JPS6323343A - Resin-sealed semiconductor device - Google Patents
Resin-sealed semiconductor deviceInfo
- Publication number
- JPS6323343A JPS6323343A JP2960687A JP2960687A JPS6323343A JP S6323343 A JPS6323343 A JP S6323343A JP 2960687 A JP2960687 A JP 2960687A JP 2960687 A JP2960687 A JP 2960687A JP S6323343 A JPS6323343 A JP S6323343A
- Authority
- JP
- Japan
- Prior art keywords
- tab
- resin
- leads
- sealed
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 24
- 239000008188 pellet Substances 0.000 claims abstract description 15
- 239000000725 suspension Substances 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 abstract description 9
- 229920005989 resin Polymers 0.000 abstract description 9
- 230000000694 effects Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Abstract
Description
【発明の詳細な説明】 ［産業上の利用分野コ この発明は樹脂封止半導体装置に関する。[Detailed description of the invention] [Industrial application fields] The present invention relates to a resin-sealed semiconductor device.
［従来技術］
樹脂封止半導体装置は半導体素子とその周囲から外方へ
導出される複数のリードを樹脂体で封止したもので、複
数のリードは半導体素子を取付けるべきタブと共に一つ
の枠状のフレーム部材内に一体に形成したリードフレー
ムが使用される。この複数のリードをその外端側で一列
に配置したシングル・イン・ライン（Ｓｉｎｇｌｅ−ｉ
ｎ−Ｌｉｎｅ） ８ピン型（ＳＩＬ８ビン）のものが従
来より知られている。この型のリードフレームにおいて
は第１図に示すようにタブ１を支持するタブリード（又
はタブつり）２を複数のリード３の一部リードとして共
用した構造のものが普通である。なお、同図（以下の図
においても同様）で実線で示す部分はリード及びタブ、
破線で示す部分はフレーム４゜５及び６，７部分で樹脂
体８（−点鎖線で囲む部分）による封止後に実線のリー
ド部分から切り離されるものである。[Prior Art] A resin-sealed semiconductor device is a device in which a semiconductor element and a plurality of leads extending outward from its surroundings are sealed with a resin body. A lead frame integrally formed within the frame member is used. Single-in-line (Single-i), in which these multiple leads are arranged in a line on the outer end
n-Line) 8-pin type (SIL 8-bin) is conventionally known. This type of lead frame usually has a structure in which a tab lead (or tab hanger) 2 supporting a tab 1 is shared as a part of a plurality of leads 3, as shown in FIG. In addition, the parts indicated by solid lines in the same figure (the same applies to the following figures) are leads, tabs,
The portions indicated by broken lines are the portions of the frame 4° 5, 6, and 7 that are separated from the lead portions indicated by solid lines after being sealed with the resin body 8 (the portion surrounded by the dashed line).
［発明が解決しようとする問題点］
第１図では複数のリード３の配列の中心にタブリード２
が設けられているが、他のリード例えば３ａ、３ｂ・・
・と共用される場合もある。いずれにしてもいったんリ
ードフレームのレイアウトが決るとタブリードの位置は
規定され、したがって接他用ピン及びプリント基板にお
ける接地部の配置の自由度が固定されることになる。こ
のことは同時にＩＣペレットの電極配置などのレイアウ
トに制約を及ぼすことになる。又、従来のシングル・イ
ン・ライン型リードフレームにおいては耐湿性および放
熱性は充分考慮されていない。[Problems to be Solved by the Invention] In FIG.
are provided, but other leads such as 3a, 3b...
・It may also be shared with . In any case, once the layout of the lead frame is determined, the positions of the tab leads are defined, and therefore the degree of freedom in arranging the contact pins and the grounding portions on the printed circuit board is fixed. This also imposes restrictions on the layout of the IC pellet, such as the arrangement of electrodes. Furthermore, moisture resistance and heat dissipation properties are not sufficiently considered in conventional single-in-line lead frames.
［問題点を解決するための手段］
この発明の目的はリード配置のレイアウトの容易かつ耐
湿性向上をはかった樹脂封止半導体装置を提供すること
にある。[Means for Solving the Problems] An object of the present invention is to provide a resin-sealed semiconductor device that facilitates the layout of lead arrangement and improves moisture resistance.
上記目的を達成するための本発明は、半導体ペレット取
付用タブと、そのタブに取付けられた半導体ペレットと
、タブを取り囲み一方向に沿って配列される複数のリー
ドと、これらタブ、半導体ペレット及び複数のリードの
それぞれの一部分を封止する樹脂封止体とより成るシン
グル・イン・ライン型樹脂封止半導体装置であって、上
記タブは複数のリードの導出方向と反対の方向であって
そのタブからずれた位置より樹脂封止体外に一部露出す
るタブつり部材を有するシングル・イン・ライン型樹脂
封止半導体装置にある。To achieve the above object, the present invention includes a tab for attaching a semiconductor pellet, a semiconductor pellet attached to the tab, a plurality of leads surrounding the tab and arranged along one direction, these tabs, the semiconductor pellet, and a semiconductor pellet attached to the tab. A single-in-line type resin-sealed semiconductor device comprising a resin-sealed body that seals a portion of each of a plurality of leads, wherein the tab is in a direction opposite to the leading-out direction of the plurality of leads, and The single-in-line resin-sealed semiconductor device has a tab suspension member that is partially exposed outside the resin-sealed body from a position offset from the tab.
［実施例］ 以下５本発明を若干の実施例にそって具体的に述べる。[Example] The present invention will be specifically described below with reference to some examples.
第２図は本発明を０．５ＷパワーＩＣ用ＳＩＬ型リード
フレームに適した一例を示す。同図に示すようにタブ１
からタブつり部材１１が複数のリード３ａ、３ｂの導出
方向と反対方向（上側）に導出されて破線で示すフレー
ム又はダム６に接続する。複数のリード３ａ、３ｂ・・
・は従来のもの同様の形態を有するが、タブリードのあ
った位置に新たにリード３ｍが追加される。図示されな
いがこのタブ１上に半導体ペレット１２がボンディング
され、その半導体ペレットに形成された電極と複数のリ
ードの内端との間にワイヤ１３がボンディングされる。FIG. 2 shows an example in which the present invention is suitable for a SIL type lead frame for a 0.5W power IC. Tab 1 as shown in the figure
A tab suspension member 11 is led out in the opposite direction (upper side) to the direction in which the plurality of leads 3a and 3b are led out, and connected to the frame or dam 6 shown by the broken line. Multiple leads 3a, 3b...
- has the same form as the conventional one, but a new lead of 3 m is added at the position where the tab lead was. Although not shown, a semiconductor pellet 12 is bonded onto the tab 1, and a wire 13 is bonded between the electrode formed on the semiconductor pellet and the inner ends of the plurality of leads.
この状態でフレーム４，５、ダム６．７で囲まれた空間
に樹脂体８がモールドされ、フレーム及びダムがリード
から切り離されて完成した半導体装置となる。In this state, the resin body 8 is molded in the space surrounded by the frames 4, 5 and the dams 6, 7, and the frames and dams are separated from the leads to form a completed semiconductor device.
このリードフレームは第２図に示すようにタブ１より複
数のリード３ａ、３ｂの導出される方向と逆の方向（上
側）のタブ（又はフレーム）６にそって左右に延長し、
かつ充分な面積をもたせたタブ延長部１０を形成すると
ともに半導体ペレット１２が取付けられたタブ１からず
れて位置するタブつり部材１１を介してダム（又はフレ
ーム）６に連結した構造を有する。上記タブ延長部の大
部分は樹脂封止体８の内側に形成されるが、タブつり部
材１１の一部は樹脂封止体に露出する。As shown in FIG. 2, this lead frame extends left and right along the tab (or frame) 6 in the opposite direction (upper side) to the direction in which the plurality of leads 3a, 3b are led out from the tab 1,
It has a structure in which a tab extension part 10 with a sufficient area is formed, and the semiconductor pellet 12 is connected to the dam (or frame) 6 via a tab hanging member 11 that is positioned offset from the attached tab 1. Most of the tab extension is formed inside the resin seal 8, but a portion of the tab suspension member 11 is exposed to the resin seal.
［効果コ
このような本発明の如き構成によれば、タブリードを複
数のリードと逆方向に導出することでＩＣピンとなるリ
ードのレイアウトが容易となり。[Effects] According to the configuration of the present invention, the layout of the leads that will become IC pins is facilitated by leading out the tab leads in the opposite direction to the plurality of leads.
リードフレームの形状、ピン数を選ぶ上での自由度が向
上する。The degree of freedom in choosing the shape of the lead frame and the number of pins is improved.
また、タブつり部材１１は半導体ペレット１２が取付け
られたタブ１からずれて位置しているため、そのタブつ
り部材１１の一部が樹脂封止体から露出しても、そこか
ら入ってタブに到達するまでの水の浸入経路（リークパ
ス）は長くなり、耐湿性劣化を防止できる。Further, since the tab hanging member 11 is located offset from the tab 1 to which the semiconductor pellet 12 is attached, even if a part of the tab hanging member 11 is exposed from the resin sealing body, it will enter from there and attach to the tab. The water intrusion path (leak path) until reaching the surface becomes longer, and deterioration of moisture resistance can be prevented.
さらに、実施例のように、タブ延長部１０の存在によっ
て、タブから樹脂体への接触熱抵抗を下げることにより
ジャンクション・ケース熱抵抗θｊｃを大幅に減少させ
る効果を有する。Furthermore, as in the embodiment, the presence of the tab extension 10 has the effect of significantly reducing the junction case thermal resistance θjc by lowering the contact thermal resistance from the tab to the resin body.
第１図は従来例によるリードフレームの平面図、第２図
は本発明によるリードフレームの実施例の平面図である
。
１・・ペレット取付用タブ、２・・タブ（タブリード）
−３ｐ ３ａ、ａｂ、” ”リード、４，５・・フレ
ーム、６，７・・ダム（フレーム部材）、８・・樹脂封
止体、９・・タブつり部材、１０・・タブ延長部、１１
・・タブつり部材、１２・・半導体ペレット、１３・・
ワイヤ。FIG. 1 is a plan view of a conventional lead frame, and FIG. 2 is a plan view of an embodiment of the lead frame according to the present invention. 1. Tab for pellet installation, 2. Tab (tab lead)
-3p 3a, ab, "" lead, 4, 5... frame, 6, 7... dam (frame member), 8... resin sealing body, 9... tab suspension member, 10... tab extension part, 11
・・Tab hanging member, 12・・Semiconductor pellet, 13・・
wire.
Claims (1)
れた半導体ペレットと、タブを取り囲み一方向に沿って
配列される複数のリードと、これらタブ、半導体ペレッ
ト及び複数のリードのそれぞれの一部分を封止する樹脂
封止体とより成るシングル・イン・ライン型樹脂封止半
導体装置であって、上記タブは複数のリードの導出方向
と反対の方向であってそのタブからずれた位置より樹脂
封止体外に一部露出するタブつり部材を有するシングル
・イン・ライン型樹脂封止半導体装置。1. A tab for attaching a semiconductor pellet, a semiconductor pellet attached to the tab, a plurality of leads surrounding the tab and arranged along one direction, and a portion of each of these tabs, the semiconductor pellet, and the plurality of leads being sealed. A single-in-line resin-sealed semiconductor device consisting of a resin-sealed body for sealing, the tab being in a direction opposite to the lead-out direction of the plurality of leads, and from a position offset from the tab. A single-in-line resin-sealed semiconductor device that has a tab suspension member that is partially exposed outside the body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2960687A JPS6323343A (en) | 1987-02-13 | 1987-02-13 | Resin-sealed semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2960687A JPS6323343A (en) | 1987-02-13 | 1987-02-13 | Resin-sealed semiconductor device |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6778678A Division JPS54159178A (en) | 1978-06-07 | 1978-06-07 | Lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6323343A true JPS6323343A (en) | 1988-01-30 |
Family
ID=12280723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2960687A Pending JPS6323343A (en) | 1987-02-13 | 1987-02-13 | Resin-sealed semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6323343A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0453644U (en) * | 1990-09-11 | 1992-05-07 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5367786A (en) * | 1976-11-29 | 1978-06-16 | Matsushita Electric Ind Co Ltd | Smoothed films |
| JPS54159178A (en) * | 1978-06-07 | 1979-12-15 | Hitachi Ltd | Lead frame |
-
1987
- 1987-02-13 JP JP2960687A patent/JPS6323343A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5367786A (en) * | 1976-11-29 | 1978-06-16 | Matsushita Electric Ind Co Ltd | Smoothed films |
| JPS54159178A (en) * | 1978-06-07 | 1979-12-15 | Hitachi Ltd | Lead frame |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0453644U (en) * | 1990-09-11 | 1992-05-07 | ||
| JP2529333Y2 (en) * | 1990-09-11 | 1997-03-19 | 住友ベークライト株式会社 | Packaging bag |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR950001854A (en) | A manufacturing method of a resin encapsulated semiconductor device, a lead frame for installing a plurality of semiconductor elements used in the manufacturing method, and a resin encapsulated semiconductor device manufactured by this manufacturing method | |
| JPH0492462A (en) | Semiconductor device | |
| KR970067736A (en) | Lead frame, semiconductor device using same and manufacturing method thereof | |
| JP2005159103A5 (en) | ||
| KR870004509A (en) | Lead frame and semiconductor device using same | |
| KR910007094A (en) | Resin Sealed Semiconductor Device | |
| JPS6323343A (en) | Resin-sealed semiconductor device | |
| JPH0151058B2 (en) | ||
| JPH0546280Y2 (en) | ||
| KR920017219A (en) | Semiconductor device and manufacturing method of semiconductor device and tape carrier | |
| JPS63104435A (en) | Semiconductor device | |
| JP3248117B2 (en) | Semiconductor device | |
| JPS60235443A (en) | Semiconductor device | |
| JPH0526761Y2 (en) | ||
| KR950005966B1 (en) | Plastic mold type semiconductor device | |
| JPH03129840A (en) | Resin-sealed semiconductor device | |
| JPS5949695B2 (en) | Manufacturing method for glass-sealed semiconductor devices | |
| KR970053749A (en) | Semiconductor package | |
| JPH04134853A (en) | Lead frame for semiconductor device | |
| KR200156148Y1 (en) | Semiconductor package | |
| JPS60111449A (en) | Semiconductor device | |
| JPH0560662B2 (en) | ||
| JPH01173747A (en) | Resin-sealed semiconductor device | |
| JPH10178146A (en) | Lead frame and semiconductor device | |
| JPH01255259A (en) | Resin-sealed semiconductor device |