JPS6323259U - - Google Patents

Info

Publication number
JPS6323259U
JPS6323259U JP11873986U JP11873986U JPS6323259U JP S6323259 U JPS6323259 U JP S6323259U JP 11873986 U JP11873986 U JP 11873986U JP 11873986 U JP11873986 U JP 11873986U JP S6323259 U JPS6323259 U JP S6323259U
Authority
JP
Japan
Prior art keywords
tape
electronic components
tongue piece
regular intervals
embossed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11873986U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11873986U priority Critical patent/JPS6323259U/ja
Publication of JPS6323259U publication Critical patent/JPS6323259U/ja
Pending legal-status Critical Current

Links

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  • Packages (AREA)
  • Packaging Frangible Articles (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａおよびｂは本考案の第一の実施例の平
面図およびＢ―Ｂ断面図、第２図ａおよびｂは第
１図の実施例にチツプ型電子部品を収納した状態
を示す平面図およびＣ―Ｃ断面図、第３図ａおよ
びｂならびに第４図ａおよびｂは、それぞれ第１
図の実施例の成形加工過程を示す平面図および正
面図ならびに平面図およびＤ―Ｄ断面図、第５図
ａおよびｂは本考案の第二の実施例の成形加工過
程を示す平面図、第６図ａおよびｂは本考案の第
三の実施例の成形加工過程を示す平面図、第７図
ａおよびｂは従来のキヤリヤテープの一例を示す
平面図およびＥ―Ｅ断面図、第８図ａおよびｂは
第７図のキヤリヤテープにチツプ型電子部品を収
納した状態を示す平面図およびＦ―Ｆ断面図であ
る。 １・１１・２１・３１……テープ部材、２・１
２・２２・３２……送り穴、３・１３・２３・３
３……エンボス溝、４・４０・４１・４２……キ
ヤリヤテープ、５・１５……チツプ型電子部品、
６・１６……トツプテープ、１７・２７・３７…
…切込み、１８・２８・３８……舌片。 1A and 1B are a plan view and a BB sectional view of the first embodiment of the present invention, and FIGS. 2A and 2B are plane views showing the embodiment of FIG. 1 in which a chip-type electronic component is housed. Figures and CC sectional views, Figures 3 a and b, and Figures 4 a and b are respectively
Figures 5a and 5b are plan views and front views showing the molding process of the second embodiment of the present invention, as well as a plan view and DD sectional view, respectively. 6a and b are plan views showing the molding process of the third embodiment of the present invention, FIGS. 7a and b are plan views and EE sectional views showing an example of a conventional carrier tape, and FIG. 8 a and b are a plan view and a cross-sectional view taken along line FF, showing a state in which chip-type electronic components are housed in the carrier tape of FIG. 7. 1, 11, 21, 31... Tape member, 2, 1
2, 22, 32...Sprocket hole, 3, 13, 23, 3
3... Embossed groove, 4, 40, 41, 42... Carrier tape, 5, 15... Chip type electronic component,
6.16...Top tape, 17.27.37...
...Incisions, 18, 28, 38...tongue pieces.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 合成樹脂製のテープ部材に一定間隔で設けられ
た複数個の長方形状のエンボス溝と、前記一定間
隔と同一間隔でかつ同一位置関係で設けられた送
り穴とを有する電子部品搬送用テープにおいて、
前記エンボス溝の互に隣接する２個の側面の中央
部にその底面に向つて傾斜して突出した舌片を設
けたことを特徴とする電子部品搬送用テープ。 A tape for transporting electronic components having a plurality of rectangular embossed grooves provided at regular intervals on a synthetic resin tape member, and feed holes provided at the same intervals and in the same positional relationship as the regular intervals,
A tape for transporting electronic components, characterized in that a tongue piece is provided at the center of two adjacent side surfaces of the embossed groove, the tongue piece slanting and protruding toward the bottom surface of the embossed groove.
JP11873986U 1986-07-31 1986-07-31 Pending JPS6323259U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11873986U JPS6323259U (en) 1986-07-31 1986-07-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11873986U JPS6323259U (en) 1986-07-31 1986-07-31

Publications (1)

Publication Number Publication Date
JPS6323259U true JPS6323259U (en) 1988-02-16

Family

ID=31005479

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11873986U Pending JPS6323259U (en) 1986-07-31 1986-07-31

Country Status (1)

Country Link
JP (1) JPS6323259U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02282068A (en) * 1989-04-14 1990-11-19 Taiyo Yuden Co Ltd Plastic carrier tape and manufacture thereof
JPH03178199A (en) * 1989-12-06 1991-08-02 Matsushita Electric Ind Co Ltd Embossed tape for packing electronic parts
US9538695B2 (en) 2012-12-14 2017-01-03 Murata Manufacturing Co., Ltd. Carrier tape, package tape and series of electronic components
JP2021066457A (en) * 2019-10-23 2021-04-30 株式会社村田製作所 Electronic component array and base tape

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02282068A (en) * 1989-04-14 1990-11-19 Taiyo Yuden Co Ltd Plastic carrier tape and manufacture thereof
JPH03178199A (en) * 1989-12-06 1991-08-02 Matsushita Electric Ind Co Ltd Embossed tape for packing electronic parts
US9538695B2 (en) 2012-12-14 2017-01-03 Murata Manufacturing Co., Ltd. Carrier tape, package tape and series of electronic components
JP2021066457A (en) * 2019-10-23 2021-04-30 株式会社村田製作所 Electronic component array and base tape
US11844179B2 (en) 2019-10-23 2023-12-12 Murata Manufacturing Co., Ltd. Electronic component series and base tape

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