JPH0180472U - - Google Patents

Info

Publication number
JPH0180472U
JPH0180472U JP1987176287U JP17628787U JPH0180472U JP H0180472 U JPH0180472 U JP H0180472U JP 1987176287 U JP1987176287 U JP 1987176287U JP 17628787 U JP17628787 U JP 17628787U JP H0180472 U JPH0180472 U JP H0180472U
Authority
JP
Japan
Prior art keywords
attached
lower surfaces
positions
raised
outer periphery
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987176287U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987176287U priority Critical patent/JPH0180472U/ja
Publication of JPH0180472U publication Critical patent/JPH0180472U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Credit Cards Or The Like (AREA)
  • Casings For Electric Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示す係合部分の分
解斜視図、第2図は全体の斜視図である。 1……ICカード基体、2……第1の金属板、
3……第2の金属板、13……上下貫通穴、21
……舌片、22……係合穴、31……舌片、32
……突出部。
FIG. 1 is an exploded perspective view of an engaging portion showing an embodiment of the present invention, and FIG. 2 is an overall perspective view. 1... IC card base, 2... First metal plate,
3... Second metal plate, 13... Upper and lower through holes, 21
... Tongue piece, 22 ... Engagement hole, 31 ... Tongue piece, 32
...protrusion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体集積回路を内蔵したICカードの基体の
上下面に金属板を被着せしめたICカードケース
において、前記上下面の片方に被着させる第1の
金属板の外周近傍に四角な係合穴を有する舌片を
複数個切起して設けるとともに、前記上下面の他
面に被着させる第2の金属板の外周近傍に前記四
角な係合穴に係合する突出部を有する舌片を第1
の金属板の舌片位置に対応する位置に切起して設
け、さらに、これら前記のそれぞれの舌片の有す
る係合穴と突出部との係合部位に対応する基体の
位置に上下貫通穴を設けたことを特徴とするIC
カードケース。
In an IC card case in which metal plates are attached to the upper and lower surfaces of the base of an IC card containing a built-in semiconductor integrated circuit, a square engagement hole is provided near the outer periphery of a first metal plate that is attached to one of the upper and lower surfaces. A plurality of tongue pieces are cut and raised, and a tongue piece having a protrusion that engages with the square engagement hole is provided near the outer periphery of the second metal plate to be attached to the other surface of the upper and lower surfaces. 1
The metal plates are cut and raised at positions corresponding to the positions of the tongues, and upper and lower through holes are provided at positions of the base body corresponding to the engagement portions of the engagement holes and the protrusions of the respective tongues. An IC characterized by being provided with
card case.
JP1987176287U 1987-11-18 1987-11-18 Pending JPH0180472U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987176287U JPH0180472U (en) 1987-11-18 1987-11-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987176287U JPH0180472U (en) 1987-11-18 1987-11-18

Publications (1)

Publication Number Publication Date
JPH0180472U true JPH0180472U (en) 1989-05-30

Family

ID=31468029

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987176287U Pending JPH0180472U (en) 1987-11-18 1987-11-18

Country Status (1)

Country Link
JP (1) JPH0180472U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0345397A (en) * 1989-07-13 1991-02-26 Mitsubishi Electric Corp Ic card
JPH0424390U (en) * 1990-06-19 1992-02-27

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0345397A (en) * 1989-07-13 1991-02-26 Mitsubishi Electric Corp Ic card
JPH0424390U (en) * 1990-06-19 1992-02-27

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