JPS6323327A - Wafer holder for etching - Google Patents

Abstract

PURPOSE:To enable a wafer to be rapidly etched up to its lateral side faces, upper and lower and front and back margins without producing a bubble by opening not only above and below but also before and behind the wafer. CONSTITUTION:Upper and lower pairs of supporting rods 3a, 3b, 4a and 4b are provided in the lower portions of right and left side plates hung by a handle inserted in the upper ends of the side plates in a vertical direction thereto. A number of 110-150 deg. angled V-shaped notches for holding the four corners of a wafer W are formed in the supporting rods 3a, 3b, 4a and 4b at equal phases. Opposite guide slots 6 and 6 are formed in the right and left side plates in an upper-to-lower direction. Both ends of he upper front supporting rod 3a are loosely fit into the guide slots 6 and 6. When, after the supporting rod 3a is raised upward along the guide slots 6 and 6 and the wafer W is inserted in the notches 5 of the supporting rods 3b, 4a and 4b at the same phase, the supporting rod 3a is returned to an original position, the four corners of the wafer W are brought into point contact with the V-shaped notches 5 of the supporting rods 3a, 3b, 4a and 4b to be supported thereby. The wafers are suspended by the handle 1 supported by the right and left opposite upper edges of the tank of a circulating etchant heated to about 200 deg.C to be etched.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) This is an improvement on an apparatus for supporting IC substrates or wafers side by side when immersing them in an etching solution.

(Prior art) As shown in Japanese Patent Publication No. 54-10429, a conventional wafer support of this kind is a support in which a large number of guide grooves are formed facing each other on the inner sides of a front plate and a rear plate, and the upper and lower sides thereof are open. The wafer was etched by inserting the front and rear edges of the wafer into the body and immersing them in an etching solution.

(Problems to be Solved by the Invention) In this way, the etching solution only touches the left and right sides of the wafer from the upper and lower open parts of the support, and the front and rear edges of each wafer come into contact with the guide grooves. Moreover, since the etching solution has a strong adhesive force, when the wafer is immersed in the solution, air bubbles may be trapped in the area that makes contact with the etching process. In order to improve this drawback, the present invention supports the four corners of the wafer in point contact without forming bubbles, and the left and right sides and upper and lower edges of the wafer, as well as the front and rear edges, are The purpose is to quickly etch all the way to the edges.

(Means for solving the problem) A pair of upper and lower support rods 3a are provided at the lower front and rear of the left and right side plates 2.2, which are suspended by inserting the handle 1 into the upper end.

3b, 4a, and 4b, and a large number of V-shaped notches 5 opening at 120 DEG -150 DEG are formed in the same phase on each support rod to hold the four corners of the wafer W.

Therefore, the left and right side plates 2, 2 have guide holes 6.6 in the vertical direction.
are bored opposite each other, and both ends of the upper front support rod 3a are loosely fitted into the guide holes 6.6.

(Function) First lift the front upper support rod 3a upward along the vertical guide hole 6.6, and insert the wafer into the notches 5 of the same phase of the front lower support rod 3b and the rear upper and lower support rods 4a and 4b. After inserting the wafer W, when the upper front support rod 3a is returned to its old position, the four corners of each wafer W are attached to the support rods 3a, 3b and 4a, 4b.
It is supported in point contact with the V-shaped notch 5 of. Therefore, the fifth
As shown in the figure, each wafer W is etched by hanging it from the left and right edges of a tank T of an etching solution heated to about 200 DEG C. and circulated by a handle L.

After etching is completed, the support of the present invention is placed in a tank T.
Then, each wafer W is taken out by moving the upper front support rod 3a upward along the guide hole 6.6.

(Example) The left and right outer ends of each support rod 3a, 3b and 4a, 4b are fastened to the side plates 2, 2 by a fastening napft 7.

In this case, in order to move the support rod 3a along the guide hole 6 in the vertical direction, it is preferable to loosen the tightening nuts 7 at both ends thereof.

Reference numeral 8 denotes guide holes drilled radially in the side plate 2, and the lower half of the guide hole 6 in the vertical direction as well as the support rods 3a, 3b and 4a, 4.
b is moved and guided according to the size of the wafer W.

It is preferable to connect the middle of the left and right side plates 2 with an erection rod 9.
10 is a seat plate common to the support rods 3b, 4a, and 4b.

A handle 1, left and right side plates 2.2, and each support rod 3a.

3b, 4a, 4b, the erection rod 9, and the seat plate 10 are made of a highly corrosion-resistant synthetic resin such as fluororesin, and the handle 1, the erection rod 9, and each support rod are made of six metal rods. Insert and reinforce.

FIG. 4 is an enlarged front view of a V-shaped notch 5 that opens at 120°, and the notch 5 has a depth of 1.5 mm and a width of 3 mm.

(Effects of the Invention) According to the present invention, the large number of wafers W whose four corners are supported by the support rods 3a, 3b and 4a, 4b are opened not only at the top and bottom, but also at the front and back. Compared to conventional products, the etching liquid flows up and down, back and forth, and the wafers W can be immersed quickly and evenly, and each wafer W is only supported by point contact with the V-shaped notches 5 at only its four corners. Therefore, it is possible to etch not only the left and right sides, but also the top and bottom edges, and since the V-shaped notch 5 is open at 110°-150° as shown in Figure 4, it can be etched using a highly adhesive etching liquid. Since the air bubbles formed between the wafer and the notch 5 quickly rise and disappear, there is no risk that the wafer will come into contact with the air bubbles and leave unetched parts. Therefore, in the present invention, only the upper front support rod 3a By moving the wafer W along the guide hole 6 in the vertical direction, it is possible to easily take out and insert the wafer W from the support.

It goes without saying that the present invention can also be used for plating.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of an embodiment of the present invention, Fig. 2 is a side view thereof,
FIG. 3 is a vertical side view of the same, FIG. 4 is an enlarged front view of the ■-shaped side view, and FIG. 5 is a front view of the state in use. 1 is a handle, 2 is a side plate, 3a, 3b, 4a, 4b are support rods, 5 is a notch, and 6 is a guide hole. Agent Maki Tobe (and 2 others) Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Summer 3b

Claims (1)

[Scope of Claims] A pair of upper and lower support rods are installed at the front and rear of the lower part of the left and right side plates, which are suspended by inserting handles into the upper ends, and each support rod has a large number of 110 wafers that are to hold the four corners of the wafer W. V-shaped notches opening at -150° are formed in the same phase, and guiding holes are bored vertically facing each other in the left and right side plates, and both ends of the upper front support rod are loosely fitted into these guiding holes. Wafer support for etching.