JPS63249317A - Manufacture of metallized film capacitor - Google Patents
Manufacture of metallized film capacitorInfo
- Publication number
- JPS63249317A JPS63249317A JP8324687A JP8324687A JPS63249317A JP S63249317 A JPS63249317 A JP S63249317A JP 8324687 A JP8324687 A JP 8324687A JP 8324687 A JP8324687 A JP 8324687A JP S63249317 A JPS63249317 A JP S63249317A
- Authority
- JP
- Japan
- Prior art keywords
- film
- metallized
- metallized film
- metal
- film capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011104 metalized film Substances 0.000 title claims description 33
- 239000003990 capacitor Substances 0.000 title claims description 25
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000002184 metal Substances 0.000 claims description 28
- 229910052751 metal Inorganic materials 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 5
- 239000010408 film Substances 0.000 description 22
- 238000000465 moulding Methods 0.000 description 10
- 238000007740 vapor deposition Methods 0.000 description 7
- 239000002131 composite material Substances 0.000 description 5
- 239000002985 plastic film Substances 0.000 description 4
- 229920006255 plastic film Polymers 0.000 description 4
- 238000005507 spraying Methods 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000000087 stabilizing effect Effects 0.000 description 2
- 238000007751 thermal spraying Methods 0.000 description 2
- 241000283080 Proboscidea <mammal> Species 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、電子機器、電気機器に用いられる金属化フィ
ルムコンデンサに関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to metallized film capacitors used in electronic and electrical equipment.
従来の技術
近年、電子部品のチップ化、小型化が実装技術の進歩に
伴い、日進月歩の勢いで進んでいる。このチップ化、小
型化の波は金属化フィルムコンデンサにも押し寄せてい
る。BACKGROUND OF THE INVENTION In recent years, chipping and miniaturization of electronic components have been progressing at a rapid pace due to advances in packaging technology. This wave of chipping and miniaturization is also hitting metallized film capacitors.
金属化フィルムコンデンサの電槙引き出しは、金属化フ
ィルムを巻回あるいは積層した後、対向する金属化電極
(通常は金属蒸着膜)が各々延びる両縁辺部に金属溶射
(ここではその下地処理の蒸着やイオンブレーティング
等を含む。)したり、導電性ペイントを塗布することに
より行われている(以下、これらを含めて金属溶射と記
す)。ここでの金属化電極と溶射金属との接触状態はコ
ンデンサ特性を左右する最も大きな要素である。この接
触状態が悪い場合には、単に特性劣化だけでなく、金属
化電極と溶射金属が離れた場合、コンデンサ機能をなく
す場合さえあり、電気的にも機械的にも充分な強度が必
要である。A metallized film capacitor is manufactured by winding or laminating a metallized film, and then applying metal spraying (in this case, evaporation of the base treatment) to both edges where opposing metallized electrodes (usually metal evaporated films) extend. metal spraying) or by applying conductive paint (hereinafter referred to as metal spraying). The contact condition between the metallized electrode and the sprayed metal is the most important factor that influences the capacitor characteristics. If this contact condition is poor, not only will the characteristics deteriorate, but if the metallized electrode and sprayed metal become separated, the capacitor function may even be lost, so sufficient electrical and mechanical strength is required. .
近年、金属化フィルムコンデンサのチップ化。In recent years, metallized film capacitors have been made into chips.
小型化を図るために1.6μm〜4μm程度の薄手の金
属化フィルムが使用されている。これら薄手のフィルム
を使用した場合、厚さが薄いために溶射金属の侵入する
間隙が小さくなることや、いわゆるフィルムの腰が弱い
ために本来もつべきフィルム相互間の間隙をもフィルム
自体の変形により塞いでしまうこと、あるいは熱収縮が
起こりやすいことのために、上記の金属化電極と溶射金
属との接触状態は従来の厚手フィルムにくらべ極めて悪
くなっておシ、巻回型コンデンサにおいては誘電正接特
性を劣化させる原因となっている。In order to achieve miniaturization, a thin metallized film of about 1.6 μm to 4 μm is used. When these thin films are used, the thinness of the film reduces the gap through which the sprayed metal can penetrate, and the so-called stiffness of the film reduces the gap between the films that should otherwise exist due to deformation of the film itself. Due to the tendency of clogging or thermal shrinkage, the contact condition between the metallized electrode and the sprayed metal is much poorer than that of conventional thick films, and the dielectric loss tangent is low in wound capacitors. This causes the characteristics to deteriorate.
また、電極がそれぞれ独立構造となっている積層フィル
ムコンデンサの場合には、この接触状態の間層はさらに
深刻で、誘電正接特性の劣化ばかりでなく、蒸着電極が
溶射金属から離れることにより、静電容量が次第に減少
していくという問題も起きている。Furthermore, in the case of multilayer film capacitors in which each electrode has an independent structure, this contact between the layers is even more serious, and not only does the dielectric loss tangent characteristic deteriorate, but the vapor deposited electrode separates from the sprayed metal, causing static electricity. Another problem is that the capacitance is gradually decreasing.
これらの原因は、溶射金属が金属化フィルムの縁辺部に
充分侵入しないため、金属化電極との接触が非常に弱く
なっていることにある。The reason for this is that the sprayed metal does not fully penetrate the edges of the metallized film, resulting in very weak contact with the metalized electrode.
従来、このような問題の解決策として、第4図に示すよ
うに、幅方向の縁辺部に切り欠き4を繰り返し設けた金
属化フィルムもしくは非金属化フィルム、もしくは金属
化フィルムの少なくとも片面に誘電体を設けた複合フィ
ルムを、巻回または積層した後、金属溶射した構成の金
属化フィルムコンデンサを提案している。上記幅方向の
縁辺部に設けた切シ欠き部が、溶射金属の侵入する間隙
を確保し金属化電極と溶射金属との接触状態を確実にす
るという手段である。1はプレス金型、2は蒸着電極(
金属蒸着膜)、3は蒸着マージン部、4は溶射金属の侵
入する間隙を確保する切り欠き部、5は誘電体であるプ
ラスチックフィルム、6は金属溶射端面である。さて一
方上記構成の金属化フィルムコンデンサを製造する過程
で、容量精度の安定、あるいは素子寸法の均一化という
目的でプレス成形工程がある。この工程は、圧力と温度
を加え金属化フィルムを物理的、化学的に変形させ金属
化フィルム層間を接着させる目的で行われる。この目的
を達成するために第4図に示すようにプレス金型1を用
いてフィルム積層方向へプレスを行ない、フィルム層間
の接着を確実にし、容量精度の安定、素子寸法の均一化
を図っている。Conventionally, as a solution to this problem, as shown in FIG. A metallized film capacitor is proposed in which a composite film provided with a body is wound or laminated and then metal sprayed. The notch provided in the edge portion in the width direction is a means for ensuring a gap into which the sprayed metal enters and ensuring contact between the metallized electrode and the sprayed metal. 1 is a press mold, 2 is a vapor deposition electrode (
3 is a vapor deposition margin portion, 4 is a notch portion for securing a gap into which the sprayed metal enters, 5 is a plastic film which is a dielectric, and 6 is a metal sprayed end face. On the other hand, in the process of manufacturing the metallized film capacitor having the above structure, a press molding process is carried out for the purpose of stabilizing the capacitance accuracy or making the element dimensions uniform. This step is performed by applying pressure and temperature to physically and chemically deform the metallized film to bond the metallized film layers. To achieve this purpose, as shown in Figure 4, pressing is performed in the film lamination direction using a press die 1 to ensure adhesion between film layers, stabilize capacitance accuracy, and uniformize element dimensions. There is.
発明が解決しようとする問題点
しかしながら、金属化フィルムの幅方向の縁辺部に設け
た切シ欠き部の間隙が、溶射金属の侵入を容易にし金属
化電極と溶射金属との接触状態を確実にするという金属
化フィルムコンデンサの製造において、上記プレス成形
工程により容量精度の安定、あるいは素子寸法の均一と
いう目的は確保できるが、金属化電極と溶射金属との接
触状態を確実にするという切り欠き部の間隙は、プレス
時の温度、圧力により変形し、第5図に示すように損失
してし寸い、さらに切シ欠き部の間隙4の損失状態は均
一でないという状態になっている。Problems to be Solved by the Invention However, the gaps between the notches provided at the edges in the width direction of the metallized film facilitate the penetration of the sprayed metal and ensure the contact between the metalized electrode and the sprayed metal. In the production of metallized film capacitors, the press forming process described above can ensure stable capacitance accuracy or uniform element dimensions, but the cutout part is used to ensure contact between the metalized electrode and the sprayed metal. The gap is deformed by the temperature and pressure during pressing, and as shown in FIG. 5, is almost lost, and furthermore, the state of loss in the gap 4 at the notch portion is not uniform.
すなわち、金属化フィルムコンデンサの切り欠き部4の
エツジ7の位置で、接する金属化プラスチックフィルム
が折れ曲がり、込み、切り欠き部4の間隙を損失してし
まうという現象といえる。この様に金属化篭筒と溶射金
属との接触状態を不確実にし、誘電正接特性が劣化する
、さらに積層型金属化フィルムコンデンサにおいては、
静電容量の低下を招く等の問題があった。In other words, it can be said that the metallized plastic film in contact with the edge 7 of the notch 4 of the metallized film capacitor bends and tucks in, causing the gap between the notch 4 to be lost. In this way, the contact state between the metallized canister and the sprayed metal becomes uncertain, and the dielectric loss tangent characteristics deteriorate.
There were problems such as a decrease in capacitance.
本発明は、上記の問題点を鑑み、金属化電極と溶射金属
の面接触状態を確保し、誘電正接特性および静電容量が
安定し、しかも素子寸法の均一な小型の金属化フィルム
コンデンサの製造方法を提供することを目的とする。In view of the above problems, the present invention aims to manufacture a small metallized film capacitor that ensures surface contact between the metallized electrode and the sprayed metal, has stable dielectric loss tangent characteristics and capacitance, and has uniform element dimensions. The purpose is to provide a method.
問題”点を解決するための手段
上記目的を達成するために、本発明の金属化フィルムコ
ンデンサの製造方法は、プレス成形工程において金属化
フィルムもしくは非金属フィルム、もしくは金属化フィ
ルムの少なくとも片面に誘電体を設けた複合フィルムの
幅方向の縁辺部に切り欠きを繰り返し設け、かつ上記切
り欠き部分を除き、対向する金属化電極を含む部分をプ
レス成形(以下、部分プレス成形と記す)する工程を設
けている。Means for Solving the Problem In order to achieve the above object, the method for manufacturing a metallized film capacitor of the present invention provides a metallized film or a non-metallic film, or a dielectric film on at least one side of the metallized film in a press molding process. A process of repeatedly providing notches in the edge portion in the width direction of the composite film provided with the body, and press-molding (hereinafter referred to as partial press-molding) a portion including the opposing metallized electrodes, excluding the cut-out portions. It is set up.
作 用
この部分プレス成形工程を設けることによって、フィル
ム層間の接着を確実にし、容量精度の安定、素子寸法の
均一化が図れると共に金属化フィルムもしくは非金属フ
ィルム、もしくは金属化フィルムの少なくとも片面に誘
電体を設けた複合フィルムの幅方向の縁辺部に切シ欠き
を繰り返し設けた部分による間隙を損失することなく、
溶射金属が切り欠き部の間隙に侵入し、金属化電極との
面接触状態を確保することにより、誘電正接特性の安定
化が図れる。Function: By providing this partial press molding process, it is possible to ensure adhesion between film layers, stabilize capacitance accuracy, and make device dimensions uniform. Without losing the gap created by repeatedly providing notches on the widthwise edge of the composite film provided with the body,
The sprayed metal enters the gap between the notches and ensures surface contact with the metallized electrode, thereby stabilizing the dielectric loss tangent characteristics.
実施例
以下本発明の一実施例について、図面を参照しながら説
明する。第1図は本発明の一実施例における積層形金属
化フィルムコンデンサの部分プレス成形工程を示す斜視
図である。11は部分プレス成形金型、12は金属蒸着
膜、13は蒸着マージン、14は切り欠き部、16はプ
ラスチックフィルム、16は溶射端面である。EXAMPLE An example of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing a partial press molding process of a laminated metallized film capacitor in an embodiment of the present invention. 11 is a partial press molding die, 12 is a metal vapor deposition film, 13 is a vapor deposition margin, 14 is a notch, 16 is a plastic film, and 16 is a thermal sprayed end face.
上記の金属化フィルムコンデンサの製造方法の部分プレ
ス成形工程について、以下その方法を説明する。The partial press molding step of the above metallized film capacitor manufacturing method will be explained below.
部分プレス成形金型11の上下の間に、積層された素子
を置く。次に切り欠きを繰り返し設けた部分を除き、対
向する蒸着電極を含む部分をプレス成形する。成形の時
は、少なくとも圧力は加える。その結果を第2図をもっ
て説明する。第2図は、第1図の溶射端面16から見た
端面の図である。切シ欠き部14の間隙は、プレス時の
温度。The stacked elements are placed between the upper and lower parts of the partial press molding die 11. Next, excluding the portion where the notches are repeatedly provided, the portion including the opposing vapor deposition electrodes is press-molded. When molding, apply at least pressure. The results will be explained with reference to FIG. FIG. 2 is a view of the end face seen from the thermal spraying end face 16 of FIG. 1. FIG. The gap between the notches 14 is at a temperature during pressing.
圧力等による影響が全くなく、切り欠き部14の形成が
均=に残っている。There is no influence from pressure or the like, and the notch portion 14 remains evenly formed.
以上のような本実施例によれば、金属化フィルムもしく
は非金属フィルム、もしくは金属化フィルムの少なくと
も片面に誘電体を設けた複合フィルムの幅方向の縁辺部
に切り欠きを繰り返し設けた部分が確保でき、溶射金属
が確実に切り欠き部に侵入し、金属化電極と溶射金属と
の接触状態を確実にする。従って、誘電正接特性および
静電容量精度を安定することが可能となる。According to this embodiment as described above, a portion where cutouts are repeatedly provided on the edge portion in the width direction of a metalized film, a non-metallic film, or a composite film in which a dielectric material is provided on at least one side of a metalized film is secured. This ensures that the sprayed metal enters the notch and ensures contact between the metallized electrode and the sprayed metal. Therefore, it is possible to stabilize dielectric loss tangent characteristics and capacitance accuracy.
第3図a、bに従来および本発明で得られるコンデンサ
の容量精度、誘電正特性を示す。従来の方法では、金属
化電極と溶射金属との接触状態が不確実で誘電特性がば
らつき、また、一部接触状態が得られてない所もあシ、
容量精度は低く値を示す。Figures 3a and 3b show the capacitance accuracy and dielectric positive characteristics of the conventional capacitor and the capacitor obtained by the present invention. With conventional methods, the contact between the metallized electrode and the sprayed metal is uncertain and the dielectric properties vary, and there are some areas where contact cannot be achieved.
The capacitance accuracy shows a low value.
発明の効果
以上のように本発明は、フィルム層間の接着を確実にす
ると共に金属化フィルムもしくは非金属フィルム、もし
くは金属化フィルムの少なくとも片面に誘電体を設けた
複合フィルムの幅方向の縁辺部に切シ欠きを繰り返し設
けた部分による間隙が確保でき、溶射金属との面接触状
態が確実となる。このように本発明の製造方法によれば
誘電正接および静電容量精度が安定し、しかも寸法精度
の安定した金属化フィルムコンデンサを提供することが
でき、その実用的効果は大なるものである。Effects of the Invention As described above, the present invention ensures adhesion between film layers, and also provides a metallized film, a non-metallic film, or a composite film in which a dielectric material is provided on at least one side of the metallized film at the edge portion in the width direction. A gap can be secured by the portion where the notches are repeatedly provided, and surface contact with the sprayed metal can be ensured. As described above, according to the manufacturing method of the present invention, it is possible to provide a metallized film capacitor with stable dielectric loss tangent and capacitance accuracy, as well as stable dimensional accuracy, and its practical effects are great.
第1図は本発明の一実施例における金属化フィルムコン
デンサの部分プレス成形工程での斜視図、第2図は本発
明の一実施例における金属化フィルムコンデンサの部分
プレス成形後の溶射端面の平面図、第3図は本発明の詳
細な説明するための特性図、第4図は従来の金属化フィ
ルムコンデンサのプレス成形工程での斜視図、第6図は
従来の金属化フィルムコンデンサのプレス成形後の溶射
端面の平面図である。
11・・・・・・プレス金型、12・・・・・・金属蒸
着膜、13−・・・蒸着マージン部、14・・・・・・
切り欠き部、16・・・・・・プラスチックフィルム、
16・・・・・・溶射端面。
代理人の氏名 弁理士 中 尾 敏 男 ほか1名n−
“°7°は金1
ff;−−−5象打tnfn
第3図Fig. 1 is a perspective view of a metallized film capacitor in an embodiment of the present invention during a partial press forming process, and Fig. 2 is a plane view of a sprayed end face after partial press forming of a metallized film capacitor in an embodiment of the present invention. Fig. 3 is a characteristic diagram for explaining the present invention in detail, Fig. 4 is a perspective view of a conventional metallized film capacitor in the press forming process, and Fig. 6 is a conventional press forming of a metallized film capacitor. FIG. 7 is a plan view of a later thermal sprayed end face. 11... Press mold, 12... Metal vapor deposition film, 13-... Vapor deposition margin part, 14...
Notch part, 16...Plastic film,
16...Thermal spraying end face. Name of agent: Patent attorney Toshio Nakao and one other person n-
“°7° is gold 1 ff; ---5 elephants tnfn Fig. 3
Claims (1)
フィルムの縁辺部に切り欠きを繰り返し形成し、上記切
り欠き部分を除き、対向する金属化電極を含む部分をプ
レスする工程を具備することを特徴とする金属化フィル
ムコンデンサの製造方法。It is characterized by comprising the step of repeatedly forming notches on the edge of the metallized film or non-metalized film that is sprayed with metal on the end face, and pressing the portion containing the opposing metallized electrode, excluding the notch portion. A method for manufacturing a metallized film capacitor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8324687A JPS63249317A (en) | 1987-04-03 | 1987-04-03 | Manufacture of metallized film capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8324687A JPS63249317A (en) | 1987-04-03 | 1987-04-03 | Manufacture of metallized film capacitor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63249317A true JPS63249317A (en) | 1988-10-17 |
Family
ID=13796972
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8324687A Pending JPS63249317A (en) | 1987-04-03 | 1987-04-03 | Manufacture of metallized film capacitor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63249317A (en) |
-
1987
- 1987-04-03 JP JP8324687A patent/JPS63249317A/en active Pending
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