are shown in Table 1.
比較例1
実施例1で、電子線照射をしない以外は実施例1と同様
に行なった。結果を第−表に示す。Comparative Example 1 The same procedure as in Example 1 was conducted except that electron beam irradiation was not performed. The results are shown in Table 1.
比較例2
実施例1で、加熱処理をしない以外は実施例1と同様に
行なった。結果を第−表に示す。Comparative Example 2 The same procedure as in Example 1 was conducted except that the heat treatment was not performed. The results are shown in Table 1.
比較例3
実施例1で、樹脂混合物に対するPDMS −1の添加
量を0.2重量%にした以外は実施例1と同様に行なっ
た。結果を第−表に示す。Comparative Example 3 The same procedure as in Example 1 was conducted except that the amount of PDMS-1 added to the resin mixture was 0.2% by weight. The results are shown in Table 1.
比較例4
実施例1で、樹脂混合物に対するPDMS −IIIの
添加量を35重量%にした場合、樹脂混合物と混合する
際に押し出し機で押し出し不能でありた。Comparative Example 4 In Example 1, when the amount of PDMS-III added to the resin mixture was 35% by weight, it could not be extruded with an extruder when mixed with the resin mixture.
上記、実施例1〜7.比較例1〜3の剥離強度、残留粘
着率の測定結果を第−災に示す。また、参′i5例とし
て、標準テープとして使用した・母イロンクラフトテー
グを実施例1と同様にして剥離強度、残留粘着率を測定
し、第−表に併記した。Above, Examples 1 to 7. The measurement results of peel strength and residual adhesiveness of Comparative Examples 1 to 3 are shown in the first example. In addition, as a reference example, the peel strength and residual adhesiveness of iron kraft tape used as a standard tape were measured in the same manner as in Example 1, and the results are also listed in Table 1.
第−表
〔発明の効果〕
以上述べたように、本発明の方法は、4リオレフイン系
熱可塑性樹脂に、ジメチルポリシロキサンを混合、成形
し、電子線照射処理を施こすことによって、すぐれた剥
離性能を発揮するばかシでなく、マジックインキで筆記
できる剥離性表面を得ることができる。また、従来のよ
うに加熱処理あるいは溶媒回収のための大規模な装置を
必要とせず、容易に剥離性表面を得ることができるので
、その経済的効果は極めて大きい。Table 1 [Effects of the Invention] As described above, the method of the present invention achieves excellent peeling by mixing dimethylpolysiloxane with a 4-lyolefin thermoplastic resin, molding it, and subjecting it to electron beam irradiation treatment. It is possible to obtain a removable surface that can be written with marker ink instead of a smudge that exhibits high performance. Moreover, unlike conventional methods, large-scale equipment for heat treatment or solvent recovery is not required, and a releasable surface can be easily obtained, so the economic effect is extremely large.
Claims (8)
ロキサンとからなる組成物を成形し、成形品の表面にジ
メチルポリシロキサンをブリードせしめた後、電子線照
射を施こし、さらに空気中でポリオレフィン系熱可塑性
樹脂の融点未満の温度で熱処理を施こすことを特徴とす
る剥離性材料の製造方法。(1) After molding a composition consisting of a polyolefin thermoplastic resin and dimethylpolysiloxane and allowing the dimethylpolysiloxane to bleed onto the surface of the molded product, electron beam irradiation is performed, and the polyolefin thermoplastic resin is further molded in air. 1. A method for producing a releasable material, which comprises performing heat treatment at a temperature below the melting point of the resin.
〜30重量%である特許請求の範囲第1項記載の製造方
法。(2) The amount of dimethylpolysiloxane in the composition is 0.5
The manufacturing method according to claim 1, wherein the content is 30% by weight.
オレフィンの混合物であり、該混合物が必須成分として
ポリエチレン及びC_3〜C_5のα−オレフィンの単
(もしくは共)重合体を含有する特許請求の範囲第1項
記載の製造方法。(3) The polyolefin thermoplastic resin is a mixture of two or more types of polyolefins, and the mixture contains polyethylene and a mono (or co)polymer of α-olefins C_3 to C_5 as essential components. The manufacturing method according to item 1.
請求の範囲第1項記載の製造方法。(4) The manufacturing method according to claim 1, wherein the irradiation dose of the electron beam is 20 megarads or less.
載の製造方法。(5) The manufacturing method according to claim 1, wherein the molded product is a film.
項記載の製造方法。(6) Claim 1 in which the molded product is a laminated film
Manufacturing method described in section.
リシロキサン含有ポリオレフィンの3層構造から成る特
許請求の範囲第6項記載の製造方法。(7) The manufacturing method according to claim 6, wherein the laminated film has a three-layer structure of paper/polyolefin/dimethylpolysiloxane-containing polyolefin.
ある特許請求の範囲第3項記載の製造方法。(8) The manufacturing method according to claim 3, wherein the α-olefin of C_3 to C_5 is propylene.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8284187A JPH0698700B2 (en) | 1987-04-06 | 1987-04-06 | Method of manufacturing peelable material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8284187A JPH0698700B2 (en) | 1987-04-06 | 1987-04-06 | Method of manufacturing peelable material |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63249627A true JPS63249627A (en) | 1988-10-17 |
JPH0698700B2 JPH0698700B2 (en) | 1994-12-07 |
Family
ID=13785615
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8284187A Expired - Lifetime JPH0698700B2 (en) | 1987-04-06 | 1987-04-06 | Method of manufacturing peelable material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0698700B2 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5206092A (en) * | 1988-02-24 | 1993-04-27 | Showa Denko K.K. | Electron beam-curable composition for release material and process for preparation of release material |
KR100601146B1 (en) * | 1999-11-12 | 2006-07-13 | 삼성토탈 주식회사 | Polyethylene resin composition for plastic closure and its article |
WO2011041862A1 (en) * | 2009-10-07 | 2011-04-14 | Braskem S.A. | Extrusion method for producing a hybrid polymer composition, hybrid polymer composition and article |
JP2011107547A (en) * | 2009-11-20 | 2011-06-02 | Canon Inc | Method of manufacturing electrifying member |
JP2012507609A (en) * | 2008-10-29 | 2012-03-29 | スリーエム イノベイティブ プロパティズ カンパニー | Electron curable silicone release material |
US9359529B2 (en) | 2008-10-29 | 2016-06-07 | 3M Innovative Properties Company | Electron beam cured silicone materials |
-
1987
- 1987-04-06 JP JP8284187A patent/JPH0698700B2/en not_active Expired - Lifetime
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5206092A (en) * | 1988-02-24 | 1993-04-27 | Showa Denko K.K. | Electron beam-curable composition for release material and process for preparation of release material |
KR100601146B1 (en) * | 1999-11-12 | 2006-07-13 | 삼성토탈 주식회사 | Polyethylene resin composition for plastic closure and its article |
JP2012507609A (en) * | 2008-10-29 | 2012-03-29 | スリーエム イノベイティブ プロパティズ カンパニー | Electron curable silicone release material |
US9017771B2 (en) | 2008-10-29 | 2015-04-28 | 3M Innovative Properties Company | Gentle to skin adhesive |
US9359529B2 (en) | 2008-10-29 | 2016-06-07 | 3M Innovative Properties Company | Electron beam cured silicone materials |
WO2011041862A1 (en) * | 2009-10-07 | 2011-04-14 | Braskem S.A. | Extrusion method for producing a hybrid polymer composition, hybrid polymer composition and article |
JP2011107547A (en) * | 2009-11-20 | 2011-06-02 | Canon Inc | Method of manufacturing electrifying member |
Also Published As
Publication number | Publication date |
---|---|
JPH0698700B2 (en) | 1994-12-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4769418A (en) | Propylene polymer film | |
DE60118795T2 (en) | ADHESIVE AND METHOD FOR THE PRODUCTION THEREOF | |
US4636340A (en) | Method of producing crosslinked polyethylene stretched film | |
DE60222741T2 (en) | METHOD FOR PRODUCING A COATED POLYMER FILM | |
US5206092A (en) | Electron beam-curable composition for release material and process for preparation of release material | |
US5945210A (en) | Porous film and preparation process thereof | |
DE102009011163A1 (en) | Adhesive tape, in particular for bonding photovoltaic modules | |
DE4426456A1 (en) | Composite films and processes for their manufacture | |
JPH0678505B2 (en) | Release agent and method for producing release paper using the same | |
DE602004004043T2 (en) | Resin composition for release film and release film made therefrom | |
US4702874A (en) | Manufacturing method of release paper | |
JPS63249627A (en) | Manufacture of releasable material | |
US6506500B2 (en) | Polyolefin film, its use, and process for its production | |
JPS63248834A (en) | Production of releasing material | |
DE3513526A1 (en) | Anti-cohesively treated plastic film, process for the production of the film and the use thereof | |
CN115284706B (en) | Polypropylene film, preparation method thereof and paper-plastic thermal composite base material | |
US7314901B2 (en) | Polypropylene films | |
JPS62173251A (en) | Easy-cut film | |
JP2001233971A (en) | Polyolefine film having excellent printability | |
JP2909138B2 (en) | Production method of release paper | |
JP3032355B2 (en) | Base material for polypropylene release paper | |
JPH0379685A (en) | Releasable material and production thereof | |
DE69635799T2 (en) | PRESSURE-RESISTANT ADHESIVE COMPOSITION AND PRINT-SENSITIVE ADHESIVES AND SEAL MASSES, IMPRESSION FOILS, AND PRESSURE-SENSITIVE ADHESIVE PRINTED FOILS MANUFACTURED THEREFROM | |
JPH0631865A (en) | Release sheet and preparation thereof | |
JPH09174743A (en) | Released film for tack label |