JPS6324894U - - Google Patents

Info

Publication number
JPS6324894U
JPS6324894U JP11758486U JP11758486U JPS6324894U JP S6324894 U JPS6324894 U JP S6324894U JP 11758486 U JP11758486 U JP 11758486U JP 11758486 U JP11758486 U JP 11758486U JP S6324894 U JPS6324894 U JP S6324894U
Authority
JP
Japan
Prior art keywords
heat
heating element
heat pipe
heat sink
pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11758486U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11758486U priority Critical patent/JPS6324894U/ja
Publication of JPS6324894U publication Critical patent/JPS6324894U/ja
Pending legal-status Critical Current

Links

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図はこの考案の一実施例によるヒートシン
クの所定温度以下の状態を示す斜視図、第２図は
この考案の一実施例によるヒートシンクの所定温
度以上の状態を示す斜視図、第３図はこの考案の
一実施例によるヒートシンクを装着した状態を示
す斜視図、第４図は電子応用機器等における密閉
状容器の例を示す斜視図である。 図において、７はヒートシンク、８はヒートパ
イプ、９は伝熱フイン、１０は固定部、１１は可
動部、１２は放熱フインである。各図中、同一符
号は同一部分を示す。 FIG. 1 is a perspective view showing a heat sink according to an embodiment of this invention when the temperature is below a predetermined temperature, FIG. 2 is a perspective view showing a heat sink according to an embodiment of this invention when the temperature is above a predetermined temperature, and FIG. FIG. 4 is a perspective view showing a state in which a heat sink according to an embodiment of the invention is attached, and FIG. 4 is a perspective view showing an example of a closed container for electronic application equipment and the like. In the figure, 7 is a heat sink, 8 is a heat pipe, 9 is a heat transfer fin, 10 is a fixed part, 11 is a movable part, and 12 is a heat radiation fin. In each figure, the same reference numerals indicate the same parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ヒートパイプを用いて発熱体の熱を伝達し放熱
するヒートシンクにおいて、上記ヒートパイプに
固定されかつ所定温度以上になると上記ヒートパ
イプと発熱体とを熱伝達関係に接続するように変
形する形状記憶合金からなる伝熱フインを備えて
なるヒートシンク。 In a heat sink that transfers and radiates heat from a heating element using a heat pipe, a shape memory alloy is fixed to the heat pipe and deforms to connect the heat pipe and the heating element in a heat transfer relationship when the temperature exceeds a predetermined temperature. A heat sink comprising heat transfer fins.
JP11758486U 1986-07-31 1986-07-31 Pending JPS6324894U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11758486U JPS6324894U (en) 1986-07-31 1986-07-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11758486U JPS6324894U (en) 1986-07-31 1986-07-31

Publications (1)

Publication Number Publication Date
JPS6324894U true JPS6324894U (en) 1988-02-18

Family

ID=31003238

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11758486U Pending JPS6324894U (en) 1986-07-31 1986-07-31

Country Status (1)

Country Link
JP (1) JPS6324894U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0373113U (en) * 1989-11-21 1991-07-23
JP2009168354A (en) * 2008-01-17 2009-07-30 Kiko Kagi Kofun Yugenkoshi Thermal conduit molding method and its structure
JP2012077988A (en) * 2010-09-30 2012-04-19 Fujitsu Ltd Heat relay mechanism, and heat-dissipating fin unit

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0373113U (en) * 1989-11-21 1991-07-23
JP2009168354A (en) * 2008-01-17 2009-07-30 Kiko Kagi Kofun Yugenkoshi Thermal conduit molding method and its structure
JP2012077988A (en) * 2010-09-30 2012-04-19 Fujitsu Ltd Heat relay mechanism, and heat-dissipating fin unit

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