JPS63248834A - Production of releasing material - Google Patents
Production of releasing materialInfo
- Publication number
- JPS63248834A JPS63248834A JP8284087A JP8284087A JPS63248834A JP S63248834 A JPS63248834 A JP S63248834A JP 8284087 A JP8284087 A JP 8284087A JP 8284087 A JP8284087 A JP 8284087A JP S63248834 A JPS63248834 A JP S63248834A
- Authority
- JP
- Japan
- Prior art keywords
- dimethylpolysiloxane
- manufacturing
- electron beam
- moldings
- polyolefin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 6
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- -1 polypropylene Polymers 0.000 claims abstract description 28
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims abstract description 26
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims abstract description 26
- 239000004205 dimethyl polysiloxane Substances 0.000 claims abstract description 25
- 239000000203 mixture Substances 0.000 claims abstract description 21
- 229920000098 polyolefin Polymers 0.000 claims abstract description 16
- 238000010894 electron beam technology Methods 0.000 claims abstract description 15
- 238000000465 moulding Methods 0.000 claims abstract description 10
- 230000001678 irradiating effect Effects 0.000 claims abstract description 3
- 229920005992 thermoplastic resin Polymers 0.000 claims description 12
- 229920000573 polyethylene Polymers 0.000 claims description 10
- 239000004698 Polyethylene Substances 0.000 claims description 9
- 229920001577 copolymer Polymers 0.000 claims description 6
- 239000004711 α-olefin Substances 0.000 claims description 3
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 27
- 239000004743 Polypropylene Substances 0.000 abstract description 17
- 229920001155 polypropylene Polymers 0.000 abstract description 13
- 238000003475 lamination Methods 0.000 abstract description 7
- 229920001684 low density polyethylene Polymers 0.000 abstract description 5
- 239000004702 low-density polyethylene Substances 0.000 abstract description 5
- 239000003795 chemical substances by application Substances 0.000 abstract description 3
- 230000000740 bleeding effect Effects 0.000 abstract description 2
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 abstract description 2
- 229920001169 thermoplastic Polymers 0.000 abstract 2
- 238000009395 breeding Methods 0.000 abstract 1
- 230000001488 breeding effect Effects 0.000 abstract 1
- 238000002156 mixing Methods 0.000 description 8
- 229920005989 resin Polymers 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000000123 paper Substances 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 5
- 238000004132 cross linking Methods 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000002655 kraft paper Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 238000011084 recovery Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000003550 marker Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229920001179 medium density polyethylene Polymers 0.000 description 1
- 239000004701 medium-density polyethylene Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Landscapes
- Treatments Of Macromolecular Shaped Articles (AREA)
- Adhesive Tapes (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は主としてワッペン、シール等の基台面とか、巻
回された包装用テープ等の背面に剥離性を付与する剥離
紙等の製造方法に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention mainly relates to a method for manufacturing release paper, etc. that imparts releasability to the base surface of patches, stickers, etc., or the back surface of wound packaging tape, etc. .
従来、ワッペン、シール等の粘着性シートの基台に使用
される剥離紙、或いは巻回された包装用粘着テープ等の
背面には、剥離性を発現させるために、ポリオレフィン
をラミネートした基材面上に、高価な反応性シリコーン
を塗布し、さらに熱硬化処理を行なっていた。その工程
は、シリコーンを塗布、乾燥、架橋させる処理工程から
成るが、通常、その際の装置の長さは数十メートルにも
達し、大規模なものとなる。さらに、反応性シリコーン
を塗布する際に、トルエンなどの溶媒を使用するため、
その回収にも多大な設備費とエネルギーを必要としてい
る。Conventionally, release paper used as the base of adhesive sheets for patches, stickers, etc., or the back side of wrapped adhesive tapes for packaging, etc., has a base material surface laminated with polyolefin in order to exhibit releasability. On top of this, expensive reactive silicone was applied and a heat curing process was performed. The process consists of coating, drying, and crosslinking silicone, and the length of the equipment used for this process is usually several tens of meters, making it large-scale. Furthermore, since solvents such as toluene are used when applying reactive silicones,
Its recovery also requires a large amount of equipment cost and energy.
上記シリコーン油を熱可塑性樹脂に混合する方法によっ
て、性能の良い剥離紙の製造が可能であれば、上記大規
模な工程を省略することが出来る。If a release paper with good performance can be produced by mixing the silicone oil with a thermoplastic resin, the large-scale process described above can be omitted.
しかし、この場合、剥離紙として要求される剥離性が発
現しないばかシでなく、表面にブリードしたシリコーン
油が、ワッペン、シール等の粘着剤層に移行し、その粘
着力が低下し、ワッペン、シールとして致命的欠陥とな
る。However, in this case, the releasability required for release paper is not achieved, and the silicone oil that bleeds onto the surface transfers to the adhesive layer of patches, stickers, etc., reducing its adhesive strength. This is a fatal flaw as a seal.
この問題を解決する方法として、特開昭57−1872
21では、放射線硬化型オルガノポリシロキサンを樹脂
に添加混合して、ラミネーションおよびインフレーショ
ン法によって成形した後、放射線を照射する方法が提案
されているが、この方法では、メルカプト基などを含む
高価なオルガノシロキサンを使用しないと実用に耐える
程度の性能が発現しない。As a method to solve this problem,
No. 21 proposes a method in which a radiation-curable organopolysiloxane is added and mixed with a resin, molded by lamination and inflation methods, and then irradiated with radiation. If siloxane is not used, practical performance will not be achieved.
本発明者らは、上記の現行法での問題点を勘案し、繁雑
な工程を必要としない、安価な剥離性材料の製造法を開
発すべく鋭意検討した結果、単独で加熱したシミ子線照
射をするだけでは硬化することが困難な化学的に安定な
ジメチルポリシロキサンと& IJオレフィン系熟熱可
塑性樹脂から成る組成物を成形し、成形品の表面にジメ
チルポリシロキサンをブリードせしめた後、電子線照射
を施こすことによってすぐれた剥離性能(低剥離強度及
び高残留粘着率)が発現され且粘着剤への移行がなく、
さらに驚くべきことに剥離性能が高いにもかかわらず、
マジックインキ筆記性が良好であることが発見された。The present inventors took into consideration the problems with the current method described above, and as a result of intensive studies to develop an inexpensive method for producing removable materials that does not require complicated processes, A composition consisting of chemically stable dimethylpolysiloxane and &IJ olefin-based thermoplastic resin, which is difficult to cure only by heating, is molded, and after the dimethylpolysiloxane is bled onto the surface of the molded product, it is By applying radiation irradiation, excellent peeling performance (low peel strength and high residual adhesive rate) is developed, and there is no transfer to the adhesive.
Even more surprisingly, despite its high peeling performance,
It was discovered that the marker ink has good writing properties.
本発明は極めて反応性に乏しく性能の発現が難しかった
官能基を有さないジメチルポリシロキサンを剥離剤とし
て使用することが可能なことを発見したことに基づいて
なされたものである。The present invention was made based on the discovery that it is possible to use dimethylpolysiloxane, which does not have functional groups, as a stripping agent, and which has had extremely poor reactivity and has been difficult to exhibit performance.
以下、本発明の詳細な説明する。 The present invention will be explained in detail below.
本発明において原料として用いられるポリオレフィン系
熱可塑性樹脂としては、高密度ポリエチレン、中密度ポ
リエチレン、低密度ポリエチレン、ポリプロピレン及び
これらを主体とする共重合体、エチレンとビニルエステ
ル又はα、β−不飽和カルポン酸エステルとの共重合体
などが使用できる。Polyolefin thermoplastic resins used as raw materials in the present invention include high-density polyethylene, medium-density polyethylene, low-density polyethylene, polypropylene, copolymers mainly composed of these, ethylene and vinyl esters, or α,β-unsaturated carpons. Copolymers with acid esters, etc. can be used.
好ましくは、エチレン重合体、エチレン−プロピレン共
重合体、エチレン−ブテン共重合体、ポリプロピレン、
ポリブテン、ポリ−4−メチル−1−ペンテンが使用で
きる。これらは単独でも性能発揮するが、特定の2種類
以上の混合物全使用することによって性能の発現を容易
にすることができる。この場合、ポリエチレンとC3〜
C5のα−オレフィンの単重合体もしくは共重合体を必
須成分とする混合物を使用することが好ましい。中でも
低密度ポリエチレンとポリプロピレンの混合物を使用す
ることが適している。その組成比は、ポリエチレン1〜
99重量係に対してポリプロピレン99〜1重量係で、
好ましくは、ポリエチレン10重量係以上ないし40重
量係以下に対し、ポリプロピレフ90重量係以下ないし
60重重量板上、及び、ポリエチレン90重量係以下な
いし60重量係以上に対し、ポリノロピレン1o重量係
以上ないし40重量係以下、さらに好ましくはポリエチ
レン15〜30重量係に対してポリプロピレン85〜7
0重量係及び、ポリエチレン85〜フ0重量係に対して
ポリプロピレン15〜30重量係である。ポリエチレン
が40重重量上り多く60重量係未満に対してポリプロ
ピレンが60重量係未満40重量係よシ多い場合には、
性能発揮上は問題はないが、成形性が著しく悪くなる。Preferably, ethylene polymer, ethylene-propylene copolymer, ethylene-butene copolymer, polypropylene,
Polybutene and poly-4-methyl-1-pentene can be used. These can exhibit performance even when used alone, but performance can be easily achieved by using a mixture of two or more specific types. In this case, polyethylene and C3~
It is preferable to use a mixture containing a C5 α-olefin homopolymer or copolymer as an essential component. Among these, it is suitable to use a mixture of low density polyethylene and polypropylene. Its composition ratio is polyethylene 1~
99 weight factor to polypropylene 99-1 weight factor,
Preferably, for polyethylene from 10 weight ratio or more to 40 weight ratio or less, polypropylene is 90 weight ratio or less to 60 weight ratio on a board, and for polyethylene from 90 weight ratio or less to 60 weight ratio or more, polynolopylene is 10 weight ratio or more to 40 weight ratio or less, more preferably polypropylene 85-7 to polyethylene 15-30 weight ratio
Polypropylene has a weight ratio of 15 to 30 compared to 0 weight ratio and polyethylene 85 to 0 weight ratio. If polyethylene is more than 40% by weight and less than 60% by weight, polypropylene is less than 60% by weight and more than 40% by weight,
Although there is no problem in terms of performance, moldability becomes significantly worse.
ポリオレフィン系熱可塑性樹脂のメルトインデックスあ
るいはメルトフローレイトば、一般的には0.01〜2
0011/ 10m1nであシ、0.1〜100!i/
10m1nが望ましく、1〜201/ 10 minが
好適である。The melt index or melt flow rate of polyolefin thermoplastic resin is generally 0.01 to 2.
0011/ 10m1n, 0.1~100! i/
10 m1n is desirable, and 1 to 201/10 min is suitable.
また、最も容易に性能が発現する組成である低密度ポリ
エチレンとポリプロピレンの混合物におけるメルトイン
デックスは、ポリエチレンとしては0.01〜200
Fi/ 10m1nであシ、0.1〜100.9/10
m1nが望ましく、0.5〜15 、!i’/ 10m
1nが好適であシ、ポリプロピレンとしては、0,01
〜150.9/10m1nであシ、1〜100 !/
10m1nが望ましく、2〜301/10m1nが好適
である。In addition, the melt index of a mixture of low density polyethylene and polypropylene, which is the composition that most easily exhibits performance, is 0.01 to 200 for polyethylene.
Fi/ 10m1n, 0.1~100.9/10
m1n is desirable, 0.5 to 15,! i'/10m
1n is preferable, and as polypropylene, 0.01
~150.9/10m1n, 1~100! /
10 m1n is desirable, and 2 to 301/10 m1n is suitable.
また、上記ポリオレフィン系熱可塑性樹脂に混合するジ
メチルポリシロキサンとは、末端が一5iR1R2R3
(但し、R1、n2 、 R3は夫々独立に、メチル基
、ヒドロオキシル基、C−C3のアルコキシ基から選ば
れる)からなるジメチルポリシロキサンである。好まし
くは、両末端トリメチルシリル基封鎖及び両末端ヒドロ
オキシジメチルシリル基封鎖ジメチルポリシロキサンで
ある。25℃における粘度は50〜8 X 1060s
で、特に500〜60.0OOcsの範囲のものが好ま
しい。25℃における粘度が500sよシ低い場合には
、熱可塑性樹脂との混合が困難で成形しにくいはかシで
なく、充分な剥離性能を発現させるために多大な照射線
量を必要とし、マトリックスの樹脂の機械的強度を著し
く低下させる。また、8X10csを越えると、充分な
剥離性能の発現が困難になる。In addition, the dimethylpolysiloxane to be mixed with the polyolefin thermoplastic resin has a terminal of 15iR1R2R3.
(However, R1, n2, and R3 are each independently selected from a methyl group, a hydroxyl group, and a C-C3 alkoxy group). Preferably, it is a dimethylpolysiloxane with trimethylsilyl groups blocked at both ends and hydroxydimethylsilyl groups blocked at both ends. Viscosity at 25℃ is 50~8 x 1060s
In particular, those in the range of 500 to 60.0 OOcs are preferred. If the viscosity at 25°C is lower than 500 s, it is difficult to mix with the thermoplastic resin and difficult to mold, and a large irradiation dose is required to develop sufficient peeling performance, resulting in the formation of a matrix. Significantly reduces the mechanical strength of the resin. Moreover, if it exceeds 8×10 cs, it becomes difficult to exhibit sufficient peeling performance.
また、ジメチルポリシロキサンのポリオレフィン系熱可
塑性樹脂との混合割合はポリオレフィン系熱可塑性樹脂
に対して、0.5〜30重量係であり、1〜15重量係
が好ましく、2〜6重量係が好適である。その量が0.
5重ft%未満では、充分な剥離性能が得られず、30
重量係を越えるとジメチルポリシロキサンを混合しにく
り、成形が非常に困難になるばかシか、コスト的に不利
である。In addition, the mixing ratio of dimethylpolysiloxane with the polyolefin thermoplastic resin is 0.5 to 30 parts by weight, preferably 1 to 15 parts by weight, and preferably 2 to 6 parts by weight. It is. The amount is 0.
If it is less than 5% by weight, sufficient peeling performance cannot be obtained, and 30%
If the weight ratio is exceeded, it becomes difficult to mix dimethylpolysiloxane, making molding extremely difficult, or it is disadvantageous in terms of cost.
上記のポリオレフィン系熱可塑性樹脂およびジメチルポ
リシロキサンを混合するには、一般に合成樹脂を混線、
混合する際に使用する装置が利用出来る。例えば、バン
バリーミキサ−、ニーダ−1二軸押出機、単軸押出機、
ロールミルなどの混合機を使って溶融混合させる方法が
ある。特に、粘度の低いジメチルポリシロキサンを使用
する場合には、通常の混合は困難となるので、押出機の
シリンダー中間部にジメチルポリシロキサンをポンプで
注入することにより混合する。In order to mix the above polyolefin thermoplastic resin and dimethylpolysiloxane, it is generally necessary to cross-wire the synthetic resin,
Equipment used for mixing can be used. For example, Banbury mixer, kneader 1 twin screw extruder, single screw extruder,
There is a method of melting and mixing using a mixer such as a roll mill. In particular, when dimethylpolysiloxane with low viscosity is used, ordinary mixing becomes difficult, so dimethylpolysiloxane is mixed by injecting it into the middle of the cylinder of the extruder with a pump.
上記混合物を成形するには、通常の押し出しラミネーシ
ョン法および共押し出しラミネーション法、インフレー
ション法、共押し出しインフレーション法があシ、目的
、用途に応じて適宜選択すればよい。この成形品に電子
線照射処理を施こすことによって、剥離性表面を形成す
ることができる。To mold the above mixture, a conventional extrusion lamination method, a coextrusion lamination method, an inflation method, or a coextrusion inflation method may be selected depending on the purpose and use. A releasable surface can be formed by subjecting this molded article to electron beam irradiation treatment.
成形後に、添加、混合した・ジメチルポリシロキサンを
表面にブリードさせる方法については、マトリックスの
樹脂組成、ジメチルポリシロキサンの粘度、及びジメチ
ルポリシロキサンの添加量によって異なる。成形直後に
完全にブリードしている場合が多いが、必要に応じてエ
イジングしてもいい。エイジングに際しては、変形が起
こらない程度の温度をかけてもいいし、常温でもいい。The method for bleeding the added and mixed dimethylpolysiloxane onto the surface after molding varies depending on the resin composition of the matrix, the viscosity of the dimethylpolysiloxane, and the amount of dimethylpolysiloxane added. In many cases, it bleeds completely immediately after molding, but it can be aged if necessary. When aging, the temperature may be applied to a level that does not cause deformation, or it may be at room temperature.
ジメチルポリシロキサンとの関連でいうと、粘度の低い
ものの方が有利である。In relation to dimethylpolysiloxanes, lower viscosities are advantageous.
上記の電子線処理を実施する方法としては、コツククロ
フト型、コツククロフトワルトン型、バンプグラフ型、
絶縁コア変圧器型、直線型、ダイナミドロン星、高周波
型、エレクトロンカーテン型などの各種電子線加速器か
ら電子線を放出させる方法が挙げられる。照射線量は必
要とされる被照射物の性能によって広い範囲で変えるこ
とができる。一般には、30メガラド以下であシ、1〜
15メガラドが望ましく、とシわけ5〜10メガラドが
好適である。照射線量が30メガラドを越えるとマトリ
ックスのポリマーの機械的強度が著しく低くなシ実用的
でない。また、加速電圧は特にこだわらないが100〜
300kVが実用的である。Methods for carrying out the above electron beam treatment include Kotsukucroft type, Kotskucroft Walton type, bumpgraph type,
Methods include emitting electron beams from various types of electron beam accelerators, such as insulated core transformer type, linear type, dynamidron star, high frequency type, and electron curtain type. The irradiation dose can vary within a wide range depending on the required performance of the irradiated object. Generally, it is less than 30 megarads, 1~
A value of 15 megarads is desirable, and a range of 5 to 10 megarads is preferred. If the irradiation dose exceeds 30 megarads, the mechanical strength of the matrix polymer will be extremely low, making it impractical. Also, the acceleration voltage is not particularly particular, but it is 100~
300kV is practical.
照射時の雰囲気としては不活性ガス中で行なうことが望
ましい。この不活性ガスの代表例としては、窒素、炭酸
ガス、ヘリウムなどが挙げられる。The atmosphere during irradiation is preferably an inert gas. Representative examples of this inert gas include nitrogen, carbon dioxide, helium, and the like.
本発明の系に電子線を照射することによってすぐれた剥
離性能を発揮するに至るメカニズムは必らずしも明確で
はない。しかし、電子線によって架橋もしくは分解する
性質を持つポリオレフィン系熱可塑性樹脂がジメチルポ
リシロキサンと共存することによって、ポリオレフィン
に生じたラジカルとジメチルポリシロキサンラジカルと
が微妙かつ複雑に影響しあい、グラフト反応及び/又は
シロキサン同志の架橋を促進し、特殊な性能発揮につな
がっているものと思われる。The mechanism by which the system of the present invention exhibits excellent peeling performance by irradiating it with an electron beam is not necessarily clear. However, when a polyolefin thermoplastic resin that has the property of crosslinking or decomposing with electron beams coexists with dimethylpolysiloxane, the radicals generated in the polyolefin and the dimethylpolysiloxane radicals interact delicately and complexly, resulting in graft reactions and/or Alternatively, it is thought that it promotes crosslinking between siloxanes, leading to special performance.
本発明の方法は、従来の大規模な塗布、乾燥、架橋工程
、あるいは溶媒回収工程を必要とせず、さらに使用する
ジメチルポリシロキサンの混合割合、電子線処理条件等
を変えて組み合わせることによって発現される剥離性能
を調節することが出来る。The method of the present invention does not require conventional large-scale coating, drying, crosslinking, or solvent recovery steps, and can be realized by changing and combining the mixing ratio of dimethylpolysiloxane used, electron beam treatment conditions, etc. The peeling performance can be adjusted.
以下、実施例、比較例を示して、本発明を更に詳しく説
明するが、本発明はその要旨を越えない限シ、これらの
例に何ら制約されるものではない。Hereinafter, the present invention will be explained in more detail with reference to Examples and Comparative Examples; however, the present invention is not limited to these examples as long as the gist thereof is not exceeded.
実施例、比較例において、種々の条件で作製した試料の
剥離強度および残留粘着率を測定し、その結果を一括し
て第−表に示す。In Examples and Comparative Examples, the peel strength and residual adhesion of samples prepared under various conditions were measured, and the results are summarized in Table 1.
上記の剥離強度および残留粘着率の測定は次のようにし
て行なった。すなわち、標準テープとしてバイロンクラ
フトチーf(共和((社)製)を用い、これを剥離紙の
ラミネートした面に貼シ、JIS−Z−0237に従い
、180°剥離試験を実施し、さらにJIS−Z−15
23に準じて残留粘着率を測定した。The peel strength and residual adhesion rate described above were measured as follows. That is, using Byron Craft Chee F (manufactured by Kyowa Co., Ltd.) as a standard tape, it was pasted on the laminated surface of release paper, a 180° peel test was conducted in accordance with JIS-Z-0237, and further JIS-Z-0237 was applied. Z-15
The residual adhesion rate was measured according to No. 23.
実施例1
メルトフローレイト(以下MFRと略す)が20g/1
0mtlのポリゾロピレン(昭和電工(株)製ニジヨウ
アロマ−)(以下PPと略す)とメルトインデックス(
以下MIと略す)が0.7 &/ 10 min、密度
0.925の低密度ポリエチレン(昭和電工(沫)製ニ
ジヨウレックス)(以下LDと略す)をPP/LD=8
0/2o (重量%)の割合で溶融混合した混合物に2
5℃における粘度が500csのジメチルポリシロキサ
ン(東しシリコーン(株)製:5H200) (以下P
DMS −1と略す)を3重量係添加混合した混合物を
ポリプロピレンをラミネートしたクラフト紙に、樹脂温
315°Cラミ厚10μmの条件で押し出しラミネート
し、続いて酸素濃度300ppm1ラインスピード30
m/min、照射線量6メガラドで電子線照射処理を施
こした。結果を第−表に示す。Example 1 Melt flow rate (hereinafter abbreviated as MFR) is 20g/1
0 mtl of polyzolopyrene (Rainbow Aroma manufactured by Showa Denko K.K.) (hereinafter abbreviated as PP) and melt index (
Low-density polyethylene (Nijiyo Rex manufactured by Showa Denko (Same)) (hereinafter abbreviated as LD) with a density of 0.925 and a PP/LD = 8
2 to the melt-mixed mixture at a ratio of 0/2o (wt%).
Dimethylpolysiloxane (manufactured by Toshi Silicone Co., Ltd.: 5H200) with a viscosity of 500 cs at 5°C (hereinafter P
DMS-1) was extruded and laminated onto kraft paper laminated with polypropylene at a resin temperature of 315°C and a lamination thickness of 10 μm, followed by an oxygen concentration of 300 ppm and a line speed of 30.
Electron beam irradiation treatment was performed at m/min and an irradiation dose of 6 megarads. The results are shown in Table 1.
実施例2
ポリプロピレンをラミネートしたクラフト紙に押し出し
ラミネートするかわシに、クラフト紙にジメチルシロキ
サンを添加していないp p (MFR= 30f!7
10m1n )と実施例1の混合物とを共押し出しラミ
ネート(樹脂@315℃、ラミ厚10μm)する以外は
、実施例1と同様の試験を行なった。Example 2 In extrusion lamination on kraft paper laminated with polypropylene, no dimethylsiloxane was added to the kraft paper p p (MFR = 30f!7
The same test as in Example 1 was conducted, except that the mixture of Example 1 (10 m1n) and the mixture of Example 1 were coextruded and laminated (resin @ 315°C, lamination thickness of 10 μm).
結果を第−表に示す。The results are shown in Table 1.
実施例3
実施例1で、ppとLDの混合比をPP/LD=80/
20(重量%)のかわりに、PP/LD=70/30(
重量%)にしたものを用いる以外は実施例1と同様に行
なった。結果全第−表に示す。Example 3 In Example 1, the mixing ratio of pp and LD was set to PP/LD=80/
Instead of 20 (wt%), PP/LD=70/30 (
The same procedure as in Example 1 was carried out except that % by weight was used. The complete results are shown in Table 1.
実施例4
実施例1で、PDMS −1のかわりに25℃における
粘度が3000cs(以下、PDMS −IIと略す)
のジメチルポリシロキサンを用いる以外は実施例1と同
様に行なった。結果を第−表に示す。Example 4 In Example 1, the viscosity at 25°C was 3000 cs (hereinafter abbreviated as PDMS-II) instead of PDMS-1.
Example 1 was carried out in the same manner as in Example 1 except that dimethylpolysiloxane was used. The results are shown in Table 1.
実施例5
実施例1で、PDMS −1のかわりに25℃における
粘度が30,0OOc+(以下、PDMS −IIIと
略す)のジメチルシロキサンを用いる以外は実施例1と
同様に行なった。結果を第−表に示す。Example 5 The same procedure as in Example 1 was carried out except that dimethylsiloxane having a viscosity at 25° C. of 30.0 OOc+ (hereinafter abbreviated as PDMS-III) was used instead of PDMS-1. The results are shown in Table 1.
実施例6
実施例1でPDMS −1の添加量を3重量%のかわシ
に5重量%にしたものを用いる以外は実施例1と同様に
行なった。結果を第−表に示す。Example 6 The same procedure as in Example 1 was conducted except that the amount of PDMS-1 added in Example 1 was changed from 3% by weight to 5% by weight. The results are shown in Table 1.
実施例7
実施例1で、電子線の照射量を6メガラドのかわシに1
0メガラドにする以外は実施例1と同様に行なった。結
果を第−表に示す。Example 7 In Example 1, the amount of electron beam irradiation was changed to 1 to 6 megarads.
The same procedure as in Example 1 was carried out except that the concentration was 0 megarad. The results are shown in Table 1.
比較例1
実施例1で、電子線照射をしない以外は実施例1と同様
に行なった。結果を第−表に示す。Comparative Example 1 The same procedure as in Example 1 was conducted except that electron beam irradiation was not performed. The results are shown in Table 1.
比較例2
実施例1で、樹脂混合物に対するPDMS −Iの添加
量を0.2重量%にした以外は実施例1と同様に行なっ
た。結果を第−表に示す。Comparative Example 2 The same procedure as in Example 1 was conducted except that the amount of PDMS-I added to the resin mixture was 0.2% by weight. The results are shown in Table 1.
比較例3
実施例1で、樹脂混合物に対するPDMS −IIIの
添加量を35重fillにした場合、樹脂混合物と混合
する際に押し出し機で押し出し不能であった。Comparative Example 3 In Example 1, when the amount of PDMS-III added to the resin mixture was set to 35 fill, it could not be extruded with an extruder when mixed with the resin mixture.
上記実施例1〜7、比較例1〜2の剥離強度、残留粘着
率の測定結果を第−表に示す。また、参考例として、標
準テープとして使用したパイロンクラフトチー7″ヲ実
施例1と同様にして剥離強度、残留粘着率を測定し、第
−表に併記した。The measurement results of the peel strength and residual adhesive rate of Examples 1 to 7 and Comparative Examples 1 to 2 are shown in Table 1. Further, as a reference example, the peel strength and residual adhesive rate of Pylon Craft Tea 7'' used as a standard tape were measured in the same manner as in Example 1, and the results are also listed in Table 1.
第−表
〔発明の効果〕
以上述べたように、本発明の方法は、ポリオレフィン系
熱可塑性樹脂に、ジメチルポリシロキサンを混合、成形
し、電子線照射処理を施こすことによって、すぐれた剥
離性能を発揮するばかりでなく、マジックインキで筆記
できる剥離性表面を得ることができる。また、従来のよ
うに加熱処理あるいは溶媒回収のための大規模な装置を
必要とせず、容易に剥離性表面を得ることができるので
、その経済的効果は極めて大きい。Table 1 [Effects of the Invention] As described above, the method of the present invention has excellent peeling performance by mixing dimethylpolysiloxane with a polyolefin thermoplastic resin, molding it, and subjecting it to electron beam irradiation treatment. Not only does it provide excellent performance, but it also provides a removable surface that can be written on with marker ink. Moreover, unlike conventional methods, large-scale equipment for heat treatment or solvent recovery is not required, and a releasable surface can be easily obtained, so the economic effect is extremely large.
Claims (8)
ロキサンとから成る組成物を成形し、成形品の表面にジ
メチルポリシロキサンをブリードせしめた後、電子線照
射を施こすことを特徴とする剥離性材料の製造方法。(1) A removable material characterized by molding a composition consisting of a polyolefin thermoplastic resin and dimethylpolysiloxane, allowing dimethylpolysiloxane to bleed onto the surface of the molded product, and then irradiating it with an electron beam. Production method.
〜30重量%である特許請求の範囲第1項記載の製造方
法。(2) The amount of dimethylpolysiloxane in the composition is 0.5
The manufacturing method according to claim 1, wherein the content is 30% by weight.
オレフィンの混合物からなり、該混合物が必須成分とし
てポリエチレン及びC_3〜C_5のα−オレフィンの
単(もしくは共)重合体を含有する特許請求の範囲第1
項記載の製造方法。(3) The polyolefin thermoplastic resin is composed of a mixture of two or more types of polyolefins, and the mixture contains polyethylene and a mono (or co)polymer of C_3 to C_5 α-olefins as essential components. 1
Manufacturing method described in section.
請求の範囲第1項記載の製造方法。(4) The manufacturing method according to claim 1, wherein the irradiation dose of the electron beam is 30 megarads or less.
載の製造方法。(5) The manufacturing method according to claim 1, wherein the molded product is a film.
項記載の製造方法。(6) Claim 1 in which the molded product is a laminated film
Manufacturing method described in section.
リシロキサン含有ポリオレフィンの3層構造から成る特
許請求の範囲第6項記載の製造方法。(7) The manufacturing method according to claim 6, wherein the laminated film has a three-layer structure of paper/polyolefin/dimethylpolysiloxane-containing polyolefin.
ある特許請求の範囲第3項記載の製造方法。(8) The manufacturing method according to claim 3, wherein the α-olefin of C_3 to C_5 is propylene.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8284087A JPS63248834A (en) | 1987-04-06 | 1987-04-06 | Production of releasing material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8284087A JPS63248834A (en) | 1987-04-06 | 1987-04-06 | Production of releasing material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63248834A true JPS63248834A (en) | 1988-10-17 |
Family
ID=13785591
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8284087A Pending JPS63248834A (en) | 1987-04-06 | 1987-04-06 | Production of releasing material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63248834A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02252782A (en) * | 1989-03-27 | 1990-10-11 | Sekisui Chem Co Ltd | Self-adhesive sheet or tape for surface protection |
JPH02252783A (en) * | 1989-03-27 | 1990-10-11 | Sekisui Chem Co Ltd | Manufacture of self-adhesive sheet for surface protection |
US5206092A (en) * | 1988-02-24 | 1993-04-27 | Showa Denko K.K. | Electron beam-curable composition for release material and process for preparation of release material |
KR970042756A (en) * | 1995-12-29 | 1997-07-26 | 황선두 | Polypropylene resin composition excellent in release property |
KR100429467B1 (en) * | 1995-12-20 | 2004-07-30 | 삼성아토피나주식회사 | A polypropylene resin composition used for adhesive tape |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57187221A (en) * | 1981-05-13 | 1982-11-17 | Fujimori Kogyo Kk | Manufacture of stripping paper |
-
1987
- 1987-04-06 JP JP8284087A patent/JPS63248834A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57187221A (en) * | 1981-05-13 | 1982-11-17 | Fujimori Kogyo Kk | Manufacture of stripping paper |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5206092A (en) * | 1988-02-24 | 1993-04-27 | Showa Denko K.K. | Electron beam-curable composition for release material and process for preparation of release material |
JPH02252782A (en) * | 1989-03-27 | 1990-10-11 | Sekisui Chem Co Ltd | Self-adhesive sheet or tape for surface protection |
JPH02252783A (en) * | 1989-03-27 | 1990-10-11 | Sekisui Chem Co Ltd | Manufacture of self-adhesive sheet for surface protection |
KR100429467B1 (en) * | 1995-12-20 | 2004-07-30 | 삼성아토피나주식회사 | A polypropylene resin composition used for adhesive tape |
KR970042756A (en) * | 1995-12-29 | 1997-07-26 | 황선두 | Polypropylene resin composition excellent in release property |
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