JPS6322733U - - Google Patents
Info
- Publication number
- JPS6322733U JPS6322733U JP11629686U JP11629686U JPS6322733U JP S6322733 U JPS6322733 U JP S6322733U JP 11629686 U JP11629686 U JP 11629686U JP 11629686 U JP11629686 U JP 11629686U JP S6322733 U JPS6322733 U JP S6322733U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- turntable
- heating means
- semiconductor
- raising
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11629686U JPH0410689Y2 (pl) | 1986-07-29 | 1986-07-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11629686U JPH0410689Y2 (pl) | 1986-07-29 | 1986-07-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6322733U true JPS6322733U (pl) | 1988-02-15 |
| JPH0410689Y2 JPH0410689Y2 (pl) | 1992-03-17 |
Family
ID=31000752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11629686U Expired JPH0410689Y2 (pl) | 1986-07-29 | 1986-07-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0410689Y2 (pl) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000223394A (ja) * | 1999-01-29 | 2000-08-11 | Dainippon Screen Mfg Co Ltd | 基板処理装置及び基板処理方法 |
| US7237561B2 (en) | 2001-01-13 | 2007-07-03 | Samsung Electronics Co., Ltd. | Apparatus for cleaning semiconductor wafer including heating using a light source and method for cleaning wafer using the same |
| JP2010245575A (ja) * | 2002-05-28 | 2010-10-28 | Shibaura Mechatronics Corp | スピン処理装置及びスピン処理方法 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6008384B2 (ja) * | 2012-03-15 | 2016-10-19 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置 |
| CN112437975A (zh) * | 2018-08-22 | 2021-03-02 | 玛特森技术公司 | 在低温下对工件进行热处理和温度测量的系统和方法 |
-
1986
- 1986-07-29 JP JP11629686U patent/JPH0410689Y2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000223394A (ja) * | 1999-01-29 | 2000-08-11 | Dainippon Screen Mfg Co Ltd | 基板処理装置及び基板処理方法 |
| US7237561B2 (en) | 2001-01-13 | 2007-07-03 | Samsung Electronics Co., Ltd. | Apparatus for cleaning semiconductor wafer including heating using a light source and method for cleaning wafer using the same |
| JP2010245575A (ja) * | 2002-05-28 | 2010-10-28 | Shibaura Mechatronics Corp | スピン処理装置及びスピン処理方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0410689Y2 (pl) | 1992-03-17 |