JPS63235321A - Production of thermosetting resin - Google Patents
Production of thermosetting resinInfo
- Publication number
- JPS63235321A JPS63235321A JP62071208A JP7120887A JPS63235321A JP S63235321 A JPS63235321 A JP S63235321A JP 62071208 A JP62071208 A JP 62071208A JP 7120887 A JP7120887 A JP 7120887A JP S63235321 A JPS63235321 A JP S63235321A
- Authority
- JP
- Japan
- Prior art keywords
- polyol
- value
- thermosetting resin
- cyclic group
- amine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 24
- 239000011347 resin Substances 0.000 title claims abstract description 24
- 229920001187 thermosetting polymer Polymers 0.000 title claims description 13
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 150000003077 polyols Chemical class 0.000 claims abstract description 53
- 229920005862 polyol Polymers 0.000 claims abstract description 49
- 239000005056 polyisocyanate Substances 0.000 claims abstract description 18
- 229920001228 polyisocyanate Polymers 0.000 claims abstract description 18
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 13
- 239000003054 catalyst Substances 0.000 claims abstract description 9
- 238000005829 trimerization reaction Methods 0.000 claims abstract description 6
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 3
- 150000001412 amines Chemical class 0.000 claims description 11
- 125000004122 cyclic group Chemical group 0.000 claims description 11
- 150000001875 compounds Chemical class 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 8
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 6
- 239000012948 isocyanate Substances 0.000 claims description 6
- 150000002513 isocyanates Chemical class 0.000 claims description 6
- 125000004432 carbon atom Chemical group C* 0.000 claims description 5
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 2
- -1 oxyalkylated cyclic amine Chemical class 0.000 abstract description 9
- 239000004721 Polyphenylene oxide Substances 0.000 abstract description 5
- 229920000570 polyether Polymers 0.000 abstract description 5
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 abstract description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 15
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 14
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 10
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 9
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 8
- 239000000203 mixture Substances 0.000 description 7
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- 125000003118 aryl group Chemical group 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 229920005906 polyester polyol Polymers 0.000 description 5
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 4
- 150000007513 acids Chemical class 0.000 description 4
- 150000001298 alcohols Chemical class 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 4
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 4
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 3
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- 235000011187 glycerol Nutrition 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- RLEFZEWKMQQZOA-UHFFFAOYSA-M potassium;octanoate Chemical compound [K+].CCCCCCCC([O-])=O RLEFZEWKMQQZOA-UHFFFAOYSA-M 0.000 description 3
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 3
- 150000005846 sugar alcohols Polymers 0.000 description 3
- 229930185605 Bisphenol Natural products 0.000 description 2
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 2
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 2
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- WQDUMFSSJAZKTM-UHFFFAOYSA-N Sodium methoxide Chemical compound [Na+].[O-]C WQDUMFSSJAZKTM-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000012975 dibutyltin dilaurate Substances 0.000 description 2
- 125000005442 diisocyanate group Chemical group 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- 150000002611 lead compounds Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000000600 sorbitol Substances 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- 150000003606 tin compounds Chemical class 0.000 description 2
- VOZKAJLKRJDJLL-UHFFFAOYSA-N tolylenediamine group Chemical class CC1=C(C=C(C=C1)N)N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 2
- MGAXYKDBRBNWKT-UHFFFAOYSA-N (5-oxooxolan-2-yl)methyl 4-methylbenzenesulfonate Chemical compound C1=CC(C)=CC=C1S(=O)(=O)OCC1OC(=O)CC1 MGAXYKDBRBNWKT-UHFFFAOYSA-N 0.000 description 1
- BUZMJVBOGDBMGI-UHFFFAOYSA-N 1-phenylpropylbenzene Chemical compound C=1C=CC=CC=1C(CC)C1=CC=CC=C1 BUZMJVBOGDBMGI-UHFFFAOYSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- IHAYMIVQKCTBBS-UHFFFAOYSA-N 2-[2-(2-hydroxyethyl)phenyl]ethanol Chemical compound OCCC1=CC=CC=C1CCO IHAYMIVQKCTBBS-UHFFFAOYSA-N 0.000 description 1
- JRBJSXQPQWSCCF-UHFFFAOYSA-N 3,3'-Dimethoxybenzidine Chemical compound C1=C(N)C(OC)=CC(C=2C=C(OC)C(N)=CC=2)=C1 JRBJSXQPQWSCCF-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- JOJAEBZHFWYZAY-UHFFFAOYSA-N 4-methoxy-6-methylbenzene-1,3-diamine Chemical compound COC1=CC(C)=C(N)C=C1N JOJAEBZHFWYZAY-UHFFFAOYSA-N 0.000 description 1
- 239000004604 Blowing Agent Substances 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- CZMRCDWAGMRECN-UGDNZRGBSA-N Sucrose Chemical compound O[C@H]1[C@H](O)[C@@H](CO)O[C@@]1(CO)O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 CZMRCDWAGMRECN-UGDNZRGBSA-N 0.000 description 1
- 229930006000 Sucrose Natural products 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- HIFVAOIJYDXIJG-UHFFFAOYSA-N benzylbenzene;isocyanic acid Chemical class N=C=O.N=C=O.C=1C=CC=CC=1CC1=CC=CC=C1 HIFVAOIJYDXIJG-UHFFFAOYSA-N 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- CAPXPQVDOOOYGS-UHFFFAOYSA-N diisocyanatosilane Chemical compound O=C=N[SiH2]N=C=O CAPXPQVDOOOYGS-UHFFFAOYSA-N 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 125000006222 dimethylaminomethyl group Chemical group [H]C([H])([H])N(C([H])([H])[H])C([H])([H])* 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- AYLRODJJLADBOB-QMMMGPOBSA-N methyl (2s)-2,6-diisocyanatohexanoate Chemical compound COC(=O)[C@@H](N=C=O)CCCCN=C=O AYLRODJJLADBOB-QMMMGPOBSA-N 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- OLAKSHDLGIUUET-UHFFFAOYSA-N n-anilinosulfanylaniline Chemical compound C=1C=CC=CC=1NSNC1=CC=CC=C1 OLAKSHDLGIUUET-UHFFFAOYSA-N 0.000 description 1
- NTNWKDHZTDQSST-UHFFFAOYSA-N naphthalene-1,2-diamine Chemical compound C1=CC=CC2=C(N)C(N)=CC=C21 NTNWKDHZTDQSST-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 150000004986 phenylenediamines Chemical class 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 150000003017 phosphorus Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 125000000547 substituted alkyl group Chemical group 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 150000004072 triols Chemical class 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は熱硬化性樹脂の製法に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a method for producing thermosetting resins.
従来、有機ポリイソシアネートと高分子ポリオールと反
応させる熱硬化性樹脂の製法が知られている。Conventionally, a method for producing a thermosetting resin is known in which an organic polyisocyanate and a polymeric polyol are reacted.
しかし、従来の熱硬化性樹脂は高弾性率、耐熱性および
耐衝撃性を同時に満足していない。However, conventional thermosetting resins do not simultaneously satisfy high elastic modulus, heat resistance, and impact resistance.
本発明者らはに弾性率、耐熱性および耐WJ撃性を有す
る熱硬化性樹脂の製法を見出すべく検討を重ねた結果、
本発明に到達した。As a result of repeated studies by the present inventors to find a method for producing a thermosetting resin having elastic modulus, heat resistance, and WJ impact resistance,
We have arrived at the present invention.
すなわち、本発明は[9ポリイソシアネートとポリオー
ルを三量化触媒および必要により他の融媒の存在下に反
応させて熱硬化性樹脂を製造する方法において、
(1)ポリオールとしてOH価70以下の高分子ポリオ
ール(A)、OH価300〜750のオキシアルキル化
された環状基を有するアミンもしくはポリオール(B)
および必要により低分子ポリオール(C)を使用しく2
)イソシアネート指数を106〜1000としく3)4
0〜200℃の温度で熱処理することを特徴とする熱硬
化性樹脂の製法である。That is, the present invention provides a method for producing a thermosetting resin by reacting a polyisocyanate and a polyol in the presence of a trimerization catalyst and, if necessary, other melting medium, (1) a polyisocyanate having a high OH value of 70 or less; Molecular polyol (A), amine or polyol (B) having an oxyalkylated cyclic group with an OH value of 300 to 750
And if necessary, use low molecular weight polyol (C) 2
) with an isocyanate index of 106 to 1000 3) 4
This is a method for producing a thermosetting resin characterized by heat treatment at a temperature of 0 to 200°C.
本発明における、オキシアルキル化された環状基を有す
るアミンもしくはポリオール(B)としては一般式
%式%(1)
(式中、Arは環状基を有するアミンの残基または環状
基を有するポリオールの残基、Xは−N〈(Ao)mR
または酸素原子、Aは炭素数2〜4のアルキレン基、R
は水素原子又は炭素数1〜4のアルキル基、mはθ〜4
の整数、nは1〜4の整数、pは2〜4の整数である。In the present invention, the amine or polyol (B) having an oxyalkylated cyclic group has the general formula % (1) (where Ar is a residue of an amine having a cyclic group or a polyol having a cyclic group). residue, X is -N〈(Ao)mR
or an oxygen atom, A is an alkylene group having 2 to 4 carbon atoms, R
is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, m is θ to 4
n is an integer of 1 to 4, and p is an integer of 2 to 4.
)で示されるOH価300〜750の化合物(B)があ
げられる。) Compounds (B) having an OH value of 300 to 750 are exemplified.
一般式(1)において、舒の環状基を有するアミンの残
基を形成する該アミンとしては特開昭61−17172
0号公報記載の、非置換芳香族ポリアミン、核置換アル
キルを有する芳香族ポリアミン、核置換リン、フェニレ
ンジアミン、トリレンジアミン(以下、TL)Aと略記
)、クルードトリレンジアミン、ジエチルトリレンジア
ミン、ジフェニルメタンジアミン(以下、MDAと略記
)、クルードMDA、ナフタレンジアミン、ジアミノジ
フェニルスルホン、ベンジジン、 4.4′−ビス(
C−トルイジン)。In the general formula (1), the amine forming the amine residue having a cyclic group is disclosed in Japanese Patent Application Laid-open No. 61-17172.
Unsubstituted aromatic polyamine, aromatic polyamine having a nuclear substituted alkyl, nuclear substituted phosphorus, phenylene diamine, tolylene diamine (hereinafter abbreviated as TL A), crude tolylene diamine, diethyl tolylene diamine, described in Publication No. 0 , diphenylmethanediamine (hereinafter abbreviated as MDA), crude MDA, naphthalene diamine, diaminodiphenylsulfone, benzidine, 4,4'-bis(
C-toluidine).
チオジアニリン、ジアニシジン、メチレンビス(C−ク
ロロアニリン)、ビス(8,4−ジアミノフェニル)ス
ルホン、ジアミノジトリルスルホン。Thiodianiline, dianisidine, methylenebis(C-chloroaniline), bis(8,4-diaminophenyl)sulfone, diaminoditolylsulfone.
2.6−ジアミツピリジン、4−クロロ−0−フェニレ
ンジアミン、4−メトキシ−6−メチル−m−フェニレ
ンジアミ゛7.1Il−アミノベンジルアミン、4,4
°−ジアミノ−3,3°−ジメチルジフェニルメタン、
これらの水添物、およびこれらの2種以上の混合物が挙
げられる。これらのうちで好ましいのは芳香h’Aアミ
ン、とくにアニリン、MDA、TDAおよび4,4−ジ
アミノ−3,3°−ジクロロジフェニルメタンである。2.6-Diamitsupyridine, 4-chloro-0-phenylenediamine, 4-methoxy-6-methyl-m-phenylenediamine 7.1Il-aminobenzylamine, 4,4
°-diamino-3,3°-dimethyldiphenylmethane,
These hydrogenated products and mixtures of two or more thereof are included. Preferred among these are aromatic h'A amines, especially aniline, MDA, TDA and 4,4-diamino-3,3°-dichlorodiphenylmethane.
酊の環状基を有するポリオールの残基を形成する該ポリ
オールとしては、例えば特公昭45−1474号公報記
載の環状基を右するジオール類:ビス(ヒドロキシメチ
ル)シクロヘキサン、 m−t3よび叶キシリレングリ
コール、ビス(ヒドロキシエチル)ベンゼン、1.4−
ビス(2−ヒドロキシエトキシ)ベンUン、ビスフェノ
ールAのエチレンオキサイドおよび/またはプロピレン
オキサイド付加物[4,4−ヒス(2−ヒドロキシエト
キシ)ジフェニルプロパン、4,4−ビス(2−ヒドロ
キシプロポキシ)ジフェニルプロパン1などの芳香族お
よび脂環式ポリオール、おにびこれらの2種以上の混合
物が挙げられる。好ましいのは芳香族ポリオール、とく
(ごビスフェノールへのエチレンオキサイドd3よ7<
/ Hl+ f−(−1プロs l /ゝ/+十→
F〕 はイ;11nn Q’rn 7S 本人Aの炭素
数2〜4のアルキレン基としては、′エチレン、プロピ
レンおよびブチレン基があげられる。好ましくはエチレ
ン及びプロピレン基であル、エチル、プロピルおよびブ
チル基があげられる。好ましくは水素原子である。The polyols forming the residue of a polyol having a cyclic group include, for example, diols having a cyclic group described in Japanese Patent Publication No. 1474/1982: bis(hydroxymethyl)cyclohexane, m-t3 and Kano xylylene. Glycol, bis(hydroxyethyl)benzene, 1.4-
Bis(2-hydroxyethoxy)benun, ethylene oxide and/or propylene oxide adduct of bisphenol A [4,4-his(2-hydroxyethoxy)diphenylpropane, 4,4-bis(2-hydroxypropoxy)diphenyl Examples include aromatic and cycloaliphatic polyols such as propane 1, and mixtures of two or more thereof. Preferred are aromatic polyols, especially ethylene oxide to bisphenol.
/ Hl+ f-(-1 pro s l /ゝ/+ten→
F] is a; 11nn Q'rn 7S Examples of the alkylene group having 2 to 4 carbon atoms in person A include 'ethylene, propylene, and butylene groups. Preferred are ethylene and propylene groups, including yl, ethyl, propyl and butyl groups. Preferably it is a hydrogen atom.
一般式(1)で示される化合物のOH価は通常300〜
750.好マシくハ380〜700テアル。OH価が7
50より大きいと耐衝撃性が低下し、300未満だと弾
性率が低下する。The OH value of the compound represented by general formula (1) is usually 300 to
750. The best price is 380-700 teal. OH value is 7
When it is greater than 50, the impact resistance decreases, and when it is less than 300, the elastic modulus decreases.
一般式(1)で示される化合物は環状基を有するアミン
もしくはポリオールに常法によりアルキレンオキサイド
を付加させることにより得ることができる。該化合物に
付加するアルキレンオキサイドとしては、−エチレンオ
キサイド(以下EOともいう)、プロピレンオキサイド
(以下POともいう)、ブチレンオキサイド(テトラヒ
ドロフランなど)などがあげられる。アルキレンオキサ
イドは単独でも2種以上併用してもよい。これらのアル
キレンオキサイドのうち好ましいものはテトラヒドロフ
ランjPOおよびEOである。The compound represented by the general formula (1) can be obtained by adding alkylene oxide to an amine or polyol having a cyclic group by a conventional method. Examples of the alkylene oxide added to the compound include -ethylene oxide (hereinafter also referred to as EO), propylene oxide (hereinafter also referred to as PO), butylene oxide (tetrahydrofuran, etc.). The alkylene oxides may be used alone or in combination of two or more. Preferred among these alkylene oxides are tetrahydrofuran jPO and EO.
一般式(1)で示される化合物の具体例としてはアニリ
ンPO付加物(OH価580)、アニリンEO付加物(
OH価590)、ビスフェノールA PO付加物(O
H価850)、 MDA PO付加物(OH価560)
。Specific examples of the compound represented by general formula (1) include aniline PO adduct (OH value 580), aniline EO adduct (
OH value 590), bisphenol A PO adduct (O
H value 850), MDA PO adduct (OH value 560)
.
MDAPO,EO付加物(OH価662)などがある。Examples include MDAPO and EO adducts (OH value 662).
(B)は架橋剤として用いることができる。(B) can be used as a crosslinking agent.
本発明において使用される高分子ポリオールとしては、
ポリエーテルポリオール、ポリエステルポリオール等通
常のポリオールが使用できる。The polymer polyol used in the present invention includes:
Common polyols such as polyether polyols and polyester polyols can be used.
ポリエーテルポリオールとしては、多価アルコール、多
価フェノール、ポリカルボン酸などの活性水素原子含有
多官能化合物にアルキレンオキサイドが付加した構造の
化合物があげられる。上記多価アルコールとしては、エ
チレングリコール。Examples of polyether polyols include compounds having a structure in which an alkylene oxide is added to a polyfunctional compound containing an active hydrogen atom, such as a polyhydric alcohol, a polyhydric phenol, or a polycarboxylic acid. The polyhydric alcohol mentioned above is ethylene glycol.
プロピレングリコール、1.4−ブタンジオール、 1
.6−ヘキサンジオール、ジエチレングリコール、ネオ
ペンチルグリコールなどの2価アルコールおよびグリセ
リン、トリメチロールプロパン、ペンタエリスリトール
、ソルビトール、ショ糖などの3価以上の多価アルコー
ルなど;多価フェノール類としてはピロガロール、ヒト
ボロキノンなどの多価フェノールのほかビスフェノール
Aなどのビスフェノール類;またポリカルボン酸として
はコハク酸、アジピン酸、セバシン酸、マレイン酸、ダ
イマー酸などの脂肪族ポリカルボン酸、フタル酸。Propylene glycol, 1,4-butanediol, 1
.. Dihydric alcohols such as 6-hexanediol, diethylene glycol, neopentyl glycol, and trivalent or higher polyhydric alcohols such as glycerin, trimethylolpropane, pentaerythritol, sorbitol, sucrose; polyhydric phenols include pyrogallol, humanboroquinone, etc. In addition to polyhydric phenols, bisphenols such as bisphenol A; polycarboxylic acids include aliphatic polycarboxylic acids such as succinic acid, adipic acid, sebacic acid, maleic acid, and dimer acid, and phthalic acid.
テレフタル酸、トリメリット酸などの芳香族ポリカルボ
ン酸があげられる。上述した活性水素原子含有化合物は
2種以上使用することもできる。上記活性水素原子含有
化合物に付加するアルキレンオキサイドとしては、EO
,PO,ブチレンオキサイド(テトラヒドロフランなど
)、などがあげられる。アルキレンオキサイドは単独で
も2種以上併用してもよく、後者の場合はブロック付加
でもランダム付加でも両者の混合系でもよい。これらの
アルキレンオキサイドのうちで好ましいものはテトラヒ
ドロフラン、POおよびEOである。Examples include aromatic polycarboxylic acids such as terephthalic acid and trimellitic acid. Two or more kinds of the above-mentioned active hydrogen atom-containing compounds can also be used. As the alkylene oxide added to the above active hydrogen atom-containing compound, EO
, PO, butylene oxide (tetrahydrofuran, etc.), and the like. The alkylene oxides may be used alone or in combination of two or more, and in the latter case, block addition, random addition, or a mixture of both may be used. Preferred among these alkylene oxides are tetrahydrofuran, PO and EO.
ポリエステルポリオールとしては、たとえば、低分子ポ
リオール(前記2価アルコール、トリノチロールプロパ
ン、グリセリンなどとジカルボン酸(前記ポリカルボン
酸など)とを反応させて得られる縮合ポリエステルポリ
オールやラクトン(ε−カプロラクトンなど)の開環重
合により得られるポリエステルポリオールなどがあげら
れる。Examples of polyester polyols include condensed polyester polyols and lactones (epsilon-caprolactone, etc.) obtained by reacting low-molecular polyols (such as the dihydric alcohols, trinotyrolpropane, and glycerin) with dicarboxylic acids (such as the polycarboxylic acids). Examples include polyester polyols obtained by ring-opening polymerization.
ポリカーボネートジオールも使用できる。Polycarbonate diols can also be used.
また重合体ポリオールも使用できる。Polymeric polyols can also be used.
高分子ポリオールのOH価は70以下、好ましくは60
以下である。OH価が70より大きいと耐衝撃性が劣る
。The OH value of the polymer polyol is 70 or less, preferably 60
It is as follows. If the OH value is greater than 70, the impact resistance will be poor.
低分子ポリオール(Cとしてはエチレングリコール、プ
ロピレングリコール、ブタンジオールなどの2価アルコ
ール、グリセン、トリメチロールプロパンなどの8価以
上のアルコールがあげられる。Low-molecular polyols (C include dihydric alcohols such as ethylene glycol, propylene glycol, and butanediol, and octavalent or higher alcohols such as glycene and trimethylolpropane).
低分子ポリオール(C)のOH価は通常300以上であ
る。The OH number of the low molecular weight polyol (C) is usually 300 or more.
本発明において、高分子ポリオール体)、ポリオール(
B)および低分子ポリオール(d)の量はポリオールの
重量に基いて、(蜀は通常lO〜80%、好ましくは8
0〜70%、(B)は通常20〜70% 好ましくは8
0〜60%、(C)は通常0〜20.好ましくは0〜1
0%である。(ム)、(B)および(C)がこの範囲外
では、弾性率。In the present invention, polymer polyols), polyols (
The amount of B) and low molecular weight polyol (d) is based on the weight of the polyol (Shu usually ranges from 10 to 80%, preferably 80%).
0 to 70%, (B) is usually 20 to 70%, preferably 8
0-60%, (C) is usually 0-20%. Preferably 0-1
It is 0%. If (M), (B) and (C) are outside this range, the elastic modulus.
耐衝撃性および耐熱性を同時に満足し得ない。Impact resistance and heat resistance cannot be satisfied at the same time.
本発明において使用される有機ポリイソシアネートとし
ては従来から4tリウレタン製造に使用されているもの
が使用できる。これらの具体例としては特D9昭57−
2822等に記載の化合物が使用できる。例えば脂肪族
ポリイソシアネート(ヘキサメチレンジイソシアネート
、リジンジイソシアネートなど)、脂環式ポリイソシア
ネート(水添ジフェニルメタンジイソシアネート、イソ
ホロンジイソシアネート、水添トリレンジイソシアネー
トなど)、芳香族ポリイソシアネート〔トリレンジイソ
シアネート(TDI)、ジフェニルメタンジイソシアネ
ート(MDI入ナフナフチレンジイソシアネートシリレ
ンジイソシアネートなど〕およびこれらの混合物があげ
られる。これらのうち好ましいものは、芳香族ジイソシ
アネートでありとくに好ましいものは、TDI 、およ
びM)Iである。これらのポリイソシアネートは粗製ポ
リイソシアネート、たとえば粗製〕工、粗%MDI、あ
るいは変性ポリイソシアネートたとえば、液状化Iul
DI (カーポジイミド変性、トリヒドロカルビルホス
フェート変性など)や過剰のポリイソシアネート(TD
I、MDIなど)とポリオールとを反応させて得られる
遊離イソシアネート含有プレポリマーとして使用するこ
ともでき、またこれらを併用、(たとえば変性ポリイソ
シアネートとプレポリマーを併用)することもできる。As the organic polyisocyanate used in the present invention, those conventionally used in the production of 4t polyurethane can be used. Specific examples of these include Toku D9 1985-
Compounds described in 2822 and the like can be used. For example, aliphatic polyisocyanates (hexamethylene diisocyanate, lysine diisocyanate, etc.), alicyclic polyisocyanates (hydrogenated diphenylmethane diisocyanate, isophorone diisocyanate, hydrogenated tolylene diisocyanate, etc.), aromatic polyisocyanates [tolylene diisocyanate (TDI), diphenylmethane, etc.] Examples include diisocyanates (such as naphnaphthylene diisocyanate silylene diisocyanate containing MDI) and mixtures thereof. Among these, aromatic diisocyanates are preferred, and particularly preferred are TDI and M)I. These polyisocyanates may be crude polyisocyanates, such as crude polyisocyanates, such as crude % MDI, or modified polyisocyanates, such as liquefied Iul.
DI (carposiimide modification, trihydrocarbyl phosphate modification, etc.) or excess polyisocyanate (TD
It can also be used as a free isocyanate-containing prepolymer obtained by reacting a polyol with a polyol, or they can be used in combination (for example, a modified polyisocyanate and a prepolymer are used in combination).
上記プレポリマー製造に用いるポリオールとしては、当
量が80〜200のポジオール、たとえば、エチレング
リコール、プロピレングリコール、ジエチレングリコー
ル、ジプロピレングリコールなどのグリコール;トリメ
チロールプロパン、グリセリン等のトリオール;ペンタ
エリスリトール、ソルビトールなどの高官能ポリオール
;およびこれらのアルキレンオキサイド(エチレンオキ
サイドおよび/またはプロピレンオキサイド)付加物が
あげられる。The polyols used in the production of the prepolymer include posiols having an equivalent weight of 80 to 200, such as glycols such as ethylene glycol, propylene glycol, diethylene glycol, and dipropylene glycol; triols such as trimethylolpropane and glycerin; and pentaerythritol and sorbitol. Highly functional polyols; and alkylene oxide (ethylene oxide and/or propylene oxide) adducts thereof.
これらのうち好ましいものは官能基数2〜8のものであ
る。Among these, those having 2 to 8 functional groups are preferred.
上記変性ポリイソシアネート及びプレポリマーの遊離イ
ソシアネート基含量は通常10〜35%好ましくは15
〜80%、特に好亙しくは15〜28%のものである。The free isocyanate group content of the modified polyisocyanate and prepolymer is usually 10 to 35%, preferably 15%.
-80%, particularly preferably 15-28%.
遊戯イソシアネート基含量が10%未満では弾性率が低
く、85%を越えると衝撃強度が低い。When the content of free isocyanate groups is less than 10%, the elastic modulus is low, and when it exceeds 85%, the impact strength is low.
本発明に用いられる三量化触媒としては公知のものが使
用できる。具体的には、カルボン酸の金RiM(酢酸ナ
トリウム、オクチル酸カリ、オクチル酸鉛、オクチル酸
亜鉛、ナフテン酸コバルトなど)、アルカリおよびアル
カリ土類金属のアルコキシドおよびフェノキシト(ナト
リウムメトキシド、ナトリウムフェノキシドなど)、第
三級アミンCI、9.5.−)リス(3−ジメチルアミ
ノプロピル)へキサヒドロ−5−トリアジン、 ジメ
チルアミノメチル東フェノール、ピリジン〕、第四級ア
ンモチル−4−メチルイミダゾールなど)、などを挙げ
ることができる。仁れらのうち好ましいものはカルボン
酸の金属塩と三級アミンとの併用系である。As the trimerization catalyst used in the present invention, known ones can be used. Specifically, gold RiM of carboxylic acids (sodium acetate, potassium octylate, lead octylate, zinc octylate, cobalt naphthenate, etc.), alkoxides and phenoxides of alkali and alkaline earth metals (sodium methoxide, sodium phenoxide, etc.) ), tertiary amine CI, 9.5. -) lis(3-dimethylaminopropyl)hexahydro-5-triazine, dimethylaminomethyl eastphenol, pyridine], quaternary ammotyl-4-methylimidazole, etc.). Among these, preferred is a combination system of a metal salt of carboxylic acid and a tertiary amine.
三量化触媒の使用量は有機ポリイソシアネート100部
に対し通常0.01〜10部好ましくは0.06〜6部
である。The amount of trimerization catalyst used is usually 0.01 to 10 parts, preferably 0.06 to 6 parts, per 100 parts of the organic polyisocyanate.
本発明において必要により用いられる他の触媒としては
上記以外の第8級アミン類、有機スズ化合物および有機
鉛化合物があげられる。Other catalysts that may be used as necessary in the present invention include 8th class amines, organic tin compounds, and organic lead compounds other than those mentioned above.
上記以外の第8級アミン類としてはトリエチルアミン、
N−メチルモルホリンなどがあげられる。Examples of 8th class amines other than the above include triethylamine,
Examples include N-methylmorpholine.
有機スズ化合物および有機鉛化合物としてはジブチル錫
ジラウレート、オクチル酸錫、オクチル酸鉛などがあげ
られる。また必要により発泡剤(フレオン、メチレンジ
クロライドなど)およびその他の添加剤(顔料、フィラ
ーなど)を使用することもできる。Examples of the organic tin compound and organic lead compound include dibutyltin dilaurate, tin octylate, and lead octylate. Further, a blowing agent (freon, methylene dichloride, etc.) and other additives (pigment, filler, etc.) can also be used if necessary.
本発明において、イソシアネート指数は通常105〜1
000、好ましくは110〜900である。イソシアネ
ート指数が高いと耐熱性は良好だが耐衝撃性が劣る。In the present invention, the isocyanate index is usually 105 to 1.
000, preferably 110-900. When the isocyanate index is high, heat resistance is good but impact resistance is poor.
一方イソシアネート指数が低いとそれと逆の性能を示す
。On the other hand, when the isocyanate index is low, the performance is the opposite.
本発明において、熱処理温度は通常40〜200°C1
好ましくは60−180°C1更に好ましくは60〜1
50°Cである。熱処理温度が40°C未満では耐熱性
が不足し200℃より高いと樹脂の熱分解を引きおこす
。In the present invention, the heat treatment temperature is usually 40 to 200°C1
Preferably 60-180°C1, more preferably 60-1
It is 50°C. If the heat treatment temperature is less than 40°C, heat resistance will be insufficient, and if it is higher than 200°C, thermal decomposition of the resin will occur.
熱処理時間は通常1吟〜5時間、好ましくは30分〜2
時間である。The heat treatment time is usually 1 to 5 hours, preferably 30 minutes to 2 hours.
It's time.
熱処理条件は反応の完結、ミクロ相構造に大きな影響を
与える。これにより耐衝撃性、および耐熱性にすぐれた
熱硬化性樹脂を製造することができる。The heat treatment conditions have a great influence on the completion of the reaction and the microphase structure. This makes it possible to produce a thermosetting resin with excellent impact resistance and heat resistance.
本発明における成形法は真空注型法およびR岱■法によ
る成形が有用であるが、それ以外の成形法も適用できる
。As the molding method in the present invention, vacuum casting method and molding method are useful, but other molding methods can also be applied.
以下実施例により本発明を説明するが本発明はこれに限
定されるものではない。実施例及び比較例による部は重
量部である。測定法は以下による。The present invention will be explained below with reference to Examples, but the present invention is not limited thereto. Parts in Examples and Comparative Examples are parts by weight. The measurement method is as follows.
熱変形温度(’C) (JISK6911による。荷重
18.6 kg)曲げ弾性率(k/cut)、アイゾツ
ト(IZOD)衝撃(ノツチ付) (#g・an/ad
) (JISK69111Cよる)実施例1
プロピレンゲリコールに常法によりPOを付加したOH
価56のポリエーテルポリオール50部、アニリンにP
Oを付加したOH価530のポリオール(B)50部に
1.3.5.−)リス(3−ジメチルアミノプロピル)
−へキサヒドロ−5−トリアジン0.1部、オクチル酸
カリ0.1部およびシリコン系消泡剤を0.05部加え
25°Cに温調しそれに、OH価56のポリプロピレン
グリコールとMDIを常法により反応させて得たNC0
%20%のプレポリマー179部(NGO指数200)
を25°Cに温調したものを加えて、混合、脱泡し、型
温60°Cのモールドに注入し10分間60°Cでキュ
アー後150°CX1時間熱処理を行った。弾性率、耐
衝撃性、および耐熱性にすぐれた樹脂が得られた。Heat distortion temperature ('C) (According to JISK6911. Load 18.6 kg) Flexural modulus (k/cut), IZOD impact (notched) (#g・an/ad
) (According to JIS K69111C) Example 1 OH obtained by adding PO to propylene gelylcol by a conventional method
50 parts of polyether polyol having a value of 56, P to aniline
1.3.5. to 50 parts of polyol (B) having an OH value of 530 added with O. -) Lis(3-dimethylaminopropyl)
- Add 0.1 part of hexahydro-5-triazine, 0.1 part of potassium octylate and 0.05 part of a silicone antifoaming agent, adjust the temperature to 25°C, and add polypropylene glycol with an OH value of 56 and MDI at a constant temperature. NC0 obtained by reaction by method
%20% prepolymer 179 parts (NGO index 200)
The mixture was heated to 25°C, mixed, defoamed, poured into a mold with a mold temperature of 60°C, cured at 60°C for 10 minutes, and then heat-treated at 150°C for 1 hour. A resin with excellent elastic modulus, impact resistance, and heat resistance was obtained.
実施例2
プロピレングリコールに常法によりPOを付加したOH
価28のポリエーテルポリオール60部にビスフェノー
ルAにPOを付加した(M価350のポリオール(n)
40部に1.3,5.− トリス(3−ジメチルアミノ
プロピル)−へキサヒドロ−3−トリアジン0.1部、
オクチル酸カリ0.1部及びシリコン系消泡剤を0.0
5部加え25°Cに温調した。それに、プロピレングリ
コールとMDIを常法により反応させて得たNC0%2
6%のフL/ ホ’J v 90 部(NCO指数2
00 ) ヲ25°Cに温調したものを加え、混合、脱
泡し型温60’Cのモールドに注入し10分間、60°
Cでキュアー後150″CX1時間熱処理を行った。弾
性率、耐衝撃性、および耐熱性にすぐれた樹脂が得られ
た。Example 2 OH with PO added to propylene glycol by a conventional method
PO was added to bisphenol A in 60 parts of a polyether polyol with a value of 28 (polyol (n) with an M value of 350).
1,3,5 in 40 copies. - 0.1 part of tris(3-dimethylaminopropyl)-hexahydro-3-triazine,
0.1 part of potassium octylate and 0.0 part of silicone antifoaming agent
5 parts were added and the temperature was adjusted to 25°C. In addition, NC0%2 obtained by reacting propylene glycol and MDI by a conventional method
6% FuL/Ho'J v 90 parts (NCO index 2
00) Add the mixture to 25°C, mix, defoamer, and pour into a mold with a mold temperature of 60°C for 10 minutes at 60°C.
After curing at C, heat treatment was performed at 150''C for 1 hour. A resin with excellent elastic modulus, impact resistance, and heat resistance was obtained.
実施例3
カプロラクトンを開環重合して得たOH価56のポリエ
ステルポリオール50部にMDAにPOを付加して得た
OH価560のポリオール(B)40部、エチレングリ
コール10部にジブチル錫ジラウレート0.05部を加
えて、25°Cに温調した。それに実施例1で使用した
プレポリマー178部(N■指数110)を25℃に温
調して加え、混合、攪拌し型温60’Cのモールドに注
入し10分間60℃でキュアー後180°CX1時間熱
処理を行った弾性率、耐衝撃性、および耐熱性にすぐれ
た樹脂が得られた。Example 3 50 parts of a polyester polyol with an OH value of 56 obtained by ring-opening polymerization of caprolactone, 40 parts of a polyol (B) with an OH value of 560 obtained by adding PO to MDA, 10 parts of ethylene glycol, and 0 parts of dibutyltin dilaurate. 05 parts were added and the temperature was adjusted to 25°C. 178 parts of the prepolymer (N index 110) used in Example 1 was added to it at 25°C, mixed and stirred, poured into a mold with a mold temperature of 60°C, cured at 60°C for 10 minutes, and then heated to 180°C. A resin with excellent elastic modulus, impact resistance, and heat resistance was obtained by heat treatment with CX for 1 hour.
比較例1
実施例2で使用したポリオール(B)の代りにエチレン
ジアミンにPOを付加したOH価850のポリオールを
使用する以外は実施例2と全(同様の方法で樹脂を得た
。Comparative Example 1 A resin was obtained in the same manner as in Example 2, except that a polyol with an OH value of 850, which was obtained by adding PO to ethylenediamine, was used in place of the polyol (B) used in Example 2.
比較例2
ポリプロピレンの耐衝撃タイプを射出成形機により成型
した。Comparative Example 2 A shock-resistant type of polypropylene was molded using an injection molding machine.
試験例1
実施例1〜8および比較例1.2で得られた樹脂につい
て性能を試験した。Test Example 1 The performance of the resins obtained in Examples 1 to 8 and Comparative Example 1.2 was tested.
結果を表−1に示す。The results are shown in Table-1.
本発明により従来の熱硬化性樹脂に比べすぐれた弾性率
、耐衝撃性、および耐熱性を有し、しかも成型性にすぐ
れている熱硬化性樹脂が得られる。According to the present invention, a thermosetting resin can be obtained which has superior elastic modulus, impact resistance, and heat resistance compared to conventional thermosetting resins, and has excellent moldability.
また、従来の熱可塑樹脂(ポリプロピレン。Also, traditional thermoplastics (polypropylene).
A%樹脂など)にくらべても弾性率、耐衝撃性および耐
熱性がすぐれた熱硬化性樹脂が得られ、この樹脂は熱可
塑性樹脂にくらべて安価な金型(シリコン型、樹脂型な
ど)を使用することができるので工業的に有利である。A thermosetting resin with superior elastic modulus, impact resistance, and heat resistance compared to A% resin, etc.) can be obtained, and this resin can be used for molds (silicon molds, resin molds, etc.) that are cheaper than thermoplastic resins. It is industrially advantageous because it can be used.
上記効果を奏することから、本発明により得られる樹脂
は種々の応用分野、例えば自動車外装。Due to the above-mentioned effects, the resin obtained by the present invention can be used in various fields of application, such as automobile exteriors.
Claims (1)
および必要により他の触媒の存在下に反応させて熱硬化
性樹脂を製造する方法において(1)ポリオールとして
OH価70以下の高分子ポリオール(A)、OH価30
0〜750のオキシアルキル化された環状基を有するア
ミンもしくはポリオール(B)および必要により低分子
ポリオール(C)を使用し(2)イソシアネート指数を
105〜1000とし(3)40〜200℃の温度で熱
処理することを特徴とする熱硬化性樹脂の製法。 2、(B)が一般式 Ar−〔X−(AO)nH〕p(1) (式中、Arは環状基を有するアミンの残基、または環
状基を有するポリオールの残基、Xは−N<(AO)m
Rまたは酸素原子、Aは炭素数2〜4のアルキレン基、
Rは水素原子又は炭素数1〜4のアルキル基、mは0〜
4の整数、nは1〜4の整数、pは2〜4の整数である
。)で示されるOH価300〜750の化合物(B)で
ある特許請求の範囲第1項記載の製法。 3、(A)、(B)、(C)の使用量が、ポリオールの
重量に基いて、(A)が10〜80%、(B)が20〜
70%および(C)が0〜20%である特許請求の範囲
第1項または第2項記載の製法。[Claims] 1. In a method for producing a thermosetting resin by reacting an organic polyisocyanate and a polyol in the presence of a trimerization catalyst and, if necessary, other catalysts, (1) a polyol having a high OH value of 70 or less; Molecular polyol (A), OH value 30
Using an amine or polyol (B) having an oxyalkylated cyclic group of 0 to 750 and, if necessary, a low molecular weight polyol (C), (2) setting the isocyanate index to 105 to 1000, and (3) a temperature of 40 to 200°C. A method for producing thermosetting resin characterized by heat treatment. 2, (B) has the general formula Ar-[X-(AO)nH]p(1) (wherein, Ar is a residue of an amine having a cyclic group or a residue of a polyol having a cyclic group, and X is - N<(AO)m
R or an oxygen atom, A is an alkylene group having 2 to 4 carbon atoms,
R is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, m is 0 to
n is an integer of 1 to 4; p is an integer of 2 to 4; ) The manufacturing method according to claim 1, wherein the compound (B) has an OH value of 300 to 750. 3. The amounts of (A), (B), and (C) used are 10 to 80% for (A) and 20 to 20% for (B), based on the weight of the polyol.
70% and (C) is 0 to 20%.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62071208A JPH07685B2 (en) | 1987-03-25 | 1987-03-25 | Thermosetting resin manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62071208A JPH07685B2 (en) | 1987-03-25 | 1987-03-25 | Thermosetting resin manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63235321A true JPS63235321A (en) | 1988-09-30 |
JPH07685B2 JPH07685B2 (en) | 1995-01-11 |
Family
ID=13454030
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62071208A Expired - Fee Related JPH07685B2 (en) | 1987-03-25 | 1987-03-25 | Thermosetting resin manufacturing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH07685B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000044871A (en) * | 1998-07-28 | 2000-02-15 | Hodogaya Chem Co Ltd | Composition for polyurethane urea non-slip material and its coating method |
US6289077B1 (en) | 1997-05-06 | 2001-09-11 | Sumitomo Heavy Industries, Ltd. | Transmission system for synchrotron radiation light |
JP2010095996A (en) * | 2009-11-16 | 2010-04-30 | Hodogaya Chem Co Ltd | Composition for polyurethane urea nonslip material |
WO2014208567A1 (en) * | 2013-06-27 | 2014-12-31 | 旭化成ケミカルズ株式会社 | Polyisocyanate composition and method for production thereof, block polyisocyanate composition and method for production thereof, resin composition, curable resin composition, and cured article |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08132375A (en) * | 1994-11-02 | 1996-05-28 | Minami Denshi Kogyo Kk | Suction holding device, and suction holding method using it |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60206819A (en) * | 1984-03-30 | 1985-10-18 | Sanyo Chem Ind Ltd | Production of polyurethane molding |
JPS61120819A (en) * | 1984-11-16 | 1986-06-07 | Toyo Tire & Rubber Co Ltd | High-hardness flexible polyurethane foam |
-
1987
- 1987-03-25 JP JP62071208A patent/JPH07685B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60206819A (en) * | 1984-03-30 | 1985-10-18 | Sanyo Chem Ind Ltd | Production of polyurethane molding |
JPS61120819A (en) * | 1984-11-16 | 1986-06-07 | Toyo Tire & Rubber Co Ltd | High-hardness flexible polyurethane foam |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6289077B1 (en) | 1997-05-06 | 2001-09-11 | Sumitomo Heavy Industries, Ltd. | Transmission system for synchrotron radiation light |
US6295334B1 (en) | 1997-05-06 | 2001-09-25 | Sumitomo Heavy Industries, Ltd. | Transmission system for synchrotron radiation light |
JP2000044871A (en) * | 1998-07-28 | 2000-02-15 | Hodogaya Chem Co Ltd | Composition for polyurethane urea non-slip material and its coating method |
JP2010095996A (en) * | 2009-11-16 | 2010-04-30 | Hodogaya Chem Co Ltd | Composition for polyurethane urea nonslip material |
WO2014208567A1 (en) * | 2013-06-27 | 2014-12-31 | 旭化成ケミカルズ株式会社 | Polyisocyanate composition and method for production thereof, block polyisocyanate composition and method for production thereof, resin composition, curable resin composition, and cured article |
US10301416B2 (en) | 2013-06-27 | 2019-05-28 | Asahi Kasei Chemicals Corporation | Polyisocyanate composition and method of manufacturing the same, blocked polyisocyanate composition and method of manufacturing the same, resin composition, curable resin composition and hardened material |
Also Published As
Publication number | Publication date |
---|---|
JPH07685B2 (en) | 1995-01-11 |
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