JPS63233538A - Semiconductor manufacturing apparatus - Google Patents

Abstract

PURPOSE:To decrease remaining burr between leads and to decrease defects due to the burr in the next step, by providing a buffer member between punches and the burr when cracks are yielded in the burr by a first means. CONSTITUTION:A molded IC lead frame 2 is sent to a first stage, which is a first means for yielding cracks in burr 3. Resin punches 4 and a buffer member 6 are lowered so as to push the IC lead frame 2, and the cracks are yielded in the burr 3 between leads. The frame is sent to a second stage, which is a second means, and ordinary deburring is performed. Then the cracks can be yielded with shocks imparted to the part of the burr 3 being alleviated with the buffering action of the member 6. Thus the remaining burr between the leads is decreased, and the defects due to the burr in the next step is decreased.

Description

DETAILED DESCRIPTION OF THE INVENTION [A field of application] The present invention relates to a semiconductor manufacturing device, and particularly to a semiconductor manufacturing device for removing burrs between the leads of a molded IC lead frame.

[Conventional technology]

Conventionally, as this type of apparatus, those shown in FIGS. 2 and 3 are known. Figure 2 is a plan view showing the conventional device;
The figure is a side cross-sectional view cut along the line ■-■ in FIG. 2.

In the figure, 1 is a soldered package, 2 is
A molded IC lead frame, 3 indicates a gap between the leads of the molded IC lead frame 2, 4 is a resin punch which is a punch for removing the gap between the leads, and 5 indicates a resin punch. 4 is a resin die that is sent to a punching stage during the process of removing the burrs 3 between the mud storage leads, and the IC lead frame 2 is set on the top thereof. Hereinafter, the device that sets the IC lead frame 2 on the resin die 5 and performs operations such as removing the burrs 3 between the leads will be referred to as a punching stage.

Next, the operation will be explained. In order to punch out the molded IC lead frame 2, it is sent to a punching stage and set on a resin die 5. Then, lower the resin punch 4 and punch in the lead spacing 3. As described above, the conventional apparatus is configured to remove in one stage the minute burrs 3, which are the edges of the metal part of the workpiece, which protrude from the edges of the workpiece, stepped portions, etc., using a mold or the like.

[Problem that the invention seeks to solve]

However, in conventional semiconductor manufacturing equipment, there is only a stage to remove burrs, and burrs remain from the package along the sides of the leads, so the remaining burrs must be driven onto the leads in the next process. There were problems such as not being able to do so.

The present invention has been made to solve the above-mentioned problems, and aims to reduce the amount of embossment left between the leads and eliminate embossment on the leads.

(Means for solving the problem) Therefore, in the semiconductor manufacturing apparatus according to the present invention,
The method has a first means for cracking the package side of the burr between the leads, and a second means for removing the burr cracked by the first means, and cracks the burr by the first means. Sometimes, an attempt is made to achieve the above objective by installing a &i-gauge member between the punch and the burr to reduce the amount of burr remaining.

(Function) With the above configuration, the semiconductor manufacturing apparatus according to the present invention cracks the burr between the leads with the buffer member at the tip of the punch by the first means, and removes the cracked burr by the second means. .

(Embodiment) An embodiment of the semiconductor manufacturing apparatus according to the present invention will be described below with reference to FIG.

FIG. 1 is a side sectional view of an embodiment of the present invention. The same (equivalent) components as in the conventional device FIGS. 2 and 3 are denoted by the same reference numerals to avoid duplication of explanation. In the figure, 6 is a buffer member attached to the tip of the resin punch 4.

Next, the operation will be explained.

The first stage (Fig. 1) is the first means of cracking the molded IC lead frame 2 into the burr 3.
sent to. In FIG. 1, the resin bunch 4 and the buffer member 6 descend and press down on the IC lead frame 2, cracking the burr 3 between the leads. Then,
The paper is sent to the second stage (FIG. 3), which is the second means, and normal boring is performed. In this case, since the IC lead frame 2 is held by lowering the resin bunch 4 and the buffer member 6, it is possible to create a crack while alleviating the force applied to the burr 3 by the buffering action of the buffer member 6, and continue to It is sent to the second stage, which reduces the number of defects left by normal punching.

In this way, in the conventional device, the burrs 3 between the leads of the molded IC lead frame 2 were removed in one stage, but according to an embodiment of the present invention, the burrs 3 are removed in the first stage to crack the burrs. stage and a second stage for removing the burr cracked by the first stage, and a buffer member is inserted between the resin bunch and the burr when cracking the burr in the first stage. This has the effect of providing a semiconductor manufacturing apparatus that can reduce the number of remaining burrs, eliminate the need to implant the remaining burrs onto the leads in the next process, and reduce defects caused by burrs.

(Effects of the Invention) As explained above, according to the present invention, there is provided a first means for cracking a burr, a second means for removing the cracked burr, and a second means for removing the cracked burr. By inserting a buffer member between the punch and the burr when cracking the burr by means of means, it is possible to reduce the amount of cracks left between the leads, which has the effect of reducing defects due to the burr in the cracking process.

[Brief Description of the Drawings] Fig. 1 is a side sectional view of an embodiment of the present invention, Fig. 2 is a plan view of a conventional device, and Fig. 3 is a side cut along line m-m in Fig. 2. FIG. 1-----Package 2-----IC lead frame 3--Between leads 4--Resin bunch 5--Resin die 6...Buffer member In the figure, The same reference numerals indicate the same or equivalent parts.

Claims (1)

[Claims] In a device for removing burrs between leads of a molded IC lead frame, the first step is to crack the burrs.
and a second means for removing the burr cracked by the first means, and a buffer member is inserted between the punch and the burr when cracking the burr by the first means. Features of semiconductor manufacturing equipment.