JPS6322776U - - Google Patents
Info
- Publication number
- JPS6322776U JPS6322776U JP1986115916U JP11591686U JPS6322776U JP S6322776 U JPS6322776 U JP S6322776U JP 1986115916 U JP1986115916 U JP 1986115916U JP 11591686 U JP11591686 U JP 11591686U JP S6322776 U JPS6322776 U JP S6322776U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- insulating substrate
- conductive pattern
- resistance layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims 2
- 238000005476 soldering Methods 0.000 claims 1
- 238000002834 transmittance Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986115916U JPS6322776U (el) | 1986-07-30 | 1986-07-30 | |
| KR2019870004588U KR900004079Y1 (ko) | 1986-07-30 | 1987-04-04 | 프린트 배선 기판 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986115916U JPS6322776U (el) | 1986-07-30 | 1986-07-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6322776U true JPS6322776U (el) | 1988-02-15 |
Family
ID=31000020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986115916U Pending JPS6322776U (el) | 1986-07-30 | 1986-07-30 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS6322776U (el) |
| KR (1) | KR900004079Y1 (el) |
-
1986
- 1986-07-30 JP JP1986115916U patent/JPS6322776U/ja active Pending
-
1987
- 1987-04-04 KR KR2019870004588U patent/KR900004079Y1/ko not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR900004079Y1 (ko) | 1990-05-08 |
| KR880003790U (ko) | 1988-04-14 |