JPS6323102A - Transparent substrate for optical use - Google Patents

Transparent substrate for optical use

Info

Publication number
JPS6323102A
JPS6323102A JP61159712A JP15971286A JPS6323102A JP S6323102 A JPS6323102 A JP S6323102A JP 61159712 A JP61159712 A JP 61159712A JP 15971286 A JP15971286 A JP 15971286A JP S6323102 A JPS6323102 A JP S6323102A
Authority
JP
Japan
Prior art keywords
resin
transparent substrate
hydrocarbon compound
thermoplastic resin
transparent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61159712A
Other languages
Japanese (ja)
Other versions
JP2504959B2 (en
Inventor
Keiji Kawamoto
圭司 河本
Tetsushi Kasai
徹志 笠井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Petrochemical Industries Ltd
Original Assignee
Mitsui Petrochemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Petrochemical Industries Ltd filed Critical Mitsui Petrochemical Industries Ltd
Priority to JP61159712A priority Critical patent/JP2504959B2/en
Publication of JPS6323102A publication Critical patent/JPS6323102A/en
Application granted granted Critical
Publication of JP2504959B2 publication Critical patent/JP2504959B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To prevent the deterioration of the mechanical properties of a transparent substrate and the formation of voids and to improve the transferability of pits or guide grooves by using a transparent thermoplastic resin blended with a hydrocarbon compound having 200-3,000mol.wt. and a liq. state at ordinary temp. by 0.01-1 part by weight per 100 parts resin. CONSTITUTION:A transparent substrate is made of a transparent thermoplastic resin blended with a hydrocarbon compound having 200-3,000mol.wt. and a liq. state at ordinary temp. by 0.01-1 part by weight per 100 parts resin. Polmethyl methacrylate (PMMA), polycarbonate (PC) or poly-4-methylpentene-1 (PMP) is generally used as the transparent thermoplastic resin. The thermoplastic resin may be polystyrene or a product produced by hydrogenating a ring opened homopolymer of tetracyclododecene or a ring opened copolymer of tetracyclododecene with norbornene. The hydrocarbon compound plasticizes the transparent thermoplastic resin having high Tg by dispersion in the resin and can microscopically lower the apparent Tg. The especially preferred mol.wt. of the hydrocarbon compound is about 300-1,000.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は光学用透明基板に関し、とくに射出成形によっ
て良好な外観を示す投影面積が大きく、かつ、厚みの薄
い光学用透明基板たとえば光学ディスク基板に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to optical transparent substrates, and in particular, to optical transparent substrates that have a large projected area and a thin thickness that exhibit a good appearance by injection molding, such as optical disk substrates. Regarding.

〔従来の技術とその問題点〕[Conventional technology and its problems]

透明な熱可塑性樹脂を使用して光学用透明基板を製造す
るための成形方法は種々知られている。なかでも射出成
形法は、生産性すなわち多量の製品を高生産速度で成形
できる面から工業的に最も利用される手段である。
Various molding methods are known for manufacturing optical transparent substrates using transparent thermoplastic resins. Among them, injection molding is the method most used industrially because of its productivity, that is, the ability to mold a large amount of products at a high production rate.

ところで、光学用透明基板の1種である光学ディスク基
板のように、その製品形状が投影面積が大きく、かつ、
厚みの薄いようなものであると、射出成形によって製造
するのは以下に詳述する如(なかなか難しい。
By the way, the product shape has a large projected area, such as an optical disk substrate, which is a type of optical transparent substrate, and
If the material is thin, it is difficult to manufacture it by injection molding (as detailed below).

すなわち、透明熱可塑性樹脂たとえばポリメチルメタク
リレート(PMM八)、ポリカーボネート(PO)、ポ
リ4メチルペンテン1 (PMP)などの多(は粘性が
高くてしたがって射出成形にあたっては樹脂温度を高め
て粘性を低下させ流動性を向上させなくてはいけない。
In other words, transparent thermoplastic resins such as polymethyl methacrylate (PMM8), polycarbonate (PO), and poly4methylpentene (PMP) have high viscosity, so during injection molding, the resin temperature must be raised to lower the viscosity. We need to improve liquidity.

しかし、投影面積が大きくても厚みの薄いものは樹脂量
が少なく、よって射出成形機内での樹脂の滞留時間は長
(なる。また、金型内では肉厚のうすいところを高速で
通過するため、機械的な剪断熱も発生し易い。このよう
に外部加熱による高温下に長時間滞留し、剪断熱のよう
な内部加熱も経験する樹脂は、当然ながら分解、劣化を
生じ、得られる製品の機械的強度を弱めたり、焼けこげ
の混入等を生じて光学ディスク基板として使用できなく
なってしまうという問題がある。
However, even if the projected area is large, if the thickness is thin, the amount of resin is small, and the residence time of the resin in the injection molding machine is therefore long. , mechanical shear heat is also likely to occur.In this way, resins that remain at high temperatures for a long time due to external heating and also experience internal heating such as shear heat will naturally decompose and deteriorate, and the resulting product will deteriorate. There are problems in that the mechanical strength is weakened and scorches are mixed in, making it impossible to use it as an optical disc substrate.

このほかの問題としては、製造されたディスク基板に微
小なボイドを発生することがしばしばあるという事実が
ある。この現象は射出成形全般に言えることであるとも
受は取れるが、従来この種の問題解決に有効であるとさ
れている材料樹脂の予備乾燥や金型に空気抜きを付ける
手段では、前述の低流動性樹脂を用いた高温射出成形に
よるディスク基板の製造に関しては不充分である。
Another problem is the fact that manufactured disk substrates often have small voids. Although it can be accepted that this phenomenon applies to injection molding in general, methods such as pre-drying the material resin or adding air vents to the mold, which have been considered effective in solving this type of problem, cannot achieve the low flow rate described above. The production of disk substrates by high-temperature injection molding using plastic resins is insufficient.

また別の問題として、ディスクのピット部や案内溝が正
確にディスク基板に転写されないということがある。
Another problem is that the pits and guide grooves of the disk are not accurately transferred to the disk substrate.

更にまた別の問題として、ディスク基板表面または内部
にフラッシュと呼ばれる現象を発生することがある。こ
こでフラッシュというのは、ディスクの半径方向に沿っ
て不規則な形のクモリを生じる現象であって、比較的明
瞭な筋状の形状を示すシリバーストリークとは全く別の
現象である。
Yet another problem is that a phenomenon called flash may occur on or inside the disk substrate. Here, the flash is a phenomenon that produces irregularly shaped clouds along the radial direction of the disk, and is a completely different phenomenon from the silver streak that shows a relatively clear streak-like shape.

かかる現象は通常の成形品ではそれほど問題ないかもし
れないが、透明基板のような用途においては絶対にあっ
てはならないものである。この現象は、たとえば通常の
シルバーストリークを防止するのに有効であると称され
る材料樹脂の予備乾燥に充分時間をかけてもしばしば発
生し、当業者間における頭痛の種となっている。
Although such a phenomenon may not be much of a problem in ordinary molded products, it must never occur in applications such as transparent substrates. This phenomenon often occurs even after sufficient time has been taken to pre-dry the material resin, which is said to be effective in preventing, for example, common silver streaks, and is a source of headache for those skilled in the art.

更に他の問題は、成形によって得られる透明基板が黄色
(着色してしまう点である。
Yet another problem is that the transparent substrate obtained by molding becomes yellow (colored).

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

本発明者らは、かる現状に鑑み、光学用透明基板とくに
投影面積が大きく厚みの薄いたとえば光学ディスク基板
のようなものを射出成形しても、機械的性質の低下がな
く、ボイドの発生もなく、ビットまたは案内溝の転写性
もよく、さらにフラッシュの発生もな(かつ着色もない
製品が得られないか検討を重ねた結果本発明に到達した
ものである。
In view of the current situation, the present inventors have discovered that even if an optical transparent substrate, especially one having a large projected area and a small thickness such as an optical disk substrate, is injection molded, the mechanical properties will not deteriorate and voids will not occur. The present invention was arrived at as a result of repeated research into whether it was possible to obtain a product that does not have any problems, has good transferability of bits or guide grooves, and does not cause flash (and is not colored).

〔問題点を解決するための手段〕[Means for solving problems]

すなわち本発明は、分子量200〜3000の常温で液
状の炭化水素化合物を樹脂100重量部あたりo、oi
〜1重量部配合した透明熱可塑性樹脂からなることを特
徴とする光学用透明基板である。
That is, in the present invention, a hydrocarbon compound having a molecular weight of 200 to 3,000 and which is liquid at room temperature is added to o, oi per 100 parts by weight of resin.
This is an optical transparent substrate characterized by being made of a transparent thermoplastic resin containing ~1 part by weight.

〔作 用〕[For production]

透明な熱可塑性樹脂としては、前述したPMM^、PC
,PMPのほかにポリスチレン(PS)、あるいは特開
昭60−26024に示されるようなテトラシクロドデ
セン類の単独開環重合体やノルボネン類との開環共重合
体を水添したもの、また別にはノルボルネン、テトラシ
クロドデセン、メチルテトラシクロドデセンなどの環状
オレフィンとエチレンとの共重合体(たとえば特開昭6
0−168708 、同61−1)5912、同61−
1)5916 、同6l−120816)などを例示で
きる。
Examples of transparent thermoplastic resins include the aforementioned PMM^ and PC.
, In addition to PMP, polystyrene (PS), or hydrogenated ring-opening polymers of tetracyclododecenes or ring-opening copolymers with norbornenes as shown in JP-A-60-26024, In addition, copolymers of ethylene and cyclic olefins such as norbornene, tetracyclododecene, and methyltetracyclododecene (for example,
0-168708, 61-1) 5912, 61-
1) 5916, 6l-120816), etc.

本発明においてとくに有用な透明熱可塑性樹脂は、ガラ
ス転移温度(Tg)が比較的高いものすなわち約100
℃以上のものと(に120°C以上のものである。すな
わち、Tgが高いものは、射出成形によって金型内に流
れ込む時に金型と接触する樹脂表面の樹脂温度が低下し
、比較的早く表面が固化する。このため、樹脂の酸化劣
化に基づくと推定される揮発成分等が樹脂内部に閉じ込
められて、前述したフラッシュの原因となると推測され
る。つまり、 Tgが高いほど早く表面が固化が生じ、
フラッシュが著しくなるのであり、故にこのような樹脂
に本発明を適用するとフラッシュが防止され有用である
。したがって、好ましく使用される樹脂はエチレンと環
状オレフィンの共重合体である。
Transparent thermoplastic resins that are particularly useful in the present invention are those with relatively high glass transition temperatures (Tg) of about 100
℃ or above and 120°C or above.In other words, when the Tg is high, the temperature of the resin surface that comes into contact with the mold when it flows into the mold during injection molding decreases, and the temperature of the resin melts relatively quickly. The surface solidifies.For this reason, volatile components estimated to be due to oxidative deterioration of the resin are trapped inside the resin, causing the aforementioned flash.In other words, the higher the Tg, the faster the surface solidifies. occurs,
Therefore, applying the present invention to such resins is useful because it prevents flash. Therefore, the resin preferably used is a copolymer of ethylene and cyclic olefin.

分子M2O0〜3000の常温で液状の炭化水素化合物
を少量配合すると本発明の目的を達成できることは全く
予測し得ないことである。本発明の構成によれば、なぜ
目的を達成できるかは不明であるが、本発明者らの推測
によれば、分子i 200〜3000の常温で液状の炭
化水素化合物が高Tgの透明熱可塑性樹脂中に分散する
ことによって樹脂を可塑化させ、ミクロ的に見た場合見
掛けのTgを低下させる役目を果たすのも一因と考える
ことができる。この結果、射出成形金型に接触した樹脂
表面の固化を若干遅延させ、樹脂内部に発生した揮発成
分(樹脂の分解、劣化によって発生する低沸点物や樹脂
中にもともと含まれている微量上ツマ−など)を表面か
ら逆げ易くして、ボイドやフラッシュを防止しビットの
転写性も良くするものと考える。
It is completely unexpected that the object of the present invention can be achieved by blending a small amount of a hydrocarbon compound with a molecular M2O of 0 to 3000 that is liquid at room temperature. It is unclear why the structure of the present invention can achieve the object, but according to the inventors' speculation, a hydrocarbon compound that is liquid at room temperature and has a molecular i of 200 to 3000 can be a transparent thermoplastic with a high Tg. It can be considered that one of the reasons is that it plasticizes the resin by dispersing it in the resin, and plays the role of lowering the apparent Tg when viewed microscopically. As a result, the solidification of the resin surface in contact with the injection mold is slightly delayed, and volatile components generated inside the resin (low boiling point substances generated due to decomposition and deterioration of the resin and trace amounts of upper particles originally contained in the resin) -, etc.) from the surface, prevents voids and flashes, and improves bit transferability.

しかし、この際、炭化水素化合物をあまり多量に使用す
ると、樹脂組成物全体の可望化傾向が強くなって、透明
基板とくに光学用途の透明基板としての強度や耐熱性が
侵されるので、その配合量は対象の透明熱可塑性樹脂1
00重量部あたり0.01〜1重量部、とくに0.1〜
0.9重量部の範囲が好適である。このような極めて少
量の配合で目的を達成できることも本発明の特徴の1つ
である。すなわち、従来の知見では樹脂の改質っまり可
塑化のために使用される可塑剤量は数パーセント以上で
あったが、本発明においては射出成形時の金型と接触す
る樹脂表面の固化時間だけを若干遅延させればよいので
、前述のような少量の配合で目的を達成できるのである
。このような量で目的を達成できる理由の1つは、炭化
水素化合物が低分子量であるためモービリティ−が高く
、成形時に樹脂表面へ割合と炭化水素化合物が移行し易
く、金型と接触する樹脂面の改質効果を集中的に果たす
からとも考えられる。
However, if a too large amount of hydrocarbon compound is used at this time, the resin composition as a whole will tend to become more visible, which will affect the strength and heat resistance of the transparent substrate, especially as a transparent substrate for optical applications. The amount is the target transparent thermoplastic resin 1
0.01 to 1 part by weight, especially 0.1 to 1 part by weight per 00 parts by weight
A range of 0.9 parts by weight is preferred. It is also one of the features of the present invention that the objective can be achieved with such a very small amount of blending. In other words, in the conventional knowledge, the amount of plasticizer used for modifying or plasticizing the resin was several percent or more, but in the present invention, the amount of plasticizer used for modifying or plasticizing the resin was determined by reducing the solidification time of the resin surface in contact with the mold during injection molding. Since it is only necessary to slightly delay the reaction, the purpose can be achieved with a small amount of addition as described above. One of the reasons why the objective can be achieved with such an amount is that the hydrocarbon compound has high mobility due to its low molecular weight, which makes it easy for the hydrocarbon compound to migrate to the resin surface during molding and come into contact with the mold. This is also thought to be because it intensively achieves the effect of modifying the resin surface.

このような理由からか本発明においては、比較的低分子
量すなわち分子量300〜1000程度のものがと(に
好適である。
For these reasons, in the present invention, those having a relatively low molecular weight, that is, about 300 to 1000, are suitable for the tomato.

炭化水素化合物としては、たとえば直鎖または側鎖を有
する脂肪族炭化水素類、脂環族炭化水素類、ビフェニル
、ポリフェニルあるいは縮合多環芳香族等の脂肪族炭化
水素類、芳香族炭化水素類の部分水素添加化合物、ある
いはこれらの各種炭化水素を母体として、アルキル基、
アリール基、アラルキル基等で置換したものなどが例示
できる。
Examples of hydrocarbon compounds include aliphatic hydrocarbons having straight or side chains, alicyclic hydrocarbons, aliphatic hydrocarbons such as biphenyl, polyphenyl, or fused polycyclic aromatics, and aromatic hydrocarbons. partially hydrogenated compounds, or these various hydrocarbons as base materials, alkyl groups,
Examples include those substituted with an aryl group, an aralkyl group, etc.

これらの炭化水素類は天然物、合成物のいずれでも使用
可能である。より具体的には、ドデシルベンゼン、ドデ
シルベンゼン油製造の際に副成するポリアルキルベンゼ
ン、ジベンジルベンゼン、アルキルナフタレン、ポリフ
ェニルアルカン油、アルキル化テトラリン、エチレンオ
リゴマー、プロピレンオリゴマー、エチレン−プロピレ
ンオリゴマー、ポリブテンオリゴマー等のオレフィン重
合体、流動パラフィン、スクアラン、鉱物油等が挙げら
れるが、勿論ここに例示しない炭化水素化合物であって
も使用可能である。
Both natural and synthetic hydrocarbons can be used. More specifically, dodecylbenzene, polyalkylbenzene, dibenzylbenzene, alkylnaphthalene, polyphenylalkane oil, alkylated tetralin, ethylene oligomer, propylene oligomer, ethylene-propylene oligomer, polybutene that is produced as a by-product during the production of dodecylbenzene oil. Examples include olefin polymers such as oligomers, liquid paraffin, squalane, mineral oil, etc., but of course hydrocarbon compounds not exemplified here can also be used.

本発明においては、そのほかに樹脂の耐熱安定性を計る
ために各種の酸化防止剤を用いてもよい。
In the present invention, various antioxidants may also be used in order to measure the heat resistance stability of the resin.

さらに透明樹脂としてチーグラー触媒のようなハロゲン
含有触媒で製造されたものを用いる場合には、残留する
触媒残渣中に含まれるハロゲンが成形機を傷めることが
ないように、ハロゲン捕捉剤を併用すべきである。
Furthermore, when using a transparent resin made with a halogen-containing catalyst such as Ziegler's catalyst, a halogen scavenger should be used in combination to prevent the halogen contained in the remaining catalyst residue from damaging the molding machine. It is.

本発明を光学ディスク基板を例にとって説明すると、ま
ず樹脂と上記化合物、必要に応じて本発明の効果を填ね
ない量の他の安定剤とをリボンブレンダー、タンブラー
ブレンダー、ヘンシェルミキサーなどで混合あるいは混
合後押出機、バンバリーミキサ−1二本ロールなどで溶
融混合するか炭化水素や芳香族溶媒に溶解してポリマー
溶液に混合し、その後単軸押出機、ベント式押出機、二
本スクリュー押出機、三本スクリュー押出機、円錐型二
本スクリュー押出機、コニーダー、プラテイフイケータ
ー、ミクストルーダー、二軸コニカルスクリュー押出機
、遊星ねじ押出機、歯車型押出機、スクリューレス押出
機などを用いて射出成形を行い、ディスク成形用の金型
(情報ビットや案内溝を形成するためのスタンバ−のセ
ットされたものも含む)によって成形する。
To explain the present invention using an optical disk substrate as an example, first, the resin and the above compound, and if necessary, other stabilizers in an amount that does not reduce the effect of the present invention, are mixed in a ribbon blender, tumbler blender, Henschel mixer, etc. After mixing, melt-mix using an extruder, Banbury mixer - 1 or two rolls, or dissolve it in a hydrocarbon or aromatic solvent and mix it into a polymer solution, and then use a single-screw extruder, vented extruder, or twin-screw extruder. , three-screw extruder, conical two-screw extruder, co-kneader, plateificator, mixtruder, twin-screw conical screw extruder, planetary screw extruder, gear-type extruder, screwless extruder, etc. Injection molding is performed using a disk mold (including one equipped with a stamp bar for forming information bits and guide grooves).

射出成形の際に使用されるゲートは、公知の種々のもの
を用いてもよいが、収縮や反りの面からセンターピンゲ
ートやセンターディスクゲート、好ましくはゲート径3
III1)以下、とくに0.5〜2.0mmのセンター
ピンゲート、ゲート厚1fflI1)以下、とくに0.
2〜0 、8mmのセンターディスクゲートを用いるの
がよい。
Various known gates may be used for injection molding, but in view of shrinkage and warping, center pin gates and center disc gates, preferably gate diameter 3.
III1) or less, especially a center pin gate of 0.5 to 2.0 mm, gate thickness 1fflI1) or less, especially 0.5 to 2.0 mm.
It is preferable to use a center disk gate of 2 to 0.8 mm.

射出成形によって得られたディスク基板は、その後記録
層あるいはレーザー光線を反射するための金属層を蒸着
法、スパッタ法などの公知の方法によって形成し、更に
必要に応じて保護層を設けて完成される。
The disk substrate obtained by injection molding is then completed by forming a recording layer or a metal layer for reflecting laser beams by a known method such as vapor deposition or sputtering, and further providing a protective layer if necessary. .

〔実施例〕〔Example〕

以下本発明の内容を好適な例でもって示すが、本発明は
とくにことわりのない限り何らこれらの例に制限される
ものではない。
The content of the present invention will be illustrated below with preferred examples, but the present invention is not limited to these examples unless otherwise specified.

実施例1 荷重2.15に+r、 A度260℃におけるメルトフ
ローレート(MFR: ASTM D 1238)が3
5 kg / 10m inのエチレン・テトラシクロ
ドデセン共重合体(エチレン含量60モル%)に、テト
ラキス〔メチレン−3−(3,5−ジーtert−ブチ
ルー4−ヒドロキシフェニル)プロピオネートコメタン
(A)、スクアラン(分子量392) (B)およびス
テアリン酸亜鉛(C)を配合し、ヘンシェルミキサーで
混合後、スクリュー径401)mの2軸押出機を使用し
て230℃の温度でペレットを作成した。
Example 1 +r at load 2.15, melt flow rate (MFR: ASTM D 1238) at 260°C A degree is 3
Tetrakis[methylene-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate comethane (A ), squalane (molecular weight 392) (B) and zinc stearate (C) were mixed in a Henschel mixer, and then pellets were created at a temperature of 230°C using a twin-screw extruder with a screw diameter of 401) m. .

このペレットを原料として、住友重機P40/25A射
出成形機及びセンターディスクゲートの金型(情報ビッ
ト形成のためのスタンバ−をセットした金型)を使用し
、280℃の温度で直径80nuw、厚さ1.0III
1)のディスク基板を成形し、表1に示した項目を評価
した。なおこれらの項目は、目視により評価し、評価基
準は悪1−5良とした。
Using these pellets as raw material, using a Sumitomo Heavy Industries P40/25A injection molding machine and a center disk gate mold (a mold equipped with a stand bar for forming information bits), the pellets were heated to a diameter of 80 nuw and a thickness of 80 nuw at a temperature of 280°C. 1.0III
The disk substrate of 1) was molded, and the items shown in Table 1 were evaluated. Note that these items were evaluated visually, and the evaluation criteria were 1 to 5 good.

安定剤の配合量は、原料の樹脂100重量部に対する重
量部を示している。
The amount of the stabilizer is expressed in parts by weight based on 100 parts by weight of the raw material resin.

実施例2 (炭化水素化合物の製造) 温度計、撹拌器、冷却器と滴下ロートを備えた容ffi
 500Tnlの40フラスコに、混合キシレン(m−
キシレン45%、エチルベンゼン51%、0−およびp
−キシレン4%) 79.5g(0,75モル)に粉末
化した無水塩化アルミニウム3gを窒素雰囲気下で加え
る。撹拌しながら滴下ロートによりトリシクロ(5,2
,1,0”) デカ−3−x7含含有分(純度70.9
%) 283.5g (1,5gモル)を加え、60℃
で2時間加熱攪拌する。メタノールを加えて反応を終了
させ、中性になるまで反応液を洗浄した。次いで釜温1
50℃、圧力20mmHgで未反応物を除去し、ガード
ナー色相10.25°Cで粘度10.800cp、屈折
率(no”)1.5482の粘稠液体49gを得た。分
析の結果、トリシクロ〔5,2、■、02°6〕デカー
3−エン:l昆合キシレンの1/1付加物59重量%、
同2/1付加物33重計%、その他8重量%からなるこ
とがわかった。
Example 2 (Production of hydrocarbon compounds) A container ffi equipped with a thermometer, a stirrer, a condenser and a dropping funnel
Mixed xylene (m-
xylene 45%, ethylbenzene 51%, 0- and p
3 g of powdered anhydrous aluminum chloride are added to 79.5 g (0.75 mol) of xylene (4%) under a nitrogen atmosphere. Tricyclo(5,2
, 1,0”) Deca-3-x7 content (purity 70.9
%) 283.5g (1.5g mol) was added and heated to 60°C.
Heat and stir for 2 hours. The reaction was terminated by adding methanol, and the reaction solution was washed until it became neutral. Next, pot temperature 1
Unreacted substances were removed at 50°C and a pressure of 20mmHg to obtain 49g of a viscous liquid with a Gardner hue of 10.25°C, a viscosity of 10.800cp, and a refractive index (no'') of 1.5482.As a result of analysis, tricyclo[ 5, 2,
It was found that it consisted of 33% by weight of the 2/1 adduct and 8% by weight of others.

次いで、この粘稠液体に水添反応を行って、25℃粘度
10600cp 、屈折率(nDzs )1.5028
の粘稠液体39gを得た。分析の結果、トリシクロ〔5
゜2.1.0”’)デカ−3−エン:混合キシレンの1
/1付加水添物59重量%、同2/1付加水添物33重
量%、その他8重量%からなる平均分子量320の炭化
水化合物であることがわかった。
Next, this viscous liquid was subjected to a hydrogenation reaction, and the viscosity at 25°C was 10,600 cp and the refractive index (nDzs) was 1.5028.
39 g of viscous liquid was obtained. As a result of the analysis, tricyclo [5
゜2.1.0''') Dec-3-ene: 1 of mixed xylene
It was found to be a hydrocarbon compound with an average molecular weight of 320, consisting of 59% by weight of /1 addition hydrogenated product, 33% by weight of 2/1 addition hydrogenated product, and 8% by weight of others.

(試験例) 上記で得られた炭化水素化合物(D)を実施例1の(B
)の代わりに用いるほかは同様に行った。
(Test Example) The hydrocarbon compound (D) obtained above was added to (B) of Example 1.
) was used in the same manner.

結果を表1に示す。The results are shown in Table 1.

実施例3 (炭化水素化合物の製造) 攪拌翼を備えた41ガラス製反応器を用い連続的にエチ
レン・α−オレフィンランダム共重合体を製造した。す
なわち、ヘキサン毎時21、三塩化バナジウムのヘキサ
ン溶液(16ミリモル/l)毎時1)、エチルアルミニ
ウムセスキクロリドのヘキサン溶液(96ミリモル/7
り毎時1)を反応器上部から反応器中へ連続的に供給し
、一方、反応器下部から反応器中の反応液が常に21に
なるように連続的に反応液を抜き出す。また反応器上部
からエチレン、プロピレンおよび水素の混合ガス(エチ
レン毎時4i、プロピレン毎時41A、水素毎時220
1 ’)を供給する。反応温度は反応器外部にとりつけ
られたジャケットに温水を循環させることにより35℃
に調節した。反応器下部から抜き出した反応液中に少量
のメタノールを添加して反応を停止させたのち、反応液
を3回水洗した。
Example 3 (Production of hydrocarbon compound) An ethylene/α-olefin random copolymer was continuously produced using a 41 glass reactor equipped with a stirring blade. Namely, hexane solution (16 mmol/l) per hour, hexane solution of vanadium trichloride (16 mmol/l) per hour, hexane solution of ethylaluminum sesquichloride (96 mmol/7 hourly)
1) per hour is continuously fed into the reactor from the upper part of the reactor, while the reaction liquid is continuously withdrawn from the lower part of the reactor so that the reaction liquid in the reactor is always 21. A mixed gas of ethylene, propylene and hydrogen (ethylene 4i/hour, propylene 41A/hour, hydrogen 220
1'). The reaction temperature was maintained at 35°C by circulating hot water through a jacket attached to the outside of the reactor.
It was adjusted to A small amount of methanol was added to the reaction liquid taken out from the bottom of the reactor to stop the reaction, and then the reaction liquid was washed three times with water.

そののちQ、1mm1)gの減圧でポット温度100℃
の蒸留により溶媒ヘキサンおよび低沸点生成物を除き常
温で液状のエチレン・プロピレンランダム共重合体を得
た。
After that, the pot temperature is 100℃ with Q, 1mm 1)g vacuum.
The hexane solvent and low-boiling products were removed by distillation to obtain an ethylene-propylene random copolymer that was liquid at room temperature.

生成したエチレン・プロピレンランダム共重合体を” 
C−NMR法で測定したところエチレン含有率が54モ
ル%、ゲル・パーミェーション・クロマトグラフ法で測
定したところ】nが450、Mh/Tinが1.8であ
り、また示差走査型熱量計での融点は観察されず、融解
エネルギーはOcal/gであった。
The generated ethylene/propylene random copolymer
As measured by C-NMR, the ethylene content was 54 mol%, as measured by gel permeation chromatography, n was 450, and Mh/Tin was 1.8. No melting point was observed and the melting energy was Ocal/g.

(試験例) 上記で得られたランダム共重合体(E)を実施例Iの(
B)の代わりに用いるほかは同様に行った。
(Test Example) The random copolymer (E) obtained above was used in Example I (
The same procedure was performed except that B) was used instead of B).

結果を表1に示す。The results are shown in Table 1.

比較例1 実施例1において(B)を使用せず(A)の配合量を増
すほかは同様に行った。結果を表1に示す。
Comparative Example 1 The same procedure as in Example 1 was carried out except that (B) was not used and the amount of (A) was increased. The results are shown in Table 1.

比較例2 実施例1において(B)の代わりにn−デカン(F)を
用いるほかは同様に行った。結果を表1に示す。
Comparative Example 2 The same procedure as in Example 1 was carried out except that n-decane (F) was used instead of (B). The results are shown in Table 1.

比較例3 実施例1において(B)の代わりにポリエチレンワック
ス(ハイゼツクスo1)0P、三井石油化学工業)(G
)を用いるほかは同様に行った。結果を表1に示す。
Comparative Example 3 In Example 1, instead of (B), polyethylene wax (HIZEX O1) 0P, Mitsui Petrochemical Industries) (G
) was used in the same manner. The results are shown in Table 1.

比較例4 実施例1において(B)の代わりに低結晶性エチレン・
α−オレフィン共重合体(タフマーPO680、三井石
油化学工業)(II)を用いるほかは同様に行った。結
果を表1に示す。
Comparative Example 4 Low crystalline ethylene was used instead of (B) in Example 1.
The same procedure was carried out except that α-olefin copolymer (Tafmer PO680, Mitsui Petrochemical Industries, Ltd.) (II) was used. The results are shown in Table 1.

〔発明の効果〕〔Effect of the invention〕

本発明によれば、ボイドの発生もなく、フラッシュの発
生もなく、さらに金型内のスタンバ−模様の転写性たと
えばディスクのビット部や案内溝が正確に転写できると
いう優れた効果を示す。
According to the present invention, there is no generation of voids or flash, and furthermore, it exhibits excellent effects in that it is possible to accurately transfer the stubber pattern in the mold, such as the bit portions and guide grooves of the disk.

よって光学ディスク基板、大型ディスプレイ基板、透明
電橋基板、透明電気回路基板、VD作業用CRTカバー
などの投影面積は大きいが厚みの薄い光学用透明基板製
品の製造に好適に用いることができる。
Therefore, it can be suitably used for manufacturing optical transparent substrate products that have a large projected area but are thin, such as optical disk substrates, large display substrates, transparent electric bridge substrates, transparent electric circuit boards, and CRT covers for VD work.

Claims (6)

【特許請求の範囲】[Claims] (1)分子量200〜3000の常温で液状の炭化水素
化合物を樹脂100重量部あたり0.01〜1重量部配
合した透明熱可塑性樹脂からなることを特徴とする光学
用透明基板。
(1) A transparent optical substrate characterized by being made of a transparent thermoplastic resin containing 0.01 to 1 part by weight of a hydrocarbon compound having a molecular weight of 200 to 3,000 and liquid at room temperature per 100 parts by weight of the resin.
(2)分子量が300〜1000の炭化水素化合物であ
る特許請求の範囲第1項に記載の光学用透明基板。
(2) The optical transparent substrate according to claim 1, which is a hydrocarbon compound having a molecular weight of 300 to 1,000.
(3)透明熱可塑性樹脂のガラス転移温度が100℃以
上である特許請求の範囲第1項または第2項に記載の光
学用透明基板。
(3) The optical transparent substrate according to claim 1 or 2, wherein the transparent thermoplastic resin has a glass transition temperature of 100° C. or higher.
(4)光学用透明基板が、投影面積が大きく、かつ、厚
みの薄いものである特許請求の範囲第1項ないし第3項
のいずれかに記載の光学用透明基板。
(4) The optical transparent substrate according to any one of claims 1 to 3, wherein the optical transparent substrate has a large projected area and a small thickness.
(5)光学用透明基板が光学ディスク基板である特許請
求の範囲第1項ないし第4項のいずれかに記載の光学用
透明基板。
(5) The optical transparent substrate according to any one of claims 1 to 4, wherein the optical transparent substrate is an optical disk substrate.
(6)射出成形によつて製造される特許請求の範囲第1
項ないし第5項のいずれかに記載の光学用透明基板。
(6) Claim 1 manufactured by injection molding
The optical transparent substrate according to any one of items 5 to 6.
JP61159712A 1986-07-09 1986-07-09 Optical transparent substrate Expired - Fee Related JP2504959B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61159712A JP2504959B2 (en) 1986-07-09 1986-07-09 Optical transparent substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61159712A JP2504959B2 (en) 1986-07-09 1986-07-09 Optical transparent substrate

Publications (2)

Publication Number Publication Date
JPS6323102A true JPS6323102A (en) 1988-01-30
JP2504959B2 JP2504959B2 (en) 1996-06-05

Family

ID=15699639

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61159712A Expired - Fee Related JP2504959B2 (en) 1986-07-09 1986-07-09 Optical transparent substrate

Country Status (1)

Country Link
JP (1) JP2504959B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003504475A (en) * 1999-07-13 2003-02-04 バイエル アクチェンゲゼルシャフト Polycarbonate molding composition having good release properties, molded product and semi-finished product produced therefrom
JP2005075991A (en) * 2003-09-02 2005-03-24 Mitsubishi Engineering Plastics Corp Aromatic polycarbonate resin composition for optical waveguide, optical waveguide, and planar light source
JPWO2007004321A1 (en) * 2005-06-30 2009-01-22 三井化学株式会社 Method for producing cyclic olefin resin composition and cyclic olefin resin composition

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS586539A (en) * 1981-07-03 1983-01-14 Asahi Chem Ind Co Ltd Video disc formed with use of specific polymethyl methacryl resin
JPS61131256A (en) * 1984-11-29 1986-06-18 Matsushita Electric Ind Co Ltd Optical disk

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS586539A (en) * 1981-07-03 1983-01-14 Asahi Chem Ind Co Ltd Video disc formed with use of specific polymethyl methacryl resin
JPS61131256A (en) * 1984-11-29 1986-06-18 Matsushita Electric Ind Co Ltd Optical disk

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003504475A (en) * 1999-07-13 2003-02-04 バイエル アクチェンゲゼルシャフト Polycarbonate molding composition having good release properties, molded product and semi-finished product produced therefrom
JP2005075991A (en) * 2003-09-02 2005-03-24 Mitsubishi Engineering Plastics Corp Aromatic polycarbonate resin composition for optical waveguide, optical waveguide, and planar light source
JPWO2007004321A1 (en) * 2005-06-30 2009-01-22 三井化学株式会社 Method for producing cyclic olefin resin composition and cyclic olefin resin composition
US8114942B2 (en) 2005-06-30 2012-02-14 Mitsui Chemicals, Inc. Process for producing cycloolefin resin composition, and cycloolefin resin composition
JP5103177B2 (en) * 2005-06-30 2012-12-19 三井化学株式会社 Method for producing cyclic olefin resin composition and cyclic olefin resin composition

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