JPS63236032A - Method for exposing resist - Google Patents

Abstract

PURPOSE:To prevent the resist from reflecting a light transmitted through a transparent substrate plate on the stage etc., of an exposing device and to prevent it from sensitizing again the resist by providing with a light absorbing means on the lower surface of a transparent substrate plate. CONSTITUTION:The formed resist 3 is exposed by an UV ray through a mask 6 printed with a prescribed pattern 5 on a glass plate 4 placed in the upper position of the resist 3. In this case, an UV absorbing tape 7 is stuck on the lower surface of the transparent substrate plate 1 as the light absorbing means whereby the UV ray is prevented from leaking out from the lower surface of the transparent substrate plate 1, and from the irregular reflection on the stage of the exposing device, thereby disappearing the pin hole of the resist film.

Description

[Detailed Description of the Invention] [Technical Field] The present invention relates to a method for exposing a resist formed on a transparent substrate [Background Art] In a semiconductor element formation process, a resist is deposited on a silicon substrate to a uniform thickness using a spinner or the like. A resist film for etching or plating is formed by applying a mask on which a desired pattern is printed, exposing it to ultraviolet light, and removing the resist other than the exposed areas in a development process.

Even in the case of forming a circuit on a printed wiring board, the resist coating method is performed using a roll coater, but the method of forming the resist film through the exposure and development steps is the same.

When such an exposure to development process is applied to a transparent substrate to form a resist film for selective plating or etching on the transparent substrate (for example, when forming a transparent conductive film on a glass substrate) In such cases, there are the following problems. In other words, in silicon substrates and printed wiring boards, ultraviolet rays pass through the openings (transparent parts) of the mask, expose the resist, and are absorbed by the substrate, or even if they are reflected from the substrate surface, the resist is extremely thick. Thin (
(several microns), so the possibility of light hitting unnecessary areas is extremely small. However, in the case of a transparent substrate, as shown in FIG. 4, the light transmitted through the mask 6 passes through the resist 3, then also through the substrate 1, and is reflected by the stage 8 of the exposure apparatus. Some of this reflected light passes through the substrate 1 again and hits the resist 3, causing it to be exposed. This causes pinholes to occur in areas other than those required, and is a cause of a decrease in yield.

[Purpose of the Invention] The present invention has been made in order to improve the above-mentioned problems, and its purpose is to prevent the light transmitted through the transparent substrate from being reflected by the stage of the exposure device, etc., and to expose the resist again. An object of the present invention is to provide an exposure method that can prevent this.

"Disclosure of the Invention" The present invention provides a step of exposing a resist formed on a transparent substrate to light through a mask placed above the resist.
The present invention is characterized in that a light absorption means is disposed on the lower surface of the transparent substrate.

Hereinafter, the present invention will be explained based on examples. FIG. 1 shows an embodiment of the present invention. In the figure, ■ indicates a transparent substrate such as glass, 2 indicates a transparent conductive film formed on the transparent substrate 1,
3 is a resist, which is formed by a well-known method. The resist 3 thus formed is placed in a desired pattern 5 on a glass plate 4 placed above the resist 3.
In the step of exposing to ultraviolet light through a mask 6 printed with UV light, an ultraviolet absorbing tape 7 as a light absorbing means is adhered to the lower surface of the transparent substrate 1 to prevent ultraviolet light from leaking out from the lower surface of the transparent substrate 1. Prevent and stage 8 of exposure equipment
(See Figure 3) etc. to prevent diffused reflection.

If air bubbles enter between the transparent substrate 1 and the tape 7 when adhering the ultraviolet absorbing tape 7 to the lower surface of the transparent substrate 1, diffuse reflection will occur in that area, so a pressure roller 9 as shown in FIG. It is preferable to apply uniform pressure to the surface of the substrate to adhere the tape 7 using a tape.

It should be noted that the present invention is of course not limited to the above-mentioned embodiments. For example, the same effect can be achieved even if a light absorbing material such as chromium is formed on the lower surface of the transparent substrate 1 as the light absorbing means 7. can be expected.

[Effects of the Invention] As described above, the present invention is characterized in that in the step of exposing a resist formed on a transparent substrate to light through a mask placed above the resist, a light absorption means is arranged on the lower surface of the transparent substrate. This makes it possible to prevent diffuse reflection of ultraviolet rays transmitted through the transparent substrate, and to eliminate pinholes in the resist film. Therefore, by using the present invention, the yield of products can be improved. Furthermore, according to the present invention, even when forming a resist film for selectively plating or etching on a transparent substrate, there is no need to improve the exposure equipment, and the exposure equipment for silicon substrates and printed wiring boards can be used. There is also the advantage that it can be used as is.

[Brief explanation of the drawing]

FIG. 1 is a simplified diagram showing one embodiment of the present invention, FIG. 2 is a simplified perspective view showing the adhesive state of the light absorbing means according to the present invention, and FIG.
The figure is a simplified diagram explaining the details of the present invention, and FIG. 4 is a simplified diagram explaining the operation of the conventional example. I...Transparent substrate, 2...Transparent conductive film, 3...Resist, 6...Mask, 7...Light absorption means.

Claims (1)

[Claims] (1) A method for exposing a resist, characterized in that, in the step of exposing a resist formed on a transparent substrate to light through a mask placed above the resist, a light absorbing means is placed on the lower surface of the transparent substrate.