JPS63248867A - Heat-resistant electrical insulating coating - Google Patents
Heat-resistant electrical insulating coatingInfo
- Publication number
- JPS63248867A JPS63248867A JP7972687A JP7972687A JPS63248867A JP S63248867 A JPS63248867 A JP S63248867A JP 7972687 A JP7972687 A JP 7972687A JP 7972687 A JP7972687 A JP 7972687A JP S63248867 A JPS63248867 A JP S63248867A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- imide
- oligomers
- heat
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000576 coating method Methods 0.000 title abstract description 8
- 239000011248 coating agent Substances 0.000 title abstract description 7
- 229920005989 resin Polymers 0.000 claims abstract description 22
- 239000011347 resin Substances 0.000 claims abstract description 22
- -1 isocyanate compound Chemical class 0.000 claims abstract description 20
- 239000002904 solvent Substances 0.000 claims abstract description 7
- 239000012948 isocyanate Substances 0.000 claims abstract description 5
- 239000000203 mixture Substances 0.000 claims abstract description 5
- 239000004962 Polyamide-imide Substances 0.000 claims abstract description 4
- 230000009477 glass transition Effects 0.000 claims abstract description 4
- 229920002312 polyamide-imide Polymers 0.000 claims abstract description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 3
- 239000003973 paint Substances 0.000 claims description 13
- 229920003055 poly(ester-imide) Polymers 0.000 claims description 4
- 238000005476 soldering Methods 0.000 abstract description 12
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 abstract description 3
- 150000003949 imides Chemical class 0.000 abstract 1
- 229920006149 polyester-amide block copolymer Polymers 0.000 abstract 1
- 150000005846 sugar alcohols Polymers 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 150000003627 tricarboxylic acid derivatives Chemical class 0.000 description 6
- 229920002635 polyurethane Polymers 0.000 description 5
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 230000018044 dehydration Effects 0.000 description 2
- 238000006297 dehydration reaction Methods 0.000 description 2
- 125000005442 diisocyanate group Chemical group 0.000 description 2
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000000087 stabilizing effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 2
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005267 amalgamation Methods 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- YMAWOPBAYDPSLA-UHFFFAOYSA-N glycylglycine Chemical class [NH3+]CC(=O)NCC([O-])=O YMAWOPBAYDPSLA-UHFFFAOYSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 241000894007 species Species 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Paints Or Removers (AREA)
- Organic Insulating Materials (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はハンダ付は特性に優れた耐熱性電気絶縁塗料に
関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a heat-resistant electrically insulating paint with excellent soldering properties.
（従来の技術）
近時モーター、トランス、偏向ヨーク等に使用される絶
縁電線は、電子、電気機器の小型軽量化、高性能化に伴
い細線化或は非常に厳しい雰囲気下における使用も増大
しており、このため該電線の皮膜を形成するための樹脂
材料の耐熱性が以前にもまして要求されているものであ
る。又、一方絶縁電線の端末処理としてハンダ付は作業
を行うにおいて、省力化或は熱による他部品への悪影響
及び絶縁電線自体の細径化をさけるために低温且つ短時
間にて直接半田付は出来る自己電着材料の必要性が増大
しているものである。即ち自己電着材料として耐熱性に
優れしかも低温にてハンダ付けが可能という相反する両
特性を具備しなければならないものであった。(Prior art) Insulated wires used in motors, transformers, deflection yokes, etc. have recently become thinner and used in extremely harsh environments as electronic and electrical equipment becomes smaller, lighter, and more sophisticated. Therefore, heat resistance of the resin material used to form the coating of the electric wire is required more than ever before. On the other hand, when soldering is performed as a terminal treatment for insulated wires, direct soldering at low temperatures and in a short time is recommended in order to save labor, avoid adverse effects on other parts due to heat, and avoid reducing the diameter of the insulated wires themselves. There is an increasing need for self-electrodepositable materials. That is, as a self-electrodeposition material, it had to have two contradictory properties: excellent heat resistance and the ability to be soldered at low temperatures.
而して現在この桟の絶縁電線において主流ケなすものと
しては、ポリウレタｙｔｓであり、その耐熱グレードは
８種レベル（Ｉ２０℃）にしてハンダ付は温度３６０〜
３８０℃、１〜２秒からなるものである。また更に耐熱
性を向上せしめるためにエステルイミド変性ポリウレタ
ン電線として耐熱クレードが８種レベル（Ｉ３０℃）、
ハンダ付は温度３８０〜４２０℃、数秒からなるもの及
びポリエステルイミド電線として耐熱グレートがＦ［レ
ベル（Ｉ５５℃）、ハンタ付温１ｉ［４４０〜４６０℃
、数秒からなるものが出現している。Currently, the mainstream insulated wire for this crosspiece is polyurethane YTS, and its heat resistance grade is level 8 (I20℃), and the temperature for soldering is 360~360℃.
It consists of 380 degreeC and 1 to 2 seconds. In addition, in order to further improve heat resistance, the esterimide-modified polyurethane wire has 8 types of heat resistance clades (I30℃),
Soldering is done at a temperature of 380-420℃ for a few seconds, and as a polyester imide electric wire, the heat-resistant grade is F [level (I55℃), the soldering temperature is 1i [440-460℃]
, consisting of several seconds has appeared.
然しこれらの絶縁電線においても電気機器メーカーのニ
ーズを満足することが出来ないものでありだ。例えば０
．０５ｗφ以下の絶縁電線においてハンダ付は温度４０
０℃では、ハンダが耐着した後数秒以内に導体が溶融（
ＳｎとＣｕのアマルがム化）、切断或は消滅する。従っ
て耐熱性が要求される部品に使用する場合の細径絶縁電
線ＶＣおいては少くとも４００℃以下、２〜３秒以内の
ものが要望されているものであった。However, even these insulated wires cannot satisfy the needs of electrical equipment manufacturers. For example 0
．． For insulated wires of 05wφ or less, the temperature is 40℃ for soldering.
At 0°C, the conductor melts (
The amalgamation of Sn and Cu is mutated), severed, or disappears. Therefore, for small-diameter insulated wires VC used in parts requiring heat resistance, it is desired that the wires be heated at a temperature of at least 400 DEG C. or less and within 2 to 3 seconds.
（発明が解決しようとする問題点）
本発明はかかる要望に応じ鋭意研究を行った結果、耐熱
グレード２種を保持し且つハンダ付は温度を３６０°〜
４００℃、１〜２秒以下という画期的な特性を有する耐
熱性電気塗料を開発したものである。(Problems to be Solved by the Invention) As a result of intensive research in response to such requests, the present invention has two heat-resistant grades and a soldering temperature range of 360° to 360°.
We have developed a heat-resistant electric paint that has the revolutionary property of being heated to 400°C for 1 to 2 seconds or less.
（問題点を解決するための手段）
本発明は（Ｉ１平均分子量４０００以上、ガラス転移温
度１６０°〜３２０℃のポリアミドイミド樹脂、ポリエ
ステルアミドイミド樹脂、ポリエステルイミド樹脂、ポ
リピタントインイミドエステル樹脂の内から選ばれた１
種又は２種以上の樹脂１０〜８０重量％と、（■）分子
ｆｋ２３０〜１８００を有し、末端に水酸基を有するエ
ステルイミドオリゴマー、エステルアミドイミドオリゴ
マー、エステルアミドオリゴマーの内から選ばれた１種
又は２種以上のオリゴマー４〜４５重ｉ％と、 （ＩＩ
Ｄ安定化インシアナート化合物１２〜８０重量％との混
和物を有機溶媒に溶解したことを特徴とするものである
。(Means for Solving the Problems) The present invention provides (a polyamide-imide resin, a polyesteramide-imide resin, a polyesterimide resin, a polypitantoinimide ester resin having an I1 average molecular weight of 4000 or more and a glass transition temperature of 160° to 320°C). 1 selected from within
10 to 80% by weight of a species or two or more resins, and (■) one type selected from ester imide oligomers, ester amide imide oligomers, and ester amide oligomers having a hydroxyl group at the end and having a molecule fk of 230 to 1800. or 4 to 45 weight i% of two or more types of oligomers, (II
It is characterized in that a mixture with 12 to 80% by weight of D-stabilized incyanate compound is dissolved in an organic solvent.
本発明において前記（Ｉ）の樹脂は耐熱グレー２２種以
上を有するものであるが平均分子量が４０００未満の場
合には熱特性が低下するため該分子量を４０００以上に
限定したものである。又ガラス転移温度１６００〜３２
０℃と限定した理由は１６０℃未満の場合には熱特性が
著しく低下するためであり、又３２０℃を超えると全く
ハンダ特性を発現することができないためである。更に
その配合量を１０〜８０重量％に限定した理由は１０重
鷲チ未満の場合には熱特性が著しく低下するためであり
、又８０重債チを超えた場合にはハンダ特性が殆んど発
現されず且つ絶縁電線を得友場合に、その表面の外観不
良を生ずるためである。なお好適な範囲は３０〜７０重
斂チである。In the present invention, the resin (I) has 22 or more types of heat-resistant gray, but if the average molecular weight is less than 4,000, the thermal properties will deteriorate, so the molecular weight is limited to 4,000 or more. Also glass transition temperature 1600~32
The reason why it is limited to 0°C is that if the temperature is less than 160°C, the thermal properties will be significantly degraded, and if it exceeds 320°C, no soldering properties will be exhibited at all. Furthermore, the reason why the amount is limited to 10 to 80% by weight is that if it is less than 10% by weight, the thermal properties will deteriorate significantly, and if it exceeds 80% by weight, the solder properties will be almost non-existent. This is because if the insulated wire is not exposed and the insulated wire is damaged, the appearance of the surface thereof will be poor. Note that the preferred range is 30 to 70 centimeters.
この高分子社の樹脂を製造するには、例えばポリアミド
イミド樹脂としては少くとも一種のトリカルボン酸無水
物と少くとも１独のジインシアネートとを反応させるも
のであシ、その市販製品としては日立化成社製商品名Ｈ
Ｉ−４０５がある。To produce Kobunshisha's resin, for example, the polyamide-imide resin must be made by reacting at least one kind of tricarboxylic acid anhydride with at least one diincyanate. Company product name H
There is I-405.
又ポリエステルアミドイミド樹脂は少くとも１種のトリ
カルボン酸無水物、多価アミンジカルボン酸及び多価ア
ルコールとを反応させるものであり、その市販製品とし
ては大日精化社製商品名Ｔａｒｅｂｅｃ ８００がある
。Further, the polyesteramide-imide resin is made by reacting at least one type of tricarboxylic acid anhydride, polyvalent amine dicarboxylic acid, and polyhydric alcohol, and its commercially available product is available under the trade name Tarebec 800 manufactured by Dainichiseika Kaisha.
又ポリエステルイミド樹脂は少くとも１種のトリカルボ
ン酸無水物、ジインシアネート及び多価アルコールとを
反応させるものであυ、その市販製品としては口触スケ
ネクタデイ社製商品名Ｉｓｏｍｉｄ ＲＬがある。The polyesterimide resin is made by reacting at least one kind of tricarboxylic anhydride, diincyanate, and polyhydric alcohol, and its commercially available product is available under the trade name Isomid RL manufactured by Schenectaday Co., Ltd.
又ポリピタントインイミドエステル樹脂は、少くとも１
種のジグリシン誘導体、ジインシアネート、トリカルボ
ン酸無水物、多価アルコールとを反応させるものであり
、その市販製品としては東芝ケミカル社製ＴＶＥ ５４
１６がある。In addition, the polypitantoinimide ester resin has at least 1
It reacts with a diglycine derivative, diincyanate, tricarboxylic acid anhydride, and polyhydric alcohol, and its commercially available product is TVE 54 manufactured by Toshiba Chemical Corporation.
There are 16.
次に（ｎ）のオリゴマーについて、その分子量を２３０
〜１８００に限定した理由は、分子量２３０が最低であ
υ、又分子ｔｈｉｔ１８００ｔ−超えるとハンダ特性が
著しく低下するためである。なお好適な範囲は分子量６
００〜１３００である。Next, regarding the oligomer (n), its molecular weight is 230
The reason for limiting the molecular weight to 1,800 is that the minimum molecular weight is 230, and if the molecular weight exceeds 1,800 t-, the solder properties will deteriorate significantly. The preferred range is molecular weight 6.
00-1300.
更にその配合量を４〜４５重ｉ％に限定した理由は、こ
の範囲以外の場合には何れもハンダ付は特性に劣るため
である。Furthermore, the reason why the amount is limited to 4 to 45% by weight is that the soldering properties are inferior in any case outside this range.
このオリゴマの間エステルイミドオリゴマーは少くとも
１種のトリカルボン酸無水物、ジアミン、多価アルコー
ルとを反応させたものである。Among these oligomers, the ester imide oligomer is obtained by reacting at least one kind of tricarboxylic acid anhydride, diamine, and polyhydric alcohol.
又エステルアミドオリゴマーは少くとも１種のジカルボ
ン酸、多価インシアネート、多価アルコールとを反応さ
せたものである。Further, the ester amide oligomer is a product obtained by reacting at least one type of dicarboxylic acid, polyhydric incyanate, or polyhydric alcohol.
又エステルアミドイミドオリゴマーは少くとも１種のト
リカルボン酸無水物、ジイソシアネート、ジカルボン酸
、多価アルコールとを反応させたものであれ
次に（Ｉ１Ｄの安定化イソシアネート化合物は少くとも
１檎の多価インシアネートのインシアネート基を多１曲
アルコール、或はフェノール類で安定化したものであり
、市販製品として日本ポリウレタン社製の商品名コロネ
ートＡＰステーブル、コロネート２５０３、ミリオネー
）ＭＳ−５０がある。The ester amide imide oligomer may be one obtained by reacting at least one kind of tricarboxylic acid anhydride, diisocyanate, dicarboxylic acid, or polyhydric alcohol (the stabilized isocyanate compound of I1D is reacted with at least one kind of tricarboxylic acid anhydride, diisocyanate, dicarboxylic acid, or polyhydric alcohol). It is obtained by stabilizing the incyanate group of cyanate with a polyalcohol or phenol, and commercially available products include the trade names Coronate AP Stable, Coronate 2503, and Millione MS-50 manufactured by Nippon Polyurethane Co., Ltd.
この安定化イソシアネート化合物の配合量を１２〜８０
重針チと限定した理由は、これ以外の範囲の場合にはハ
ンダ付特性が低下するためである。The amount of this stabilizing isocyanate compound is 12 to 80%.
The reason why it is limited to heavy needles is that the soldering characteristics deteriorate if the range is outside this range.
又本発明において（Ｉ１（ＩＩ）及び（ＨＤの混和物の
溶媒としてはフェノール類、ＤＭＦ、Ｎ−メチルピロリ
ドン等が好ましく、該混和物績度は５〜６０重ｉチの範
囲が好ましい。In the present invention, the solvent for the mixture of (I1(II) and (HD) is preferably phenols, DMF, N-methylpyrrolidone, etc., and the strength of the mixture is preferably in the range of 5 to 60%.
この他、本発明の効果を減じない限りにおいては、ポリ
アミド樹脂、エポキシ樹脂、シリコン樹脂、フェノール
樹脂等を組合せて用いることもできる。In addition, polyamide resins, epoxy resins, silicone resins, phenol resins, etc. may be used in combination as long as they do not reduce the effects of the present invention.
（実施例）
実施例（Ｉ）
トリメリット酸無水物（０，３６モル）１６５ｇ、ジア
ミノジフェニルメタン（０，４３モル）８５ｇ、トリメ
チロールグロパン（０，８６モル）１１５．９、及び溶
剤としてＮ−メチルピロリドン１００（ｌを２１のフラ
スコに入れた後、内容物温度を８０℃に上昇せしめて溶
解する。(Example) Example (I) 165 g of trimellitic anhydride (0.36 mol), 85 g of diaminodiphenylmethane (0.43 mol), 115.9 g of trimethylolglopane (0.86 mol), and N as a solvent. - 100 l of methylpyrrolidone is placed in a 21 flask and the temperature of the contents is raised to 80°C to dissolve.
この場合９０℃に上昇すると急激に固化するが、２００
１：まで昇温すると再び溶解する。In this case, when the temperature rises to 90°C, it solidifies rapidly, but at 200°C
When the temperature is raised to 1:1, it dissolves again.
更に２３０″Ｃまで昇温せしめて脱水量が９５〜１００
％に達した時点で加熱を停止し冷却する。Furthermore, the temperature was raised to 230″C and the dehydration amount was 95 to 100.
%, stop heating and cool.
１００℃以下になったときにナフサ５００ｙと日本ポＩ
Ｊウレタン社製商品名Ｍｓ −５０を２５０ｇ入れ溶解
し、エステルイミドオリゴマー２５頭溶液２０００．９
をえた。When the temperature drops below 100℃, naphtha 500y and Nipponpo I
Add 250g of Ms-50 (trade name, manufactured by J Urethane Co., Ltd.) and dissolve it to create a solution of 25 esterimide oligomers (2000.9%).
I got it.
次にこのオリゴマー溶液に日立化成社製商品名ＨＩ−４
０５，２５％を２０００．９添加混和して、本発明絶縁
塗料をえた。Next, add HI-4 (trade name, manufactured by Hitachi Chemical Co., Ltd.) to this oligomer solution.
The insulating paint of the present invention was obtained by adding and mixing 05.25% and 2000.9%.
実施例（２）
実施例（Ｉ）によシ得たエステルイミドオリゴマー２５
％溶液ｓｏｏ、ｖに日立化成社製商品名ＨＩ−４０５，
２５％を３２０（［’入れて混合し、本発明絶縁塗料を
えた。Example (2) Esterimide oligomer 25 obtained according to Example (I)
% solution soo, v to Hitachi Chemical Co., Ltd. product name HI-405,
25% was added to 320 ([') and mixed to obtain the insulating paint of the present invention.
実施例（３）
トリメリット酸無水物（０，５２モル）１０１．９、テ
レフタル酸（０，２６モル）４４１ジフエニルメタンノ
イソシアネート（０，５２モル）１３２１溶剤クレゾー
ル１０７５．Ｆを３１７２スコに入れた後、内容物温度
を８０℃まで上昇して溶解させる。Example (3) Trimellitic anhydride (0.52 mol) 101.9, Terephthalic acid (0.26 mol) 441 Diphenylmethanoisocyanate (0.52 mol) 1321 Solvent Cresol 1075. After charging F into the 3172 Sco, the temperature of the contents is raised to 80°C to dissolve it.
９０℃まで上げると急激に発冷しＣＯ２を発散し固化す
るが、２００℃まで昇温すると再び溶解する。When the temperature is raised to 90°C, it rapidly cools down, releases CO2, and solidifies, but when the temperature is raised to 200°C, it melts again.
コノトキヘンタエリスリトール（０，５２モル）７２ｙ
を徐々に入れ、脱水量が９５〜１００チに達した時点で
加熱を停止し冷却する。１００℃以下になったときにナ
フサ１０７Ｍと日本ポリウレタン社製コロネート２５０
３を６１４Ｉ添加して溶解してエステルアミドイミドオ
リゴマー３０チ溶液を３０７０＃得た。Conotokhentaerythritol (0.52 mol) 72y
is gradually added, and when the amount of dehydration reaches 95 to 100 inches, heating is stopped and cooled. When the temperature drops below 100℃, naphtha 107M and Coronate 250 manufactured by Nippon Polyurethane Co., Ltd.
614I of 3 was added and dissolved to obtain 3070# of esteramide-imide oligomer solution.
次にこのオリゴマー溶液に大日精化製ＴｅｒｅｂｅｃＳ
ＯＯの３６％溶液９３０１を添加、混和して本発明絶縁
塗料をえた。Next, this oligomer solution was added to TerebecS manufactured by Dainichiseika Chemical Co., Ltd.
A 36% solution of OO 9301 was added and mixed to obtain an insulating coating of the present invention.
実施例（４）
実施例（３）と同様にして製造したエステルアミドイミ
ドオリゴマーの３０チ溶液２１６０．Ｐに大日精化社製
Ｔｅｒ＠ｂ＠ｃ ８００の３６チ溶液１８４０ｇを添加
混和して本発明絶縁塗料をえた。Example (4) A 30% solution of ester amide imide oligomer produced in the same manner as in Example (3) 2160. An insulating coating of the present invention was obtained by adding and mixing 1,840 g of a 36-chip solution of Ter@b@c 800 manufactured by Dainichiseika Chemical Co., Ltd. to P.
実施例（５）
テレフタル酸（０，７０モル）１１６．９、ジアミノジ
フェニルメタン（０，４７モル）９２．Ｐ、グリセリン
（０，４７モル）４３１溶剤クレゾール６５８Ｉを３１
フラスコ中に添加した後、内容物温度を８０℃まで上昇
せしめて溶解する。更に９０℃まで上昇すると急激に高
粘性を呈するが、そのまま徐々に２３０′Ｃまで昇温さ
せて脱水量が９５〜１００％に達した時点で加熱を停止
せしめ冷却する。１００℃以下になった時点でナフサ６
５８ｇと日本ポリウレタン社製コロネートＡＰステープ
ルを３３８ｇ添加せしめてエステルアミドオリゴマー３
０チ溶液１８８（［’をえた。Example (5) Terephthalic acid (0.70 mol) 116.9, diaminodiphenylmethane (0.47 mol) 92. P, glycerin (0,47 mol) 431 solvent cresol 658I 31
After addition into the flask, the contents temperature is raised to 80° C. to dissolve. When the temperature is further increased to 90°C, the viscosity suddenly becomes high, but the temperature is gradually increased to 230'C, and when the amount of water removed reaches 95 to 100%, heating is stopped and cooled. Naphtha 6 when the temperature drops below 100℃
58 g and 338 g of Coronate AP staple manufactured by Nippon Polyurethane Co., Ltd. were added to prepare ester amide oligomer 3.
0chi solution 188 ([' was obtained.
次にこのオリゴマー溶液に口触スケネクタディー社製Ｉ
ｓｏｍｉｄＲＬ ２７ ％溶液を２１２ＯＮ添加混合し
て本発明絶縁塗料をえた。Next, this oligomer solution was coated with Schenectady I
An insulating paint of the present invention was obtained by adding and mixing 212ON of somidRL 27% solution.
実施例（６）
実施例（５）と同様に製造したエステルアミドオリゴマ
ーの３０％溶液２１８０．９に大日精化製Ｔ＠ｒｅｂｅ
ｃ８００．３６％溶液１８２ＯＮを添加混和して本発明
絶縁塗料をえた。Example (6) A 30% solution 2180.9 of an ester amide oligomer produced in the same manner as in Example (5) was added with T@rebe manufactured by Dainichiseika Chemical Co., Ltd.
C800.36% solution 182ON was added and mixed to obtain the insulating paint of the present invention.
比較例（Ｉ）〜比較例（４）
日立化成社製）（Ｉ−４０５の２５％溶液（比較例（Ｉ
））、口触スケネクタディー社製Ｉａｏｍｉｄ ＲＬの
２７チ溶液（比較例（２） ） 、実施例（Ｉ）と同様
にして製造したエステルイミドオリゴマーの２５％溶液
（比較例（３） ） 、実施例（３）と同様にして製造
したエステルアミドイミドオリゴマーの３０％溶液３４
０Ｓに大日精化社製Ｔ＊ｒｅｂａｃ ８００の３６チ溶
液を４６６０、Ｆ添加混和して絶縁塗料（比較例（４）
）を夫夫得た。Comparative Example (I) to Comparative Example (4) (Manufactured by Hitachi Chemical) (25% solution of I-405 (Comparative Example (I)
)), 27% solution of Iaomid RL manufactured by Schenectady (Comparative Example (2)), 25% solution of esterimide oligomer produced in the same manner as in Example (I) (Comparative Example (3)), 30% solution 34 of ester amide imide oligomer produced in the same manner as in Example (3)
Insulating paint (Comparative Example (4)
) got a husband.
斯くして得た本発明電気絶縁塗料及び比較例絶縁塗料に
ついて、第１表に示す条件にて夫々絶縁電線を作成し、
その性能を測定した。その結果は第２表に示す通りであ
る。Using the electrical insulating paint of the present invention and the comparative insulating paint thus obtained, insulated wires were prepared under the conditions shown in Table 1.
Its performance was measured. The results are shown in Table 2.
第 １ 表
芯線 ０．２００ｍφ
横型焼付炉 炉温 ５００℃
炉長 ３ｍ
適正焼付速度 １５０ｍ／分塗布回数
５回（ダイス使用）塗膜厚
１５〜１８μｍ上表より明らかな如く本発明絶縁
塗料よりなる絶縁電線はハンダ付は性及び電気特性に優
れていることが認められた。1st table Core wire 0.200mφ Horizontal baking furnace Furnace temperature 500℃ Furnace length 3m Appropriate baking speed 150m/min Number of coatings
5 times (using die) coating thickness
As is clear from the table above, the insulated wire made of the insulating paint of the present invention was found to have excellent solderability and electrical properties.
（効果）
以上詳述した如く本発明耐熱性電気絶縁塗料によれば、
該塗料により得た絶縁電線はノ・ング付は性に優れた耐
熱特性を有するため電子、電器機器に適用して極めて有
用である。(Effects) As detailed above, according to the heat-resistant electrical insulation paint of the present invention,
The insulated wires obtained with the paint have excellent heat resistance properties and are therefore extremely useful for electronic and electrical appliances.
Claims (1)
０°〜３２０℃のポリアミドイミド樹脂、ポリエステル
アミドイミド樹脂、ポリエステルイミド樹脂、ポリビタ
ントインイミドエステル樹脂の内から選ばれる１種又は
２種以上の樹脂１０〜８０重量％と、（II）分子量２３
０〜１８００を有し、末端に水酸基を有するエステルイ
ミドオリゴマー、エステルアミドイミドオリゴマー、エ
ステルアミドオリゴマーの内から選ばれた１種又は２種
以上のオリゴマーを４〜４５重量％と、（III）安定化
イソシアナート化合物１２〜８０重量％との混和物を溶
媒に溶解したことを特徴とする耐熱性電気絶縁塗料。(I) Average molecular weight 4000 or more, glass transition temperature 16
10 to 80% by weight of one or more resins selected from polyamideimide resin, polyesteramideimide resin, polyesterimide resin, and polyvitantoinimideester resin at 0° to 320°C, and (II) molecular weight 23
4 to 45% by weight of one or more oligomers selected from ester imide oligomers, ester amide imide oligomers, and ester amide oligomers having a hydroxyl group at the end, and (III) stable. 1. A heat-resistant electrically insulating paint characterized in that a mixture with 12 to 80% by weight of an isocyanate compound is dissolved in a solvent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62079726A JP2801189B2 (en) | 1987-04-02 | 1987-04-02 | Heat resistant electrical insulation paint |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62079726A JP2801189B2 (en) | 1987-04-02 | 1987-04-02 | Heat resistant electrical insulation paint |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63248867A true JPS63248867A (en) | 1988-10-17 |
| JP2801189B2 JP2801189B2 (en) | 1998-09-21 |
Family
ID=13698205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62079726A Expired - Fee Related JP2801189B2 (en) | 1987-04-02 | 1987-04-02 | Heat resistant electrical insulation paint |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2801189B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01230680A (en) * | 1988-03-11 | 1989-09-14 | Furukawa Electric Co Ltd:The | Heat-resistant insulating paint |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53123437A (en) * | 1977-04-04 | 1978-10-27 | Teijin Ltd | Heat-resistant insulating coating |
| JPS53130750A (en) * | 1977-04-20 | 1978-11-15 | Toshiba Chem Corp | Thermosetting resin composition |
| JPS6258519A (en) * | 1985-09-06 | 1987-03-14 | 東京特殊電線株式会社 | Manufacture of heat resistant insulated wire |
-
1987
- 1987-04-02 JP JP62079726A patent/JP2801189B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53123437A (en) * | 1977-04-04 | 1978-10-27 | Teijin Ltd | Heat-resistant insulating coating |
| JPS53130750A (en) * | 1977-04-20 | 1978-11-15 | Toshiba Chem Corp | Thermosetting resin composition |
| JPS6258519A (en) * | 1985-09-06 | 1987-03-14 | 東京特殊電線株式会社 | Manufacture of heat resistant insulated wire |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01230680A (en) * | 1988-03-11 | 1989-09-14 | Furukawa Electric Co Ltd:The | Heat-resistant insulating paint |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2801189B2 (en) | 1998-09-21 |
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