JPS63238284A - Production of resin mold for molding - Google Patents
Production of resin mold for moldingInfo
- Publication number
- JPS63238284A JPS63238284A JP7082187A JP7082187A JPS63238284A JP S63238284 A JPS63238284 A JP S63238284A JP 7082187 A JP7082187 A JP 7082187A JP 7082187 A JP7082187 A JP 7082187A JP S63238284 A JPS63238284 A JP S63238284A
- Authority
- JP
- Japan
- Prior art keywords
- resin mold
- electroless plating
- molding
- resin
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 title claims abstract description 30
- 229920005989 resin Polymers 0.000 title claims abstract description 30
- 238000000465 moulding Methods 0.000 title claims description 11
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000007772 electroless plating Methods 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 19
- 229910052802 copper Inorganic materials 0.000 claims abstract description 5
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 5
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 230000003197 catalytic effect Effects 0.000 claims description 9
- 239000003973 paint Substances 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 2
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract description 8
- 239000011248 coating agent Substances 0.000 abstract description 7
- 238000000576 coating method Methods 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 abstract description 6
- 238000010306 acid treatment Methods 0.000 abstract description 5
- 239000003822 epoxy resin Substances 0.000 abstract description 5
- 229920000647 polyepoxide Polymers 0.000 abstract description 5
- 238000005406 washing Methods 0.000 abstract description 3
- 230000015572 biosynthetic process Effects 0.000 abstract description 2
- 229910018104 Ni-P Inorganic materials 0.000 abstract 1
- 229910018536 Ni—P Inorganic materials 0.000 abstract 1
- 238000005507 spraying Methods 0.000 abstract 1
- 238000005323 electroforming Methods 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000010107 reaction injection moulding Methods 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Chemically Coating (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、発泡ウレタンの反応射出成形や塩化ビニルシ
ートの真空成形、及びスラッシュ成形などにおける簡易
成形型として好適な成形用樹脂型の製造方法に関する。[Detailed Description of the Invention] <Industrial Application Field> The present invention provides a method for producing a molding resin mold suitable as a simple mold for reaction injection molding of urethane foam, vacuum molding of vinyl chloride sheets, slush molding, etc. Regarding.
〈従来の技術〉
成形用樹脂型は、例えば、木製の母型を枠型の中にセッ
トして型構成樹脂材料を注入し、母型から脱型して樹脂
型本体を製造し、さらに耐久性（耐摩耗性・硬さ）を付
与するために、通常、分割面及び製品キャビティ面に金
属膜を形成していた。この金属層の形成は、電鋳法（電
気メッキ）により行なっていた。そして、電鋳に先立つ
樹脂型本体への導電性処理は、酸処理などで活性化処理
された表面に銀粉などの導電性粉末をすりこんで行なっ
ていた。<Conventional technology> A resin mold for molding is produced by, for example, setting a wooden mother mold in a frame mold, injecting the resin material forming the mold, and removing the mold from the mother mold to produce a resin mold body. In order to impart properties (wear resistance and hardness), a metal film is usually formed on the dividing surface and the product cavity surface. This metal layer was formed by electroforming (electroplating). The conductive treatment of the resin mold body prior to electroforming was carried out by rubbing conductive powder such as silver powder onto the surface which had been activated by acid treatment or the like.
〈発明が解決しようとする問題点〉
しかし、上記電鋳法は工数が嵩み、かつ銀粉などを使用
するため材料費も嵩んだ。<Problems to be Solved by the Invention> However, the electroforming method described above requires a large number of man-hours, and also increases material costs because silver powder and the like are used.
く問題点を解決するための手段〉
そこで、本発明者は、上記問題点を解決するために、樹
脂型本体への金属膜形成手段として、電鋳法の代りに、
電鋳法に比して、工程が簡単で、かつ銀粉などの高価な
材料を使用する必要のない無電解メッキ法が使用できな
いかと考え、試験研究を行なった。 ところが、通常の
触媒化処理（通常、塩化パラジウムの希塩酸溶液に浸漬
して行なう。）された樹脂型本体に無電解メッキして得
た金属膜は、樹脂型本体に対する密着性があまり良好で
ないことが分った。Means for Solving the Problems> Therefore, in order to solve the above problems, the inventors of the present invention developed a method for forming a metal film on the resin mold body instead of the electroforming method.
We conducted a test study to see if electroless plating could be used, which is a simpler process than electroforming and does not require the use of expensive materials such as silver powder. However, the metal film obtained by electroless plating on a resin mold body that has been subjected to the usual catalytic treatment (usually performed by immersing it in a dilute hydrochloric acid solution of palladium chloride) does not have very good adhesion to the resin mold body. I understand.
そこで、本発明者は、さらに鋭意開発に努力した結果、
下記構成に成形用樹脂型の製造方法に想到し得た。Therefore, as a result of further efforts in development, the present inventor found that
We were able to come up with a method for manufacturing a resin mold for molding with the following configuration.
樹脂型本体の少くとも分割面及び製品キャビティ面が金
属膜で被覆されてなる成形用樹脂型を製造するに際して
、金属膜を無電解メッキにより形成するとともに、無電
解メッキに先立つ触媒化処理を、 Ｐｄ及びＣｕがビス
フェノールＡ型エポキシ樹脂に分散された塗料を樹脂型
本体に塗布して行なうことを特徴とする。When manufacturing a molding resin mold in which at least the dividing surface and the product cavity surface of the resin mold body are coated with a metal film, the metal film is formed by electroless plating, and a catalytic treatment is performed prior to electroless plating. It is characterized in that a paint in which Pd and Cu are dispersed in bisphenol A type epoxy resin is applied to the resin mold body.
〈実施例〉 以下本発明の方法を、図例に基づいて説明をする。<Example> The method of the present invention will be explained below based on illustrated examples.
（１）従来と同様、木製の母型を枠型の中にセットして
型構成樹脂材料（エポキシ樹脂・フェノール樹脂・ポリ
エステル樹脂等）を注入し、母型から脱型して樹脂型本
体を製造する。(1) As in the past, a wooden mother mold is set in the frame mold, mold-constituting resin material (epoxy resin, phenol resin, polyester resin, etc.) is injected, and the mold is removed from the mother mold to form the resin mold body. Manufacture.
（２）上記樹脂型本体への金属膜の形成は下記の如く行
なう。(2) Formation of the metal film on the resin mold body is performed as follows.
■脱脂処理・・・
メチルアルコール、イソプロピルアルコールなどを用い
て洗浄をする。■Degreasing treatment...Clean using methyl alcohol, isopropyl alcohol, etc.
■触媒化処理・・・
ＰｄとＣｕをビスフェノールＡ型エポキシ樹脂に分散さ
せた塗料、具体的には、奥野製薬工業株式会社からセラ
ミック製品触媒化処理用塗料として、“キャタペースト
ＣＧＰ−８５０−ＣＧＰ−８７１″等の商品名で製造販
売されているものを溶剤で希釈して樹脂型本体に塗布す
る。塗布態様は特に限定されないが、通常スプレー塗布
とする。■Catalytic treatment... Paint in which Pd and Cu are dispersed in bisphenol A type epoxy resin, specifically, "Catapaste CGP-850-CGP" is manufactured by Okuno Pharmaceutical Co., Ltd. as a paint for catalytic treatment of ceramic products. A product manufactured and sold under a trade name such as -871'' is diluted with a solvent and applied to the resin mold body. The method of application is not particularly limited, but spray application is usually used.
塗布後、１５０〜２００度Ｘ２０〜４０分の条件で塗膜
を乾燥させ、さらには酸処理・水洗を行ない活性化して
おく。After coating, the coating film is dried at 150 to 200 degrees for 20 to 40 minutes, and is further activated by acid treatment and water washing.
上記塗料中のＰｄはメッキの触媒核となり、Ｃｕは無電
解メッキの析出金属の付着性を向上させる作用を奏する
。また、酸処理は、’ｄｓ Ｇｕの表面を被覆するそれ
らの酸化物を除去して活性化の作用を奏する。酸として
は、通常、希硫酸溶液を使用する。Pd in the paint serves as a catalyst nucleus for plating, and Cu functions to improve the adhesion of deposited metal during electroless plating. In addition, the acid treatment removes those oxides that coat the surface of 'ds Gu and has the effect of activating it. As the acid, a dilute sulfuric acid solution is usually used.
■無電解メッキ処理・・・
慣用の無電解メッキ浴を使用して行なうが、通常、Ｎｉ
−Ｐ系の浴を使用することが、析出速度が速く、かつ
金属膜の硬度が高くて望ましい。■Electroless plating treatment... It is performed using a conventional electroless plating bath, but usually Ni
It is desirable to use a -P bath because the deposition rate is fast and the hardness of the metal film is high.
下記に無電解メッキ浴組成の一例を示す。An example of an electroless plating bath composition is shown below.
塩化ニッケル・・・ ４５ ｇ／１次亜リン
酸ナトリウム・・・ １１ ｇ／ｌクエン酸ナトリウ
ム・・・ １００ｇ／ｌ塩化アンモニウンム・・・
５０ｇ／ＩＰＨ・・・ ４．６〜５
．０液温・・・ ８５〜９０℃〈発明
の作用・効果〉
本発明の成形用樹脂型の製造方法は、上記の如く、樹脂
型本体の少くとも分割面及び製品キャビティ面が金属膜
で被覆されてなる成形用樹脂型を製造するに際して、金
属膜を無電解メッキにより形成するとともに、無電解メ
ッキに先立つ触媒化処理を、Ｐｄ及びＣｕがビスフェノ
ールＡ型エポキシ樹脂に分散された塗料を樹脂型本体に
塗布して行なう構成であるので、下記のような作用効果
を奥する。Nickel chloride... 45 g/l Sodium hypophosphite... 11 g/l Sodium citrate... 100 g/l Ammonium chloride...
50g/IPH...4.6~5
．． 0 Liquid temperature... 85 to 90°C <Operations and effects of the invention> As described above, the method for manufacturing a resin mold for molding of the present invention includes coating at least the dividing surface and the product cavity surface of the resin mold body with a metal film. When manufacturing a resin mold for molding, a metal film is formed by electroless plating, and a catalytic treatment is performed prior to electroless plating. Since it is applied by applying it to the main body, it has the following effects.
樹脂型本体への金属膜の形成を電鋳法の代りに、電鋳法
に比して工程が繁雑でなく、銀粉のような高価な材料を
使用する必要がない無電解メッキ法を使用するため、全
体としてコスト安となる。Instead of electroforming to form the metal film on the resin mold body, we use electroless plating, which is a less complicated process than electroforming and does not require the use of expensive materials such as silver powder. Therefore, the overall cost is low.
また、本発明の無電解メッキ法により形成した金属膜は
樹脂型本体に対する密着性も良好であり長期間にわたり
使用可能である。なお、本発明の下記処決の無電解メッ
キ法により、及び当該無電解メッキ法において触媒化処
理を慣用の塩化パラジウム溶液に浸漬して行なう方法に
置換することにより、それぞれエポキシ樹脂製基体上に
形成した金属膜について、導電性処理膜の密着性を慣用
の９０度剥離試験により測定した。その結果は、前者；
０ 、８ ｋｇ／ ｃｍ、後者； ０ 、４ ｋｇ／
ｃＩ１１であった無電解メッキ法処法
（１）触媒化処理
■ 塗料”ＣＧＰ−８７１”を溶剤で
希釈してスプレー塗布
（塗布量：１．２〜ｔ、７ｇ／ｄゴ）
■乾燥条件・・・１８０℃Ｘ３０分
■酸処理・・・硫酸：５０ｍｕ／β
液温：５５〜６５℃
時間：５分
（２）無電解メッキ
浴 ：前述に例示のものと同一
浸漬時間：６０分
膜厚：約１６μｍFurther, the metal film formed by the electroless plating method of the present invention has good adhesion to the resin mold body and can be used for a long period of time. In addition, by the electroless plating method according to the following treatment of the present invention, and by replacing the catalytic treatment in the electroless plating method with a method in which the catalytic treatment is carried out by immersion in a conventional palladium chloride solution, Regarding the formed metal film, the adhesion of the conductive treated film was measured by a conventional 90 degree peel test. The result is the former;
0, 8 kg/cm, latter; 0, 4 kg/cm
Electroless plating method that was cI11 (1) Catalytic treatment■ Paint "CGP-871" diluted with solvent and sprayed (coating amount: 1.2-t, 7g/d) ■Drying conditions・...180°C x 30 minutes Acid treatment...Sulfuric acid: 50 mu/β Liquid temperature: 55 to 65°C Time: 5 minutes (2) Electroless plating bath: Same as the one exemplified above Immersion time: 60 minutes Film thickness : Approximately 16μm
第１図は本発明の方法を示す工程図である。
特 許 出 願 人
豊田合成株式会社
弁理士 飯 １） 昭 夫 、）・
゛１FIG. 1 is a process diagram showing the method of the present invention. Patent application: Toyoda Gosei Co., Ltd. Patent attorney Ii 1) Akio, )・
゛1
Claims (1)
属膜で被覆されてなる成形用樹脂型を製造するに際して
、 前記金属膜を無電解メッキにより形成するとともに、 該無電解メッキに先立つ触媒化処理を、Ｐｄ及びＣｕが
ビスフェノールＡ型エポキシ樹脂に分散された塗料を樹
脂型本体に塗布して行なうこと を特徴とする成形用樹脂型の製造方法。[Claims] When manufacturing a molding resin mold in which at least the dividing surface and the product cavity surface of the resin mold body are coated with a metal film, the metal film is formed by electroless plating, and the electroless plating method comprises: A method for manufacturing a resin mold for molding, characterized in that a catalytic treatment prior to plating is performed by applying a paint in which Pd and Cu are dispersed in a bisphenol A epoxy resin to the resin mold body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7082187A JPS63238284A (en) | 1987-03-25 | 1987-03-25 | Production of resin mold for molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7082187A JPS63238284A (en) | 1987-03-25 | 1987-03-25 | Production of resin mold for molding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63238284A true JPS63238284A (en) | 1988-10-04 |
Family
ID=13442623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7082187A Pending JPS63238284A (en) | 1987-03-25 | 1987-03-25 | Production of resin mold for molding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63238284A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05116182A (en) * | 1991-07-10 | 1993-05-14 | Ebara Corp | Plastic molding die |
-
1987
- 1987-03-25 JP JP7082187A patent/JPS63238284A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05116182A (en) * | 1991-07-10 | 1993-05-14 | Ebara Corp | Plastic molding die |
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