JPS6323666U - - Google Patents

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Publication number
JPS6323666U
JPS6323666U JP11701786U JP11701786U JPS6323666U JP S6323666 U JPS6323666 U JP S6323666U JP 11701786 U JP11701786 U JP 11701786U JP 11701786 U JP11701786 U JP 11701786U JP S6323666 U JPS6323666 U JP S6323666U
Authority
JP
Japan
Prior art keywords
rail
pin
moves
heating device
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11701786U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11701786U priority Critical patent/JPS6323666U/ja
Publication of JPS6323666U publication Critical patent/JPS6323666U/ja
Pending legal-status Critical Current

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  • Testing Of Individual Semiconductor Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案による実施例の構成図。 1……レール、2……IC、3……ピン、4…
…駆動手段。
FIG. 1 is a configuration diagram of an embodiment according to this invention. 1...Rail, 2...IC, 3...Pin, 4...
...driving means.

Claims (1)

【実用新案登録請求の範囲】 加熱されたレール1内をIC2が移動するよう
にし、レール1の熱がIC2に伝達するようにし
たIC加熱装置において、 レール1内に出入するピン3と、 ピン3のレール1内への出入を制御する駆動手
段4とを備え、 IC2がレール1内を移動するとき、ピン3が
レール1内に出るようにしてIC2をレール1の
側面に押し付け、レール1にIC2を接触させて
レール1の熱をIC2に伝えるようにし、ピン3
をレール1内から外に出してピン3のIC2に対
する押し付けを解除することにより、レール1内
をIC2が移動するようにしたことを特徴とする
ICの加熱装置。
[Claim for Utility Model Registration] In an IC heating device in which an IC 2 moves within a heated rail 1 and heat from the rail 1 is transferred to the IC 2, a pin 3 that goes in and out of the rail 1; When the IC 2 moves within the rail 1, the IC 2 is pressed against the side surface of the rail 1 so that the pin 3 comes out into the rail 1, and the IC 2 is pressed against the side surface of the rail 1. IC2 is brought into contact with IC2 to transfer the heat of rail 1 to IC2, and pin 3
An IC heating device characterized in that the IC 2 is moved within the rail 1 by taking the pin 3 out from the rail 1 to release the pin 3 from pressing against the IC 2.
JP11701786U 1986-07-30 1986-07-30 Pending JPS6323666U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11701786U JPS6323666U (en) 1986-07-30 1986-07-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11701786U JPS6323666U (en) 1986-07-30 1986-07-30

Publications (1)

Publication Number Publication Date
JPS6323666U true JPS6323666U (en) 1988-02-16

Family

ID=31002148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11701786U Pending JPS6323666U (en) 1986-07-30 1986-07-30

Country Status (1)

Country Link
JP (1) JPS6323666U (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4860581A (en) * 1971-11-27 1973-08-24
JPS5717871A (en) * 1980-07-04 1982-01-29 Mitsubishi Electric Corp Environment test device
JPS61102568A (en) * 1984-10-25 1986-05-21 Advantest Corp Ic test handler

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4860581A (en) * 1971-11-27 1973-08-24
JPS5717871A (en) * 1980-07-04 1982-01-29 Mitsubishi Electric Corp Environment test device
JPS61102568A (en) * 1984-10-25 1986-05-21 Advantest Corp Ic test handler

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