JPS63246855A - Hybrid integrated circuit device - Google Patents
Hybrid integrated circuit deviceInfo
- Publication number
- JPS63246855A JPS63246855A JP8152787A JP8152787A JPS63246855A JP S63246855 A JPS63246855 A JP S63246855A JP 8152787 A JP8152787 A JP 8152787A JP 8152787 A JP8152787 A JP 8152787A JP S63246855 A JPS63246855 A JP S63246855A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- receiving part
- coupler receiving
- integrated circuit
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 abstract description 8
- 239000011347 resin Substances 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 229920001296 polysiloxane Polymers 0.000 abstract description 4
- 239000004593 Epoxy Substances 0.000 abstract description 3
- 239000004033 plastic Substances 0.000 abstract description 3
- 238000000465 moulding Methods 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract 3
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、混成集積回路装置の構造に関するものである
。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the structure of a hybrid integrated circuit device.
従来この種の混成集積回路装置は、牛導体素子を固着し
た回路基板に接続されたリード参を回路基板を封入した
容器の枠に固定しである外部接続用リードに溶接、ｒｔ
んだ付は等で接続し、この外部接続用リードに外部の信
号線と接続するためのカプラーの受入部を形成していた
。Conventionally, in this type of hybrid integrated circuit device, a lead pin connected to a circuit board to which a conductive element is fixed is fixed to the frame of a container in which the circuit board is enclosed, and then welded to an external connection lead, which is RT.
The connection was made by soldering, etc., and a receiving part for a coupler for connecting to an external signal line was formed on this external connection lead.
上述した従来の構造は、回路基板からのリード線とカプ
ラーの受入部との間に外部接続リードがある為下記の欠
点がある。The conventional structure described above has the following drawbacks because there is an external connection lead between the lead wire from the circuit board and the receiving part of the coupler.
１、外部接続リードを設ける為外形寸法が大きくなる。1. The external dimensions become larger due to the provision of external connection leads.
２、 外部接続リードと基板からのリード端子との接続
を要しコスト高となる。2. It requires connection between external connection leads and lead terminals from the board, resulting in high costs.
特に外形寸法に厳しい制約がある場合、設計に無理が発
生する危険があり、高信頼性を要求される相合品質不良
の原因にもなりかねない。In particular, if there are strict restrictions on external dimensions, there is a risk that the design will be unreasonable, and this may also cause defects in the quality of compatibility, which requires high reliability.
本発明の混成集積回路装置ｒｉ電子部品を搭載し九基板
と、該基板に設けられたリード端子と、前記基板が載置
きれた容器と、前記リード端子が電気的に接続された外
部接続端子を備えた前記容器の蓋部材とを有する混成集
積回路装置において、前記リード端子と前記外部接続端
子は一体に形成されており、前記外部接続端子の近傍は
蓋部材と一体に構°成された外部の信号線との接続のた
めのカプラーの受は入れ部を構成している。A hybrid integrated circuit device RI of the present invention includes a board on which electronic components are mounted, a lead terminal provided on the board, a container in which the board is placed, and an external connection terminal to which the lead terminal is electrically connected. In the hybrid integrated circuit device, the lead terminal and the external connection terminal are integrally formed, and the vicinity of the external connection terminal is integrally formed with the lid member. A coupler receptacle for connection with an external signal line constitutes a receptacle.
回路基板からのリード端子を直接外部に出してカプラー
の受入部の一部としており％蓋部材の一部でカプラーの
受入部の外周部を形成しているので、製品全体の寸法は
小型に形成でき、製造コストも安くなる。更に、リード
端子ｒｉ蓋部材で外部に蕗出する場合機械的ストレスに
耐える様硬質のエポキシ系樹脂で固定し、さらに部品が
搭載されている回路基板及びリード端子たわみ部はシリ
コーン等の軟質樹脂で被うことにより、熱膨張係数の差
による熱歪はこのたわみ部により吸収できる。The lead terminal from the circuit board is brought out directly to the outside and becomes part of the coupler receiving part, and a part of the lid member forms the outer periphery of the coupler receiving part, so the overall size of the product is small. possible, and the manufacturing cost will be lower. Furthermore, when the lead terminal RI cover member is to be exposed externally, it should be fixed with hard epoxy resin to withstand mechanical stress, and the circuit board on which components are mounted and the lead terminal's bending parts should be covered with soft resin such as silicone. By covering, thermal strain due to the difference in thermal expansion coefficients can be absorbed by this flexure.
次に、本発明の実施例を図面を参照して説明する。 Next, embodiments of the present invention will be described with reference to the drawings.
第１図に、本発明の一実施例の平面図である。FIG. 1 is a plan view of an embodiment of the present invention.
さらに第２図は、第１図のＡ−Ａ’線断面図であり第３
図は、同じ（Ｂ−Ｂ’線断面図である。Furthermore, FIG. 2 is a cross-sectional view taken along line A-A' in FIG.
The figure is the same (BB' line sectional view).
第２図及び第３図に示すように電子部品８を搭載した基
板７に固定されたリード端子６はシリコーン等の軟質樹
脂部４内でたわみを設けられさらにエポキシ等の硬質樹
脂部５により完全に固定される。これによりカプラーの
受入部１ａの端子となる。As shown in FIGS. 2 and 3, the lead terminals 6 fixed to the board 7 on which the electronic components 8 are mounted are bent in the soft resin part 4 such as silicone, and are further fixed in the hard resin part 5 such as epoxy. Fixed. This serves as a terminal for the receiving portion 1a of the coupler.
さらに外形の構成は１部品が搭載されている基板７を接
着樹脂等で固定するヒートシンク３．プラスチックケー
ス２及びＭｌでおるが、カプラ受入れ部１ａｔ：ｔ、蓋
そのものの一部を成形して構成されている。Furthermore, the external configuration consists of a heat sink 3, which fixes the board 7 on which one component is mounted with adhesive resin, etc. Although it is covered with a plastic case 2 and Ml, the coupler receiving part 1at:t is constructed by molding a part of the lid itself.
以上説明した様に、本発明は、基板からのリード端子６
をそのままカプラー受は入れ部１ａの端子として使用し
ていること、さらに蓋１にカプラー受は入れ部１ａを設
けたことにより、製造工程が簡略化されるとともに、製
品の外形も小型化され、
１、製品使用側のスペースファクターの問題２、製品製
造側の量産性及びコストの問題などが解決される。As explained above, the present invention provides lead terminals 6 from the board.
By using the coupler receiver as it is as a terminal of the insert part 1a, and by providing the coupler receiver insert part 1a in the lid 1, the manufacturing process is simplified and the external size of the product is also reduced. 1. Problems with space factors on the product user side, 2. Problems with mass productivity and cost on the product manufacturing side are solved.
置の平面図、第２図は第１図に示した本発明の一実施例
による混成集積回路装置のＡ−Ａ’線断面図、第３図ｒ
ｉ第１図に示した本発明の一実施例による混成集積回路
装置のＢ−Ｂ’線断面図である。FIG. 2 is a cross-sectional view taken along line A-A' of the hybrid integrated circuit device according to an embodiment of the present invention shown in FIG.
i is a sectional view taken along line BB' of the hybrid integrated circuit device according to an embodiment of the present invention shown in FIG. 1;
ｌ・・・・・・蓋、１ａ・・・・・・蓋に設けたカプラ
ーの受は入れ部、２・・・・・・プラスチックケース、
３・・・・・・ヒートシンク、４・・・・・・シリコー
ン等の軟質樹脂、５・・・・・・エポキシ等の硬質樹脂
、６・・・・・・リード端子（カプラー受入側端子）、
７・・・・・・基板、８・・・・・・電子部品。l...Lid, 1a...The coupler receptacle provided on the lid is the receptacle, 2...Plastic case,
3...Heat sink, 4...Soft resin such as silicone, 5...Hard resin such as epoxy, 6...Lead terminal (coupler receiving side terminal) ,
7... Board, 8... Electronic parts.
Claims (1)
端子と、前記基板が載置された容器と、前記リード端子
が電気的に接続された外部接続端子を備えた前記容器の
蓋部材とを有する混成集積回路装置において、前記リー
ド端子と前記外部接続端子は一体に形成されており、前
記外部接続端子の近傍は前記蓋部材と一体構成された外
部の信号線との接続のためのカプラーの受入れ部を構成
していることを特徴とする混成集積回路装置。A lid member for the container includes a board on which an electronic component is mounted, a lead terminal provided on the board, a container on which the board is placed, and an external connection terminal to which the lead terminal is electrically connected. In the hybrid integrated circuit device, the lead terminal and the external connection terminal are integrally formed, and a coupler for connection with an external signal line is integrally formed with the lid member near the external connection terminal. 1. A hybrid integrated circuit device comprising a receiving section of a hybrid integrated circuit device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8152787A JPS63246855A (en) | 1987-04-01 | 1987-04-01 | Hybrid integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8152787A JPS63246855A (en) | 1987-04-01 | 1987-04-01 | Hybrid integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63246855A true JPS63246855A (en) | 1988-10-13 |
Family
ID=13748796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8152787A Pending JPS63246855A (en) | 1987-04-01 | 1987-04-01 | Hybrid integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63246855A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6774465B2 (en) * | 2001-10-05 | 2004-08-10 | Fairchild Korea Semiconductor, Ltd. | Semiconductor power package module |
-
1987
- 1987-04-01 JP JP8152787A patent/JPS63246855A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6774465B2 (en) * | 2001-10-05 | 2004-08-10 | Fairchild Korea Semiconductor, Ltd. | Semiconductor power package module |
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